CN221444519U - Refrigerating apparatus - Google Patents

Abstract

The utility model discloses refrigeration equipment, which comprises a box body, a semiconductor refrigeration module and a heat-conducting gasket, wherein a compartment is formed in the box body; the semiconductor refrigeration module comprises a semiconductor refrigeration chip, a radiator and a radiator, wherein the semiconductor refrigeration chip is provided with a cold end and a hot end, the cold end is connected with the radiator, the radiator is connected with the side wall of the compartment, the hot end is connected with the radiator, and the radiator is positioned outside the box body; the heat conducting gasket is arranged between the box body and the radiator so that part of heat of the radiator is guided to the box body through the heat conducting gasket. When the semiconductor refrigeration module is started, the cold quantity of the cold end is transferred to the compartment through the radiator to help to cool, and the heat of the hot end is radiated through the radiator to maintain the operation of the semiconductor refrigeration chip. Through setting up the heat conduction gasket, with the outer wall of the partial heat transfer of radiator for the box, help the heat dissipation, promote the radiating effect, be favorable to promoting semiconductor refrigeration module's refrigerating capacity.

Description

Refrigerating apparatus

Technical Field

The utility model relates to the technical field of refrigeration equipment, in particular to refrigeration equipment.

Background

A refrigerator is a refrigerating apparatus that maintains a stable low temperature for maintaining a low temperature state of food materials or other objects. The semiconductor refrigeration module is used for supplementing cold energy for the compartments, and is provided with a cold end and a hot end, the hot end dissipates heat by using the radiator, and the semiconductor refrigeration module is limited by the volume of the radiator, so that the heat dissipation effect is not ideal.

Disclosure of utility model

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides the refrigeration equipment, the outer wall of the box body of the refrigeration equipment is connected with the radiator through the heat conduction gasket, and the heat dissipation is assisted by the box body, so that the heat dissipation effect is improved.

The refrigeration equipment comprises a box body, a semiconductor refrigeration module and a heat conduction gasket, wherein a compartment is formed in the box body; the semiconductor refrigeration module comprises a semiconductor refrigeration chip, a radiator and a radiator, wherein the semiconductor refrigeration chip is provided with a cold end and a hot end, the cold end is connected with the radiator, the radiator is connected with the side wall of the compartment, the hot end is connected with the radiator, and the radiator is positioned outside the box body; the heat conducting gasket is arranged between the box body and the radiator, so that part of heat of the radiator is guided to the box body through the heat conducting gasket.

The refrigeration equipment provided by the embodiment of the utility model has at least the following beneficial effects: when the semiconductor refrigeration module is started, the cold quantity of the cold end is transferred to the compartment through the radiator to help to cool, and the heat of the hot end is radiated through the radiator to maintain the operation of the semiconductor refrigeration chip. Through setting up the heat conduction gasket, with the outer wall of the partial heat transfer of radiator for the box, help the heat dissipation, promote the radiating effect, be favorable to promoting semiconductor refrigeration module's refrigerating capacity.

According to some embodiments of the utility model, the thermally conductive pad is a flexible pad having a thermal conductivity of 1 to 8W/(m×k).

According to some embodiments of the utility model, the box, the radiator and the radiator are fixedly connected by bolts, and the heat-conducting gasket is provided with through holes for the bolts to pass through.

According to some embodiments of the utility model, the box is provided with a foaming layer surrounding the compartment, the radiator is located in the foaming layer, the radiator is provided with heat conducting blocks, the heat conducting blocks are located in the foaming layer and connected with the hot end, and the through holes are distributed at intervals along the circumferential direction of the heat conducting blocks.

According to some embodiments of the utility model, the thermally conductive pad is arranged in a direction extending from an edge of the thermally conductive pad to a middle portion, the thickness of the thermally conductive pad gradually decreasing.

According to some embodiments of the utility model, a side of the radiator facing the box body is a first side, and the heat conducting gasket is attached to the first side.

According to some embodiments of the utility model, the outer wall of the box body is a metal shell, and the heat conducting gasket is attached to the metal shell.

According to some embodiments of the utility model, the box body comprises a metal liner, an inner cavity of the metal liner is the compartment, and the radiator is connected with the metal liner.

