CN221010393U - Circuit board and power module - Google Patents

Abstract

The utility model discloses a circuit board and a power supply module, wherein the circuit board includes at least one power supply unit, and the power supply unit includes a circuit board body and electronic components. The surface of the circuit board body close to the electronic components includes a plurality of pad areas, and the pad areas include a plurality of mounting areas. The pad areas cover the mounting areas, and the electronic components are arranged on the circuit board body through the pad areas. In the above-mentioned circuit board, the pad areas cover the mounting areas, so that the mounting areas on the surface of the circuit board body become conductive areas. The electronic components are arranged on the circuit board body through the pad areas, so that each electronic component shares a common ground, avoiding the use of copper wires for connection, and effectively reducing the generation of parasitic inductance. The power supply module using the above-mentioned circuit board has a small parasitic inductance, which is conducive to improving the efficiency of the power supply module.

Description

Circuit board and power module

Technical Field

The utility model relates to the technical field of printed circuit boards, in particular to a circuit board and a power supply module.

Background technique

In the design of printed circuit boards, component layout and circuit connection wiring are two key links. In the process of circuit connection, the components are generally connected by copper wires. However, when multiple high-power power supply units are combined on a circuit board, it is inevitable that the distance between the components is far, which makes the copper wires used for connection longer, and then leads to the generation of parasitic inductance, which reduces the efficiency of the power module during the power supply operation.

Utility Model Content

Based on this, the present application provides a circuit board and a power module, which can reduce the problem of long copper wires and large parasitic inductance when multiple high-power power circuit units are synthesized on a circuit board in the prior art, thereby reducing the problem of low power circuit efficiency.

The present application also relates to a circuit board, which includes at least one power supply unit, the power supply unit includes a circuit board body and electronic components, the surface of the circuit board body close to the electronic components includes multiple installation areas, the installation areas are provided with solder pad areas, the solder pad areas cover the installation areas, and the electronic components are arranged on the circuit board body through the solder pad areas.

In one embodiment, the electronic components include a switch, an inductor, a capacitor and a transformer, and the switch, the inductor, the capacitor and the transformer are arranged in sequence along a first direction.

In one embodiment, the capacitor includes a first side and a second side that are adjacent to each other, the length of the first side is greater than the length of the second side, and the extension direction of the first side is consistent with the first direction.

In one embodiment, the capacitor includes a first capacitor and a second capacitor, the number of the transformers is at least two, the first capacitor and the second capacitor each include a first pin close to the inductor, and a second pin close to the transformer, the first pin of the first capacitor is connected to the first pin of the second capacitor, and the second pin of the first capacitor and the second pin of the second capacitor are respectively connected to the two transformers.

In one embodiment, the electronic component further includes a first rectifier module, which is connected to the inductor and disposed on the circuit board body along the first direction.

In one embodiment, the power supply unit includes a first sub-power supply unit and a second sub-power supply unit, the first rectifier module is connected to the first sub-power supply unit and the second sub-power supply unit, and the first sub-power supply unit and the second sub-power supply unit have the same composition.

In one of the embodiments, the first sub-power supply unit includes the inductor, the capacitor, the switch and the two transformers, the first rectifier module is connected to the inductor, the switch is connected to the inductor and the capacitor, and the capacitor is connected to the transformer.

In one embodiment, the electronic components also include a second rectifier module, the first sub-power supply unit and the second sub-power supply unit are both provided with the second rectifier module, the two transformers in the first sub-power supply unit are located between the capacitor and the second rectifier module, and the second rectifier module is connected to the two transformers.

In one embodiment, the second rectifier module is a rectifier diode, the switch is a switch tube, and the second rectifier module and the switch are both provided with a heat sink.

In one embodiment, the transformer includes a primary winding and a secondary winding, and the sum of the distance between the output end of the secondary winding and the input end of the second rectifier module and the distance between the output end of the second rectifier module and the capacitor is less than or equal to 10 cm.

In one embodiment, there are multiple power supply units, and the multiple power supply units share a common ground.

In one embodiment, the circuit board body is a multilayer board, a plurality of the power supply units are located on one layer of the multilayer board, the transformer includes a primary winding and a secondary winding, the primary winding and the secondary winding are respectively located in different pad areas, the pad area where the primary winding is located and the pad area where the secondary winding is located are respectively shared by a common ground, and the pad area is grounded.

In one of the embodiments, the circuit board body includes a top circuit board, a bottom circuit board, and an intermediate circuit board located between the top circuit board and the bottom circuit board, and the top circuit board and the bottom circuit board are both grounded.

