CN220895458U - Wafer detecting device - Google Patents

Abstract

The utility model belongs to the technical field of wafer detection, and particularly relates to a wafer detection device. The wafer detection device comprises a carrying platform, a heating assembly, a detection piece and an induction assembly, wherein the carrying platform is used for carrying a wafer, the carrying platform can drive the wafer to rotate, the heating assembly comprises a heating piece and a cable, the heating piece is arranged on the carrying platform and is used for heating the wafer, the heating piece is connected with a power supply below the carrying platform through the cable, the detection piece is arranged above the carrying platform, the carrying platform drives the wafer to rotate, so that the detection piece detects the wafer, the induction assembly is arranged on the periphery of the carrying platform, a triggering piece is arranged on the carrying platform and is rotated for a circle, the triggering piece can trigger the induction assembly, and after the induction assembly is triggered, the carrying platform is controlled to rotate in the opposite direction. The wafer detection device changes the rotation direction after the carrying platform rotates for one circle through the induction component, so that the cable rotates for one circle along with the carrying platform and is wound for one circle, the reverse rotation is performed, the winding is released, the problem that the cable is broken by pulling is avoided, the use cost of the cable is saved, and the wafer detection accuracy is improved.

Description

Wafer detecting device

Technical Field

The utility model relates to the technical field of wafer detection, in particular to a wafer detection device.

Background

After the wafer is manufactured, the resistance performance of the surface of the wafer needs to be detected one by one so as to ensure that the wafer can be used normally. In the prior art, when detecting, a wafer is placed on a rotating wafer carrier, a movable detector is arranged on the periphery of the wafer carrier, the detector can move along the radial direction of the carrier, and all positions on the surface of the wafer can be detected by combining the radial movement of the detector with the rotation of the wafer carrier.

When the central position of the wafer is detected, resistance change under the temperature with different central points is required to be detected, so that the wafer carrying platform is further provided with a heating plate for changing the temperature of the central points of the wafer, the heating plate is electrified by a cable connection power supply, when the wafer carrying platform rotates for a plurality of circles in one direction, the cable can be wound and knotted below the wafer carrying platform and is finally pulled off, the cost is increased due to the replacement of the cable, and the constant temperature environment is damaged due to the breakage of the cable, so that the detection result of the wafer is affected.

Disclosure of utility model

The utility model aims to provide a wafer detection device, which solves the problem that a cable is broken after being wound and knotted due to the fact that a carrier rotates for a plurality of circles in one direction in the prior art, so that the cost of using the cable is saved, and the accuracy of wafer detection is improved.

To achieve the purpose, the utility model adopts the following technical scheme:

a wafer inspection apparatus includes:

The carrier is used for carrying the wafer and can drive the wafer to rotate;

The heating assembly comprises a heating sheet and a cable, wherein the heating sheet is arranged on the carrying platform and is used for heating the wafer, and the heating sheet is connected with a power supply below the carrying platform through the cable;

The detection piece is arranged above the carrying platform, and the carrying platform drives the wafer to rotate so that the detection piece detects the wafer;

The induction component is arranged on the periphery of the carrying platform, the carrying platform is provided with a trigger piece, the carrying platform rotates for one circle, the trigger piece can trigger the induction component, and after the induction component is triggered, the carrying platform is controlled to rotate in the opposite direction.

As an optional technical scheme of the wafer detection device, the sensing assembly comprises a limiting rod, a first sensor and a second sensor, wherein the limiting rod is rotatably arranged on the periphery of the carrier; the first sensor and the second sensor are arranged at one end of the limiting rod, which is far away from the carrier, and are symmetrically arranged relative to the limiting rod; the trigger piece is abutted with the other end of the limiting rod, so that the limiting rod can trigger the first sensor or the second sensor.

As an optional technical scheme of the wafer detection device, a bearing block is arranged on the periphery of the carrying platform, a rotating shaft is arranged at the center of the bearing block, and the limiting rod is rotationally connected with the rotating shaft.

