CN221405947U - Chip test carrier and equipment - Google Patents

Abstract

The application relates to a chip test carrier and equipment, the chip test carrier comprises a base, a test seat and a carrier plate, wherein: the test seat is detachably connected to the base and is provided with at least one accommodating groove; the carrier plate is detachably arranged in the accommodating groove and is provided with a plurality of bearing areas for bearing the chip to be tested. According to the chip test carrier provided by the application, the base, the test seat and the carrier plate are designed to be detachably connected, when the specification of the chip to be tested changes, the carrier plate can be replaced only by releasing the connection relation between the carrier plate and the test seat, so that the carrier plate is suitable for carrying chips to be tested with different specifications, the alternate feeding of the chips to be tested in batches can be realized, the test efficiency of the chips to be tested is improved, the test cost of the chips to be tested is reduced, and when the specification of the carrier plate changes, the connection relation between the test seat and the base is released, so that the test seat can be replaced, the carrier plate with different specifications can be suitable for carrying the chips to be tested, and the test cost of the chips to be tested is reduced.

Description

Chip test carrier and equipment

Technical Field

The present application relates to the field of chip testing technologies, and in particular, to a chip testing carrier and a device.

Background

With the development of technology, chips are widely used with high integration and stable performance, and instruments such as lasers, photodetectors, modulators and the like are applied to the chips. Chips often require performance testing after packaging is complete to screen out electronic chips that are defective or otherwise unable to meet the conditions of use. However, since the chip to be tested has a small size, in order to prevent the chip to be tested from being damaged, the chip to be tested is usually placed on a carrier, and the carrier and the chip to be tested are fixed on a testing device together for testing the performance of the chip.

When the specification of the chip to be tested changes, the whole set of carriers needs to be replaced to carry and detect the chip to be tested again, the same test equipment needs to be provided with carriers with more specifications, the test cost of the chip is increased, the chip to be tested shares one set of carriers, only one batch of chips can be tested in unit time, and the test efficiency is low.

Disclosure of Invention

Based on this, it is necessary to provide a chip test carrier and apparatus for solving the problems of high test cost and low test efficiency of the existing chip.

A chip test carrier, the chip test carrier comprising:

A base;

the test seat is detachably connected to the base and is provided with at least one accommodating groove;

The carrier plate is detachably arranged in the accommodating groove and is provided with a plurality of bearing areas for bearing the chip to be tested.

In one embodiment, the test seat is provided with a first avoidance groove, and the first avoidance groove is communicated with the accommodating groove, so that the carrier plate can be taken and placed conveniently;

And/or the number of the groups of groups,

The base is provided with a second avoidance groove and a mounting groove for bearing the test seat, and the second avoidance groove is communicated with the mounting groove, so that the test seat can be conveniently taken and placed.

In one embodiment, the carrier plate is disposed in the accommodating groove in a threaded and/or clamping manner.

In one embodiment, the chip test carrier further includes two first connectors, and the two first connectors are simultaneously connected to the carrier plate and the test seat, and are disposed at intervals along a circumferential direction of the carrier plate.

In one embodiment, the test seat is disposed on the base by screwing and/or clamping.

In one embodiment, the chip test carrier further includes two second connectors, and the two second connectors are simultaneously connected to the test seat and the base, and are disposed at intervals along the circumferential direction of the test seat.

In one embodiment, the chip test carrier further comprises a base, a heat source and a temperature control component, wherein the base is connected to the base, the heat source is embedded in the base and used for providing heat for the carrier plate, and the temperature control component is embedded in the base and used for controlling the heat quantity transferred from the heat source to the carrier plate.

In one embodiment, the temperature control assembly comprises a temperature sensor and a cold source connected with the temperature sensor in a signal manner, and the temperature sensor is embedded in the base and is used for acquiring the heat of the carrier plate.

In one embodiment, the chip test carrier further includes a heat conducting member connected to the heat source and in contact with the base.

A chip testing apparatus, the chip testing apparatus comprising:

the chip test carrier according to any one of the above technical solutions.

According to the chip testing carrier and the device, the base, the testing seat and the carrier plates are designed to be detachably connected, when the specifications of the chips to be tested change, the carrier plates can be replaced only by releasing the connection relation between the carrier plates and the testing seat, so that the carrier plates are suitable for carrying the chips to be tested with different specifications, in the process of testing one batch of chips to be tested, the loading operation of the chips to be tested is performed on the other carrier plates, after the testing process of the chips to be tested is completed, the carrier plates for loading the chips to be tested and the carrier plates for carrying the chips to be tested after the testing is completed are replaced, the alternate loading of the chips to be tested in batches can be realized, the testing efficiency of the chips to be tested is improved, and the testing cost of the chips to be tested is reduced. And when the specification of the carrier plate changes, the connection relation between the test seat and the base is released, so that the test seat can be replaced, the carrier plate is suitable for carrying carrier plates with different specifications, and the test cost of the chip to be tested is reduced.

