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CN221199755U - Semiconductor test fixture and test device - Google Patents

Semiconductor test fixture and test device Download PDF

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Publication number
CN221199755U
CN221199755U CN202322932347.7U CN202322932347U CN221199755U CN 221199755 U CN221199755 U CN 221199755U CN 202322932347 U CN202322932347 U CN 202322932347U CN 221199755 U CN221199755 U CN 221199755U
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CN
China
Prior art keywords
clamping device
clamping
piece
lifting platform
test piece
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Application number
CN202322932347.7U
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Chinese (zh)
Inventor
黄艳
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Hangzhou Lingbo Precision Machinery Co ltd
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Hangzhou Lingbo Precision Machinery Co ltd
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Priority to CN202322932347.7U priority Critical patent/CN221199755U/en
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Abstract

The application discloses a semiconductor test fixture and a test device, wherein the semiconductor test fixture comprises a fixture body and a lifting driving device, the fixture body is provided with a containing groove for containing a test piece to be tested, a clamping device for clamping the test piece to be tested and a lifting platform for placing the test piece to be tested are arranged in the containing groove, the lifting platform is arranged at the bottom of the containing groove and is in sliding connection with the fixture body along a first direction, the clamping device is arranged at the side face of the containing groove and is in sliding connection with the fixture body along a second direction, the lifting platform is matched with an inclined plane of the clamping device, the driving device is connected with the lifting platform and is used for driving the lifting platform to move along the first direction relative to the fixture body so as to drive the clamping device to move along the second direction relative to the fixture body, and the side wall of the clamping device in the containing groove is elastically connected along the second direction. Through the scheme, the test piece to be tested can be conveniently taken, placed and fixed, and the product yield and the production efficiency are improved.