According to some embodiments of the utility model, a cold conducting gasket is arranged between the cold radiator and the metal liner.

According to some embodiments of the utility model, the radiator is connected with a cooling fan, and the cooling fan is located on the side surface of the radiator, which faces away from the box body.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

Additional aspects and advantages of the present utility model will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a cross-sectional view of a refrigeration appliance according to some embodiments of the present utility model;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

fig. 3 is a cross-sectional view of a refrigeration appliance according to further embodiments of the present utility model;

FIG. 4 is an enlarged view of a portion of FIG. 3 at B;

FIG. 5 is a front view of a thermally conductive gasket of the present utility model;

Fig. 6 is a partial cross-sectional view of a thermally conductive gasket in accordance with the present utility model.

The reference numerals are as follows:

A case 100, a chamber 101, a foaming layer 102, and bolts 110;

semiconductor refrigeration module 200, semiconductor refrigeration chip 210, radiator 220, radiator 230, heat conduction block 231, and cooling fan 232;

A heat conductive pad 300, a through hole 301;

cold guide gasket 400.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, the description of the first and second is only for the purpose of distinguishing technical features, and should not be construed as indicating or implying relative importance or implying the number of technical features indicated or the precedence of the technical features indicated.

In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

The refrigerator is a refrigeration device for providing a low-temperature environment to store food and other articles, is popular with people, and is widely used. In the related art, a refrigeration system of a refrigerator generally adopts compression cycle refrigeration, which includes a compressor, a condenser, a throttling device, and an evaporator, and a refrigerant circulates in the compressor, the condenser, the throttling device, and the evaporator to realize refrigeration. Because the refrigerator has low frequency of use in part of time periods and low refrigeration requirement, part of the refrigerator adopts a semiconductor refrigeration module, and the refrigerator supplements the cold energy when the refrigeration requirement is low or supplements the cold energy for a compartment needing to be deeply cooled.

Generally, the hot end of the semiconductor refrigeration module dissipates heat through the radiator, so that the semiconductor refrigeration module can continuously run, but is limited by the installation space of the refrigerator, the radiator is small in size, the heat dissipation capacity is insufficient, the refrigeration capacity of the semiconductor refrigeration module is limited, the refrigeration capacity requirement of the refrigerator is difficult to meet, and the use effect is poor.

Therefore, the embodiment of the utility model provides the refrigeration equipment, the box body of the refrigeration equipment is used for helping the radiator to radiate heat, the heat radiation capacity is improved, the refrigeration capacity of the semiconductor refrigeration module is improved, and the refrigeration capacity requirement of the refrigerator is met. The refrigerating device may be a refrigerator or other products, and the refrigerator will be described as an example.

The main body of the refrigerator is a refrigerator body 100, a compartment 101 is arranged in the refrigerator body 100, the compartment 101 is generally divided into a refrigerating chamber and a freezing chamber, a refrigeration system generally adopted by the refrigerator comprises a compressor, a condenser, a throttling device and an evaporator which are sequentially connected through pipelines, the condenser is connected with a condensing fan, and the compressor, the condenser, the throttling device and the evaporator form a circulation flow path of a refrigerant. The compressor, condenser and throttle device are typically disposed in a press housing at the back of the case 100, a refrigerator door is provided at the front of the case 100 to open and close the compartment 101, and the evaporator is disposed at a position close to the compartment 101. When the refrigerating system is in operation, the compressor compresses the sucked refrigerant gas, then the refrigerant with high temperature and high pressure obtained after compression is input into the condenser, the condenser is utilized to cool the refrigerant, the condensing fan blows air to the condenser to help the condenser to cool, the medium-temperature and high-pressure refrigerant output by the condenser is input into the throttling device, the throttling device plays a role of throttling and depressurization, the temperature and the pressure of the refrigerant are reduced, the refrigerant entering the evaporator becomes low-pressure liquid with lower saturation temperature, the refrigerant evaporates in the evaporator and absorbs the heat of the external air, cold air is prepared, the cold air is input into the compartment 101 to help cool, the compartment 101 keeps a stable low-temperature environment for freezing or storing various objects, and finally the refrigerant returns to the compressor to complete one cycle. The compressor continuously operates to provide power for the refrigerant, and drives the refrigerant to circularly flow for continuous refrigeration.