The present application also relates to a power module, comprising the above-mentioned circuit board.

In the above circuit board, the pad area covers the mounting area, so that the mounting area on the surface of the circuit board body becomes a conductive area. The electronic components are arranged on the circuit board body through the pad area, so that the various electronic components share a common ground, avoiding the use of copper wires for connection, and effectively reducing the generation of parasitic inductance. The power module using the above circuit board has a small parasitic inductance, which is conducive to improving the efficiency of the power module.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic structural diagram of a circuit board according to an embodiment.

Detailed ways

The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

In order to enable those skilled in the art to better understand the technical solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application.

It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

As shown in Figure 1, the circuit board of the present application includes at least one power supply unit 1, the power supply unit 1 includes a circuit board body and electronic components, the surface of the circuit board body close to the electronic components includes multiple solder pad areas A, the solder pad areas A include multiple installation areas, the solder pad areas A cover the installation areas, and the electronic components are arranged on the circuit board body through the solder pad areas A.

In the above-mentioned circuit board, the pad area A covers the installation area, so that the installation area on the surface of the circuit board body becomes a conductive area. The electronic components are arranged on the circuit board body through the pad area A, so that the various electronic components share a common ground, avoiding the use of copper wires for connection, and effectively reducing the generation of parasitic inductance.

The circuit board may include at least one power supply unit, and each power supply unit is arranged in parallel on the surface of the circuit board. The number of power supply units can be selected according to the voltage value to be output, the number of electronic components and the cost. For example, when the voltage value to be output is high, more power supply units can be selected to be connected in parallel or in series to meet the requirements of the output voltage value. For example, one or more circuit units can be set on the circuit board. As shown in Figure 1, in this embodiment, the circuit board includes three power supply units 1, and the three power supply units 1 are arranged side by side. The three power supply units 1 can be connected in parallel or in series. The number and type of electronic components included in the three power supply units 1 are the same.

It should be noted that when the circuit board includes multiple power supply units, the pad areas between adjacent power supply units are isolated, that is, each power supply unit corresponds to a pad area, and the multiple power supply units are respectively grounded. For example, in the embodiment shown in Figure 1, the circuit board includes three power supply units, and the three power supply units correspond to a pad area, that is, three pad areas are included. Among them, each pad area is respectively grounded to avoid short circuits between power supply units. The isolation between adjacent power supply units can be achieved by setting a gap between the pad areas, and the size of the gap can be selected according to actual needs and is not limited here.

In addition, the number of pad areas can be set according to the number of power supply units. For example, the surface of the circuit board body close to the electronic components can include at least two pad areas, one is a pad area for input, and the other is a pad area for output.

For the convenience of description, the circuit board of the present application is described below by taking one of the power supply units 1 as an example.

In this embodiment, the surface of the circuit board body includes a plurality of pad areas, and the pad area includes a plurality of mounting areas, and gaps are provided between adjacent mounting areas to separate the mounting areas. It should be noted that the plurality here refers to two or more. That is, in this embodiment, the surface of the circuit board body includes a mounting area and a non-mounting area N, wherein the mounting area is used to set electronic components, and the non-mounting area N is used to separate adjacent mounting areas. The pad area covers the mounting area, that is, the surface of each mounting area is a connection area. Among them, the pad area is a copper-plated layer. The pins of the electronic components are all connected to the pad area, so that each electronic component is grounded, avoiding the traditional use of copper wires for connection, and effectively reducing parasitic parameters. For example, the electronic components arranged in the same pad area are all connected to the common ground. The number of pad areas can be multiple, for example, in one of the power supply units 1, two pad areas are included, namely pad area A and pad area B, wherein pad area A is used for input and pad area B is used for output. A safety distance is provided between pad area A and pad area B to isolate pad area A and pad area B. Each pad area may include at least one mounting area. As shown in FIG1 , in the present embodiment, the pad area A includes a plurality of mounting areas, and the mounting areas include at least a first mounting area S1, a second mounting area S2, a third mounting area S3, a fourth mounting area S4, a fifth mounting area S5, a sixth mounting area S6, and a seventh mounting area S7. The input and output ends of the electronic components are respectively located in different mounting areas, and the width of the components themselves spans across different mounting areas, and the pins of the electronic components are connected to the pad area, thereby avoiding the use of copper wires for connection between electronic components and reducing parasitic parameters. It should be noted that the connection method between the electronic components and the pad area is a commonly used connection method in the art, such as a welding connection, which is not limited here.

