CN221381552U - Heat dissipation cover structure and electronic water pump - Google Patents

Abstract

The utility model relates to the technical field of liquid pumps, in particular to a heat dissipation cover structure and an electronic water pump. The heat dissipation cover structure comprises a heat dissipation plate and a cover body connecting piece, wherein the heat dissipation plate is in a disc-shaped structure, the cover body connecting piece is connected with the outer Zhou Baosu of the heat dissipation plate, the heat dissipation plate is a heat dissipation material piece, and the cover body connecting piece is used for being connected with a device main body for installing the heat dissipation cover structure; one side of the radiating plate is provided with a radiating boss which is used for contacting with components on the control circuit board; the other surface of the heat dissipation plate is provided with heat dissipation columns and/or heat dissipation ribs. The heat radiation boss is used for contacting with the components on the control circuit board, can directly absorb the heat of the components to radiate the components, and can increase the heat radiation effect of the heat radiation plate on the components; meanwhile, the contact area between the heat dissipation plate and the air can be increased by the heat dissipation columns and/or the heat dissipation ribs, so that heat on the heat dissipation plate can be rapidly diffused into the air, and the heat dissipation effect of the heat dissipation plate is increased.

Description

Heat dissipation cover structure and electronic water pump

Technical Field

The utility model relates to the technical field of liquid pumps, in particular to a heat dissipation cover structure and an electronic water pump.

Background

The electronic water pump is a water pump which adopts piezoelectric materials as a power device, thoroughly realizes electronization from control to driving, and completely controls liquid transmission by an electronic integrated system, thereby realizing adjustability and accuracy of liquid transmission. At present, the electronic water pump is widely applied to the field of new energy automobiles.

The control circuit board in the electronic water pump is one of the core parts, and when the electronic water pump operates, the control circuit board can generate a large amount of heat, especially the components on the control circuit board can generate a large amount of heat, and if the heat cannot be timely and effectively discharged, the damage of each component on the control circuit board can be caused, so that the service life and the performance of the electronic water pump are affected.

In order to realize the heat dissipation of the control circuit board, the control circuit board is arranged at the rear end of the electronic water pump, and the control circuit board dissipates heat through the rear cover of the electronic water pump. However, the rear cover of the electronic water pump in the prior art has a defect of poor heat dissipation effect.

Disclosure of utility model

In view of the above, the present utility model is directed to a heat dissipation cover structure and an electronic water pump, so as to solve or partially solve the problem that the existing rear cover of the electronic water pump has poor heat dissipation effect.

In order to achieve the above purpose, the technical scheme of the utility model is realized as follows:

In a first aspect, the utility model discloses a heat dissipation cover structure, which comprises a heat dissipation plate and a cover body connecting piece, wherein the heat dissipation plate is in a disc-shaped structure, the cover body connecting piece is connected with the outer Zhou Baosu of the heat dissipation plate, the heat dissipation plate is a heat dissipation material piece, and the cover body connecting piece is used for being connected with a device main body for installing the heat dissipation cover structure; a heat radiation boss is arranged on one surface of the heat radiation plate and is used for being in contact with components on the control circuit board; and the other surface of the heat dissipation plate opposite to the heat dissipation plate is provided with heat dissipation columns and/or heat dissipation ribs.

Further, the heat dissipation boss has a plurality of, and a plurality of heat dissipation bosses face away from the height of one side of heating panel has at least one.

Further, the heat dissipation columns are multiple, and the heights of the heat dissipation columns, which deviate from the opposite other surfaces of the heat dissipation plates, gradually decrease from the centers of the heat dissipation columns to the outer circumferences of the heat dissipation columns.

Further, the periphery of the other surface opposite to the heat dissipation plate is provided with an annular convex rib, and the cover body connecting piece is coated with plastic on the annular convex rib.

Further, the annular convex rib is provided with a breaking groove, and the cover body connecting piece is further coated with plastic.

Further, an annular groove is formed in the periphery of one face of the heat dissipation plate, and at least part of the annular groove is molded by the cover body connecting piece.

Further, the cover body connecting piece is coated with the annular groove, and the sealing glue is arranged on the rest part of the annular groove.

Further, the heat dissipation plate is a metal material piece.

Further, the cover body connecting piece is a plastic material piece.

In a second aspect, the utility model also discloses an electronic water pump, which comprises an equipment main body, a control circuit board and the heat dissipation cover structure, wherein the equipment main body is provided with an installation cavity; the control circuit board is arranged in the mounting cavity and comprises components; the heat dissipation cover structure covers the mounting cavity, and the heat dissipation cover structure is in contact with the component.