The refrigerating system can meet the larger refrigerating requirement of the refrigerator, but under the circumstance that the refrigerating requirement of the refrigerator is smaller, the problem of energy consumption exists when the refrigerating system is started, part of the refrigerator has a cryogenic function, and the refrigerating system is difficult to meet by means of the refrigerating system alone, so that the semiconductor refrigerating module is added, the semiconductor refrigerating module is utilized to supplement the cold energy, the low refrigerating requirement and the cryogenic function are met, and the energy consumption is reduced.

Referring to fig. 1 and 2, some embodiments of the present utility model provide a refrigerator including a cabinet 100, a semiconductor refrigeration module 200, and a heat conductive gasket 300, the cabinet 100 being a main body of the refrigerator, a compartment 101 being formed inside the cabinet 100, the cabinet 100 being simultaneously provided with a foaming layer 102, the foaming layer 102 being disposed at an outer circumference of the compartment 101 to perform a heat insulation function, reduce heat transfer, and help the compartment 101 maintain a low temperature environment.

The semiconductor refrigeration module 200 generally comprises a semiconductor refrigeration chip 210, a radiator 220 and a radiator 230, wherein the semiconductor refrigeration chip 210 is also called a thermoelectric refrigeration sheet, and has the advantages of no sliding component, and is applied to occasions with limited space, high reliability requirement and no refrigerant pollution. The semiconductor refrigeration chip 210 can be cooled and heated by using a direct current in its operation, and the cooling or heating on the same refrigeration sheet is determined by changing the polarity of the direct current. The semiconductor refrigeration chip 210 is a P-N junction formed by using a special semiconductor material, forms a thermocouple pair, and generates a peltier effect, and is referred to as a three-large refrigeration mode of semiconductor refrigeration, compression refrigeration, and absorption refrigeration. The working principle of the semiconductor refrigeration chip 210 is as follows: when an N-type semiconductor material and a P-type semiconductor material are connected into a couple pair, after direct current is connected in the circuit, energy transfer can be generated, the current absorbs heat from the joint of the N-type element to the P-type element to become a cold end, and the joint of the P-type element to the N-type element releases heat to become a hot end. The magnitude of the heat absorption and release is determined by the magnitude of the current and the number of pairs of elements of the semiconductor material N, P. The inside of the refrigerating sheet is a thermopile formed by coupling hundreds of pairs of electric wires so as to achieve the effect of enhancing refrigeration (heating). Therefore, the semiconductor refrigeration chip 210 has a cold end and a hot end, the cold end is connected to the radiator 220 to transfer cold, the radiator 220 is connected to a sidewall of the compartment 101 to input cold into the compartment 101, and the hot end is connected to the radiator 230 to help heat dissipation, and the radiator 230 is generally arranged outside the case 100 to facilitate heat dissipation while preventing heat from entering the compartment 101 to avoid affecting the performance of the refrigerator, considering the shape and structure of the refrigerator.

It will be appreciated that the heat dissipation capacity of the heat sink 230 is related to the volume, and the heat sink 230 is generally designed to be small in size in consideration of the external shape and use of the refrigerator, which limits the refrigerating capacity of the semiconductor refrigeration module 200. The outer wall of the case 100 has a larger area, but is not utilized, so the heat-conducting pad 300 is disposed between the case 100 and the heat sink 230, a part of heat of the heat sink 230 is transferred to the case 100 by the heat-conducting pad 300, and the outer wall of the case 100 is utilized to help dissipate heat, thereby improving the refrigerating capacity of the semiconductor refrigerating module 200.

It should be appreciated that the heat conductive gasket 300 functions to transfer heat, and thus the heat conductive gasket 300 is made of a high performance heat conductive material having excellent heat conductivity. In addition, the heat conducting gasket 300 is in close contact with the box body 100 and the radiator 230, and has a large heat conducting area, thereby being beneficial to heat transfer.

