CN220807384U - Atmospheric pressure wafer conveying manipulator based on parallel mechanism - Google Patents

Abstract

The utility model discloses an atmospheric pressure wafer conveying manipulator based on a parallel mechanism, which comprises a mechanical arm mechanism and a parallel mechanism; the mechanical arm mechanism is in a double-arm form formed by two mechanical arm units, each mechanical arm unit has a horizontal rotation degree of freedom, a pitching rotation degree of freedom and a feeding rotation degree of freedom, and an absorber for absorbing and transporting a wafer substrate by utilizing atmospheric pressure is mounted on an end effector of each mechanical arm unit; the parallel mechanism comprises at least three linear degrees of freedom which are arranged in an annular array along the same axial direction, and all the linear degrees of freedom are commonly connected with the mechanical arm mechanism for universal angle adjustment; through integrated design and multi-degree-of-freedom motion, quick and efficient wafer grabbing, positioning, transporting and placing are realized, and the wafer processing efficiency is improved. The mechanical arm unit has multiple degrees of freedom, can realize complex motion tracks and multiple degrees of freedom of rotation, and provides higher flexibility and versatility.

Description

Atmospheric pressure wafer conveying manipulator based on parallel mechanism

Technical Field

The utility model relates to the technical field of semiconductor production, in particular to an atmospheric pressure wafer conveying manipulator based on a parallel mechanism.

Background

Wafer substrates are critical materials in semiconductor fabrication, which are the basis for the fabrication of integrated circuits (chips). The wafer substrate is typically made of single crystal silicon (single crystal Si) or polycrystalline silicon (polycrystalline Si). The preparation of wafer substrates requires highly pure silicon materials, typically deposited by Chemical Vapor Deposition (CVD) or sputtering techniques to form the desired wafer structure. In the chip production process, the wafer substrate needs to be processed and treated for many times in a vacuum environment, such as film deposition, etching, cleaning, etc. In this case, a vacuum transfer robot is required for transferring and processing the wafer.

The atmospheric wafer conveying manipulator is provided with a multi-axis motion system, so that motion with multiple degrees of freedom can be realized, and accurate grabbing and positioning of the wafer in space can be ensured. Through vacuum adsorption mode, ensure that the wafer can firmly be snatched by the manipulator, avoid the wafer to receive the damage in the transportation. And it is usually integrated with automated system, can carry out operations such as snatch, transportation, place through the procedure of predetermineeing automatically, improves production efficiency and accuracy. The atmospheric wafer transfer robot can accurately position the wafer to a designated position, ensuring that processing and handling can be performed as required in subsequent processes.

In the wafer production process, some processes need to arrange two mechanical arms simultaneously to normally implement operation. This is mainly to enhance the handling accuracy, improve the efficiency, ensure the safety, or cope with specific process requirements. For example, two mechanical arms are used simultaneously to perform cooperative processing, one of which is responsible for coating or covering a wafer, and the other is used for etching or cleaning, so as to improve the processing efficiency. For example, if some processes require transferring a wafer from one stage to another, two robots are used, one holding the wafer at a source location and the other receiving the wafer at a target location, thereby achieving a stable transfer of the wafer. For example, in a specific process, the wafer needs to be flipped, rotated, or oriented. Two mechanical arms are used to clamp two sides of the wafer respectively so as to ensure the stability of the wafer and turn, rotate or adjust the direction of the wafer. For another example, some processes require processing multiple wafers simultaneously, such as coating or etching multiple wafers, etc. Two mechanical arms are used for clamping a plurality of wafers at the same time, so that the plurality of wafers can be processed at the same time, and the production efficiency is improved. But this mode has the following drawbacks:

(1) Complexity and cost are high: the conventional technology requires two independent mechanical arms to be independently designed, maintained and controlled, which increases the complexity of the system. Each mechanical arm needs an independent control unit and a sensor, and the cost and the maintenance difficulty are increased.

(2) Difficulty in coordination: the two independent mechanical arms need to work together accurately to ensure stable grabbing and transporting of the wafer. However, the cooperative coordination becomes complicated due to the independent control, and errors are likely to occur, particularly in the case of the multi-degree-of-freedom cooperative control.

(3) The occupied space is large: the two independent mechanical arms require more space to ensure that their coordinated movements do not collide. This limits its application in spatially limited manufacturing environments, especially in the field of semiconductor manufacturing.