As an optional technical scheme of the wafer detection device, one end of the bearing block, which is far away from the carrying platform, is provided with the first inductor and the second inductor at intervals, and the induction ends of the first inductor and the second inductor are all arranged on one side, which is close to the limiting rod.

As an optional technical scheme of wafer detection device, wafer detection device still includes first spring and second spring, first spring with first inductor all is located the first side of gag lever post, the second spring with the second inductor all is located the second side of gag lever post, first spring with the second spring is relative the gag lever post symmetry sets up, just first spring is kept away from the one end of gag lever post with the one end that the second spring kept away from the gag lever post is fixed in respectively the both sides that the carrier block is close to the one end of carrier.

As an optional technical scheme of the wafer detection device, a connecting surface is arranged between the end surface of the bearing block, which is close to one end of the bearing table, and two adjacent side walls, and the first spring and the second spring are respectively connected to the two connecting surfaces.

As an optional technical scheme of the wafer detection device, the trigger piece is arranged as an abutting joint, the abutting joint is arranged in the circumferential direction of the carrying platform, the carrying platform rotates to drive the abutting joint to rotate, the abutting joint can abut against the limiting rod to drive the limiting rod to rotate, so that one end of the limiting rod, which is far away from the carrying platform, abuts against the sensing end of the first sensor or abuts against the sensing end of the second sensor.

As an optional technical scheme of the wafer detection device, the sensing assembly comprises a proximity sensor, the proximity sensor is arranged on the periphery of the carrier, and the trigger piece is a metal piece.

As an optional technical scheme of the wafer detection device, a rotating motor is arranged on the carrier and used for driving the carrier to rotate, and after the induction component is triggered, the rotating motor rotates in the opposite direction by changing the direction of current.

As an optional technical scheme of the wafer detection device, the wafer detection device further comprises a support assembly and a slideway, wherein the detection piece is arranged above the carrying platform through the support assembly; and a slide way is arranged along the radial direction of the carrying platform, and the supporting component is arranged on the slide way in a sliding way.

The utility model has the beneficial effects that:

The wafer detection device provided by the utility model uses the carrier to bear the wafer and drive the wafer to rotate, the detection piece is arranged above the carrier, the wafer is detected by using the rotation of the carrier, the heating piece is arranged on the carrier and is connected with a power supply below the carrier through a cable so as to keep the wafer constant, the induction component is arranged on the periphery of the carrier, the trigger piece is arranged on the carrier, the carrier rotates for one circle, the trigger piece can trigger the induction component, and the carrier is controlled to rotate in the opposite direction. According to the wafer detection device, the induction component is arranged to change the rotation direction of the carrier after the carrier rotates for one circle, so that the cable rotates for one circle along with the carrier and winds around the carrier for one circle, the reverse rotation is performed again along with the carrier to unwind the carrier, the problem that the cable rotates for multiple circles in one direction and is wound and knotted to be broken after the cable rotates along with the carrier is avoided, the cost of using the cable is saved, and the accuracy of wafer detection is improved.

Drawings

FIG. 1 is a top view of a wafer inspection apparatus provided by the present utility model;

FIG. 2 is an isometric view of a wafer inspection apparatus provided by the present utility model;

FIG. 3 is a side view of a wafer inspection apparatus provided by the present utility model;

fig. 4 is an isometric view of a sensing assembly and trigger of a wafer inspection apparatus provided by the present utility model.

