CN221283412U

CN221283412U - High power density point power supply

Info

Publication number: CN221283412U
Application number: CN202323216362.8U
Authority: CN
Inventors: 谢斌; 李思琦; 陈卫东
Original assignee: Shenzhen Daneng Chuangzhi Semiconductor Co ltd
Current assignee: Shenzhen Daneng Chuangzhi Semiconductor Co ltd
Priority date: 2023-11-27
Filing date: 2023-11-27
Publication date: 2024-07-05
Anticipated expiration: 2033-11-27

Abstract

The embodiment of the utility model discloses a high-power density point power supply, which comprises the following components: the two sides of the inductor are provided with a plurality of welding copper bars, and the welding copper bars are perpendicular to the bottom surface of the inductor; the substrate is provided with a first surface, and a plurality of welding points used for welding the copper bars are arranged on two sides of the first surface; the plastic packaging material is arranged on the first surface and is provided with a plurality of through holes for accommodating the welding copper bars; the bonding copper bars are bonded to the respective bonding pads through the respective through holes. Through the mode, the embodiment of the utility model can integrate the point power supply module in the vertical direction, reduce the packaging size and the process cost and improve the space utilization rate of products; and then, heat generated by electronic elements in the plastic packaging material can be radiated through the welding copper bars of the inductor, so that the radiating effect is further improved.

Description

High power density point power supply

Technical Field

The embodiment of the utility model relates to the field of point power supply structures, in particular to a high-power density point power supply.

Background

In the design of a Point of Load (POL) power module, inductors are designed in topologies such as a topology buck, a boost or a buck-boost, so as to realize functions of conversion, management, switching and the like.

Further high-density integration of the load point power supply is required to ensure the power of the product so as to achieve miniaturization, however, the size of the inductor is generally larger in proportion, and heat is generated along with loss, so that the placement of the inductor is important. For low power, power density requirements are typically such that the inductor is placed directly on the substrate. For the case of medium and high power density requirements, the inductance will be elevated, either by copper bars, or in the form of copper bars + PCB.

Disclosure of utility model

The embodiment of the utility model mainly solves the technical problem of providing a high-power density point power supply, which can be further integrated at high density so as to realize miniaturization and reduce the packaging size.

In order to solve the technical problems, the utility model adopts a technical scheme that: providing a high power density point power supply comprising: the two sides of the inductor are provided with a plurality of welding copper bars; the substrate is provided with a first surface, and a plurality of welding points used for welding the welding copper bars are arranged on two sides of the first surface; the plastic packaging material is arranged on the first surface and is provided with a plurality of through holes for accommodating the welding copper bars; the bonding copper bars are bonded to the respective bonding pads through the respective through holes to support the inductor directly above the first surface.

In some embodiments, the first surface further has a plurality of electronic components disposed thereon.

In some embodiments, the electronic components include a resistor, a capacitor, and a power control chip.

In some embodiments, the molding compound includes a third surface and a second surface having grooves;

The second surface is attached to the first surface and the electronic component.

In some embodiments, the third surface is parallel to the first surface.

In some embodiments, a side of the inductor facing the first surface is bonded to the third surface.

In some embodiments, the solder joint includes a solder pad and a solder via.

In some embodiments, the bonding copper bars are bonded to respective bonding pads through respective vias.

In some embodiments, the bonding copper bars are bonded to respective bonding vias through respective vias.

In some embodiments, 2 welding copper bars are respectively arranged on two sides of the inductor, 2 welding points are respectively arranged on two sides of the first surface, and 4 through holes are formed in the plastic package material.

The embodiment of the utility model has the beneficial effects that: compared with the prior art, the embodiment of the utility model can maximally utilize the product space, and realize miniaturization, high-density integration and three-dimensional installation of surface mounting and inductance; and secondly, the heat dissipation path of the device can be optimized, and heat generated by the electronic element in the plastic package material can be transferred through the substrate and the plastic package material, and meanwhile, the heat can be transferred upwards through the copper bars of the inductor, so that a better heat dissipation effect is achieved.

Drawings

FIG. 1 is a front view of a high power density point power supply according to an embodiment of the present utility model;

FIG. 2 is a side view of a high power density point power supply according to an embodiment of the present utility model;

Fig. 3 is a top view of a plastic molding compound according to an embodiment of the present utility model;

FIG. 4 is a top view of a substrate structure according to an embodiment of the present utility model;

fig. 5 is a structural elevation view of another high power density point power supply provided by an embodiment of the present utility model.

Detailed Description

In order that the utility model may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.

For further high-density integration of the POL (load) point power supply to achieve miniaturization and reduction of package size, the embodiment of the present application provides a high-power density point power supply, which has a structure schematically shown in fig. 1 and 2, and includes an inductor 110, a molding compound 200 and a substrate 300.

In the embodiment of the application, 2 welding copper bars 120 are respectively disposed on two sides of the inductor 110, and the total number of the welding copper bars 120 is 4. As can be seen from fig. 1, the solder copper bars 120 are bent downwards from both sides of the inductor 110, and are integrally perpendicular to the surface of the inductor facing the substrate; as can be seen from fig. 2, the entire solder copper bar 120 has a sheet-like structure with a certain thickness.

