CN221094307U - Negative plate bottom plate connection structure - Google Patents
Negative plate bottom plate connection structure Download PDFInfo
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- CN221094307U CN221094307U CN202322740333.5U CN202322740333U CN221094307U CN 221094307 U CN221094307 U CN 221094307U CN 202322740333 U CN202322740333 U CN 202322740333U CN 221094307 U CN221094307 U CN 221094307U
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- Prior art keywords
- plate
- copper
- negative plate
- shell
- fixedly connected
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 52
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 37
- 239000007787 solid Substances 0.000 claims description 6
- 230000002146 bilateral effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 18
- 238000005868 electrolysis reaction Methods 0.000 abstract description 16
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 13
- 229910001431 copper ion Inorganic materials 0.000 abstract description 13
- 239000003792 electrolyte Substances 0.000 abstract description 10
- 238000004090 dissolution Methods 0.000 abstract description 5
- 238000009792 diffusion process Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 abstract description 3
- 239000001301 oxygen Substances 0.000 abstract description 3
- 238000005502 peroxidation Methods 0.000 abstract description 3
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 description 10
- 230000008021 deposition Effects 0.000 description 9
- 238000009826 distribution Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
Landscapes
- Electrolytic Production Of Metals (AREA)
Abstract
The utility model relates to the technical field of electrolytic copper and discloses a negative plate bottom plate connecting structure which comprises a shell, wherein copper cores are fixedly connected to the inner wall of the shell, conductive lugs are respectively arranged at the left end and the right end of the bottom side of the shell, a negative plate is fixedly connected to the middle part of the bottom side of the shell, two bilaterally symmetrical through holes are formed in the upper part of the negative plate, positive plates are respectively fixedly connected to the front side and the rear side of the negative plate, wire slots are respectively formed in one side, far away from the negative plate, of the two positive plates, and a bottom slot is formed in the middle part of the bottom side of the negative plate. In the utility model, the structures such as the bottom groove and the wire groove are matched with each other, so that excessive concentration of current can be avoided in the copper electrolysis process, and the partial peroxidation and oxygen production phenomena of the electrode are reduced, thereby improving the current efficiency and the diffusion of copper ions in the electrolyte, and promoting the dissolution and electrolysis process of copper by increasing the surface area.
Description
Technical Field
The utility model relates to the technical field of electrolytic copper, in particular to a negative plate and base plate connecting structure.
Background
Electrolytic copper is a technique whereby pure copper is deposited from an electrolyte by an electrolytic process. It is a commonly used metal electrolysis process for the production of high purity and high quality copper materials, in which the electrolytic cell used generally comprises an anode and a cathode, which are placed in an electrolyte. The anode is made of a soluble copper material, and the cathode is usually a fixed base plate material, and the cathode base plate plays a key role in the copper electrolysis process, and plays important roles in collecting copper deposition, providing a conductive path, controlling current distribution, improving copper deposition quality, maintaining stability and the like in the copper electrolysis process.
The cathode bottom plate is crucial to realizing high-quality copper deposition and stable electrolysis process, but the current partial bottom plate bottom can appear copper connection together when carrying out this function of electrolytic copper, needs follow-up cutting off and separating, therefore can influence the life of negative plate to the bottom plate surface is covered to the electrolyte can not be even, leads to copper deposition's homogeneity not enough, leads to electrolytic efficiency low. For this purpose, a connection structure for the bottom plate of a cathode plate is proposed.
Disclosure of utility model
The utility model aims to solve the defects in the prior art, and provides a negative plate bottom plate connecting structure, wherein the bottom is diverged to form an inverted eight shape to form a bottom groove, and the bottom groove can promote current to be uniformly distributed around a bottom grooving area, so that the non-uniformity of current density is reduced. In the copper electrolysis process, the current is prevented from being excessively concentrated, the peroxidation and oxygen production phenomena of the local part of the electrode are reduced, so that the current efficiency and the diffusion of copper ions in the electrolyte are improved, the effective area of the surface of the anode plate can be increased through the arrangement of the wire slots, more anode reaction areas can be provided through the increase of the surface area, the copper ions generated by the anode are increased, and the dissolution and the electrolysis process of copper are promoted.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The utility model provides a negative plate bottom plate connection structure, includes the shell, shell inner wall fixedly connected with copper core, conductive hangers have all been seted up at both ends about the shell bottom side, shell bottom side middle part fixedly connected with negative plate, two bilateral symmetry's through-hole has been seted up on negative plate upper portion, both sides all fixedly connected with anode plate around the negative plate, two the wire casing has all been seted up to anode plate one side of keeping away from the negative plate, the kerve has been seted up at negative plate bottom side middle part.