In the figure:

1. A carrier; 11. a trigger; 12. a relief groove; 13. a rotating electric machine; 14. a support column;

2. a heating assembly; 21. a heating sheet; 22. a cable;

3. A detecting member;

4. An induction assembly; 41. a first inductor; 42. a second inductor; 43. a limit rod; 431. a rotating shaft;

5. A bearing block; 51. A bearing surface; 52. A connection surface;

61. a first spring; 62. A second spring;

7. A support assembly;

8. and a slideway.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

Fig. 1 is a top view of a wafer inspection apparatus according to the present utility model, fig. 2 is an isometric view of the wafer inspection apparatus according to the present utility model, and fig. 3 is a side view of the wafer inspection apparatus according to the present utility model. Referring to fig. 1, 2 and 3, the present utility model provides a wafer detecting device, which solves the problem that in the prior art, a carrier 1 rotates for a plurality of circles in one direction, so that a cable 22 rotates along with the carrier 1 and is broken after being wound around a support column 14 for knotting, thereby saving the cost of using the cable 22 and improving the accuracy of wafer detection.

The wafer detection device comprises a carrier 1, a heating component 2, a detection piece 3 and an induction component 4, wherein the carrier 1 is used for carrying a wafer, and the carrier 1 can drive the wafer to rotate; the heating assembly 2 comprises a heating plate 21 and a cable 22, wherein the heating plate 21 is arranged on the carrying platform 1 and is used for heating a wafer, and the heating plate 21 is connected with a power supply below the carrying platform 1 through the cable 22; the detecting piece 3 is arranged above the carrying platform 1, and the carrying platform 1 drives the wafer to rotate so that the detecting piece 3 detects the wafer; the induction component 4 is arranged on the periphery side of the carrier 1, the carrier 1 is provided with a trigger piece 11, the carrier 1 rotates for one circle, the trigger piece 11 can trigger the induction component 4, and after the induction component 4 is triggered, the carrier 1 is controlled to rotate in the opposite direction.

When detecting the resistance performance of the center point of the surface of the wafer at different temperatures, when the wafer is placed on the carrier 1, a heating plate 21 is placed below the wafer for heating the wafer to change the temperature, in this embodiment, the heating plate 21 is fixed on the carrier 1 through a screw, the heating plate 21 is connected with a power supply through a cable 22, a trigger piece 11 is arranged on the carrier 1, an induction component 4 is circumferentially arranged, the position of the trigger piece 11 for triggering the induction component 4 is the starting position of the carrier 1 for rotation, when the carrier 1 rotates for one circle, the cable 22 is wound on a support column 14 below the carrier 1, at the moment, the trigger piece 11 triggers the induction component 4, after the induction component 4 is triggered, a signal is sent, the carrier 1 is controlled to rotate in the opposite direction, the cable 22 is unwound, the trigger piece 11 and the induction component 4 avoid the problem that the carrier 1 rotates for a plurality of circles in one direction, the cable 22 is wound on the support column 14 after the carrier 1 rotates, the cable 22 is knotted and is broken, the cost of using the cable 22 is saved, and meanwhile, the accuracy of the wafer detection is improved.

Fig. 4 is an isometric view of a sensing assembly and trigger of a wafer inspection apparatus provided by the present utility model. Referring to fig. 4, the sensing assembly 4 includes a limiting rod 43, a first sensor 41 and a second sensor 42, wherein the limiting rod 43 is rotatably disposed on the peripheral side of the carrier 1, and the first sensor 41 and the second sensor 42 are disposed at one end of the limiting rod 43 away from the carrier 1 and are symmetrically disposed with respect to the limiting rod 43; the triggering piece 11 is abutted with the other end of the limiting rod 43, so that the limiting rod 43 triggers the first sensor 41 or the second sensor 42.

In this embodiment, the first sensor 41 and the second sensor 42 are configured as photo-gates, and when the stop lever 43 blocks the light of one of the photo-gates, the other photo-gate is triggered to send a signal. In other embodiments, the first sensor 41 and the second sensor 42 may be provided as a touch sensor, a press sensor, or the like.

Further, a bearing block 5 is disposed on the periphery of the carrier 1, a rotating shaft 431 is disposed at the center of the bearing block 5, and the limiting rod 43 is rotatably connected with the rotating shaft 431. The bearing block 5 bears the limit rod 43 close to the carrying platform 1, so that the limit rod 43 can be abutted with the trigger piece 11.