For this purpose, an atmospheric wafer transfer robot based on a parallel mechanism is proposed.

Disclosure of utility model

In view of the foregoing, it is desirable to provide an atmospheric wafer transfer robot based on a parallel mechanism, so as to solve or alleviate the technical problems existing in the prior art, that is, complexity and cost are high, coordination is difficult and space occupation is large, and at least provide a beneficial choice for the same;

The technical scheme of the embodiment of the utility model is realized as follows: an atmospheric pressure wafer conveying manipulator based on a parallel mechanism comprises a mechanical arm mechanism and a parallel mechanism; the mechanical arm mechanism is in a double-arm form formed by two mechanical arm units, each mechanical arm unit has a horizontal rotation degree of freedom, a pitching rotation degree of freedom and a feeding rotation degree of freedom, and an absorber for absorbing and transporting a wafer substrate by utilizing atmospheric pressure is mounted on an end effector of each mechanical arm unit; the parallel mechanism comprises at least three linear degrees of freedom which are arranged in an annular array along the same axial direction, and all the linear degrees of freedom are commonly connected with the mechanical arm mechanism for universal angle adjustment.

In the above embodiment, the following embodiments are described. In the technology, the atmospheric pressure wafer conveying manipulator adopts a design of combining a parallel mechanism and a mechanical arm mechanism. The mechanical arm mechanism takes the form of double arms, and each mechanical arm unit has horizontal rotation, pitching rotation and feeding rotation degrees of freedom. An absorber is mounted on the end effector for absorbing and transporting the wafer substrate by atmospheric pressure. In addition, a parallel mechanism is introduced, and the parallel mechanism is composed of at least three linear degrees of freedom which are arranged in an annular array mode, is arranged along the same axial direction and is connected with the mechanical arm mechanism, so that universal angle adjustment is realized.

Wherein in one embodiment: the mechanical arm mechanism is arranged on the rack; the flexible sleeve for protection, which is sleeved outside the parallel mechanism, is arranged between the top frame and the frame.

In the above embodiment, the following embodiments are described. The system comprises a top frame and a frame. The top frame is fixed in the external environment, and the machine frame is provided with a mechanical arm mechanism. The parallel mechanism is arranged between the top frame and the frame, and is provided with a flexible sleeve which can be sleeved outside the parallel mechanism and is used for protecting the mechanical structure.

Wherein in one embodiment: the parallel mechanism comprises six linear actuators for outputting the linear degrees of freedom, and the linear actuators are arranged on the opposite surfaces of the top frame and the stand.

In the above embodiment, the following embodiments are described. The parallel mechanism is composed of six linear actuators for outputting linear degrees of freedom. The linear actuators are respectively arranged on the opposite surfaces of the top frame and the stand to form a parallel mechanism.

Wherein in one embodiment: the linear actuator is preferably a servo electric cylinder, and a cylinder body and a piston rod of the servo electric cylinder are respectively and universally hinged to the opposite surfaces of the top frame and the frame through universal joint couplings.

In the above embodiment, the following embodiments are described. The linear actuator is preferably a servo cylinder. The cylinder body and the piston rod of the servo electric cylinder are respectively connected through universal joint couplings, and the couplings are arranged on the opposite surfaces of the top frame and the stand through universal hinges.

Wherein in one embodiment: every two adjacent servo electric cylinders are mutually arranged on one surface of the top frame and one surface of the frame, which are mutually opposite, in a V-shaped mode. The purpose of this arrangement mode is to overlap each linear degree of freedom, thereby increasing the stroke amount of the linear degree of freedom and increasing the control accuracy.

In the above embodiment, the following embodiments are described. The two adjacent servo cylinders are arranged on opposite sides between the top frame and the frame in a V shape so as to achieve the purpose of overlapping linear degrees of freedom. Such arrangement mode aims to increase the stroke amount of the linear degree of freedom and to improve the control accuracy.

Wherein in one embodiment: each mechanical arm unit comprises a first arm body, a second arm body, a third arm body and a fourth arm body which are sequentially hinged with each other; a rotary actuator is arranged on the hinge surfaces of the first arm body, the second arm body, the third arm body and the fourth arm body, and the rotary actuator is used for outputting the horizontal rotation freedom degree, the pitching rotation freedom degree or the feeding rotation freedom degree; the fourth arm body is the end effector, and the adsorber is installed on the fourth arm body.