The substrate 300 has a first surface 310, and a plurality of bonding pads 330 for bonding the bonding copper bars 120 are disposed on two sides of the first surface 310. Corresponding to the number of the soldering copper bars 120, in the embodiment of the present application, two soldering points 330 are respectively disposed on two sides of the first surface 310, and the total of 4 soldering points 330, and the distance between the soldering points is the same as the distance between the soldering copper bars.

The first surface 310 of the substrate 300 further includes a plurality of electronic components, including a resistor, a capacitor, and a power control chip. Since the layout of the particular electronic components is not an issue for the present application, all electronic components are labeled 320, and not described in detail.

The molding compound 200 is disposed on the first surface 310 of the substrate 300, and the molding compound 200 includes a third surface 230 and a second surface 220 having a groove. As can be seen in fig. 1, the second surface 220 is attached to the first surface 310 and the electronic component 320, i.e. the electronic component 320 is encapsulated in the molding compound 200; the third surface 230 is parallel to the first surface 310, and a surface of the inductor 110 facing the first surface 310 is attached to the third surface 230.

In addition, the molding compound 200 is further provided with a plurality of through holes 210 for accommodating the solder copper bars 120, 2 through holes 210 are respectively arranged at two sides of the molding compound 200 corresponding to the solder points 330, 4 through holes 210 are provided, and the positions of the through holes 210 on the molding compound 200 correspond to the positions of the solder points 330 on the substrate 300.

It should be noted that the length and width of the through hole 210 are larger than the length and thickness of the solder copper bar 120 to ensure that the solder copper bar 120 can pass through.

Finally, the types of bonding pads 330 include bonding pads and bonding vias, and in the embodiment of the present application, the types of bonding pads 330 are bonding pads, so that the bonding copper bars 120 are bonded to the corresponding bonding pads 330 through the corresponding through holes 210 to support the inductor 110 directly above the first surface 310.

Fig. 3 shows a top view of a plastic molding compound 200, and as can be seen from fig. 3, 4 through holes 210 with the same length and width and rectangular shapes are provided on the plastic molding compound 200, two sides of the plastic molding compound 200 are respectively provided with 2 through holes 210, and the through holes 210 on the same side are symmetrically arranged on the third surface with a central line in the length direction of the third surface as a symmetry axis.

Fig. 4 shows a top view of a structure of a substrate 300, and as can be seen from fig. 4, the substrate 300 is provided with 4 solder joints 330 having the same length and width and being rectangular, two sides of the substrate 300 are respectively provided with 2 solder joints 330 on the same side, and the solder joints 330 on the same side are symmetrically arranged on the first surface by taking the central line of the first surface in the length direction as a symmetry axis.

In the embodiment of the present application, the bonding pad 330 is a bonding pad.

The manufacturing process of the high-power density point power supply is briefly introduced:

Firstly, SMT is carried out on a substrate 300, an electronic element 320 is mounted on a first surface 310 of the substrate 300, then plastic packaging is carried out on the electronic element and the exposed part of the first surface 310, and curing is waited for forming a plastic packaging material 200; then, slotting is performed by a laser or a mechanical manner, and holes are formed in the plastic package material 200 at positions corresponding to the welding points 330 on the substrate 300, so that through holes 210 corresponding to the welding points 330 are formed in the plastic package material 200. In the whole, the through holes 210 are formed as grooves in the whole formed by the molding compound 200 and the substrate 300, and then the bonding copper bars of the inductor 110 are bonded to the corresponding grooves, that is, the bonding copper bars 120 of the inductor 110 are bonded to the bonding pads 330 through the corresponding through holes 210.

Laser grooving mode: and ablating by adjusting the laser different frequencies and laser scanning times of the plastic packaged module. Specifically, laser ablation molding EMC is controlled to expose a substrate bonding pad to form a groove.

Mechanical grooving mode: by controlling the drill depth, the drill is drilled to a required position to form a groove, and the bonding pad (bonding pad of the welding inductor on the substrate) in the groove is protected from being damaged, and local adhesive tape protection may be required before plastic packaging.

In addition, there is another method in which the solder joints 330 are protected by providing a special mold so that the plastic sealing curing process directly forms the through holes 210.

Specifically: slotting the plastic packaging jig: the ejector pins are added in the design process of the plastic packaging jig, positions of the substrate bonding pads which do not need plastic packaging are protected by the ejector pins, and grooves are formed in the plastic packaging process.

Compared with the prior art, the embodiment of the utility model can maximally utilize the product space, and realize miniaturization, high-density integration and three-dimensional installation of surface mounting and inductance; and secondly, the heat dissipation path of the device can be optimized, and heat generated by the electronic element in the plastic package material can be transferred through the substrate and the plastic package material, and meanwhile, the heat can be transferred upwards through the copper bars of the inductor, so that a better heat dissipation effect is achieved.