Please continue to refer to Figure 1. In this embodiment, the electronic components include a switch 10, an inductor 20, a capacitor 30 and a transformer 40. The switch 10, the inductor 20, the capacitor 30 and the transformer 40 are arranged in sequence along a first direction. The first direction is the vertical direction of the circuit board shown in Figure 1. One end of the switch 10 is connected to the first mounting area S1, and the other end is connected to the fourth mounting area S4. One end of the inductor 20 is connected to the second mounting area S2, and one end is connected to the fourth mounting area S4 or the fifth mounting area S5. One end of the capacitor 30 is connected to the fourth mounting area S4, and one end is connected to the sixth mounting area S6; or, one end of the capacitor 30 is connected to the fifth mounting area S5, and one end is connected to the seventh mounting area S7. One end of the transformer 40 is connected to the sixth mounting area S6, and the other end is connected to other mounting areas.

Furthermore, in this embodiment, the capacitor 30 includes a first side and a second side that are adjacent to each other, the length of the first side is greater than the length of the second side, and the extension direction of the first side is consistent with the first direction. That is, the capacitor 30 is placed vertically on the circuit board, so that the pins of the capacitor 30 are closer to the pins of the inductor 20, shortening the connection distance between the two, which is conducive to reducing parasitic parameters.

In this embodiment, the current is input through the inductor, the capacitor is charged by controlling the switch (for example, adjusting the on-off frequency and duty cycle of the switch), and then output to the load through the transformer 40. The transformer includes a primary winding and a secondary winding, and the primary winding and the secondary winding are respectively located in different pad areas, and the pad area where the primary winding is located and the pad area where the secondary winding is located are respectively grounded. The pad area for input and the pad area for output are not grounded, that is, a pad area is provided at each end of the transformer to avoid short circuit.

Specifically, a single power supply unit 1 includes two pad areas, namely pad area A and pad area B, and pad area A and pad area B are isolated. Among them, pad area A is the input area, and pad area B is the output area. Electronic components located in the same pad area share a common ground, while electronic components located in different pad areas share a common ground respectively. When there is three-phase electricity on the circuit board, that is, the circuit board includes three power supply units 1, and each power supply unit 1 corresponds to one phase respectively. The first phase includes pad area A (input) and pad area B (output), the second phase includes pad area A (input) and pad area B (output), and the third phase also includes pad area A (input) and pad area B (output). Therefore, the three-phase electricity circuit board includes 6 areas, and each area shares a common ground respectively.

Please continue to refer to Figure 1. In this embodiment, the capacitor 30 includes a first capacitor 300 and a second capacitor 302, and the number of transformers 40 is at least two. The first capacitor 300 and the second capacitor 302 both include a first pin close to the inductor 20, and a second pin close to the transformer 40. The first pin of the first capacitor 300 is connected to the first pin of the second capacitor 302, and the second pin of the first capacitor 300 and the second pin of the second capacitor 302 are respectively connected to the two transformers 40. The first pin of the first capacitor 300 and the first pin of the second capacitor 302 are both located in the fourth installation area S4 or the fifth installation area S5, and the second pin of the first capacitor 300 and the second pin of the second capacitor 302 are respectively located in the installation area where the corresponding transformer 40 is located. After the current flows in through the first pin of the first capacitor 300 or the first pin of the second capacitor 302, it flows into the corresponding transformer 40 through the second pin of the first capacitor 300 or the second pin of the second capacitor 302. With two capacitors, the voltage range of the circuit board output can be expanded to be suitable for different application scenarios. In this embodiment, the number of capacitors 30 is two, corresponding to two transformers 40 respectively. In other embodiments, the number of capacitors 30 may also be one, corresponding to one transformer 40. Similarly, the number of capacitors 30 may also be one, corresponding to multiple transformers 40. This is not limited here.

In the present embodiment, the electronic components also include a first rectifier module 50, which is connected to the inductor 20 and is arranged on the circuit board body along the first direction. The input current enters the inductor 20 after being rectified and filtered by the first rectifier module 50. Further, in the present embodiment, each power supply unit 1 includes a first sub-power supply unit and a second sub-power supply unit, and the first rectifier module 50 is connected to the first sub-power supply unit and the second sub-power supply unit, and the first sub-power supply unit and the second sub-power supply unit have the same composition. As shown in Figure 1, the circuit board in the present embodiment includes three power supply units 1, each of which includes two small units, namely, the first sub-power supply unit and the second sub-power supply unit. The first sub-power supply unit and the second sub-power supply unit both include a switch 10, an inductor 20, a capacitor 30 and a transformer 40. Among them, the first sub-power supply unit and the second sub-power supply unit share the first rectifier module 50 to reduce product cost. The first rectifier module 50 is a common rectifier module in the art, such as, it can be two diodes, which is not limited here.