In the above embodiment, the following embodiments are described. Each mechanical arm unit consists of a first arm body, a second arm body, a third arm body and a fourth arm body which are sequentially hinged with each other. The arm bodies are connected through a rotary actuator, and the rotary actuator is used for outputting horizontal rotation, pitching rotation or feeding rotation degrees of freedom. The fourth arm body is used as an end effector and is provided with an absorber for grabbing the wafer.

Wherein in one embodiment: the rotary actuator is preferably a servo motor, and output shafts of the servo motors are respectively and fixedly arranged on the first arm body, the second arm body, the third arm body and the fourth arm body.

In the above embodiment, the following embodiments are described. The rotary actuator preferably employs a servo motor. An output shaft of each servo motor is fixed on the first arm body, the second arm body, the third arm body and the fourth arm body, and movement of each mechanical arm is controlled respectively.

Compared with the prior art, the utility model has the beneficial effects that:

(1) High-efficiency wafer processing: through integrated design and multi-degree-of-freedom motion, quick and efficient wafer grabbing, positioning, transporting and placing are realized, and the wafer processing efficiency is improved. The mechanical arm unit has multiple degrees of freedom, can realize complex motion tracks and multiple degrees of freedom of rotation, and provides higher flexibility and versatility.

(2) Space and resources are saved: through compact design, integrate a plurality of degrees of freedom in a mechanical unit, effectively reduced the required space of system, make full use of space has reduced the system volume. The integrated design reduces the control cost of the independent mechanical arm, simplifies the control system, reduces the equipment components and reduces the complexity and maintenance cost of the system.

(3) The synergistic efficiency is improved: the parallel mechanism and the integrated design realize the efficient cooperative motion of multiple mechanical arms, ensure the coordination and stability in the wafer processing process and improve the overall cooperative efficiency. The multiple degrees of freedom and the high flexibility enable the technology to be suitable for wafer processing with different sizes, shapes and requirements, and have strong universality and adaptability.

Drawings

In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are necessary for the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a perspective view of a robot arm unit of the robot arm mechanism of the present utility model;

FIG. 3 is a schematic perspective view of a parallel mechanism according to the present utility model;

Reference numerals: 1. a top frame; 2. a frame; 3. a flexible sleeve; 4. a mechanical arm mechanism; 401. a rotary actuator; 402. a first arm body; 403. a second arm body; 404. a third arm body; 405. a fourth arm body; 406. an adsorber; 5. a parallel mechanism; 501. a linear actuator; 502. a universal joint coupling;

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. This utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below;

It should be noted that the terms "first," "second," "symmetric," "array," and the like are used merely for distinguishing between description and location descriptions, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of features indicated. Thus, a feature defining "first," "symmetry," or the like, may explicitly or implicitly include one or more such feature; also, where certain features are not limited in number by words such as "two," "three," etc., it should be noted that the feature likewise pertains to the explicit or implicit inclusion of one or more feature quantities;

it is noted that terms like "degree of freedom" refer to a relationship of connection and application of a force of at least one component, e.g. "linear degree of freedom" refers to a relationship in which a component is connected to and applies a force to another component or components through the linear degree of freedom such that it is capable of sliding fit or application of a force in a straight direction; "rotational freedom" means that a component is free to rotate about at least one axis of rotation and can apply or receive torque.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature; meanwhile, all axial descriptions such as X-axis, Y-axis, Z-axis, one end of X-axis, the other end of Y-axis, or the other end of Z-axis are based on a cartesian coordinate system.

In the present utility model, unless explicitly specified and limited otherwise, terms such as "mounted," "connected," "secured," and the like are to be construed broadly; for example, the connection can be fixed connection, detachable connection or integrated molding; the connection may be mechanical, direct, welded, indirect via an intermediate medium, internal communication between two elements, or interaction between two elements. The specific meaning of the terms described above in the present utility model will be understood by those skilled in the art from the specification and drawings in combination with specific cases.

Examples

An atmospheric pressure wafer conveying manipulator based on a parallel mechanism comprises a mechanical arm mechanism 4 and a parallel mechanism 5; the mechanical arm mechanism 4 is formed by two mechanical arm units, each mechanical arm unit has a horizontal rotation degree of freedom, a pitching rotation degree of freedom and a feeding rotation degree of freedom, and an end effector of each mechanical arm unit is provided with an absorber 406 for absorbing and transporting a wafer substrate by utilizing atmospheric pressure; the parallel mechanism 5 comprises at least three linear degrees of freedom arranged in an annular array along the same axial direction, and all the linear degrees of freedom are commonly connected to the mechanical arm mechanism 4 for universal angle adjustment.