In operation of the refrigerator, the semiconductor refrigeration module 200 is started, the cold end of the semiconductor refrigeration chip 210 forms a low temperature region, the hot end of the semiconductor refrigeration chip 210 forms a high temperature region, the cold end transmits cold energy to the compartment 101 through the radiator 220 to help to cool, and the hot end radiates heat through the radiator 230 to maintain normal operation of the semiconductor refrigeration chip 210. Moreover, by providing the heat conductive pad 300 between the case 100 and the heat sink 230, part of heat of the heat sink 230 is transferred to the outer wall of the case 100 by using the heat conductive pad 300, thereby helping to radiate heat, helping to improve the heat radiation effect, helping to improve the refrigerating capacity of the semiconductor refrigerating module 200, and the semiconductor refrigerating module 200 can be provided.

In some embodiments of the present utility model, the heat-conducting pad 300 is made of a flexible material, and the heat-conducting pad 300 has a heat conductivity coefficient of 1 to 8W/(m×k), which is a material 1m thick under a stable heat transfer condition, and a temperature difference between two side surfaces is 1 degree (K, °c), and the heat transferred through 1 square meter area is expressed in watts/(m×c) within one hour. It should be appreciated that the flexible thermal pad 300 facilitates the bonding of the case 100 and the heat sink 230, and that the case 100 and the heat sink 230 sandwich the thermal pad 300 when the semiconductor refrigeration module 200 is assembled, and that the thermal pad 300 may be partially deformed by the characteristics of the flexible material, so that the thermal pad 300 is bonded to the case 100 and the heat sink 230 without leaving a gap, thereby facilitating the heat transfer.

Referring to fig. 1 and 2, the case 100, the radiator 220, and the radiator 230 are fixedly connected through the bolts 110, the case 100 and the radiator 220 are provided with circular holes, the radiator 230 is provided with threaded holes, and when assembled, the bolts 110 pass through the circular holes provided in the case 100 and the radiator 220 and are screwed into the threaded holes of the radiator 230, and the case 100 and the radiator 230 are continuously closed in the process of tightening the bolts 110, thereby clamping the heat-conducting gasket 300, and the heat-conducting gasket 300 is slightly deformed and attached to the case 100 and the radiator 230.

In addition, during the assembly process, the tightening bolt 110 applies a force to the semiconductor refrigeration chip 210, and the flexible heat-conducting gasket 300 can absorb a certain force to prevent the semiconductor refrigeration chip 210 from being damaged due to excessive stress, which is beneficial to protecting the semiconductor refrigeration chip 210.

It will be appreciated that the coverage area of the heat conducting pad 300 is larger than the area where the bolt 110 is located, so as shown in fig. 5, the heat conducting pad 300 is provided with a through hole 301 for the bolt 110 to pass through, and after the heat conducting pad 300 is assembled to surround the bolt 110, the heat conducting pad 300 can be positioned by using the bolt 110 to prevent the heat conducting pad 300 from deviating.

Of course, the coverage area of the heat-conducting pad 300 may be smaller than the area where the bolts 110 are located, the heat-conducting pad 300 is provided with the bolts 110 distributed on the outer side of the heat-conducting pad 300, and the heat sink 230 may be provided with positioning grooves to define the heat-conducting pad 300, so as to prevent the heat-conducting pad 300 from deviating.

It can be understood that the refrigerator case 100 has the foaming layer 102, the foaming layer 102 injects the foaming material into the interlayer of the refrigerator case 100, and the foaming material solidifies and fixes after reacting, due to the limitation of the bolts 110, the deformation of the refrigerator case 100 around the bolts 110 is smaller, and the deformation of the refrigerator case 100 is relatively larger at the edge position of the heat conducting gasket 300, so that the heat conducting gasket 300 is set to be in a shape with thin center and thick periphery, that is, the thickness of the heat conducting gasket 300 gradually decreases along the direction that the edge of the heat conducting gasket 300 extends to the middle part, in the foaming process, the thickness of the periphery of the heat conducting gasket 300 is larger, the deformation of the periphery of the heat conducting gasket 300 can apply pressure to the refrigerator case 100, thereby balancing the expansion force of the foaming material, making the heat conducting gasket 300 closely fit with the refrigerator case 10, not generating gaps, being beneficial to transferring heat, and improving the heat dissipation efficiency.