Drawings

Fig. 1 is an exploded view of a chip test carrier provided in some embodiments.

Fig. 2 is an exploded view of a base, test seat and carrier module provided in some embodiments.

Fig. 3 is an exploded view of a module formed by a test seat and a carrier plate according to some embodiments.

Reference numerals:

100. Chip test carrier;

110. A base; 111. a second avoidance groove; 112. a mounting groove; 120. a test seat; 121. a receiving groove; 122. a first avoidance groove; 130. a carrier plate; 131. a carrying area; 140. a first connector; 150. a second connector; 160. a base; 170. a heat source; 180. a temperature control assembly; 181. a temperature sensor; 182. a cold source; 183. a heat conductive member; 1831. a thermally conductive gasket; 1832. a heat conductive plate; 184. and a protective plate.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

The following describes the technical scheme provided by the embodiment of the application with reference to the accompanying drawings.

Referring to fig. 1-3, the present application provides a chip test carrier 100, wherein the chip test carrier 100 includes a base 110, a test seat 120 and a carrier 130. The chip testing carrier 100 can be used for carrying a chip to be tested, and can be configured in a chip testing device to perform performance test on the chip to be tested.

The test seat 120 is connected to the base 110, and the test seat 120 is detachable from the base 110. The test seat 120 is provided with at least one accommodating groove 121, and preferably, the accommodating groove 121 is integrally formed on the test seat 120 by injection molding, extrusion and the like, so as to simplify the forming mode of forming the accommodating groove 121 on the test seat 120.

The carrier 130 is disposed in the accommodating groove 121 in an embedding manner, and the carrier 130 and the test seat 120 are detachable. The carrier 130 is provided with a plurality of carrying areas 131 for carrying chips to be tested, for example, the plurality of carrying areas 131 are distributed on the carrier 130 in an array manner, so that a plurality of chips to be tested can be carried on the carrier 130 at the same time, and the chips to be tested are carried out in batches for carrying test, so that the test efficiency of the chips to be tested is improved. Preferably, the carrying area 131 is integrally formed on the carrier 130 by injection molding, casting, etc., so as to simplify the forming manner of forming the carrying area 131 on the carrier 130.

The chip testing carrier 100 is designed to detachably connect the base 110, the test seat 120 and the carrier 130, when the specifications of the chips to be tested change, the carrier 130 can be replaced only by releasing the connection relationship between the carrier 130 and the test seat 120 so as to adapt to the loading of the chips to be tested with different specifications, and in the process of testing one batch of chips to be tested, the loading operation of the chips to be tested is performed on the other carrier 130, after the testing process of the chips to be tested is completed, the carrier 130 for loading the chips to be tested and the carrier 130 for carrying the chips to be tested after the testing process is completed are replaced, so that the alternate loading of the chips to be tested in batches can be realized, the loading and unloading time of the chips to be tested is saved, the testing efficiency of the chips to be tested is improved, and the testing cost of the chips to be tested is reduced. In addition, when the specification of the carrier 130 changes, the connection relationship between the test seat 120 and the base 110 is released, so that the test seat 120 can be replaced, thereby adapting to the carrying of the carrier 130 with different specifications and reducing the test cost of the chip to be tested.

In order to facilitate the picking and placing operations of the carrier 130 and the test seat 120, in an embodiment, referring to fig. 2 and 3, the test seat 120 is provided with a first avoiding groove 122, the first avoiding groove 122 is communicated with the accommodating groove 121, and the first avoiding groove 122 is convenient for picking and placing the carrier 130. Specifically, when the carrier 130 needs to be disassembled and replaced, the connection relationship between the carrier 130 and the test seat 120 is first released, then the operator takes and places the carrier 130 in the accommodating groove 121, at this time, the first avoiding groove 122 can avoid the hand of the operator, that is, the first avoiding groove 122 can reserve the operation space for taking and placing the carrier 130 by the operator, so that the carrier 130 is convenient to be disassembled and replaced. Preferably, the number of the first avoidance grooves 122 is two, and the two first avoidance grooves 122 are respectively arranged at two opposite sides of the accommodating groove 121, so as to avoid the hands of the operator.