In this embodiment, the rotation shaft 431 is set to be a bolt, the limiting rod 43 is provided with a first through hole, the bearing block 5 is provided with a first threaded hole, the bolt passes through the first through hole and is in threaded connection with the first threaded hole, and a clearance fit is formed between the first through hole and the bolt, so that the limiting rod 43 can rotate on the carrying platform 1, the end part of the bolt is arranged above the limiting rod 43, and the end part of the bolt and the upper surface of the bearing block 5 can limit the limiting rod 43 to move up and down in the rotation process. In other embodiments, the shaft 431 may be hinged to the bearing block 5.

Further, a first sensor 41 and a second sensor 42 are disposed at an end of the carrier block 5 away from the carrier 1, and sensing ends of the first sensor 41 and the second sensor 42 are disposed at a side close to the limiting rod 43. The sensing ends of the first sensor 41 and the second sensor 42 are close to each other, and the stopper rod 43 swings between the first sensor 41 and the second sensor 42 to trigger the second sensor 42 in forward rotation and the first sensor 41 in reverse rotation.

Specifically, the upper surface of the bearing block 5 is provided as a bearing surface 51, and the stop lever 43, the first sensor 41 and the second sensor 42 are all disposed on the bearing surface 51.

Further, the wafer detecting device further comprises a first spring 61 and a second spring 62, the first spring 61 and the first sensor 41 are located on the first side of the limiting rod 43, the second spring 62 and the second sensor 42 are located on the second side of the limiting rod 43, the first spring 61 and the second spring 62 are symmetrically arranged relative to the limiting rod 43, and one end, away from the limiting rod 43, of the first spring 61 and one end, away from the limiting rod 43, of the second spring 62 are respectively fixed on two sides, close to one end of the carrier block 5, of the carrier 1. The first spring 61 and the second spring 62 are used for driving the stop lever 43 to disengage from triggering the first sensor 41 or the second sensor 42 after the stop lever 43 triggers the first sensor 41 or the second sensor 42.

Illustratively, when the trigger 11 toggles the stop lever 43 to trigger the second sensor 42, the first spring 61 is compressed, the second spring 62 is stretched, and when the trigger 11 is separated from the stop lever 43, the first spring 61 and the second spring 62 drive the stop lever 43 to rotate due to their elastic restoring forces, and return to the initial positions.

The first spring 61 and the second spring 62 in this embodiment can also be used for protecting the cable 22 under the condition of power failure, when the carrier 1 is manually moved to abut the trigger piece 11 of the carrier 1 with the stop lever 43 to enable the carrier 1 to reach the initial rotating position, during the rotating process, the carrier 1 may rotate more than one circle due to improper observation, and the first spring 61 and the second spring 62 provided in this embodiment can provide mechanical limitation for the carrier 1, when the carrier 1 rotates to reach the elastic limit of the first spring 61 and the second spring 62, the carrier 1 cannot be manually rotated, so that the cable 22 is protected from being damaged.

Further, a connecting surface 52 is arranged between the end surface of the end, close to the carrier 1, of the carrier block 5 and the two adjacent side walls, and the first spring 61 and the second spring 62 are respectively connected to the two connecting surfaces 52. Specifically, the first spring 61 and the second spring 62 may be welded, glued, clamped, or the like with the two connection surfaces 52.

Further, the trigger piece 11 is configured as an abutting joint, the abutting joint is arranged in the circumferential direction of the carrier 1, the carrier 1 rotates to drive the abutting joint to rotate, the abutting joint can abut against the limiting rod 43 to drive the limiting rod 43 to rotate, so that one end of the limiting rod 43 away from the carrier 1 abuts against the sensing end of the first sensor 41 or abuts against the sensing end of the second sensor 42.