Referring to fig. 1 and 2, in some embodiments of the present utility model, the radiator 220 is disposed in the foaming layer 102, the radiator 230 is provided with the heat conductive block 231, the heat conductive block 231 is also disposed in the foaming layer 102, and the heat conductive block 231 abuts against the hot end of the semiconductor refrigeration chip 210, the radiator 230 and the heat conductive block 231 are generally disposed as a rectangular body, so four bolts 110 are used, the heat conductive pad 300 is also provided with four through holes 301, and the four through holes 301 are distributed at intervals along the circumferential direction of the heat conductive block 231, one through hole 301 is disposed at each of four corners of the heat conductive block 231, or one through hole 301 is disposed at each of middle regions of four sides of the heat conductive block 231, and the four bolts 110 are used for fixing, so that the structure is stable, and the stress is balanced. Of course, three bolts 110 or other numbers of bolts 110 may be used, and the design may be performed according to the shape of the heat conducting block 231.

Referring to fig. 1 and 2, it can be appreciated that the radiator 230 is generally made of a metal material with a high thermal conductivity, such as copper or aluminum, and considering that a side of the radiator 230 facing away from the case 100 is an open space, a fin or other structure is generally provided to help dissipate heat, while a side of the radiator 230 facing the case 100 is set to be a first side, for the first side to be attached to the thermal pad 300, the first side may be set to be a plane, and the shape of the thermal pad 300 is designed to be the same as that of the first side, so that the thermal pad 300 is attached to the first side, thereby eliminating gaps and facilitating heat transfer. In addition, the area of the heat-conducting pad 300 may be equal to the area of the first side, or the area of the heat-conducting pad 300 may be larger than the area of the first side, so that the heat-conducting pad 300 has a larger contact area with the box 100, and the heat-conducting effect is better.

Referring to fig. 1, in some embodiments of the present utility model, a heat dissipating fan 232 is further connected to the heat sink 230, the heat dissipating fan 232 is mounted on a side of the heat sink 230, and the heat dissipating fan 232 is located on a side of the heat sink 230 facing away from the case 100. Considering the blockage of the airflow by the case 100, it is common that the radiator 230 is located at the air suction side of the radiator fan 232, and the airflow passes through the radiator 230 and then enters the radiator fan 232. The radiator 230 may be made of aluminum alloy, and is provided with a structure such as a radiating fin, so that the contact area between the radiator 230 and air is increased, and heat dissipation is accelerated.

It can be appreciated that, due to the addition of the heat-conducting gasket 300, part of heat of the radiator 230 is transferred to the box body 100 to help heat dissipation, so that the higher the heat transfer efficiency of the box body 100 is, the better the heat transfer efficiency is, the outer wall of the box body 100 can be set to be a metal shell, the metal shell has better heat conductivity coefficient and heat dissipation speed, the heat-conducting gasket 300 is attached to the metal shell, and the heat transferred to the metal shell can be quickly diffused to the whole metal shell to accelerate heat dissipation.

It can be understood that, considering that the cold end of the semiconductor refrigeration chip 210 transfers the cold energy to the compartment 101 through the radiator 220, and the capacity of the side wall of the compartment 101 for transferring the cold energy affects the transferring efficiency, the metal liner is disposed in the box 100, the inner cavity of the metal liner is the compartment 101, the radiator 220 is connected with the metal liner, the cold energy is transferred to the metal liner first, and then is transferred to the compartment 101 through the metal liner, so that the metal liner has better heat conductivity coefficient and heat conductivity, thereby facilitating the rapid transferring and diffusing of the cold energy and accelerating the cooling of the compartment 101.