In the scheme, the method comprises the following steps: in the technology, the atmospheric pressure wafer conveying manipulator adopts a design of combining a parallel mechanism 5 and a mechanical arm mechanism 4. The arm mechanism 4 takes the form of two arms, each arm unit having horizontal rotation, pitch rotation and feed rotation degrees of freedom. The end effector is equipped with a suction unit 406 for sucking and transporting the wafer substrate by the atmospheric pressure. In addition, a parallel mechanism 5 is also introduced, and the parallel mechanism 5 is composed of at least three linear degrees of freedom which are arranged in an annular array, are arranged along the same axial direction and are connected with the mechanical arm mechanism 4, so that the universal angle adjustment is realized.

In the scheme, all electric elements of the whole device are powered by mains supply; specifically, the electric elements of the whole device are in conventional electrical connection with the commercial power output port through the relay, the transformer, the button panel and other devices, so that the energy supply requirements of all the electric elements of the device are met.

Specifically, a controller is further arranged outside the device and is used for connecting and controlling all electrical elements of the whole device to drive according to a preset program as a preset value and a drive mode; it should be noted that the driving mode corresponds to output parameters such as start-stop time interval, rotation speed, power and the like between related electrical components, and meets the requirement that related electrical components drive related mechanical devices to operate according to the functions described in the related electrical components.

It can be understood that the mechanical arm unit of the mechanical arm mechanism 4 forms a mechanical arm, and the parallel mechanism 5 is in the form of a parallel robot, so that the existing PID mechanical arm gesture control algorithm program and the existing PID parallel robot algorithm program can be respectively selected for control.

In the scheme, all pneumatic elements of the whole device are powered by an external compressed air bottle matched with an air pump; specifically, the pneumatic element of the whole device is in conventional pneumatic connection with the air pump output port of the compressed air cylinder through devices such as an electromagnetic valve, a reversing valve, a pipe body and the like;

preferably, the driving synchronization of the pneumatic elements is controlled by a controller.

Specific: the design of this technique is based on the synergistic effect of the parallel mechanism 5 and the mechanical arm mechanism 4. The mechanical arm mechanism 4 provides multiple degrees of freedom of motion including horizontal rotation, pitch rotation and feed rotation degrees of freedom, so that gripping, positioning and transporting of wafers can be realized with high flexibility and accuracy. The adsorber 406 ingeniously effects adsorption and transport of the wafer substrate using atmospheric pressure. The linear degrees of freedom of the parallel mechanism 5 are arranged along the same axial direction, and the angle adjustment of the mechanical arm can be realized by connecting the parallel mechanism to the mechanical arm mechanism 4, so that the whole structure has the capability of universal angle adjustment, and the adaptability and the flexibility of wafer conveying are further improved.

Preferably, the adsorber 406 is a vacuum chuck.

It will be appreciated that in this embodiment: the wafer conveying manipulator realizes the efficient and accurate conveying of wafers through the combination of the mechanical arm mechanism 4 and the parallel mechanism 5. The multi-degree-of-freedom design of the mechanical arm mechanism 4 enables the mechanical arm mechanism to adapt to the requirements of wafer grabbing and positioning at different positions and angles. The absorber 406 utilizes atmospheric pressure to realize stable absorption and transportation of the wafer, and ensures the safety and stability of the wafer conveying process. The parallel mechanism 5 provides the mechanical arm with the angle adjusting capability, so that the wafer conveying adaptability is stronger, and the wafer conveying mechanism can be suitable for wafer conveying requirements under different conditions. Overall, the technique has efficient, accurate and flexible wafer transport capabilities, providing reliable support for semiconductor manufacturing.

In some embodiments of the present application, please refer to fig. 2-3 in combination: the device also comprises a top frame 1 and a frame 2, wherein the top frame 1 is fixed in the external environment, and a mechanical arm mechanism 4 is arranged on the frame 2; a parallel mechanism 5 and a flexible sleeve 3 for protection which can be sleeved outside the parallel mechanism 5 are arranged between the top frame 1 and the frame 2.

