CN221125981U - LED packaging support with good heat dissipation effect - Google Patents
LED packaging support with good heat dissipation effect Download PDFInfo
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- CN221125981U CN221125981U CN202323064245.4U CN202323064245U CN221125981U CN 221125981 U CN221125981 U CN 221125981U CN 202323064245 U CN202323064245 U CN 202323064245U CN 221125981 U CN221125981 U CN 221125981U
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- heat dissipation
- bottom plate
- heat
- led
- fixedly connected
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- 230000017525 heat dissipation Effects 0.000 title abstract description 41
- 230000000694 effects Effects 0.000 title abstract description 14
- 238000004806 packaging method and process Methods 0.000 title abstract description 12
- 238000012546 transfer Methods 0.000 abstract description 25
- 239000011521 glass Substances 0.000 abstract description 9
- 239000010425 asbestos Substances 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 7
- 239000011258 core-shell material Substances 0.000 abstract description 7
- 229910052895 riebeckite Inorganic materials 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 4
- 238000009423 ventilation Methods 0.000 description 6
- 239000011324 bead Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000007599 discharging Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses an LED packaging support with good heat dissipation effect, which comprises a single panel, wherein the bottom of the single panel is connected with a fixed bottom plate, air circulation grooves are formed in the single panel and the fixed bottom plate, a filter screen is fixedly connected to the edges of the single panel and the fixed bottom plate, and an asbestos core shell is fixedly connected to the outer surface of the filter screen at the edges of the single panel and the fixed bottom plate. Above-mentioned scheme, through setting up a plurality of independent glass boards, make it form a plurality of cavities, and every cavity carries out the heat and looses from louvre and air circulation groove through the fin, when the in-process that forced air cooling flows, because the appearance of heat dissipation fin is the wave, the radiating area of heat dissipation fin has been increased, and utilize heat transfer bottom plate, heat on LED chip surface is conducted to the surface of heat dissipation fin through heat transfer bottom plate, utilize circumference form distribution, make the heat that produces can be to spreading all around simultaneously, thereby improve radiating efficiency and radiating effect.
Description
Technical Field
The utility model relates to the technical field of LED packaging supports, in particular to an LED packaging support with good heat dissipation effect.
Background
Generally, the function of the package is to provide enough protection for the chip, prevent the chip from being exposed in air for a long time or from being damaged mechanically to fail, so as to improve the stability of the chip, and for the LED package, good light extraction efficiency and good heat dissipation are also required, and the good package can enable the LED to have better luminous efficiency and heat dissipation environment, so as to further improve the service life of the LED. The problem that the general LED packaging support is not provided with the mechanism for conveniently snapping the LED lamp holder is inconvenient to snap and position, the problem that the general LED packaging support is not provided with the mechanism for conveniently penetrating the core is solved, and the conduction heat dissipation effect of the LED lamp holder is poor.
In order to solve the problem, patent document publication number CN218352982U, a but quick radiating LED encapsulation support, including single panel and LED row pearl, single panel top and the left and right sides both ends outside are fixedly connected with LED row pearl and side bar board respectively, the side bar board outside is provided with and pops together card mechanism and leads to core cooling mechanism, the pops together card mechanism and includes the side slat, side bar board top and bottom contact respectively are connected with T type backing plate and bottom pad board, half card pearl of equal fixedly connected with in T type backing plate bottom and bottom pad board top, the inboard fixedly connected with spring depression bar of T type backing plate and bottom pad board, both ends outside all fixedly connected with lamination about T type backing plate and the bottom pad board, inboard fixedly connected with traveller and the sleeve pipe respectively in lamination top and the bottom.
When the device is used, the function of the spring packaging of the LED bead discharging plate is completed through the T-shaped base plate, the bottom base plate, the spring pressing rod, the sliding column and the sleeve, but in the use process, a relatively closed cavity is formed through the embedding of the single glass plate and the T-shaped base plate, the inner cavity is also provided with a plurality of LED bead discharging holes, heat generated by the plurality of LED bead discharging holes in the closed cavity is inconvenient to discharge, and the device improves the moisture absorption and air cooling flowing heat dissipation function of the inside of the device through the filter screen, the asbestos core shell and the inner through holes of the alloy core plate, and the heat dissipation effect is relatively weak.