The base 110 is provided with a second avoiding groove 111 and a mounting groove 112, and the mounting groove 112 is used for bearing the test seat 120. The second avoidance groove 111 is communicated with the mounting groove 112, and the second avoidance groove 111 is convenient for taking and placing the test seat 120. Specifically, when the test seat 120 needs to be disassembled and replaced, the connection relationship between the test seat 120 and the base 110 is first released, then the operator takes and places the test seat 120 in the mounting groove 112, at this time, the second avoidance groove 111 can avoid the hand of the operator, that is, the second avoidance groove 111 can reserve the operation space for the operator to take and place the test seat 120, so that the disassembly and replacement operations for the test seat 120 are facilitated. Preferably, the number of the second avoidance grooves 111 is two, and the two second avoidance grooves 111 are respectively arranged at two opposite sides of the mounting groove 112 so as to avoid the hands of the operator.

In an embodiment, referring to fig. 2 and fig. 3, the carrier 130 is disposed in the accommodating groove 121 by screwing and/or clamping. In other words, the carrier 130 may be disposed in the accommodating groove 121 only by screwing, and when the carrier 130 is required to be detached from the test seat 120, the detachment operation of the carrier 130 on the test seat 120 can be achieved only by releasing the screwing relationship between the carrier 130 and the test seat 120. The carrier 130 may be further disposed in the accommodating groove 121 in a clamping manner, and when the carrier 130 needs to be detached from the test seat 120, the detachment operation of the carrier 130 on the test seat 120 can be achieved only by releasing the clamping relationship between the carrier 130 and the test seat 120. The carrier 130 may be disposed in the accommodating groove 121 in a screwing and clamping manner, and when the carrier 130 is required to be detached from the test seat 120, the screwing and clamping relationship between the carrier 130 and the test seat 120 is required to be released, so as to realize the detachment operation of the carrier 130 on the test seat 120.

Further, referring to fig. 2 and 3, the chip test carrier 100 further includes two first connectors 140. The two first connecting members 140 are simultaneously connected to the carrier 130 and the test socket 120, so as to realize detachable connection between the carrier 130 and the test socket 120. If the carrier 130 is connected to the test seat 120 by screwing, the first connecting member 140 may be bolts, and coaxial and communicating threaded holes may be formed on the carrier 130 and the test seat 120, and when two bolts are correspondingly inserted into the two threaded holes, the carrier 130 may be screwed to the test seat 120 by two bolts. For example, when the carrier 130 is connected to the test socket 120 by means of a clamping connection, the first connecting member 140 may be a latch, and the carrier 130 may be clamped to the test socket 120 by means of two latches. Preferably, the two first connecting members 140 are disposed at intervals along the circumferential direction of the carrier 130, for example, when the carrier 130 is a rectangular plate, the two first connecting members 140 are disposed at two opposite corners of the carrier 130, for example, when the carrier 130 is a circular plate, the two first connecting members 140 are disposed at two opposite sides of the carrier 130. By arranging the two first connecting members 140 at the relatively far positions of the carrier 130, on one hand, the connection reliability of the first connecting members 140 to the carrier 130 and the test seat 120 can be improved, and on the other hand, when the disassembling operation of the carrier 130 on the test seat 120 needs to be executed, only the connection relation between the two first connecting members 140 and the carrier 130 and the test seat 120 needs to be released, so that the disassembling efficiency of the carrier 130 on the test seat 120 is improved.

It should be noted that, in other possible embodiments, the number of the first connecting members 140 may be four, six, or other numbers, for example, when the number of the first connecting members 140 is four, the four first connecting members 140 are respectively disposed at four corners of the carrier 130. The specific number and the setting positions of the first connecting members 140 are not limited, and the present application can be actually set according to the requirement.

In one embodiment, referring to fig. 2 and 3, the test socket 120 is disposed on the base 110 by screwing and/or clamping. In other words, the test socket 120 may be disposed on the base 110 only by screwing, and when the test socket 120 is to be detached from the base 110, the detachment operation of the test socket 120 on the base 110 can be achieved by only releasing the screwing relationship between the carrier 130 and the test socket 120. The test seat 120 may be further disposed on the base 110 by a clamping manner, and when the test seat 120 is to be detached from the base 110, the detachment operation of the test seat 120 on the base 110 can be achieved only by releasing the clamping relationship between the test seat 120 and the base 110. The test seat 120 may be disposed on the base 110 in a screwing and clamping manner, and when the test seat 120 is required to be detached from the base 110, the screwing and clamping relationship between the test seat 120 and the base 110 is required to be released, so as to realize the detachment operation of the test seat 120 on the base 110.