In the scheme, the method comprises the following steps: the system comprises a top frame 1 and a frame 2. The top frame 1 is fixed to the external environment, and the machine frame 2 is provided with a mechanical arm mechanism 4. The parallel mechanism 5 is installed between the top frame 1 and the frame 2, and is equipped with a flexible sleeve 3 which can be sleeved outside the parallel mechanism 5 for protecting the mechanical structure.

Specific: the roof rack 1 serves as a fixed supporting structure to provide a stable foundation for the whole system. The frame 2 is used as a support of the mechanical arm mechanism 4 to support the movement of the mechanical arm. The parallel mechanism 5 is installed between the top frame 1 and the frame 2, and universal angle adjustment of the mechanical arm mechanism 4 is realized through adjustment of linear degrees of freedom. The flexible sleeve 3 serves to protect the parallel mechanism 5 from the external environment, ensuring reliable operation of the mechanical structure.

It will be appreciated that in this embodiment: the rational layout of the top frame 1 and the machine frame 2 ensures the stability and structural strength of the system. The installation of the parallel mechanism 5 enhances the flexibility and adjustability of the robotic arm mechanism 4 to accommodate a variety of wafer processing requirements. The flexible sleeve 3 serves as a protective device, ensuring a long-term reliable operation of the mechanical structure, and at the same time improving the safety of the system. Overall, this embodiment provides good support for stable operation and safe operation of the wafer handling robot.

In some embodiments of the present application, please refer to fig. 2-3 in combination: the parallel mechanism 5 includes six linear actuators 501 for outputting linear degrees of freedom, and the linear actuators 501 are mounted on respective faces of the top frame 1 and the frame 2 opposite to each other.

In the scheme, the method comprises the following steps: the parallel mechanism 5 is composed of six linear actuators 501, which are used to output a linear degree of freedom. The linear actuators 501 are mounted on the opposite surfaces of the top frame 1 and the frame 2, respectively, and form a parallel mechanism 5.

Specific: the core of the parallel mechanism 5 is six linear actuators 501, each providing one linear degree of freedom. These linear actuators achieve linear motion by controlling the extension and retraction of the piston. The actuators can work cooperatively because the actuators are arranged on the top frame 1 and the frame 2, and the multi-dimensional adjustment of the mechanical arm mechanism 4 is realized through the linear degrees of freedom of respective output, so that the omnibearing attitude control is realized.

It will be appreciated that in this embodiment: the configuration of the six linear actuators 501 enables the parallel mechanism 5 to provide sufficient linear freedom to achieve multi-dimensional adjustment. The multi-dimensional adjusting function provides extremely high flexibility for the wafer conveying manipulator, and can meet the requirements of different wafer processing scenes. By reasonably controlling the linear actuators, the efficient grabbing, transporting and placing of the wafers can be realized, and reliable guarantee is provided for the wafer manufacturing process. Overall, this embodiment enhances motion control capability and multi-dimensional adaptability for the wafer handling robot by fully utilizing the characteristics of the six linear actuators.

In some embodiments of the present application, please refer to fig. 2-3 in combination: the linear actuator 501 is preferably a servo cylinder, and the cylinder body and the piston rod of the servo cylinder are respectively and universally hinged on the opposite surfaces of the top frame 1 and the frame 2 through universal joint couplings 502.

In the scheme, the method comprises the following steps: the linear actuator 501 preferably employs a servo cylinder. The cylinder body and the piston rod of the servo cylinder are respectively connected by universal joint couplings 502 which are then mounted on the opposite faces of the top frame 1 and the frame 2 by universal hinges.

Specific: the servo electric cylinder is selected as a core component of the linear actuator 501, and has higher precision, stability and response speed. The cylinder body and the piston rod are connected through a universal joint coupling 502, and the connection mode can ensure the relative movement of the cylinder body and the piston rod and is arranged on the top frame 1 and the frame 2 through a universal hinging device. This design ensures stable movement of the linear actuator 501 in all directions.

It will be appreciated that in this embodiment: the servo cylinder is adopted as the linear actuator 501, so that the linear motion output with high precision and high stability can be ensured. The design of the coupler and the universal hinging device enables the servo electric cylinder to adapt to the movement requirements in different directions, and the linear movement with multiple degrees of freedom is realized. The structure design provides a reliable linear degree of freedom for the wafer conveying manipulator, so that the grabbing, transporting and placing of the wafer are more accurate and efficient. Overall, this embodiment provides a highly reliable basis for motion control of the wafer handling robot by employing servo cylinders and corresponding linkages.

