Disclosure of utility model
Therefore, it is necessary to provide a grinding wheel with grooves which are easy to drain, slag and chip, and solve the problems in the prior art that the grooves of the grinding wheel have poor drainage and chip removal functions, so that silicon material chips and diamond resin chips generated continuously by grinding can stay on the grinding wheel and the surface of a silicon rod for a large amount and a long time, and the grinding effect such as the surface finish of the silicon material is affected.
In order to achieve the above purpose, the utility model provides a grinding wheel with a groove which is easy to drain, slag and chip, comprising a base body and a working layer; the center of the base body is provided with a connecting shaft hole which is used for being connected with driving equipment; the working layer comprises grinding blocks and grooves, wherein a plurality of grinding blocks are arranged on one side surface of the base body in an equidistant annular mode, and the grooves are formed between two adjacent grinding blocks; the inner side opening of the groove is larger than the outer side opening, and the inner side opening and the outer side opening are in smooth transition.
Further, the projection of the groove in a direction perpendicular to one side face of the base body is trapezoidal.
Further, the projection of the two side surfaces of the groove in the direction perpendicular to one side surface of the substrate is an arc line.
Further, an annular groove is formed in the base body, the grinding block is arranged in the annular groove, and the depth of the annular groove is smaller than the thickness of the grinding block.
Further, the abrasive block is detachably connected with the base body.
Further, an adhesive layer is arranged between the grinding block and the matrix, and detachable connection is realized through the adhesive layer.
Further, the device also comprises a positioning hole, and the positioning hole is arranged on the base body.
Further, the groove has an inner side opening width that is less than an inner side edge width of the block.
Further, the substrate is a rigid substrate.
Further, the grinding block is made of diamond resin material.
Compared with the prior art, the technical scheme is characterized in that the grinding wheel is formed by combining the base body and the working layer, the width of the inner side opening of the groove of the working layer is increased, the inverted splayed inclined surface structure or the inverted horn-shaped cambered surface structure is formed, cooling water, silicon material scraps and diamond resin scraps can be more smoothly and more rapidly thrown out of the grinding wheel through the groove with the new structure under the action of rotating centrifugal force and water pressure in the grinding process of rotating and moving the grinding wheel, the stay of scraps on the grinding wheel and the surface of the silicon material is reduced, the functions of water drainage, slag discharge and chip removal of grinding are enhanced, and the grinding processing effects such as the surface finish of the silicon material are improved.
Detailed Description
In order to describe the technical content, constructional features, achieved objects and effects of the technical solution in detail, the following description is made in connection with the specific embodiments in conjunction with the accompanying drawings.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of the phrase "in various places in the specification are not necessarily all referring to the same embodiment, nor are they particularly limited to independence or relevance from other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the technical features mentioned in each embodiment may be combined in any manner to form a corresponding implementable technical solution.
Unless defined otherwise, technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application pertains; the use of related terms herein is for the purpose of describing particular embodiments only and is not intended to limit the application.
In the description of the present application, the term "and/or" is a representation for describing logical relationships between objects, which means that three relationships may exist, e.g., a and/or B, representing: there are three cases, a, B, and both a and B. In addition, the character "/" herein generally indicates that the context associated object is a logical relationship of a type "or".
In the present application, terms such as "first" and "second" are used merely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual number, order, or sequence of such entities or operations.
Without further limitation, the use of the terms "comprising," "including," "having," or other like terms in this specification is intended to cover a non-exclusive inclusion, such that a process, method, or article of manufacture that comprises a list of elements does not include additional elements but may include other elements not expressly listed or inherent to such process, method, or article of manufacture.
As in the understanding of "review guidelines," the expressions "greater than", "less than", "exceeding" and the like are understood to exclude this number in the present application; the expressions "above", "below", "within" and the like are understood to include this number. Furthermore, in the description of embodiments of the present application, the meaning of "a plurality of" is two or more (including two), and similarly, the expression "a plurality of" is also to be understood as such, for example, "a plurality of" and the like, unless specifically defined otherwise.
In the description of embodiments of the present application, spatially relative terms such as "center," "longitudinal," "transverse," "length," "width," "thickness," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counter-clockwise," "axial," "radial," "circumferential," etc., are used herein as a basis for the description of the embodiments or as a basis for the description of the embodiments, and are not intended to indicate or imply that the devices or components referred to must have a particular position, a particular orientation, or be configured or operated in a particular orientation and therefore should not be construed as limiting the embodiments of the present application.
Unless specifically stated or limited otherwise, the terms "mounted," "connected," "affixed," "disposed," and the like as used in the description of embodiments of the application should be construed broadly. For example, the "connection" may be a fixed connection, a detachable connection, or an integral arrangement; the device can be mechanically connected, electrically connected and communicated; it can be directly connected or indirectly connected through an intermediate medium; which may be a communication between two elements or an interaction between two elements. The specific meaning of the above terms in the embodiments of the present application can be understood by those skilled in the art to which the present application pertains according to circumstances.