Referring to fig. 3 and 4, another embodiment of the present utility model provides a refrigerator, which includes a refrigerator body 100, a semiconductor refrigeration module 200, a heat-conducting gasket 300 and a cold-conducting gasket 400, wherein the refrigerator body 100 is a main body of the refrigerator, a metal liner is disposed inside the refrigerator body 100, and an inner cavity of the metal liner forms a compartment 101. The semiconductor refrigeration module 200 generally comprises a semiconductor refrigeration chip 210, a radiator 220 and a radiator 230, wherein the semiconductor refrigeration chip 210 is also called a thermoelectric refrigeration sheet, and has the advantages of no sliding component, and is applied to occasions with limited space, high reliability requirement and no refrigerant pollution. The working principle of the semiconductor refrigeration chip 210 is: when an N-type semiconductor material and a P-type semiconductor material are connected into a couple pair, after direct current is connected in the circuit, energy transfer can be generated, the current absorbs heat from the joint of the N-type element to the P-type element to become a cold end, and the joint of the P-type element to the N-type element releases heat to become a hot end. The magnitude of the heat absorption and release is determined by the magnitude of the current and the number of pairs of elements of the semiconductor material N, P. Therefore, the semiconductor refrigeration chip 210 has a cold end and a hot end, the cold end is connected to the radiator 220 to transfer cold, the radiator 220 is connected to the metal liner to input cold into the compartment 101, and the hot end is connected to the radiator 230 to help heat dissipation, and the radiator 230 is generally arranged outside the case 100 to facilitate heat dissipation while preventing heat from entering the compartment 101 to avoid affecting the performance of the refrigerator, considering the shape and structure of the refrigerator.

It will be appreciated that the heat transfer capability of the heat spreader 220 and the heat sink 230 is volume dependent, and that the heat spreader 220 and the heat sink 230 are generally designed to be small in size in consideration of the external shape of the refrigerator and the use scenario, which limits the refrigerating capability of the semiconductor refrigeration module 200. The outer wall of the case 100 has a larger area, but is not utilized, so the heat-conducting pad 300 is disposed between the case 100 and the heat sink 230, a part of heat of the heat sink 230 is transferred to the case 100 by using the heat-conducting pad 300, and the heat dissipation is assisted by the outer wall of the case 100, so as to improve the refrigerating capacity of the semiconductor refrigerating module 200. Similarly, the metal liner has a larger area, but is not utilized, so the cold guide gasket 400 is arranged between the metal liner and the cold sink 220, the heat of the cold sink 220 is transferred to the metal liner by the cold guide gasket 400 in an accelerating way, and the cold is transferred by the aid of the metal liner, so that the refrigerating efficiency of the semiconductor refrigerating module 200 is improved.

It should be understood that the heat conductive gasket 300 and the cold conductive gasket 400 function to transfer heat or cold, and thus the heat conductive gasket 300 and the cold conductive gasket 400 are made of high performance heat conductive materials having excellent heat conductivity. Also, the heat conductive gasket 300 and the cold conductive gasket 400 eliminate gaps on the transfer path.

In some embodiments of the present utility model, the heat-conducting gasket 300 and the cold-conducting gasket 400 are made of flexible materials, and the heat-conducting coefficients of the heat-conducting gasket 300 and the cold-conducting gasket 400 can be 1 to 8W/(m×k), so that the heat-conducting gasket has good performance. It should be appreciated that the flexible thermal pad 300 facilitates the bonding of the case 100 and the heat sink 230, and that the case 100 and the heat sink 230 sandwich the thermal pad 300 when the semiconductor refrigeration module 200 is assembled, and that the thermal pad 300 may be partially deformed by the characteristics of the flexible material, so that the thermal pad 300 is bonded to the case 100 and the heat sink 230 without leaving a gap, thereby facilitating the heat transfer. Similarly, the flexible cold guide gasket 400 is beneficial to attaching the metal liner and the cold sink 220, when the semiconductor refrigeration module 200 is assembled, the metal liner and the cold sink 220 clamp the cold guide gasket 400, and the cold guide gasket 400 can generate partial deformation by utilizing the characteristic of the flexible material, so that the cold guide gasket 400 is attached to the metal liner and the cold sink 220 without leaving a gap, and the cold transfer is facilitated.

Referring to fig. 3 and 4, the case 100, the radiator 220, and the radiator 230 are fixedly connected through the bolts 110, the case 100 and the radiator 220 are provided with circular holes, the radiator 230 is provided with screw holes, and when assembled, the bolts 110 pass through the circular holes provided in the case 100 and the radiator 220 and are screwed into the screw holes of the radiator 230, and the case 100 and the radiator 230 are continuously closed in the process of tightening the bolts 110, thereby clamping the heat conductive gasket 300 and the cold conductive gasket 400, and the heat conductive gasket 300 and the cold conductive gasket 400 are slightly deformed, thereby eliminating the gap.