In some embodiments of the present application, please refer to fig. 2-3 in combination: every two adjacent servo electric cylinders are arranged on the opposite surfaces of the top frame 1 and the frame 2 in a V-shaped mode. The purpose of this arrangement mode is to overlap each linear degree of freedom, thereby increasing the stroke amount of the linear degree of freedom and increasing the control accuracy.

In the scheme, the method comprises the following steps: adjacent two servo cylinders are arranged in a V-shape on opposite sides between the top frame 1 and the frame 2 for the purpose of overlapping linear degrees of freedom. Such arrangement mode aims to increase the stroke amount of the linear degree of freedom and to improve the control accuracy.

Specific: the V-shaped arrangement mode can enable linear motion tracks among the servo electric cylinders to overlap with each other, and effectively increases the stroke quantity of the linear degree of freedom. By this overlapping, a larger range of linear motion of the wafer handling robot can be achieved in a limited space. Meanwhile, the movement of the electric cylinders is controlled by a servo system, so that the overlapping arrangement mode can improve the control precision of linear movement.

It will be appreciated that in this embodiment: by adopting the V-shaped arrangement mode, the limited space can be fully utilized, and the stroke amount of the linear degree of freedom is maximized. The design can improve the adaptability of the wafer conveying manipulator, so that the wafer conveying manipulator can adapt to the wafer processing requirements under different working scenes. By increasing the stroke amount of the linear degree of freedom, more flexible and accurate linear movement can be realized, thereby providing higher efficiency and precision for conveying, positioning and processing the wafer. Overall, the V-shaped arrangement mode increases flexibility and control accuracy for linear motion of the wafer conveying manipulator, and improves overall working efficiency.

In some embodiments of the present application, please refer to fig. 2-3 in combination: each mechanical arm unit comprises a first arm body 402, a second arm body 403, a third arm body 404 and a fourth arm body 405 which are hinged with each other in sequence; the first arm body 402, the second arm body 403, the third arm body 404 and the fourth arm body 405 are all provided with a rotary actuator 401 on the hinge surfaces thereof, and the rotary actuator 401 is used for outputting a horizontal rotation degree of freedom, a pitching rotation degree of freedom or a feeding rotation degree of freedom; the fourth arm 405 is an end effector, and an adsorber 406 is mounted on the fourth arm 405.

In the scheme, the method comprises the following steps: each mechanical arm unit is composed of a first arm body 402, a second arm body 403, a third arm body 404 and a fourth arm body 405 which are hinged with each other in sequence. The arms are connected by a rotary actuator 401, the rotary actuator 401 being adapted to output a horizontal rotation, a pitch rotation or a feed rotation degree of freedom. The fourth arm 405 serves as an end effector, and a chuck 406 is mounted thereon for gripping a wafer.

Specific: the design of the robotic arm unit is based on multiple segments of mutually articulated arms, with rotational degrees of freedom provided on the articulation surfaces by a rotary actuator 401. The rotation actuator 401 is used to control the horizontal rotation, the pitching rotation, and the feeding rotation of the robot arm, thereby realizing various movement states. The fourth arm 405 is provided with a suction unit 406 as an end effector, and suctions and transports wafers.

It will be appreciated that in this embodiment: the design enables the mechanical arm unit to realize various rotational degrees of freedom, including horizontal rotation, pitching rotation and feeding rotation, and has higher flexibility and versatility. The fourth arm body is used as an end effector to be provided with an absorber, so that the wafer can be stably absorbed, and the reliable grabbing and positioning of the wafer are realized. The functional design provides powerful protection for the transportation, positioning and processing of the wafer, and meanwhile, the diversified movement capability of the mechanical arm is improved. Overall, this kind of embodiment has realized the high-efficient, the accurate control to the wafer through rational design and overall arrangement arm unit.

In some embodiments of the present application, please refer to fig. 2-3 in combination: the rotary actuator 401 is preferably a servo motor, and output shafts of each individual servo motor are respectively fixed on the first arm 402, the second arm 403, the third arm 404 and the fourth arm 405.

In the scheme, the method comprises the following steps: the rotary actuator 401 preferably employs a servo motor. The output shaft of each servo motor is fixed on the first arm 402, the second arm 403, the third arm 404 and the fourth arm 405, and controls the movement of each mechanical arm respectively.