Specifically, the abutment may be provided as a screw, which is glued or welded to the carrier 1. In other embodiments, the sensing component 4 may be configured as a proximity sensor, where the proximity sensor is disposed on the peripheral side of the carrier 1, the trigger member 11 is configured as a metal member, when the carrier 1 rotates, the trigger member 11 rotates with the carrier 1, and when the trigger member 11 rotates to be within the detection range of the proximity sensor, the proximity sensor is triggered to send a signal to the controller, and the controller changes the rotation direction of the carrier 1.

Further, the carrier 1 is provided with a relief groove 12 along a radial direction, and the relief groove 12 is used for avoiding a suction pen when moving the wafer. The suction pen is used for sucking the side wall of the wafer, and after the suction pen is used for sucking the wafer, the suction pen places the wafer on the carrier 1 through the abdication groove 12, so that the wafer is prevented from being damaged after the wafer is contacted by hands.

Further, the wafer detection device also comprises a support component 7 and a slideway 8, and the detection piece 3 is arranged above the carrier 1 through the support component 7; a slideway 8 is arranged along the radial direction of the carrying platform 1, and the supporting component 7 is arranged on the slideway 8 in a sliding way. Specifically, set up motor control supporting component 7 slip on the supporting component 7, carrier 1 is at rotatory in-process, supporting component 7 drives the radial slip of detecting piece 3 along carrier 1, detecting piece 3 position remains motionless, carrier 1 is rotatory a round, detecting piece 3 has detected the resistance property on the surface of wafer outer lane this moment, detecting piece 3 removes a part to carrier 1 center this moment, carrier 1 is rotatory a round, detecting piece 3 has detected the resistance property on the surface of wafer inner lane, carrier 1 is rotatory to be cooperated with detecting piece 3 along carrier 1 radial movement, just can detect the resistance property in all positions on wafer surface.

Further, a rotating motor 13 is provided on the carrier 1 to drive the carrier 1 to rotate, and after the induction component 4 is triggered, the rotating motor 13 rotates in the opposite direction by changing the direction of the current.

Further, the wafer inspection apparatus further includes a controller capable of receiving the sensing signals from the first sensor 41 and the second sensor 42 and changing the direction of the current passing through the rotating motor 13, thereby controlling the stage 1 to change the rotation direction.

When the wafer detection device is used, the carrier 1 is manually stirred to the rotation initial position, the heating plate 21 is placed on the carrier 1, the wafer is placed on the heating plate 21 by using the suction pen, the rotating motor 13 and the detection piece 3 are started, after the carrier 1 rotates for one circle, the abutting joint stirring limiting rod 43 triggers the first sensor 41 to send out a signal, the controller receives an induction signal, the current direction in the rotating motor 13 is changed, the carrier 1 rotates in the opposite direction, after the carrier 1 rotates for one circle in the opposite direction, the second sensor 42 is triggered to send out a signal, and the controller receives the induction signal to change the current direction in the rotating motor 13 again. The detecting piece 3 gradually moves from the outer ring of the carrier 1 to the center of the carrier 1 in the process of repeatedly rotating the carrier 1, and at the moment, the power supply of the heating plate 21 is turned on, so that the detecting piece 3 detects the resistance change of the wafer at different temperatures at the center position, and the detection of all positions on the surface of the wafer is completed. After the carrying platform 1 rotates for one circle, the induction component 4 is triggered to change the rotation direction, so that the cable 22 rotates for one circle along with the carrying platform 1 and is wound around the supporting column 14 below the carrying platform 1, and then reversely rotates to unwind along with the supporting column 14, thereby avoiding the problem that the carrying platform 1 rotates for a plurality of circles in one direction, leading the cable 22 to be wound around the supporting column 14 after the carrying platform 1 rotates and knotted and pulled off, saving the cost of using the cable 22, preventing the cable 22 from being damaged, and improving the accuracy of wafer detection.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims (10)