Disclosure of utility model
In order to overcome the defects in the prior art, the embodiment of the utility model provides the LED packaging support with good heat dissipation effect, so as to solve the problems that the existing LED packaging support forms a relatively closed cavity through the embedding of a single glass plate and a T-shaped backing plate, the inner cavity is also provided with a plurality of LED row beads, the heat generated by the plurality of LED row beads in the closed cavity is inconvenient to discharge, the device improves the functions of absorbing moisture and cooling air in the device through a filter screen, an asbestos core shell and through holes in an alloy core plate, and the heat dissipation effect is relatively weak.
In order to solve the technical problems, the utility model provides the following technical scheme: the LED packaging support with the good heat dissipation effect comprises a single panel, wherein the bottom of the single panel is connected with a fixed bottom plate, air circulation grooves are formed in the single panel and the fixed bottom plate, a filter screen is fixedly connected to the edges of the single panel and the fixed bottom plate, and an asbestos core shell is fixedly connected to the outer surface of the filter screen at the edges of the single panel and the fixed bottom plate; the single-sided board comprises a board body, a plurality of evenly distributed lamp slots are formed in the board body, LED chips are connected to the lamp slots, the LED chips are fixedly connected to the outer surfaces of the lamp slots, the four sides of the LED chips are fixedly connected with heat conducting plates, the other ends of the heat conducting plates are fixedly connected with radiating fins, and the radiating fins are embedded in the inner wall of the air circulation slot.
The air circulation groove is positioned on four sides of the lamp groove, the surface of the plate body is provided with radiating holes, and the radiating holes are fixedly communicated with the outer surfaces of the radiating fins.
The LED lamp comprises a lamp groove, wherein a chip groove is formed in the lamp groove, and an LED chip is mounted in the lamp groove.
The heat transfer element comprises a heat transfer bottom plate, the bottom of the heat transfer bottom plate is fixedly connected with radiating fins, a ventilation groove is formed between the single-sided board and the fixed bottom plate through a filter screen, the heat transfer bottom plate is fixedly installed at the bottom of a chip groove inside the lamp groove, the heat transfer bottom plate is located at the bottom of the LED chip, and the radiating fins at the bottom of the heat transfer bottom plate extend to the ventilation groove between the single-sided board and the fixed bottom plate through the chip groove.
The heat dissipation fins are circumferentially distributed at the bottom of the heat transfer bottom plate, and the heat dissipation fins are wavy in shape.
The utility model has the technical effects and advantages that:
in the scheme, the heat conduction is carried out through the heat conduction plates at the side edges, so that the temperature of the radiating fins is increased, the radiating fins are communicated with the external space through the radiating holes, and meanwhile, the heat of the lamp groove cannot be rapidly dissipated due to the fact that the plurality of independent glass plates are arranged for forming a plurality of cavities through the air circulation in the air circulation groove, and each cavity dissipates heat from the radiating holes and the air circulation groove through the radiating fins;
The heat dissipation fins at the bottom of the heat transfer bottom plate extend into the ventilation groove between the single panel and the fixed bottom plate through the chip groove, and in the air cooling flowing process, as the shape of the heat dissipation fins is wavy, the heat dissipation area of the heat dissipation fins is increased, heat on the surface of the LED chip is conducted to the surface of the heat dissipation fins through the heat transfer bottom plate by utilizing the heat transfer bottom plate, and the generated heat can be diffused to the periphery simultaneously by utilizing circumferential distribution, so that the heat dissipation efficiency and the heat dissipation effect are improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the structure at A of the present utility model;
FIG. 3 is a schematic view of the internal structure of the lamp socket of the present utility model;
FIG. 4 is a schematic view of the internal structures of the single panel and the fixed bottom plate of the present utility model;
fig. 5 is a schematic view of the structure of the heat transfer member of the present utility model.