Further, referring to fig. 2 and 3, the chip test carrier 100 further includes two second connectors 150. The two second connectors 150 are simultaneously connected to the test socket 120 and the base 110 to achieve a detachable connection between the test socket 120 and the base 110. If the test socket 120 is connected to the base 110 by screwing, the second connecting member 150 may be a bolt, and coaxial and communicating threaded holes may be formed on both the test socket 120 and the base 110, and when two bolts are correspondingly inserted into the two threaded holes, the test socket 120 may be screwed to the base 110 by two bolts. For another example, when the test socket 120 is connected to the base 110 by means of a clamping connection, the second connecting member 150 may be a latch, and the test socket 120 may be clamped to the base 110 by means of two latches. Preferably, the two second connecting members 150 are disposed at intervals along the circumferential direction of the carrier 130, for example, when the test seat 120 is a rectangular plate, the two second connecting members 150 are disposed at two opposite corners of the test seat 120, and for example, when the test seat 120 is a circular plate, the two second connecting members 150 are disposed at two opposite sides of the test seat 120. By arranging the two second connecting members 150 at the relatively far positions of the test seat 120, on one hand, the connection reliability of the second connecting members 150 to the test seat 120 and the base 110 can be improved, and on the other hand, when the disassembly operation of the test seat 120 on the base 110 needs to be executed, the connection relationship between the two second connecting members 150 and the test seat 120 and the base 110 only needs to be released, so that the disassembly efficiency of the test seat 120 on the base 110 is improved.

It should be noted that, in other possible embodiments, the number of the second connectors 150 may be four, six, or other numbers, for example, when the number of the second connectors 150 is four, the four second connectors 150 are disposed at four corners of the test socket 120, respectively. The specific number and the setting positions of the second connecting members 150 are not limited to the present application, and may be actually set according to the needs.

Since the chip under test is generally accompanied by a temperature test requirement during the testing process, in one embodiment, referring to fig. 1 and 2, the chip testing carrier 100 further includes a base 160, a heat source 170, and a temperature control component 180. The base 160 is connected to the base 110, and the heat source 170 is embedded in the base 160, where the heat source 170 is used to provide heat to the carrier 130, for example, the heat source 170 is a heating block, and the heat is generated by the heat source 170 and transferred to the carrier 130, so as to create a temperature environment of the chip under test during the testing process. The temperature control component 180 is embedded inside the base 160, and the temperature control component 180 is used for controlling the amount of heat transferred from the heat source 170 to the carrier 130, so that the chip to be tested carried by the carrier 130 is in a preset temperature environment. In this embodiment, the test socket 120 is made of engineering plastics such as Polyetheretherketone (PEEK), so that the test socket 120 has sufficient supporting strength, can effectively support the carrier 130, and reduces the thermal load borne by the test socket 120 and prolongs the service life of the test socket 120 during the temperature test of the chip to be tested. The carrier 130 and the base 110 are made of materials with excellent heat conduction properties, such as aluminum, copper, etc., so as to transfer the heat generated by the heat source 170 to the carrier 130, thereby creating a temperature testing environment for the chip to be tested.

Specifically, referring to fig. 1 and 2, the temperature control assembly 180 includes a temperature sensor 181 and a cold source 182. The temperature sensor 181 is embedded on the base 160 to realize the installation and fixation of the temperature sensor 181, the temperature sensor 181 is used for acquiring the heat quantity of the carrier plate 130, the temperature sensor 181 is in signal connection with the cold source 182, the temperature sensor 181 can feed back the acquired heat quantity signal of the carrier plate 130 to the cold source 182, and the heat quantity generated by the heat source 170 is adjusted through the cold source 182 so as to adjust the heat quantity transmitted to the carrier plate 130 by the heat source 170 when the heat quantity of the carrier plate 130 deviates from the preset temperature. In this embodiment, the cold source 182 may be a cold water plate, and the cold water plate is connected with a proportional valve and a water cooler, and uses the fluorinated liquid as a refrigerating medium, so that a refrigerating environment with a larger range can be provided, and the magnitude of the cold energy is precisely controlled by the proportional valve, so as to regulate the magnitude of the heat transferred from the heat source 170 to the carrier 130.

In this embodiment, as shown in fig. 1-3, the temperature sensor 181 protrudes to the surface of the carrier 130 on the side where the carrying area 131 is provided, for example, when the chip to be tested is placed in the carrying area 131, the sensing end of the temperature sensor 181 is flush with the position of the chip to be tested, so that the temperature sensor 181 and the chip to be tested are in the same testing environment in the process of testing the chip to be tested. Compared with the traditional temperature sensor 181 which senses the temperature of the chip to be tested in a non-contact mode, the temperature sensed by the temperature sensor 181 has deviation from the actual testing temperature of the chip to be tested, and the temperature sensor 181 and the chip to be tested are arranged in the same testing environment, so that the temperature sensing precision of the temperature sensor 181 to the chip to be tested is higher, and the testing precision of the chip to be tested can be improved. Of course, in other possible embodiments, a humidity component may be further disposed in the chip testing carrier 100 to create a humidity testing environment of the chip to be tested, so as to meet the humidity testing requirement of the chip to be tested.