1. The wafer detection device is characterized by comprising:

The wafer carrier comprises a carrier (1), wherein the carrier (1) is used for carrying a wafer, and the carrier (1) can drive the wafer to rotate;

The heating assembly (2), the heating assembly (2) comprises a heating sheet (21) and a cable (22), the heating sheet (21) is arranged on the carrying platform (1) and is used for heating the wafer, and the heating sheet (21) is connected with a power supply below the carrying platform (1) through the cable (22);

The detection piece (3) is arranged above the carrying platform (1), and the carrying platform (1) drives the wafer to rotate so that the detection piece (3) detects the wafer;

The induction component (4), induction component (4) are located the week side of microscope carrier (1), be provided with trigger piece (11) on microscope carrier (1), microscope carrier (1) is rotatory a week, trigger piece (11) can trigger induction component (4), after induction component (4) are triggered, control microscope carrier (1) is rotatory to opposite direction.

2. Wafer inspection apparatus according to claim 1, wherein the sensing assembly (4) comprises:

The limiting rod (43) is rotatably arranged on the periphery side of the carrying platform (1);

The first inductor (41) and the second inductor (42) are arranged at one end, far away from the carrier (1), of the limiting rod (43) and are symmetrically arranged relative to the limiting rod (43); the triggering piece (11) is abutted with the other end of the limiting rod (43), so that the limiting rod (43) can trigger the first sensor (41) or the second sensor (42).

3. The wafer inspection device according to claim 2, wherein a carrier block (5) is disposed on a peripheral side of the carrier (1), a rotating shaft (431) is disposed at a center of the carrier block (5), and the limiting rod (43) is rotatably connected with the rotating shaft (431).

4. A wafer inspection apparatus according to claim 3, wherein the end of the carrier block (5) away from the carrier (1) is provided with the first sensor (41) and the second sensor (42) at intervals, and the sensing ends of the first sensor (41) and the second sensor (42) are both disposed at a side close to the limit lever (43).

5. The wafer inspection apparatus of claim 4, further comprising:

First spring (61) and second spring (62), first spring (61) with first inductor (41) all are located the first side of gag lever post (43), second spring (62) with second inductor (42) all are located the second side of gag lever post (43), first spring (61) with second spring (62) are relative gag lever post (43) symmetry sets up, just first spring (61) keep away from one end of gag lever post (43) with one end that second spring (62) kept away from gag lever post (43) is fixed in respectively the both sides of loading shoe (5) are close to one end of loading stage (1).

6. The wafer inspection apparatus according to claim 5, wherein a connection surface (52) is provided between an end surface of the carrier block (5) near one end of the carrier (1) and two adjacent side walls, and the first spring (61) and the second spring (62) are respectively connected to the two connection surfaces (52).

7. The wafer inspection apparatus according to claim 4, wherein the trigger member (11) is configured as an abutment, the abutment is disposed in a circumferential direction of the carrier (1), the carrier (1) rotates to drive the abutment to rotate, the abutment can abut against the stop lever (43) to drive the stop lever (43) to rotate, so that an end of the stop lever (43) away from the carrier (1) abuts against an induction end of the first sensor (41) or an induction end of the second sensor (42).

8. Wafer inspection apparatus according to claim 1, characterized in that the sensing assembly (4) comprises a proximity sensor provided on the peripheral side of the carrier (1), the triggering element (11) being a metal element.

9. Wafer inspection apparatus according to claim 1, characterized in that a rotating motor (13) is provided on the carrier (1) for driving the carrier (1) to rotate, and that the rotating motor (13) is rotated in the opposite direction by changing the direction of the current after the sensing assembly (4) is triggered.

10. The wafer inspection apparatus according to any one of claims 1 to 9, further comprising:

the detection piece (3) is arranged above the carrying platform (1) through the support component (7);

Slide (8), be provided with slide (8) along the radial of microscope carrier (1), supporting component (7) slide locates slide (8).