The reference numerals are: 1. a single panel; 2. an air circulation groove; 3. a fixed bottom plate; 4. a filter screen; 5. an asbestos core shell; 11. a plate body; 12. a lamp groove; 13. an LED chip; 14. a glass plate; 15. a heat conductive plate; 16. a heat sink; 17. a heat radiation hole; 18. a heat transfer member; 181. a heat transfer base plate; 182. and heat dissipation fins.
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved more apparent, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 to 5, the embodiment of the utility model provides an LED packaging bracket with good heat dissipation effect, which comprises a single panel 1, wherein the bottom of the single panel 1 is connected with a fixed bottom plate 3, air circulation grooves 2 are formed in the single panel 1 and the fixed bottom plate 3, a filter screen 4 is fixedly connected at the edges of the single panel 1 and the fixed bottom plate 3, and an asbestos core shell 5 is fixedly connected at the outer surface of the filter screen 4 at the edges of the single panel 1 and the fixed bottom plate 3; the single panel 1 includes plate body 11, and a plurality of evenly distributed's light trough 12 have been seted up to the inside of plate body 11, and the internal connection of light trough 12 has LED chip 13, and the inside of light trough 12 is located the surface fixedly connected with glass board 14 of LED chip 13, and the equal fixedly connected with heat-conducting plate 15 of four sides of LED chip 13, the other end fixedly connected with fin 16 of heat-conducting plate 15, the inner wall at air current groove 2 is installed in the scarf joint of fin 16.
Wherein, the air circulation groove 2 is located four sides of the lamp groove 12, the surface of the plate body 11 is provided with the radiating holes 17, and the radiating holes 17 are fixedly communicated with the outer surface of the radiating fins 16, the radiating fins 16 are directly used for radiating the outside through the radiating holes 17, meanwhile, the influence of the glass plate 14 is avoided through the communication of the radiating fins 16 and the air circulation groove 2, the glass plate 14 and the inside of the lamp groove 12 form a sealed cavity, the radiating effect is poor, and the service life of the LED chip 13 is influenced.
Wherein, the lamp slot 12 is internally provided with a chip slot provided with an LED chip 13, and the inside of the chip slot is fixedly connected with a heat transfer element 18.
The heat transfer element 18 includes a heat transfer bottom plate 181, a heat dissipation fin 182 is fixedly connected to the bottom of the heat transfer bottom plate 181, a ventilation slot is formed between the single panel 1 and the fixed bottom plate 3 through the filter screen 4, the heat transfer bottom plate 181 is fixedly installed at the bottom of the chip slot inside the lamp slot 12, the heat transfer bottom plate 181 is located at the bottom of the LED chip 13, and the heat dissipation fin 182 at the bottom of the heat transfer bottom plate 181 extends to the ventilation slot between the single panel 1 and the fixed bottom plate 3 through the chip slot.
The number of the heat dissipation fins 182 is a plurality, and the heat dissipation fins 182 are circumferentially distributed at the bottom of the heat transfer bottom plate 181, the shape of the heat dissipation fins 182 is wavy, the heat dissipation area of the heat dissipation fins 182 is increased by using the wavy shape of the heat dissipation fins 182, so that the heat dissipation efficiency is improved.
The working process of the utility model is as follows:
When the LED chip 13 is used, when the cavity in the lamp groove 12 generates heat, the heat conduction plate 15 at the side conducts heat, so that the temperature of the radiating fin 16 is increased, the radiating fin 16 is communicated with an external space through the radiating hole 17, the radiating fin 16 radiates heat under the action of the radiating hole 17, meanwhile, the heat of the lamp groove 12 cannot be rapidly radiated due to the fact that the air in the air circulation groove 2 flows through the radiating fin 16 and the air flowing outside is radiated by the aid of the air in the air circulation groove 2, a plurality of independent glass plates 14 are arranged to form a plurality of cavities, and each cavity dissipates heat from the radiating hole 17 and the air circulation groove 2 through the radiating fin 16, so that the heat of the lamp groove 12 cannot be rapidly dissipated;
In addition, the heat dissipation fins 182 at the bottom of the heat transfer bottom plate 181 extend into the ventilation groove between the single panel 1 and the fixed bottom plate 3 through the chip groove, the existing moisture absorption and air cooling flowing heat dissipation functions of the inside of the device are improved through the filter screen 4 and the asbestos core shell 5, and when the air cooling flows, the heat dissipation area of the heat dissipation fins 182 is increased due to the fact that the shape of the heat dissipation fins 182 is wavy, heat on the surface of the LED chip 13 is conducted to the surface of the heat dissipation fins 182 through the heat transfer bottom plate 181, and the generated heat can be diffused to the periphery simultaneously through circumferential distribution.