Specific: as a core component of the rotary actuator 401, a servo motor is selected, which has high accuracy, high response speed, and controllability. The output shaft of each servo motor is respectively fixed on the arm bodies of different mechanical arms, and the horizontal rotation, pitching rotation and feeding rotation of each mechanical arm are realized through the control of the motor. The design can provide accurate rotation control, so that the mechanical arm unit can realize movement with multiple degrees of freedom.

It will be appreciated that in this embodiment: a highly controllable movement can be achieved by using a servo motor as the rotary actuator 401. Each mechanical arm unit can realize accurate rotation degrees of freedom through control of a corresponding servo motor, and the mechanical arm unit comprises horizontal rotation, pitching rotation and feeding rotation. The design provides high precision and high flexibility for the control of the wafer, is beneficial to improving the precision of the wafer conveying and positioning, and further optimizes the efficiency of the whole wafer manufacturing process. In general, the implementation of the servo motor as the rotary actuator 401 provides precise motion control and multiple degrees of freedom motion capability for the wafer transfer robot.

Summarizing, aiming at the related problems in the prior art, the embodiment is based on the atmospheric pressure wafer conveying manipulator based on the parallel mechanism 5, and the following technical means or characteristics are adopted to realize the solution:

(1) Complexity and cost are high: the technology of this embodiment adopts the design of the parallel mechanism 5 and the multi-joint mechanical arm, and avoids the need for complex design, maintenance and control of a plurality of independent mechanical arms by integrating a plurality of degrees of freedom and functions into a single mechanical unit. Such an integrated design reduces the complexity of the system.

Specifically, the parallel mechanism 5 integrates multiple linear degrees of freedom, and combines tasks conventionally required to be completed by multiple independent mechanical arms into one mechanical unit. The servo motor is adopted to control the multiple degrees of freedom, so that each independent mechanical arm is prevented from being provided with an independent control system, and the cost and the maintenance complexity are reduced.

(2) Difficulty in coordination: the technology of this embodiment adopts the parallel mechanism 5 and the integrated design, and realizes a higher degree of cooperative movement by jointly controlling a plurality of mechanical arm units.

Specifically, by adopting the characteristics of the parallel mechanism 5, each mechanical arm unit forms a close association, and the mechanical arm units are controlled in a combined manner, so that a cooperative action is realized. This coordinated motion is more efficient and accurate than the coordination of a traditional independent robotic arm.

(3) The occupied space is large: the technology of the embodiment integrates a plurality of degrees of freedom into one mechanical unit through a compact design, and effectively reduces the space required by the system.

Specifically, the parallel mechanism 5 is adopted to compactly arrange a plurality of linear degrees of freedom in the vertical direction, so that the whole structure is more compact, and the required space is reduced. The integrated design effectively utilizes the space and reduces the volume of the system.

It should be noted that, in the present embodiment, although the mechanical arm unit also includes two mechanical arms, by adopting the integrated design and parallel mechanism 5, the technical drawbacks of complexity and high cost, difficulty in coordination and large space occupation of the conventional technology are successfully avoided, and specifically include:

(1) The integrated design reduces complexity and cost: although the mechanical arm unit actually comprises two mechanical arms, on the premise of the same size (traditional mechanical arm), the mechanical arm unit is integrated into one functional unit, and through the integrated design, the multi-degree-of-freedom motion is realized, and the number of components such as a required attitude control unit, an attitude sensor (the weight of the arm arranged in the mechanical arm unit) and the like is reduced. Compared with the traditional independent mechanical arm system, the design greatly reduces the complexity of the system and the cost of the system.

(2) The parallel mechanism 5 optimizes cooperative coordination: the two mechanical arms in the mechanical arm unit are connected through the parallel mechanism 5, so that cooperative motion is realized, and a closed transmission chain in the traditional mechanical sense is formed. The nature of the parallel mechanism 5 allows for coordinated movement of multiple robotic arms without the need for complex coordination algorithms. This design reduces the difficulty of cooperative coordination and improves the cooperative efficiency of the exercise.

(3) Space occupation optimization: the parallel mechanism 5 is adopted, the two mechanical arms are compactly arranged along the vertical direction, and the multiple degrees of freedom are integrated in a smaller space through an integrated design. Compared with the traditional design requiring two independent mechanical arms, the layout reduces the occupied space and improves the space utilization rate.