It will be appreciated that the coverage area of the heat-conducting gasket 300 and the cold-conducting gasket 400 is larger than the area where the bolt 110 is located, so, as shown in fig. 5, the heat-conducting gasket 300 is provided with a through hole 301 for the bolt 110 to pass through, and after the heat-conducting gasket 300 is assembled to surround the bolt 110, the heat-conducting gasket 300 can be positioned by using the bolt 110 to prevent the heat-conducting gasket 300 from deviating. The cold guide gasket 400 is also provided with a through hole for the bolt 110 to pass through, and the bolt 110 is used for helping to position the cold guide gasket 400, so that the cold guide gasket 400 is prevented from deviating.

It can be understood that the refrigerator case 100 has the foaming layer 102, the foaming layer 102 injects the foaming material into the interlayer of the refrigerator case 100, and the foaming material solidifies and fixes after reacting, due to the limitation of the bolts 110, the deformation of the refrigerator case 100 around the bolts 110 is smaller, and the deformation of the refrigerator case 100 is relatively larger at the edge of the heat-conducting gasket 300, so that the heat-conducting gasket 300 is set to a shape with thin center and thick periphery, that is, the thickness of the periphery of the heat-conducting gasket 300 is larger than that of the center, in the foaming process, the periphery of the heat-conducting gasket 300 is larger, the deformation of the periphery of the heat-conducting gasket 300 can apply pressure to the refrigerator case 100, so that the expansion force of the foaming material is balanced, the heat-conducting gasket 300 and the refrigerator case 100 are tightly attached, no gap is generated, heat transfer is facilitated, and heat dissipation efficiency is improved. Similarly, the cold guide gasket 400 may be formed to have a thin center and thick periphery, which helps to eliminate gaps.

The embodiments of the present utility model have been described in detail with reference to the accompanying drawings, but the present utility model is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present utility model.

Claims (10)

1. Refrigeration equipment, characterized in that it comprises:

the box body is internally provided with a compartment;

the semiconductor refrigeration module comprises a semiconductor refrigeration chip, a radiator and a radiator, wherein the semiconductor refrigeration chip is provided with a cold end and a hot end, the cold end is connected with the radiator, the radiator is connected with the side wall of the compartment, the hot end is connected with the radiator, and the radiator is positioned outside the box body;

And the heat conducting gasket is arranged between the box body and the radiator, so that part of heat of the radiator is guided to the box body through the heat conducting gasket.

2. The refrigeration appliance of claim 1 wherein said thermally conductive gasket is a flexible gasket having a thermal conductivity of 1 to 8W/(m x K).

3. A refrigeration unit as claimed in claim 1 or claim 2 wherein said housing, said heat sink and said heat sink are fixedly connected by means of bolts, said thermally conductive gasket being provided with through holes for said bolts to pass through.

4. A refrigeration unit as recited in claim 3 wherein said cabinet is provided with a foam layer surrounding said compartment, said heat sink is located in said foam layer, said heat sink is provided with heat conductive blocks located in said foam layer and connected to said hot end, and said through holes are plural and are spaced apart along the circumference of said heat conductive blocks.

5. The refrigeration apparatus according to claim 4, wherein the heat conductive pad is disposed in a direction extending toward a center along an edge of the heat conductive pad, and a thickness of the heat conductive pad is gradually reduced.

6. The refrigeration unit of claim 2 wherein the side of the heat sink facing the cabinet is a first side, and the thermally conductive gasket is attached to the first side.

7. The refrigeration unit as recited in claim 1 wherein said housing has an outer wall that is a metal shell and said thermally conductive gasket is attached to said metal shell.

8. The refrigeration unit as recited in claim 1 or 7 wherein said housing includes a metal liner, an inner cavity of said metal liner being said compartment, said heat sink being connected to said metal liner.

9. The refrigeration unit as recited in claim 8 wherein a cold conducting gasket is disposed between said cold sink and said metal liner.

10. The refrigeration unit of claim 1 wherein said heat sink has a cooling fan attached thereto, said cooling fan being located on a side of said heat sink facing away from said cabinet.