In addition, the embodiment of the application also provides a high-power-density point power supply with the welding point being a welding via hole, the structure front view of which is shown in figure 5,

The high power density point power supply includes an inductor 110, a molding compound 200, and a substrate 300.

In the embodiment of the application, 2 welding copper bars 120 are respectively disposed on two sides of the inductor 110, and the total number of the welding copper bars 120 is 4. As can be seen from fig. 5, the solder copper bars 120 are bent downward from both sides of the inductor 110, the whole is perpendicular to the surface of the inductor facing the substrate, and the solder copper bars 120 have a sheet structure with a certain thickness.

The molding compound 200 is disposed on the first surface 310 of the substrate 300, and the molding compound 200 includes a third surface 230 and a second surface 220 having a groove. As can be seen in fig. 5, the second surface 220 is attached to the first surface 310 and the electronic component 320, i.e. the electronic component 320 is encapsulated in the molding compound 200; the third surface 230 is parallel to the first surface 310, and a surface of the inductor 110 facing the first surface 310 is attached to the third surface 230.

Finally, it should be noted that the types of solder joints 330 include solder pads and solder vias, and in the embodiment of the present application, the type of solder joint 330 is a solder pad, and thus the solder copper bar 120 is soldered to the corresponding solder joint 330 through the corresponding through hole 210.

In the present embodiment, the solder joint 330 is a solder via.

firstly, SMT is carried out on a substrate 300, an electronic element 320 is mounted on a first surface 310 of the substrate 300, then plastic packaging is carried out on the electronic element and the exposed part of the first surface 310, and curing is waited for forming a plastic packaging material 200; then, holes are drilled in the plastic molding compound 200 at positions corresponding to the soldering points 330 on the substrate 300 by laser or mechanical means, so that through holes 210 corresponding to the soldering points 330 are formed in the plastic molding compound 200. Unlike the previous embodiment, the solder joint 330 of the present embodiment is a solder via, so that the position of the solder joint 330 on the substrate 300 can be determined in the manufacturing process, and then the solder joint is perforated to form a solder via; it is also possible to open the holes of the molding compound 200 and simultaneously open the holes of the substrate 300, that is, to determine the positions of the solder joints 330 first, then open the holes of the molded substrate, and then weld the solder copper bars 120 of the inductor 110 to the solder joints 330 through the corresponding through holes 210, that is, weld the solder copper bars 120 to the substrate 300 through the whole body formed by the substrate 300 and the molding compound 200.

Laser drilling mode: and ablating by adjusting the laser different frequencies and laser scanning times of the plastic packaged module. The laser perforation is to directly ablate EMC and the substrate by laser, and the module forms a hole after plastic package is burned through.

Mechanical drilling mode: and the drill bit is controlled to directly drill through the module after plastic package, so that the required through hole is formed.

Specifically, the plastic package jig is perforated: the design scheme of the jig is consistent with that of the slotting jig, and the jig is provided with holes when the plastic package front substrate is manufactured, different from the difference of the length of the ejector pins and the plastic package front substrate of the slotting jig. During plastic packaging, the ejector pins penetrate through reserved holes of the substrate, and the holes are formed after plastic packaging.

It should be noted that while the present utility model has been illustrated in the drawings and described in connection with the preferred embodiments thereof, it is to be understood that the utility model may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but are to be construed as providing a full breadth of the disclosure. The above-described features are further combined with each other to form various embodiments not listed above, and are considered to be the scope of the present utility model described in the specification; further, modifications and variations of the present utility model may be apparent to those skilled in the art in light of the foregoing teachings, and all such modifications and variations are intended to be included within the scope of this utility model as defined in the appended claims.

Claims

1. A high power density point power supply, comprising:

the two sides of the inductor are provided with a plurality of welding copper bars;

The substrate is provided with a first surface, and a plurality of welding points used for welding the welding copper bars are arranged on two sides of the first surface;

The plastic packaging material is arranged on the first surface and is provided with a plurality of through holes for accommodating the welding copper bars;

the bonding copper bars are bonded to the respective bonding pads through the respective through holes to support the inductor directly above the first surface.

2. The point power supply of claim 1 wherein the first surface further has a plurality of electronic components disposed thereon.

3. The point power supply of claim 2 wherein the electronic components include a resistor, a capacitor, and a power control chip.

4. The spot power supply of claim 2, wherein the molding compound includes a third surface and a second surface having a recess;

5. The point power supply of claim 4 wherein the third surface is parallel to the first surface.

6. The point power supply of claim 4 wherein a face of the inductor facing the first surface is bonded to the third surface.

7. The spot power supply of any one of claims 1-6 wherein the solder joint comprises a solder pad and a solder via.

8. The spot power supply of claim 7 wherein the bonding copper bars are bonded to the respective pads through the respective vias.

9. The spot power supply of claim 7 wherein the solder copper bars are soldered to respective solder vias through respective vias.

10. The spot power supply of claim 7, wherein 2 copper bars are disposed on two sides of the inductor, 2 soldering points are disposed on two sides of the first surface, and 4 through holes are disposed on the plastic package.