Compared with the prior art, the heat dissipation cover structure has the following advantages:

According to the radiating cover structure, the radiating plate is a radiating material piece and can be used for radiating. The heat radiation boss is arranged on the heat radiation plate and is used for contacting with the components on the control circuit board, and can directly absorb the heat of the components to radiate the components, so that the heat radiation effect of the heat radiation plate on the components can be increased; meanwhile, the heat radiating columns and/or the heat radiating ribs on the heat radiating plate can increase the contact area between the heat radiating plate and air, so that heat on the heat radiating plate can be rapidly diffused into the air, and the heat radiating effect of the heat radiating plate is increased. Moreover, the cover body connecting piece is connected with the outer Zhou Baosu of the heat dissipation plate, so that the sealing effect between the cover body connecting piece and the heat dissipation plate is good, the heat dissipation cover structure has good sealing performance, and the use requirement of the electronic water pump is met. In summary, the heat dissipation cover structure of the embodiment of the utility model has the advantages of good heat dissipation effect and good sealing performance.

The foregoing description is only an overview of the present utility model, and is intended to be implemented in accordance with the teachings of the present utility model in order that the same may be more clearly understood and to make the same and other objects, features and advantages of the present utility model more readily apparent.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments of the present utility model will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural view of a heat dissipating cover structure according to a first angle of an embodiment of the present utility model;

fig. 2 is a schematic structural view of a heat dissipating cover structure according to a second angle of the embodiment of the present utility model;

FIG. 3 is a schematic diagram of a front view of the heat dissipating cover structure shown in FIG. 1;

Fig. 4 is a schematic structural diagram of a first angle of a heat dissipation plate according to an embodiment of the utility model;

fig. 5 is a schematic structural diagram of a second angle of the heat dissipation plate according to an embodiment of the utility model;

FIG. 6 is a schematic view illustrating a structure of a cover connector according to a first angle of the present utility model;

FIG. 7 is a schematic view illustrating a structure of a cover connector according to a second embodiment of the present utility model;

fig. 8 is a schematic structural diagram of a top view of a heat dissipating cover structure according to an embodiment of the present utility model;

FIG. 9 is a schematic diagram of a cross-sectional view of the heat dissipating cover structure A-A shown in FIG. 8;

FIG. 10 is a schematic diagram of a part of the heat dissipating cover structure C shown in FIG. 9;

FIG. 11 is a schematic diagram of a cross-sectional view of the heat dissipating cover structure B-B shown in FIG. 8;

FIG. 12 is a schematic view of a part of the heat dissipating cover structure D shown in FIG. 11;

Fig. 13 is a schematic structural diagram of an electronic water pump according to an embodiment of the present utility model;

Fig. 14 is a schematic structural diagram of a control circuit board according to an embodiment of the utility model.

Reference numerals illustrate:

10-a heat dissipation plate; 11-a heat radiation boss; 12-a heat radiation column; 13-annular ribs; 14-breaking grooves; 15-an annular groove; 16-structural bosses;

20-a cover connector; 21-a limit column;

30-an apparatus body; 31-a housing; 33-a heat sink cap structure;

40-a control circuit board; 41-component.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

An embodiment of the present application provides a heat dissipation cover structure, and referring to fig. 1 and 2, fig. 1 and 2 show a schematic structural diagram of the heat dissipation cover structure of the embodiment of the present application, where the heat dissipation cover structure is applied to an electronic water pump, and specifically is connected to an apparatus main body 30 of the electronic water pump.

Referring further to fig. 1 and 2, the heat dissipating cover structure of the embodiment of the present application includes a heat dissipating plate 10 and a cover connecting member 20, the heat dissipating plate 10 has a disc-shaped structure, the cover connecting member 20 is connected to an outer Zhou Baosu of the heat dissipating plate 10, the heat dissipating plate 10 is a heat dissipating material, and the cover connecting member 20 is used for connecting to an apparatus main body 30 to which the heat dissipating cover structure is mounted; referring to fig. 5, a heat dissipation boss 11 is provided on one surface of the heat dissipation plate 10, and the heat dissipation boss 11 is used for contacting with a component 41 on the control circuit board 40; referring to fig. 4, the heat dissipation plate 10 is provided at the opposite side thereof with heat dissipation columns 12 and/or heat dissipation ribs, and the heat dissipation columns 12 and/or the heat dissipation ribs serve to increase the contact area of the heat dissipation plate 10 with air, thereby increasing the heat dissipation effect of the heat dissipation plate 10.