The last points to be described are: first, in the description of the present application, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be mechanical or electrical, or may be a direct connection between two elements, and "upper," "lower," "left," "right," etc. are merely used to indicate relative positional relationships, which may be changed when the absolute position of the object being described is changed;
Secondly: in the drawings of the disclosed embodiments, only the structures related to the embodiments of the present disclosure are referred to, and other structures can refer to the common design, so that the same embodiment and different embodiments of the present disclosure can be combined with each other under the condition of no conflict;
Finally: the foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the utility model are intended to be included within the scope of the utility model.
Claims (5)
1. The utility model provides a LED encapsulation support that radiating effect is good, includes single-sided board (1), the bottom of single-sided board (1) is connected with fixed baseplate (3), air circulation groove (2) have been seted up to the inside of single-sided board (1) and fixed baseplate (3), a serial communication port, the border department fixedly connected with filter screen (4) of single-sided board (1) and fixed baseplate (3), the border department of single-sided board (1) and fixed baseplate (3) is located the surface fixedly connected with asbestos core shell (5) of filter screen (4);
The single-sided board (1) comprises a board body (11), a plurality of evenly distributed lamp slots (12) are formed in the board body (11), LED chips (13) are connected to the lamp slots (12) in an internal mode, glass plates (14) are fixedly connected to the outer surfaces of the LED chips (13) in the lamp slots (12), heat conducting plates (15) are fixedly connected to the four sides of the LED chips (13), radiating fins (16) are fixedly connected to the other ends of the heat conducting plates (15), and the radiating fins (16) are mounted on the inner wall of the air circulation groove (2) in an embedded mode.
2. The LED package bracket with good heat dissipation effect according to claim 1, wherein the air circulation groove (2) is located at four sides of the lamp groove (12), the surface of the plate body (11) is provided with heat dissipation holes (17), and the heat dissipation holes (17) are fixedly communicated with the outer surface of the heat dissipation fin (16).
3. The LED packaging support with good heat dissipation effect according to claim 1, wherein a chip groove is formed in the lamp groove (12), wherein an LED chip (13) is mounted in the chip groove, and a heat transfer element (18) is fixedly connected to the inside of the chip groove.
4. The LED package support with good heat dissipation effect according to claim 3, wherein the heat transfer element (18) comprises a heat transfer bottom plate (181), the bottom of the heat transfer bottom plate (181) is fixedly connected with a heat dissipation fin (182), a ventilation slot is formed between the single-sided board (1) and the fixed bottom plate (3) through the fixed connection of the filter screen (4), the heat transfer bottom plate (181) is fixedly installed at the bottom of a chip slot inside the lamp slot (12), the heat transfer bottom plate (181) is located at the bottom of the LED chip (13), and the heat dissipation fin (182) at the bottom of the heat transfer bottom plate (181) extends to the ventilation slot between the single-sided board (1) and the fixed bottom plate (3) through the chip slot.
5. The LED package bracket with good heat dissipation effect according to claim 4, wherein the number of the heat dissipation fins (182) is several, and the heat dissipation fins are circumferentially distributed at the bottom of the heat transfer base plate (181), and the shape of the heat dissipation fins (182) is wave-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323064245.4U CN221125981U (en) | 2023-11-10 | 2023-11-10 | LED packaging support with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323064245.4U CN221125981U (en) | 2023-11-10 | 2023-11-10 | LED packaging support with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221125981U true CN221125981U (en) | 2024-06-11 |
Family
ID=91367827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323064245.4U Active CN221125981U (en) | 2023-11-10 | 2023-11-10 | LED packaging support with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221125981U (en) |
-
2023
- 2023-11-10 CN CN202323064245.4U patent/CN221125981U/en active Active
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