Further, referring to fig. 1 and 2, the chip test carrier 100 further includes a heat conducting member 183. The heat conducting member 183 is connected to the heat source 170, and the heat conducting member 183 contacts the base 110 to transfer the heat generated by the heat source 170 to the base 110, and the heat is fed back to the carrier 130 through the base 110, so as to create a temperature testing environment of the chip to be tested. In this embodiment, the heat conducting member 183 includes a heat conducting pad 1831 and a heat conducting plate 1832, wherein the heat conducting pad 1831 and the heat conducting plate 1832 are reasonably disposed on the base 160 and located between the heat source 170 and the carrier 130, and heat is transferred to the carrier 130 through the heat conducting pad 1831 and the heat conducting plate 1832 to create a temperature testing environment of the chip to be tested.

In addition, referring to fig. 1, the chip test carrier 100 further includes a protection plate 184, where the protection plate 184 is disposed below the base 110 to support the base 110. Because the chip to be tested can bear great pressure in the compression joint test process, the pressure can be transmitted to the base 110 through the loading plate 130 and the test seat 120, and the base 110 is supported through the protection plate 184, so that the base 110 is prevented from being deformed, bent and other bad phenomena due to overlarge pressure, the position of the chip to be tested can not be changed, the compression joint test reliability of the chip to be tested is ensured, and the service life of the chip test carrier 100 can be prolonged.

In addition, referring to fig. 1, the application also provides a chip testing device, which includes the chip testing carrier 100 according to the above technical scheme.

The chip testing device is designed to be detachably connected with the base 110, the test seat 120 and the carrier plate 130 in pairs, when the specification of the chip to be tested changes, the carrier plate 130 can be replaced only by releasing the connection relation between the carrier plate 130 and the test seat 120 so as to adapt to the bearing of chips to be tested with different specifications, and the alternate feeding of the chips to be tested in batches can be realized, so that the testing efficiency of the chips to be tested is improved, the testing cost of the chips to be tested is reduced, and when the specification of the carrier plate 130 changes, the connection relation between the test seat 120 and the base 110 is released, and the test seat 120 can be replaced so as to adapt to the bearing of the carrier plates 130 with different specifications, and the testing cost of the chips to be tested is reduced.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims (10)

1. A chip test carrier, the chip test carrier comprising:

A base;

the test seat is detachably connected to the base and is provided with at least one accommodating groove;

The carrier plate is detachably arranged in the accommodating groove and is provided with a plurality of bearing areas for bearing the chip to be tested.

2. The chip test carrier according to claim 1, wherein the test seat is provided with a first avoidance groove, and the first avoidance groove is communicated with the accommodating groove, so that the carrier plate is convenient to take and place;

And/or the number of the groups of groups,

The base is provided with a second avoidance groove and a mounting groove for bearing the test seat, and the second avoidance groove is communicated with the mounting groove, so that the test seat can be conveniently taken and placed.

3. The chip testing carrier according to claim 1, wherein the carrier plate is disposed in the accommodating groove in a threaded and/or clamping manner.

4. The chip test carrier according to claim 3, further comprising two first connectors, wherein the two first connectors are simultaneously connected to the carrier plate and the test socket and are disposed at intervals along a circumferential direction of the carrier plate.

5. The chip test carrier according to claim 1, wherein the test socket is disposed on the base by screwing and/or clamping.

6. The die test carrier of claim 5, further comprising two second connectors, wherein the two second connectors are simultaneously connected to the test socket and the base and are disposed at intervals along a circumferential direction of the test socket.

7. The chip test carrier of claim 1, further comprising a base, a heat source and a temperature control assembly, wherein the base is connected to the base, the heat source is embedded in the base for providing heat to the carrier, and the temperature control assembly is embedded in the base for controlling the amount of heat transferred from the heat source to the carrier.

8. The chip test carrier of claim 7, wherein the temperature control assembly comprises a temperature sensor and a cold source in signal connection with the temperature sensor, and the temperature sensor is embedded in the base for obtaining the heat of the carrier.

9. The die test carrier of claim 7, further comprising a thermally conductive member coupled to the heat source and in contact with the base.

10. A chip testing apparatus, the chip testing apparatus comprising:

the chip test carrier of any one of claims 1-9.