Description

Semiconductor test fixture and test device
Technical Field
The present application relates to the field of semiconductor testing technology, and in particular, to a semiconductor testing jig and a testing device.
Background
During semiconductor processing, it is desirable to detect properties and defects of semiconductor structures. The semiconductor structure has high precision requirement, and a test piece to be tested needs to be placed in the jig, and then the test is performed after the test piece to be tested is fixed through the jig. However, for the semiconductor test piece with smaller volume, the test piece to be tested is placed in the jig, and the difficulty of taking out the test piece to be tested from the jig is high, so that the damage to the test piece is easy to cause, and the product yield is affected.
Disclosure of utility model
The application mainly solves the technical problem of providing a semiconductor test fixture and a test device, which are convenient for taking, placing and fixing a test piece to be tested and improve the product yield and the production efficiency.
In order to solve the technical problems, the application adopts a technical scheme that: the utility model provides a semiconductor test fixture, includes tool body and lift drive arrangement, have the holding groove that is used for holding the test piece that awaits measuring on the tool body, be equipped with in the holding groove and be used for the centre gripping the clamping device of test piece and be used for placing the lift platform of test piece awaits measuring, the lift platform set up in holding groove bottom and with the tool body is along first direction sliding connection, clamping device set up in holding groove side and with the tool body is along second direction sliding connection, the lift platform with clamping device inclined plane cooperation, drive arrangement with the lift platform is connected, is used for the drive the lift platform is relative the tool body is followed first direction removes, so as to drive clamping device is relative the tool body is followed the second direction removes, clamping device in the lateral wall of holding groove is followed second direction elastic connection.
Preferably, the first direction is perpendicular to the second direction.
Preferably, a compression spring is arranged between the clamping device and the side wall of the accommodating groove, and two ends of the compression spring are respectively abutted between the clamping device and the side wall.
Preferably, the jig body is internally provided with a sliding hole extending along the second direction, the sliding hole is communicated with the accommodating groove, the clamping device comprises a clamping piece and a sliding rod which are connected, and the sliding rod is arranged in the sliding hole in a sliding manner.
Preferably, the side surface of the lifting platform facing the clamping piece is a first inclined surface, the bottom surface of the clamping piece facing the lifting platform is a second inclined surface, and the first inclined surface is attached to the second inclined surface.
Preferably, the clamping device comprises a first clamping piece and a second clamping piece which are oppositely arranged along the second direction, and the first clamping piece and the second clamping piece are matched with the inclined plane of the clamping device.
In order to solve the technical problems, the application adopts another technical scheme that: a semiconductor test apparatus is provided, including a semiconductor test fixture as described in any of the embodiments.
The beneficial effects of the application are as follows: compared with the prior art, the semiconductor test fixture and the semiconductor test device are provided with the clamping device and the lifting platform which are in linkage, when the lifting driving device drives the lifting platform to be away from the bottom of the accommodating groove, the test piece to be tested on the lifting platform can be driven to be away from the bottom of the accommodating groove, and meanwhile, the clamping device is away from the test piece to be tested, so that the test piece to be tested is loosened; when the lifting driving device drives the lifting platform to be close to the bottom of the accommodating groove, the to-be-tested test piece on the lifting platform can be driven to be close to the bottom of the accommodating groove, the to-be-tested test piece descends into the accommodating groove, and meanwhile the clamping device is close to the to-be-tested test piece, so that the to-be-tested test piece is clamped. The test piece to be tested can be released while being lifted, so that a mechanical arm or a person can conveniently pick up the tested test piece from the lifting platform and place the next test piece to be tested; and the test piece to be tested can be clamped while entering the accommodating groove. Thereby reducing the probability of product damage, improving the product yield and improving the production efficiency.
Drawings
FIG. 1 is a top view of a first embodiment of a semiconductor test fixture according to the present application;
FIG. 2 is a partial cross-sectional view of a semiconductor test fixture according to an embodiment of the present application in a lowered state;
FIG. 3 is a partial cross-sectional view of a semiconductor test fixture according to an embodiment of the present application in a raised state;
fig. 4 is a partial cross-sectional view of a second embodiment of the semiconductor test fixture of the present application.
Detailed Description
In order to make the objects, technical solutions and effects of the present application clearer and more specific, the present application will be described in further detail below with reference to the accompanying drawings and examples. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1 and 2, fig. 1 is a top view of a first embodiment of the semiconductor test fixture of the present application, and fig. 2 is a partial cross-sectional view of the semiconductor test fixture of the present application in a lowered state. The semiconductor test fixture 10 includes a fixture body 1 and a lifting driving device (not shown), the fixture body 1 is provided with a holding groove 1a for holding a test piece to be tested, a holding device 2 for holding the test piece to be tested and a lifting platform 3 for holding the test piece to be tested are arranged in the holding groove 1a, the lifting platform 3 is arranged at the bottom of the holding groove 1a and is slidably connected with the fixture body 1 along a first direction (Z direction in fig. 2), the holding device 2 is arranged at the side surface of the holding groove 1a and is slidably connected with the fixture body 1 along a second direction (X direction in fig. 2), the lifting platform 3 is matched with the inclined surface of the holding device 2, the lifting driving device is connected with the lifting platform 3, and is used for driving the lifting platform 3 to move along the first direction relative to the fixture body 1 so as to drive the holding device 2 to move along the second direction relative to the fixture body 1, and the holding device 2 is elastically connected with the side wall of the holding groove 1a along the second direction.
According to the semiconductor test fixture 10 provided by the application, the clamping device 2 and the lifting platform 3 are in linkage, as shown in fig. 3, when the lifting driving device drives the lifting platform 3 to be far away from the bottom of the accommodating groove 1a, a test piece to be tested on the lifting platform 3 can be driven to be far away from the bottom of the accommodating groove 1a, the test piece to be tested is lifted along the Z direction, and as the lifting platform 3 is matched with the inclined plane of the clamping device 2, the clamping device 2 is pushed by the lifting platform 3 to be far away from the test piece to be tested along the X direction, so that the test piece to be tested is loosened; as shown in fig. 2, when the lifting driving device drives the lifting platform to approach the bottom of the accommodating groove 1a, the to-be-tested test piece on the lifting platform 3 can be driven to approach the bottom of the accommodating groove 1a along the reverse direction of the Z direction, the to-be-tested test piece descends into the accommodating groove 1a, and at this time, the elastic piece connected with the accommodating groove 1a pushes the clamping device 2 to approach the to-be-tested test piece along the reverse direction of the X direction, so as to clamp the to-be-tested test piece. The test piece to be tested can be lifted and simultaneously released by the clamping device 2, so that a mechanical arm or a person can conveniently pick up the tested test piece from the lifting platform and place the next test piece to be tested; and the test piece to be tested can be clamped while entering the accommodating groove 1 a. Thereby reducing the probability of product damage, improving the product yield and improving the production efficiency.
In the present embodiment, the holding device 2 is provided only on the side of the accommodation groove 1a, specifically, a slide hole (not shown) extending in the second direction is provided in the side of the jig body 1 near the holding device 2, the holding device 2 includes a holding piece 21 and a slide rod 22 connected, and the slide rod 22 is slidably provided in the slide hole so that the holding device 2 can slide in the second direction. In other embodiments, the clamping device 2 may also be slidably connected to the jig body 1 through a structure such as a sliding rail and a sliding block. Specifically, the side surface of the lifting platform 3 facing the clamping piece 21 is a first inclined surface 31, the bottom surface of the clamping piece 21 facing the lifting platform 3 is a second inclined surface 211, and the first inclined surface 211 is attached to the second inclined surface 31. The lifting driving device can be an electric push rod or a motor and the like, and the application is not limited.
Optionally, a fixing piece 4 is further disposed on the other side of the accommodating groove 1a, and the fixing piece 4 is fixedly disposed in the accommodating groove 1a and clamps the test piece to be tested together with the clamping device 2. The side of the fixing member 4 facing the lifting platform 3 may be provided with a sliding groove, and the side of the lifting platform 3 facing the fixing member 4 may be provided with a protrusion matching the sliding groove, so that the protrusion may slide along the sliding groove in a first direction, thereby enabling the lifting platform 3 to slide on the fixing member 4 in the first direction.
Optionally, a compression spring 23 is arranged between the clamping device 2 and the side wall of the accommodating groove 1a, two ends of the compression spring 23 are respectively abutted between the clamping device 2 and the side wall of the accommodating groove 1a, and the compression spring 23 can be arranged on one side of the sliding rod 22 or sleeved outside the sliding rod 22. When the clamping device 2 is released, the compression spring 23 is compressed, and the elastic potential energy is increased, and the elastic potential energy provides power for the clamping device 2 to clamp the test piece. In other embodiments, other elastic members, such as an elastic material layer, may be disposed between the clamping device 2 and the side wall of the accommodating groove 1 a.
Referring to fig. 4, fig. 4 is a partial cross-sectional view of a second embodiment of the semiconductor test fixture of the present application, where the clamping device 2 includes a first clamping member 2a and a second clamping member 2b disposed opposite to each other along a second direction, and the first clamping member 2a and the second clamping member 2b are in slant fit with the lifting platform 3. In the present embodiment, both the first clamping member 2a and the second clamping member 2b are movable to clamp or unclamp a test piece to be tested. Specifically, the two sides of the lifting platform 3 are respectively provided with inclined planes, and the bottoms of the first clamping piece 2a and the second clamping piece 2b are respectively matched with the inclined planes of the two sides of the lifting platform 3. When the lifting platform 3 ascends, the first clamping piece 2a and the second clamping piece 2b are away from each other, and the test piece to be tested is loosened; when the lifting platform 3 descends, the first clamping piece 2a and the second clamping piece 2b are driven by the elastic structure to approach each other, and the test piece to be tested is clamped.
The application also provides a semiconductor test device, which comprises the semiconductor test jig 10 of any embodiment.
The foregoing is only the embodiments of the present application, and therefore, the patent scope of the application is not limited thereto, and all equivalent structures or equivalent processes using the descriptions of the present application and the accompanying drawings, or direct or indirect application in other related technical fields, are included in the scope of the application.