According to the technical scheme, the shell wraps the copper core, current is conducted to the cathode plate and the anode plate through the conductive lugs, copper ions are electrolyzed through the reaction of the anode plate and the cathode plate in electrolyte, in the copper electrolysis process, the current passes through the cathode bottom plate in a shortest path mode, if the shape of the cathode bottom plate is flat, the current can be concentrated in a few local areas, copper deposition in the areas is thicker, copper deposition in other areas is thinner, the distribution of the current can be improved through the through holes, the current can more uniformly pass through the whole bottom plate, the current can be promoted to be uniformly distributed around the slotted area at the bottom by the bottom grooves, the non-uniformity of the current density is reduced, the effective area of the surface of the anode plate can be increased by the arrangement of the wire grooves, more anode reaction areas can be provided by increasing the surface area, thereby increasing the copper ions generated by the anode, and promoting the dissolution and the electrolysis process of the copper.
Further, both ends of the copper core are solid copper bars.
Through above-mentioned technical scheme, solid bar copper is connected with the power through electrically conductive hangers and is electrified the electrolysis to it.
Further, both ends of the bottom side of the copper core are fixedly connected in the conductive hanging lugs.
Through the technical scheme, the copper rod is exposed by the conductive hanging lugs.
Further, the bottom groove is in an inverted eight shape.
Through the technical scheme, the inverted eight-shaped groove has the effect of increasing the reaction interface and the effective contact area, and the speed of copper ions in the solution reaching the surface of the cathode can be improved.
Further, the wire grooves are distributed in a net shape.
Through the technical scheme, the local stress concentration on the surface of the anode plate can be reduced due to the existence of the wire slot, when the anode plate is not provided with the wire slot, the uniform current distribution can possibly lead to a local high-stress area, the current can be dispersed due to the arrangement of the wire slot, the stress concentration is reduced, and the deformation and damage of the anode plate can be reduced.
The utility model has the following beneficial effects:
1. According to the utility model, through the mutual matching of the structures such as the conductive lugs and the bottom grooves, the bottom grooves can promote the current to be uniformly distributed around the bottom grooved area, so that the non-uniformity of the current density is reduced. In the process of copper electrolysis, the method can avoid excessive concentration of current, reduce the partial peroxidation and oxygen production of the electrode, and improve the current efficiency and the diffusion of copper ions in the electrolyte.
2. According to the utility model, the effective area of the surface of the anode plate can be increased through the arrangement of the wire slots, and more anode reaction areas can be provided through increasing the surface area, so that copper ions generated by the anode are increased, and the dissolution and electrolysis processes of copper are promoted.
Drawings
FIG. 1 is a front view of a cathode plate base plate connecting structure according to the present utility model;
FIG. 2 is a schematic view of a shell structure of a cathode plate base plate connecting structure according to the present utility model;
FIG. 3 is a schematic view of a copper core structure of a cathode plate base plate connecting structure according to the present utility model;
fig. 4 is an enlarged schematic view at a in fig. 2.
Legend description:
1. a housing; 2. a copper core; 3. conductive hangers; 4. a cathode plate; 5. a through hole; 6. an anode plate; 7. a wire slot; 8. a bottom groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, one embodiment provided by the present utility model is: the utility model provides a negative plate bottom plate connection structure, including shell 1, shell 1 inner wall fixedly connected with copper core 2, shell 1 bottom side both ends all have been seted up conductive hangers 3, shell 1 bottom side middle part fixedly connected with negative plate 4, two bilateral symmetry's through-holes 5 have been seted up to negative plate 4 upper portion, positive plate 4 front and back both sides all fixedly connected with positive plate 6, two positive plate 6 have all been seted up wire casing 7 far away from negative plate 4 one side, bottom slot 8 has been seted up at negative plate 4 bottom side middle part; the shell 1 wraps the copper core 2, current is conducted to the cathode plate 4 and the anode plate 6 through the conductive lugs 3, copper ions are electrolyzed through the reaction of the anode plate 6 and the cathode plate 4 in electrolyte, in the copper electrolysis process, the current passes through the cathode bottom plate in a shortest path mode, if the shape of the cathode bottom plate is flat, the current can be concentrated in a few local areas, copper deposition in the areas is thicker, copper deposition in other areas is thinner, the distribution of the current can be improved through the through holes 5, the current can more uniformly pass through the whole bottom plate, the bottom grooves 8 can promote the current to be uniformly distributed around the bottom slotting area, the non-uniformity of the current density is reduced, the effective area of the surface of the anode plate 6 can be increased through the arrangement of the wire grooves 7, more anode reaction areas can be provided through the increase of the surface area, thereby the copper ions generated by the anode are increased, and the copper dissolution and the electrolysis process are promoted.