Referring to fig. 1 to 7, the present embodiment provides a grinding wheel with a groove 22 for easily draining, discharging, and removing chips, comprising a substrate 10 and a working layer 20; the base body 10 is a rigid base body 10, the shape of the base body is disc-shaped, two side surfaces are plane, one side surface is used for bearing and fixing the working layer 20, the working layer 20 and the surface of the silicon rod are rubbed to carry out polishing work, the base body can be made of metal materials, preferably, an aluminum base body 10 can be selected, the aluminum base body 10 per unit volume is light in weight, the centrifugal force is small, the load of a main shaft is reduced, and the base body is better and lighter and used for grinding workpieces. The center of the base body 10 is provided with a connecting shaft hole 11, the connecting shaft hole 11 is used for being connected with a driving device, specifically, the driving device is usually a motor, and a driving main shaft of the motor is fixedly connected with the connecting shaft hole 11 of the base body 10, so that the base body 10 is driven to rotate. The working layer 20 includes a grinding block 21 and a groove 22, wherein the grinding block 21 may be made of electroplated diamond or resin diamond, and preferably resin diamond may be used. In addition, the price of the resin diamond grinding wheel is relatively low, and the resin diamond grinding wheel is more suitable for mass production. The grinding blocks 21 are arranged on one side surface of the base body 10 in a plurality of equidistant rings, and the grooves 22 are formed between two adjacent grinding blocks 21; the inner side opening 221 of the groove 22 is larger than the outer side opening 222, and the inner side opening 221 and the outer side opening 222 are in smooth transition. The inner side opening 221 is opened to the direction close to the center of the base body 10, and the outer side opening 222 is opened to the direction far from the center of the base body 10. The groove 22 may be inverted splayed or bell-mouth shaped, specifically, the projection of the groove 22 in the direction perpendicular to one side surface of the substrate 10 is trapezoidal, that is, an inverted splayed inclined surface structure is formed, or the projection of both side surfaces of the groove 22 in the direction perpendicular to one side surface of the substrate 10 is arc, that is, an inverted bell-mouth shaped arc surface structure is formed. Preferably, the width of the inner opening 221 of the groove 22 is smaller than the width of the inner side edge of the grinding block 21, so that the proportion of the grinding block 21 and the groove 22 on the working layer 20 is more reasonable, and the polishing efficiency is not affected while the drainage efficiency is ensured.
The utility model discloses a base member 10 and working layer 20 combination form the emery wheel, the inboard mouth 221 width increase of the slot 22 of working layer 20, form the inclined plane structure of the shape of falling splay or the cambered surface structure of the shape of falling horn mouth, rotatory and remove the grinding in-process at the emery wheel, under rotatory centrifugal force and hydraulic pressure effect, cooling water and silicon material piece, diamond resin piece can more smoothly, more quick the follow emery wheel through new construction slot 22 throws out and discharges, reduce the stay of piece on the emery wheel and silicon material surface, strengthen grinding drainage sediment chip removal function, the grinding processing effects such as surface finish of silicon material have been promoted.
It should be noted that, when grinding the silicon rod, the grinding wheel is generally vertically disposed, that is, the grinding block 21 contacts the surface of the silicon rod in the horizontal direction, when the cooling water sprays and cools the grinding wheel, a part of the mixture of the cooling water and the chips is directly discharged to the outside, and the other part of the cooling water remaining inside the grinding wheel flows downwards under the action of gravity and is thrown outwards through the combined action of the rotating centrifugal force and the water pressure into the groove 22, and the cooling water can enter the groove 22 faster and more through the widened opening 221 inside the groove 22, thereby improving the efficiency of water drainage and chip removal, and further realizing the effect of improving the grinding effect.
In some embodiments, the grinding block 21 is detachably connected with the base 10, so that the grinding block 21 which is worn out and cannot be used continuously can be replaced conveniently, the recycling rate of the base 10 is improved, the cost is saved, for example, matched through holes are formed in the base 10 and the grinding block 21, and locking and fixing are performed through fasteners such as bolts; or be equipped with the adhesion layer between the abrasive brick 21 and the base member 10, through the adhesion layer realization can dismantle the connection, for example use glue with the abrasive brick 21 is glued on the base member 10, can set up the annular 13 on the base member 10 simultaneously, the abrasive brick 21 set up in the annular 13, the abrasive brick 21 can with the bottom surface can carry out the adhesion with the base member 10 outside, the side bottom can also carry out the adhesion with the inside wall of annular 13, increase the adhesion area for the abrasive brick 21 can be more stably fixed on the base member 10, and it is noted that the degree of depth of annular 13 is less than the thickness of abrasive brick 21, for example the general degree of depth of annular 13 is 1mm, abrasive brick 21 is 4-5mm.
In some embodiments, the grinding wheel driving device further comprises a positioning hole 12, wherein the positioning hole 12 is arranged on the base body 10, specifically, the positioning hole 12 is arranged at the periphery of the connecting shaft hole 11, and is used for assisting in positioning connection between the grinding wheel and the driving device, so that the assembly efficiency is improved.
It should be noted that, although the foregoing embodiments have been described herein, the scope of the present utility model is not limited thereby. Therefore, based on the innovative concepts of the present utility model, alterations and modifications to the embodiments described herein, or equivalent structures or equivalent flow transformations made by the present description and drawings, apply the above technical solutions directly or indirectly to other relevant technical fields, all of which are included in the scope of protection of the present patent.