Meanwhile, the integrated design can reduce the control cost of the independent mechanical arms and simplify the control system, and a plurality of mechanical arms are integrated into one functional unit through the integrated design, so that one central control system can be shared. Compared with an independent mechanical arm system, only one control system is needed, and the cost in terms of hardware and software is reduced. Conventionally, each individual robotic arm requires an individual control unit, including controllers, sensors, and the like. In the integrated design of the embodiment, a plurality of mechanical arms can be controlled by one control unit, so that the number of the control units is reduced, and the system architecture is simplified. At the same time, communication and coordination are simplified as the robot arm is integrated into one unit. The instruction transmission among different mechanical arms is more direct and efficient, so that complex communication protocols and coordination algorithms are avoided, and development and maintenance costs are reduced. The integrated design integrates a plurality of mechanical arms into one mechanical unit, so that the complexity of system integration is reduced. This means that the integration and debugging process of the whole system is more simplified and efficient, reducing the integration costs.

Summarizing, through the combination of the integrated design and the parallel mechanism, the technology of the embodiment can fully exert the cooperative advantages of the two mechanical arms, furthest reduce the complexity, simplify the control system and reduce the equipment volume, thereby remarkably improving the efficiency and the performance of the system and providing a more efficient, flexible and economic solution for the wafer manufacturing process.

The above examples merely illustrate embodiments of the utility model that are specific and detailed for the relevant practical applications, but are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (7)

1. The atmospheric pressure wafer conveying manipulator based on the parallel mechanism is characterized by comprising a mechanical arm mechanism (4) and a parallel mechanism (5);

The mechanical arm mechanism (4) is in a double-arm form formed by two mechanical arm units, each mechanical arm unit has a horizontal rotation degree of freedom, a pitching rotation degree of freedom and a feeding rotation degree of freedom, and an absorber (406) for absorbing and transporting a wafer substrate by utilizing atmospheric pressure is mounted on an end effector of each mechanical arm unit;

The parallel mechanism (5) comprises at least three linear degrees of freedom which are arranged in an annular array along the same axial direction, and all the linear degrees of freedom are commonly connected with the mechanical arm mechanism (4) for universal angle adjustment.

2. The parallel mechanism-based atmospheric wafer transfer robot of claim 1, wherein: the mechanical arm mechanism is characterized by further comprising a top frame (1) and a frame (2), wherein the top frame (1) is fixed in an external environment, and the mechanical arm mechanism (4) is arranged on the frame (2);

the flexible sleeve (3) for protection, which is sleeved outside the parallel mechanism (5), is arranged between the top frame (1) and the frame (2).

3. The parallel mechanism-based atmospheric wafer transfer robot of claim 2, wherein: the parallel mechanism (5) comprises six linear actuators (501) for outputting the linear degrees of freedom, and the linear actuators (501) are mounted on the opposite surfaces of the top frame (1) and the frame (2).

4. The parallel mechanism-based atmospheric wafer transfer robot of claim 3, wherein: the linear actuator (501) is a servo electric cylinder, and a cylinder body and a piston rod of the servo electric cylinder are respectively and universally hinged to one surface of the top frame (1) and one surface of the frame (2) which are opposite to each other through a universal joint coupler (502).

5. The parallel mechanism-based atmospheric wafer transfer robot of claim 4, wherein: every two adjacent servo electric cylinders are arranged on one surface of the top frame (1) and one surface of the frame (2) which are opposite to each other in a V-shaped mode.

6. The parallel mechanism-based atmospheric wafer transfer robot of any one of claims 1 to 5, wherein: each mechanical arm unit comprises a first arm body (402), a second arm body (403), a third arm body (404) and a fourth arm body (405) which are hinged with each other in sequence;

The first arm body (402), the second arm body (403), the third arm body (404) and the fourth arm body (405) are respectively provided with a rotary actuator (401) on the mutually hinged surfaces, and the rotary actuators (401) are used for outputting the horizontal rotation freedom degree, the pitching rotation freedom degree or the feeding rotation freedom degree;

The fourth arm body (405) is the end effector, and the adsorber (406) is installed on the fourth arm body (405).

7. The parallel mechanism-based atmospheric wafer transfer robot of claim 6, wherein: the rotary actuator (401) is a servo motor, and output shafts of the servo motors are respectively and fixedly arranged on the first arm body (402), the second arm body (403), the third arm body (404) and the fourth arm body (405).