Both ends of the copper core 2 are solid copper bars; the solid copper bar is connected with a power supply through the conductive hanging lugs 3 to carry out electrifying electrolysis on the solid copper bar. Both ends of the bottom side of the copper core 2 are fixedly connected in the conductive hanging lugs 3; the conductive hanging lugs 3 expose the copper bars. The bottom groove 8 is in an inverted eight shape; the inverted eight-shaped grooves have the effect of increasing the reaction interface and the effective contact area, and can improve the speed of copper ions in the solution reaching the surface of the cathode. The wire grooves 7 are distributed in a net shape; the presence of the slot 7 can reduce local stress concentration on the surface of the anode plate 6, when the slot 7 is not arranged on the anode plate 6, the uniform current distribution can lead to local high stress areas, the arrangement of the slot 7 can disperse current, the stress concentration is reduced, and the deformation and damage of the anode plate 6 can be reduced.
Working principle: when the technical scheme is applied, the device is hung on a power supply through the conductive hanging lugs 3, current is conducted to the cathode plate 4 and the anode plate 6 through the exposed copper cores 2 in the conductive hanging lugs 3, copper ions are electrolyzed through the reaction of the anode plate 6 and the cathode plate 4 in electrolyte, the distribution of the current can be improved through the through holes 5 in the process of electrolyzing the solution, the current can more uniformly pass through the whole bottom plate, the diffusion speed of electrolytic copper is improved through the bottom groove 8, the concentration polarization of copper ions in the electrolyte is reduced, the efficiency of electrolytic reaction is improved, and the current density on the surface of the anode plate 6 can be adjusted through the design on the position and the shape of the wire grooves 7. The wire slots 7 can change the current paths, so that the current is distributed more uniformly on the surface of the anode, and the concentration of the current in a specific area is reduced, thereby avoiding the overpotential and uneven deposition phenomenon caused by overhigh current density.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.
Claims (5)
1. The utility model provides a negative plate bottom plate connection structure, includes shell (1), its characterized in that: the utility model discloses a solar cell module, including shell (1) inner wall fixedly connected with copper core (2), shell (1) bottom side both ends all have been seted up electrically conductive hangers (3), shell (1) bottom side middle part fixedly connected with negative plate (4), two bilateral symmetry's through-hole (5) have been seted up on negative plate (4) upper portion, both sides all fixedly connected with anode plate (6) around negative plate (4), two slot (7) have all been seted up in negative plate (6) one side of keeping away from negative plate (4), kerve (8) have been seted up at negative plate (4) bottom side middle part.
2. A cathode plate base plate connecting structure according to claim 1, wherein: both ends of the copper core (2) are solid copper bars.
3. A cathode plate base plate connecting structure according to claim 1, wherein: both ends of the bottom side of the copper core (2) are fixedly connected in the conductive hanging lugs (3).
4. A cathode plate base plate connecting structure according to claim 1, wherein: the bottom groove (8) is in an inverted eight shape.
5. A cathode plate base plate connecting structure according to claim 1, wherein: the wire grooves (7) are distributed in a net shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322740333.5U CN221094307U (en) | 2023-10-12 | 2023-10-12 | Negative plate bottom plate connection structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322740333.5U CN221094307U (en) | 2023-10-12 | 2023-10-12 | Negative plate bottom plate connection structure |
Publications (1)
Publication Number | Publication Date |
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CN221094307U true CN221094307U (en) | 2024-06-07 |
Family
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Family Applications (1)
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CN202322740333.5U Active CN221094307U (en) | 2023-10-12 | 2023-10-12 | Negative plate bottom plate connection structure |
Country Status (1)
Country | Link |
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CN (1) | CN221094307U (en) |
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2023
- 2023-10-12 CN CN202322740333.5U patent/CN221094307U/en active Active
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