In this embodiment, the first sub-power supply unit includes an inductor 20, a capacitor 30, a switch 10 and two transformers 40, the first rectifier module 50 is connected to the inductor 20, the switch 10 is connected to the inductor 20 and the capacitor 30, and the capacitor 30 is connected to the transformer 40. The input current enters the inductor 20 after rectification and filtering by the first rectifier module 50, and then changes the current value or voltage value flowing through the capacitor 30 by controlling the switch 10, and then outputs through the transformer 40.

In this embodiment, the electronic components further include a second rectifier module 60, the first sub-power unit and the second sub-power unit are both provided with the second rectifier module 60, the two transformers 40 in the first sub-power unit are located between the capacitor 30 and the second rectifier module 60, and the second rectifier module 60 is connected to the two transformers 40. In the first sub-power unit, the two transformers 40 share a second rectifier module 60. The second rectifier module 60 is a half-wave rectifier, and the voltage output from the secondary side of the transformer 40 is rectified by the second rectifier module 60 and then transmitted to the load. At the same time, in this embodiment, the first sub-power unit includes two transformers 40, that is, the first rectifier module 50 is connected to the first sub-power unit and the second sub-power unit, and the first sub-power unit or the second sub-power unit includes two transformers 40. The first sub-power unit and the second sub-power unit share the first rectifier module 50, and the two transformers 40 in the first sub-power unit share the second rectifier module 60. As shown in FIG. 1, in this embodiment, the second rectifier module 60 includes three pins, two pins are respectively connected to the two transformers 40, and the pin located between the two pins is used for rectification. That is, after the current is output through the secondary sides of the two transformers 40, it first enters the second rectifier module 60 through their respective pins, and then is rectified and output through the middle pin. The pins connecting the second rectifier module 60 to the transformer 40 and the corresponding secondary windings of the transformer 40 are located in the same installation area, which reduces the parasitic inductance of the secondary side of the transformer 40.

In this embodiment, the sum of the distance between the output end of the secondary winding of the transformer 40 and the input end of the second rectifier module 60 and the distance between the output end of the second rectifier module 60 and the capacitor 30 is less than or equal to 10 cm. In this way, the parasitic inductance of the secondary winding of the transformer 40 can be reduced and the efficiency of the power module can be improved. When the distance between the output end of the secondary winding of the transformer 40 and the input end of the second rectifier module 60 and the distance between the output end of the second rectifier module 60 and the capacitor 30 are too long, the parasitic inductance of the secondary side of the transformer 40 will be large, thereby significantly reducing the power of the power module.

In the present embodiment, the primary windings of the first rectifier module 50, the switch 10, the inductor 20, the capacitor 30, and the transformer 40 are grounded in common, and the secondary winding of the transformer 40 is grounded in common with the second rectifier module 60. In addition, the first rectifier module 50, the switch 10, the inductor 20, the capacitor 30, the transformer 40, and the second rectifier module 60 are all arranged along the first direction, so that the layout of the electronic components is more compact, the connection distance between the electronic components is shortened, and the parasitic inductance is reduced. In addition, when the circuit board body includes a plurality of power supply units, the plurality of power supply units are arranged in a matrix. The matrix arrangement refers to a square array formed by the circuit units arranged in a rectangular shape, which can not only make the layout of the circuit board more compact, but also improve the conversion efficiency of the power supply unit.

In this embodiment, the circuit board body is a multilayer board, and multiple power supply units are located in one layer of the multilayer board. The surface of the circuit board provided with the power supply unit is covered with a pad area, and the pad area is grounded. It should be noted that the grounding here refers to the power ground. That is, the pad area where the primary winding of the transformer is located is connected to the output negative pole of the first rectifier module. The pad area where the secondary winding of the transformer is located is connected to the output negative pole of the second rectifier module. When the circuit board includes multiple pad areas, each pad area is grounded separately. The circuit board can be designed into multiple layers according to actual conditions. For example, it can be set as a four-layer board, from bottom to top, respectively, the first layer, the second layer, the third layer and the fourth layer. The power supply unit is set on the fourth layer, that is, the top layer. According to the number of power supply units, multiple pad areas will be set on the surface of the fourth layer of the circuit board, and the multiple pad areas are grounded separately. That is, the fourth layer of the circuit board is grounded as a whole, achieving the effect of common ground, which is conducive to reducing parasitic parameters. In addition, when multiple power supply units are provided on the top layer of the circuit board, the multiple power supply units are grounded to reduce parasitic parameters.