Wherein, when the heat dissipation cover structure is used, one surface of the heat dissipation plate 10 faces the device main body 30, and the opposite surface of the heat dissipation plate 10 faces away from the device main body 30.

In the heat dissipation cover structure of the embodiment of the present application, the heat dissipation plate 10 is a heat dissipation material, and the heat dissipation plate 10 may be used for heat dissipation. The heat radiation boss 11 arranged on the heat radiation plate 10 is used for contacting with the component 41 on the control circuit board 40, the heat radiation boss 11 can directly absorb the heat of the component 41 to radiate the component 41, and the heat radiation effect of the heat radiation plate 10 on the component 41 can be increased; meanwhile, the heat dissipation columns 12 and/or the heat dissipation ribs on the heat dissipation plate 10 can increase the contact area between the heat dissipation plate 10 and the air, so that the heat on the heat dissipation plate 10 is rapidly diffused into the air, and the heat dissipation effect of the heat dissipation plate 10 is increased. Moreover, the cover body connecting piece 20 is connected with the outer Zhou Baosu of the heat radiation plate 10, so that the sealing effect between the cover body connecting piece 20 and the heat radiation plate 10 is good, and the heat radiation cover structure has good sealing performance, and meets the use requirement of the electronic water pump. In summary, the heat dissipation cover structure of the embodiment of the application has the advantages of good heat dissipation effect and good sealing performance.

Alternatively, the heat dissipation plate 10 is a metal material member. The metal material piece can transfer heat and has the advantage of good heat transfer effect; the heat dissipation plate 10 is a metal material piece, can also meet the structural strength requirement of the heat dissipation cover structure, and is suitable for being used in the heat dissipation cover structure.

Further, the specific material of the heat dissipation plate 10 may be selected according to the requirement, and a metal material with a higher thermal conductivity is selected, for example, the heat dissipation plate 10 is an aluminum piece, an aluminum alloy piece, or the like.

Optionally, the cover connector 20 is a plastic material piece. The plastic material has the advantage of relatively low cost, is suitable for connection with the apparatus body 30, and has waterproof and dustproof functions.

It should be understood that the material of the cover connector 20 is not particularly limited in the embodiment of the present application, and the cover connector 20 may be a rubber material, for example, to meet the requirement of use.

In the heat dissipation cover structure of the embodiment of the present application, when the heat dissipation plate 10 is a metal material, and the cover connector 20 is a plastic material, the heat dissipation plate 10 is used for dissipating heat, and the cover connector 20 is used for connecting with the device main body 30. The heat dissipation cover structure has the advantages of good heat dissipation effect of the metal material piece, and simultaneously has the advantages of light weight and low cost of the plastic material piece. Therefore, the heat dissipation cover structure provided by the embodiment of the application has the advantages of light weight, low cost and high heat dissipation.

The heat radiation plate 10 and the cover body connecting piece 20 are plastic-coated structural members, so that the heat radiation cover structure has the advantages of firm connection, stable structure and good sealing performance, and has the advantage of low processing cost, and the cost of the heat radiation cover structure can be effectively reduced.

Alternatively, the heat dissipating cover structure may be formed by an over-molding process. When the heat radiation cover structure is manufactured, the heat radiation plate 10 is placed in an injection mold, molten plastic is injected into the injection mold, the molten plastic wraps the heat radiation plate 10, and the heat radiation cover structure consisting of the heat radiation plate 10 and the cover body connecting piece 20 is formed after cooling.

Alternatively, referring to fig. 5, the heat dissipating boss 11 has a plurality, and at least one of the plurality of heat dissipating bosses 11 has a height of a side facing away from the heat dissipating plate 10.

Further, when at least one of the heights of the heat dissipation boss 11 facing away from the heat dissipation plate 10 is provided, the heat dissipation boss 11 can be contacted with the components 41 with different heights, so that the heat dissipation boss 11 can directly absorb the heat of the components 41 with different heights, and the heat dissipation effect of the heat dissipation plate 10 on the components 41 is increased.

Optionally, in order to further increase the heat dissipation effect on the component 41, the heat dissipation plate 10 and the component 41 may be connected by a heat conductive adhesive.

The heat conducting glue has better heat conducting and electrical insulating properties, and can be used for connecting the heat radiating plate 10 and the component 41, so that the heat of the component 41 is directly and rapidly transferred to the heat radiating plate 10 through the heat conducting glue, and the heat radiating effect of the component 41 can be improved.