Claims (7)

1. The utility model provides a semiconductor test fixture, its characterized in that includes tool body and lift drive arrangement, have the holding groove that is used for holding test piece that awaits measuring on the tool body, be equipped with in the holding groove and be used for the centre gripping the clamping device of test piece and be used for placing the lift platform of test piece that awaits measuring, the lift platform set up in the holding groove bottom and with the tool body is along first direction sliding connection, clamping device set up in holding groove side and with the tool body is along second direction sliding connection, lift platform with clamping device inclined plane cooperation, lift drive arrangement with lift platform is connected, is used for the drive lift platform is followed first direction is close to or is kept away from the holding groove bottom, so as to drive clamping device is followed the second direction is close to or is kept away from the test piece that awaits measuring, clamping device in the lateral wall of holding groove is followed second direction elastic connection.
2. The semiconductor test fixture of claim 1, wherein,
The first direction is perpendicular to the second direction.
3. The semiconductor test fixture of claim 1, wherein,
And a pressure spring is arranged between the clamping device and the side wall of the accommodating groove, and two ends of the pressure spring are respectively abutted between the clamping device and the side wall.
4. The semiconductor test fixture of claim 1, wherein,
The jig is characterized in that a sliding hole extending along the second direction is formed in the jig body, the sliding hole is communicated with the accommodating groove, the clamping device comprises a clamping piece and a sliding rod, and the sliding rod is arranged in the sliding hole in a sliding mode.
5. The semiconductor test fixture of claim 4, wherein,
The side surface of the lifting platform facing the clamping piece is a first inclined surface, the bottom surface of the clamping piece facing the lifting platform is a second inclined surface, and the first inclined surface is attached to the second inclined surface.
6. The semiconductor test fixture of claim 1, wherein,
The clamping device comprises a first clamping piece and a second clamping piece which are oppositely arranged along the second direction, and the first clamping piece and the second clamping piece are matched with the inclined plane of the lifting platform.
7. A semiconductor test apparatus comprising the semiconductor test jig according to any one of claims 1 to 6.
CN202322932347.7U 2023-10-31 2023-10-31 Semiconductor test fixture and test device Active CN221199755U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322932347.7U CN221199755U (en) 2023-10-31 2023-10-31 Semiconductor test fixture and test device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322932347.7U CN221199755U (en) 2023-10-31 2023-10-31 Semiconductor test fixture and test device

Publications (1)

Publication Number Publication Date
CN221199755U true CN221199755U (en) 2024-06-21

Family

ID=91529028

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322932347.7U Active CN221199755U (en) 2023-10-31 2023-10-31 Semiconductor test fixture and test device

Country Status (1)

Country Link
CN (1) CN221199755U (en)

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