In addition, when a power supply circuit is synthesized by multiple single-stage circuit units, when the power supply circuit is working at high power, the electromagnetic radiation generated will be very strong. Therefore, in this embodiment, the circuit board body includes a top circuit board, a bottom circuit board, and an intermediate circuit board located between the top circuit board and the bottom circuit board, and the power supply unit is arranged on the top circuit board. Both the top circuit board and the bottom circuit board are grounded. Since the top circuit board is grounded through the pad area, when both the top circuit board and the bottom circuit board are grounded, it is equivalent to forming a metal shield outside the intermediate circuit board, and wrapping the intermediate circuit board therein can prevent electromagnetic radiation from radiating outward, thereby effectively reducing electromagnetic radiation and achieving a good shielding effect.

In addition, in this embodiment, the second rectifier module 60 is a common half-wave rectifier circuit, for example, a rectifier diode. Among them, the switch 10 is a switch 10 tube, and the second rectifier module 60 and the switch 10 are both provided with a heat sink to dissipate the heat generated by the circuit board during operation in a timely manner. The location and method of setting the heat sink are common in the art and are not limited here.

The above circuit board can be used in a power module. The power module using the above circuit board has small parasitic parameters, which is beneficial to improving the efficiency of the power module.

The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims (14)

1. The utility model provides a circuit board, its characterized in that includes at least one power supply unit, the power supply unit includes circuit board body and electronic components, the surface that the circuit board body is close to electronic components includes a plurality of pad district, the pad district includes a plurality of installation region, the pad district covers the installation region makes the installation region of circuit board body surface becomes the electrically conductive district, electronic components pass through the pad district set up in the circuit board body.

2. The circuit board of claim 1, wherein the electronic component comprises a switch, an inductor, a capacitor, and a transformer, the switch, the inductor, the capacitor, and the transformer being arranged in sequence along a first direction.

3. The circuit board of claim 2, wherein the capacitor comprises adjacent first and second sides, the first side having a length greater than a length of the second side, the first side extending in a direction coincident with the first direction.

4. A circuit board according to claim 2 or 3, wherein the capacitors comprise a first capacitor and a second capacitor, the number of transformers is at least two, the first capacitor and the second capacitor each comprise a first pin close to the inductor, and a second pin close to the transformer, the first pin of the first capacitor is connected to the first pin of the second capacitor, and the second pin of the first capacitor and the second pin of the second capacitor are connected to the two transformers, respectively.

5. A circuit board according to claim 2 or 3, wherein the electronic component further comprises a first rectifying module, the first rectifying module being connected to the inductor and being arranged in the circuit board body along the first direction.

6. The circuit board of claim 5, wherein the power supply unit comprises a first sub power supply unit and a second sub power supply unit, the first rectifying module is connected to the first sub power supply unit and the second sub power supply unit, and the first sub power supply unit and the second sub power supply unit have the same composition.

7. The circuit board of claim 6, wherein the first sub power supply unit comprises the inductor, the capacitor, the switch, and two transformers, the switch being connected to the inductor, the capacitor, and the capacitor being connected to the transformers.

8. The circuit board of claim 6, wherein the electronic component further comprises a second rectifying module, the first sub power unit and the second sub power unit are both provided with the second rectifying module, two transformers in the first sub power unit are located between the capacitor and the second rectifying module, and the second rectifying module is connected with the two transformers.

9. The circuit board of claim 8, wherein the second rectifying module is a rectifying diode, the switch is a switching tube, and both the second rectifying module and the switch are provided with cooling fins.

10. The circuit board of claim 9, wherein the transformer comprises a primary winding and a secondary winding, and wherein a sum of a distance between an output of the secondary winding and an input of the second rectifying module and a distance between an output of the second rectifying module and the capacitor is 10cm or less.

11. A circuit board according to claim 1, 2 or 3, wherein there are a plurality of said power supply units, a plurality of said power supply units being respectively grounded.

12. A circuit board according to claim 2 or 3, wherein the circuit board body is a multilayer board, a plurality of the power supply units are located on one layer of the multilayer board, the transformer comprises a primary winding and a secondary winding, the primary winding and the secondary winding are respectively located in different bonding pad areas, the bonding pad areas where the primary winding is located and the bonding pad areas where the secondary winding is located are respectively and commonly grounded, and the bonding pad areas are grounded.

13. The circuit board of claim 12, wherein the circuit board body comprises a top circuit board, a bottom circuit board, and a middle circuit board between the top circuit board and the bottom circuit board, the top circuit board and the bottom circuit board each being grounded.

14. A power module comprising the circuit board of any one of claims 1-13.