At this time, in the use process of the heat dissipating cover structure of the embodiment of the present application, the heat of the component 41 on the control circuit board 40 is transferred to the heat dissipating plate 10 through the heat conducting adhesive, the opposite surface of the heat dissipating plate 10 faces the outer side of the electronic water pump to contact with the air, and the heat of the heat dissipating plate 10 is transferred to the air through the other surface of the heat dissipating plate 10 and the heat dissipating post 12.

Optionally, the heat dissipation bosses 11 are multiple, and the multiple heat dissipation bosses 11 are disposed in a one-to-one correspondence with the multiple components 41, so as to avoid heat influence between different components 41. And the components 41 to which the heat radiation boss 11 is connected are provided to be adapted in structural size.

Alternatively, referring to fig. 3 and 4, the heat dissipation pillars 12 have a plurality of heat dissipation pillars 12, and the heights of the heat dissipation pillars 12 facing away from the opposite side of the heat dissipation plate 10 gradually decrease in a direction from the centers of the plurality of heat dissipation pillars 12 to the outer circumferences of the plurality of heat dissipation pillars 12.

Further, referring to fig. 4, in the direction away from the opposite side of the heat dissipation plate 10, the heat dissipation column located at the middle is the highest among the plurality of heat dissipation columns 12, the heat dissipation column 12 located at the edge is the lowest, and the height of the heat dissipation column 12 away from the opposite side of the heat dissipation plate 10 is gradually reduced from the center of the plurality of heat dissipation columns 12 to the outer periphery of the plurality of heat dissipation columns 12, so that the air and the heat dissipation column 12 achieve convection heat dissipation at different angles in different directions.

Alternatively, referring to fig. 4, the outer periphery of the opposite side of the heat dissipation plate 10 is provided with an annular bead 13, and further referring to fig. 8 to 10, the cover connection member 20 is molded with the annular bead 13. The above structure of the heat dissipating plate 10 can increase structural stability and sealing property of the heat dissipating plate 10 after the heat dissipating plate 10 is connected with the cover connecting member 20, and prevent the heat dissipating plate 10 from being separated from the cover connecting member 20, especially prevent the heat dissipating plate 10 from being separated from the cover connecting member 20 along the diameter direction thereof.

Alternatively, referring to fig. 4, the annular rib 13 is provided with a breaking groove 14, and further referring to fig. 8, 11 and 12, the cover connector 20 further includes the breaking groove 14.

Referring to fig. 4, the breaking groove 14 interrupts the annular rib 13, and when the cover connecting piece 20 covers the breaking groove 14, the heat dissipation plate 10 and the cover connecting piece 20 can be prevented from rotating relatively after being connected, so that the stability of the heat dissipation cover structure is improved.

Further, the number of the annular ribs 13 is not particularly limited, for example, as shown in fig. 7, three annular ribs 13 are provided, the diameters of the three annular ribs 13 are sequentially increased, a groove is formed between two adjacent annular ribs 13, and two annular grooves are formed by the three annular ribs 13. Referring to fig. 9 and 10, when the cover connector 20 is molded with the annular rib 13, a portion of the cover connector 20 is located in the groove and a portion of the cover connector is located on the annular rib 13, and at this time, the annular rib 13, that is, a side wall of the groove, can prevent the heat dissipation plate 10 and the cover connector 20 from moving in the diameter direction of the heat dissipation plate 10, so that the heat dissipation plate 10 is prevented from falling out of the cover connector 20.

Further, the number and positions of the breaking grooves 14 are not particularly limited in the embodiment of the present application, for example, as shown in fig. 4, two breaking grooves 14 are provided, and the two breaking grooves 14 are located on the middle annular rib 13.

Referring to fig. 11 and 12, when the cover connector 20 is molded around the breaking groove 14, a portion of the cover connector 20 is located in the breaking groove 14, and a portion of the cover connector 20 located in the breaking groove 14 can prevent the heat dissipation plate 10 and the cover connector 20 from rotating relatively.

Optionally, referring to fig. 5, an annular groove 15 is formed on the outer periphery of one surface of the heat dissipation plate 10, and the cover connection member 20 is molded with at least a part of the annular groove 15.

With further reference to fig. 10, after the cover connecting member 20 is molded with at least a portion of the annular groove 15, the side wall of the annular groove 15 near the outer peripheral edge of the heat dissipating plate 10 can prevent the heat dissipating plate 10 from being separated from the cover connecting member 20, so as to improve the structural stability and the sealing performance after the heat dissipating plate 10 is connected with the cover connecting member 20.

Alternatively, referring to fig. 5, the cover connector 20 is molded with a portion of the annular groove 15, and a sealant is provided in the remaining portion of the annular groove 15. The sealing glue can improve the sealing performance of the heat dissipation cover structure and meet the use requirement of the electronic water pump.

Optionally, an elastic glue is disposed between the outer periphery of the heat dissipation plate 10 and the cover connector 20.

The outer periphery of the heat sink 10 includes the outer periphery of one surface of the heat sink 10, the outer periphery of the opposite surface of the heat sink 10, and the outer periphery of the heat sink 10. When being equipped with the elastic glue between the periphery of heating panel 10 and the lid connecting piece 20, can increase the sealing performance after heating panel 10 and lid connecting piece 20 are connected, avoid the expend with heat and contract with cold of heat radiating cover structure and arouse and get the leakage risk, promoted the package of lid connecting piece 20 to heating panel 10 simultaneously and moulded the effect.

Referring further to fig. 5, the heat dissipation plate 10 is further provided with a structural boss 16, the structural boss 16 protrudes toward the opposite surface of the heat dissipation plate 10, and the structural boss 16 may increase the structural strength of the heat dissipation plate 10.

Referring to fig. 4, the partially dispersed thermal pillars 12 are disposed on the structural bosses 16.

Referring to fig. 6 and 7, the cover connector 20 is connected to the outer Zhou Baosu of the heat sink 10, a through hole is formed in the middle of the cover connector 20, and the heat sink 10 penetrates through the through hole after the cover connector 20 is connected to the heat sink 10.

With further reference to fig. 6 and 7, a limit post 21 is further formed on the periphery of the cover connector 20, where the limit post 21 is used for limiting when the device main body 30 is connected, so that the connection position of the cover connector 20 and the device main body 30 is accurate, and the cover connector 20 and the device main body 30 are prevented from rotating relatively after being connected.

The application process of the heat dissipation cover structure of the embodiment of the application comprises the following steps: when the control circuit board 40 works, heat is generated, the heat of the component 41 is quickly transferred to the heat dissipation plate 10 through the heat conduction glue, the opposite side of the heat dissipation plate 10 is in contact with air, and the heat of the heat dissipation plate 10 is transferred to the air through the opposite side of the heat dissipation plate 10 and the heat dissipation column 12.

In the heat dissipation cover structure of the embodiment of the application, the heat dissipation plate 10 is a heat dissipation material piece, the heat dissipation plate 10 can be used for dissipating heat, and the heat dissipation boss 11 arranged on the heat dissipation plate 10 is used for contacting with the component 41, so that the heat of the component 41 can be directly absorbed, and the heat dissipation effect on the component 41 can be increased; meanwhile, the heat dissipation post 12 on the heat dissipation plate 10 can increase the contact area between the heat dissipation plate 10 and the air, thereby increasing the heat dissipation effect of the heat dissipation plate 10. Therefore, the heat dissipation cover structure provided by the embodiment of the application has the advantage of good heat dissipation effect.

Moreover, the heating panel 10 of heat dissipation lid structure is the metal material spare, and the lid connecting piece 20 of heat dissipation lid structure is the plastic material spare, and lid connecting piece 20 is connected with the outer Zhou Baosu of heating panel 10 for sealing effect between lid connecting piece 20 and the heating panel 10 is good, and heat dissipation lid structure has better sealing performance, satisfies the user demand of electronic water pump. In addition, the heat radiation cover structure has the advantages of good heat radiation effect of the metal material piece, and meanwhile has the advantages of light weight and low cost of the plastic material piece, so that the heat radiation cover structure provided by the embodiment of the application has the advantages of light weight, low cost and high heat radiation.

The embodiment of the application also provides an electronic water pump, and referring to fig. 13, a schematic structural diagram of the electronic water pump according to the embodiment of the application is shown. The electronic water pump comprises an equipment main body 30, a control circuit board 40 and a heat dissipation cover structure 33, wherein the equipment main body 30 is provided with an installation cavity; the control circuit board 40 is arranged in the mounting cavity, and the control circuit board 40 comprises components 41; the heat dissipation cover structure 33 covers the mounting cavity, and the heat dissipation cover structure 33 is connected with the component 41.

The device main body 30 includes a housing 31, the housing 31 encloses a mounting cavity, and the control circuit board 40 is disposed in the mounting cavity. The housing 31 and the heat dissipating cover 33 are structured to seal the mounting cavity.

Referring to fig. 14, a plurality of components 41 are provided on the control circuit board 40, and when the control circuit board 40 is in operation, the heat productivity of some components 41 on the control circuit board 40 is small, the heat productivity of some components 41 is large, and when the heat dissipation cover structure 33 is specifically used, the heat dissipation cover structure 33 can selectively contact with the components 41 with large heat productivity.

When the electronic water pump is in operation, the control circuit board 40 generates a large amount of heat, especially the components 41 on the control circuit board 40 generate a large amount of heat, and if the heat cannot be effectively discharged in time, the components 41 on the control circuit board 40 can be damaged, so that the service life and the performance of the electronic water pump are affected. In the electronic water pump of the embodiment of the application, the heat dissipation cover structure 33 is in contact with the components 41, and the heat dissipation cover structure 33 has the advantage of good heat dissipation effect, so that the heat dissipation problem of the components 41 can be effectively solved, the performance of the control circuit board 40 is ensured, and the service life of the control circuit board 40 is prolonged; but also can realize the light weight of the electronic water pump and reduce the cost of the electronic water pump, thereby improving the market competitiveness of the electronic water pump.

It should be noted that, for simplicity of description, the method embodiments are shown as a series of acts, but it should be understood by those skilled in the art that the embodiments are not limited by the order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred, and that the acts are not necessarily all required in accordance with the embodiments of the application.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The embodiments of the present utility model have been described above with reference to the accompanying drawings, but the present utility model is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present utility model and the scope of the claims, which are to be protected by the present utility model.

Claims (10)

1. The heat dissipation cover structure is characterized by comprising a heat dissipation plate (10) and a cover body connecting piece (20), wherein the heat dissipation plate (10) is in a disc-shaped structure, the cover body connecting piece (20) is connected with the outer Zhou Baosu of the heat dissipation plate (10), the heat dissipation plate (10) is a heat dissipation material piece, and the cover body connecting piece (20) is used for being connected with an equipment main body (30) for installing the heat dissipation cover structure;

A heat radiation boss (11) is arranged on one surface of the heat radiation plate (10), and the heat radiation boss (11) is used for being in contact with a component (41) on the control circuit board (40);

The opposite side of the heat dissipation plate (10) is provided with heat dissipation columns (12) and/or heat dissipation ribs.

2. The heat dissipating cover structure according to claim 1, wherein the heat dissipating boss (11) has a plurality, and a plurality of the heat dissipating bosses (11) has at least one height of a side facing away from the heat dissipating plate (10).

3. The heat radiation cover structure according to claim 1, wherein the heat radiation posts (12) have a plurality, and the heights of the heat radiation posts (12) facing away from the opposite side of the heat radiation plate (10) gradually decrease from the center of the plurality of heat radiation posts (12) to the outer periphery of the plurality of heat radiation posts (12).

4. The heat dissipation cover structure as defined in claim 1, wherein an annular rib (13) is provided on the outer periphery of the opposite side of the heat dissipation plate (10), and the cover body connecting member (20) encapsulates the annular rib (13).

5. The heat dissipation cover structure as defined in claim 4, wherein the annular rib (13) is provided with a breaking groove (14), and the cover body connecting piece (20) further encapsulates the breaking groove (14).

6. The heat dissipating cover structure according to claim 1, wherein an annular groove (15) is provided on an outer periphery of one surface of the heat dissipating plate (10), and the cover connecting member (20) is molded with at least part of the annular groove (15).

7. The heat dissipating cover structure of claim 6, wherein said cover connector (20) is overmolded with a portion of said annular groove (15), and the remaining portion of said annular groove (15) is provided with a sealant.

8. The heat dissipating cover structure according to claim 1, wherein the heat dissipating plate (10) is a metal material piece.

9. The heat dissipating cover structure of claim 1, wherein said cover connector (20) is a plastic material piece.

10. An electronic water pump, characterized by comprising an apparatus main body (30), a control circuit board (40) and a heat radiation cover structure according to any one of claims 1 to 9, the apparatus main body (30) being provided with a mounting cavity;

the control circuit board (40) is arranged in the mounting cavity, and the control circuit board (40) comprises components (41);

The heat dissipation cover structure covers the mounting cavity, and the heat dissipation cover structure is in contact with the component (41).