CN220749925U

CN220749925U - LED panel

Info

Publication number: CN220749925U
Application number: CN202322325674.6U
Authority: CN
Inventors: 陈凤; 陈薇; 赵跃兰; 杜露; 信潇雅
Original assignee: Shenzhen North South Vision Optoelectronics Co ltd
Current assignee: Shenzhen North South Vision Optoelectronics Co ltd
Priority date: 2023-08-28
Filing date: 2023-08-28
Publication date: 2024-04-09
Anticipated expiration: 2033-08-28

Abstract

The application provides an LED panel, including: a housing including a first insulating case and a second insulating case provided on the first insulating case; the LED lamps are arranged in the second insulating shell and are linearly arranged in the second insulating shell, and the LED lamps are used for changing the distribution of light rays and changing the color temperature; the LED chip is arranged in the first insulating shell and is attached to the bottom surface of the first insulating shell, the LED chip comprises an LED substrate, and the LED substrate is arranged in the second insulating shell and is attached to the LED lamp; the filter layer is arranged between the second insulating layer and the LED lamp and is used for changing the color temperature of the LED panel, and comprises an adhesive layer which is arranged on the first insulating layer and is attached to the filter layer; the lamp ring 50 is arranged below the filter layer and is attached to the LED substrate, and is used for improving the color temperature of the LED panel. The LED panel provided above controls the color temperature of the LED panel by adding a replaceable filter to the LED panel provided above and by adding a lamp ring 50.

Description

LED panel

Technical Field

The application relates to the field of LEDs, in particular to an LED panel.

Background

To overcome some limitations of LEDs in lighting, such as uneven light distribution, limited color temperature tuning range, etc., researchers have begun to attempt to design and manufacture LED panels. The LED panel is used for uniformly arranging the plurality of LED lamps on a plane so as to realize more uniform light distribution and illumination effect. Through reasonable design and control, the LED panel can realize characteristics such as colour temperature is adjustable, luminance is even, satisfies different application scenes and demand.

However, the LED panels currently on the market have some problems in terms of color temperature, resulting in that the user cannot obtain a satisfactory lighting effect. The traditional LED panel has certain limitation in color temperature adjustment, and is difficult to meet the requirements of different scenes, such as offices, households, businesses and the like. In order to improve the color temperature problem of LED panels, several solutions have been proposed. For example, the distribution and color temperature of light is changed by coating different materials on the surface of the LED lamp, or a control device capable of adjusting the color temperature is added inside the LED panel.

However, as the demand for LED panels increases, it is too complicated to coat materials or add a control device for adjusting color temperature, which has a great hindrance to the use of the user and is not beneficial to the continued use of the user.

Disclosure of Invention

In view of the foregoing, it is necessary to provide an LED panel to solve the above-mentioned problems.

Embodiments of the present application provide an LED panel, comprising:

a housing including a first insulating case and a second insulating case provided on the first insulating case;

the LED lamp is arranged in the second insulating shell and is used for changing the distribution of light rays and changing the color temperature;

the LED chip is arranged in the first insulating shell and is attached to the bottom surface of the first insulating shell, the LED chip comprises an LED substrate, and the LED substrate is arranged in the second insulating shell and is attached to the LED lamp;

the filter layer is arranged between the second insulating layer and the LED lamp and is used for changing the color temperature of the LED panel, and comprises an adhesive layer which is arranged on the first insulating layer and is attached to the filter layer;

and the lamp ring is arranged below the filter layer and is attached to the LED substrate and used for improving the color temperature of the LED panel.

In at least one embodiment of the present application, the housing is a resin.

In at least one embodiment of the present application, ten lamp rings are arranged side by side on the LED substrate and attached to the LED substrate, and the lamp rings are used for changing the color temperature of the LED panel.

In at least one embodiment of the present application, the adhesive layer is double sided tape.

In at least one embodiment of the present application, the second insulating layer includes a heat dissipation layer, and is disposed under the LED chip for dissipating heat.

In at least one embodiment of the present application, the heat dissipation layer is a thermally conductive silicone.

In at least one embodiment of the present application, the second insulating case includes two power interfaces, and two power interfaces are respectively provided at two ends of the second insulating case, and the power interfaces are used for supplying power to the LED panel.

In at least one embodiment of the present application, the optical filter is an optical film.

In at least one embodiment of the present application, the LED substrate is aluminum.

In at least one embodiment of the present application, the LED first insulating housing includes heat dissipating fins disposed within the first insulating housing, the heat dissipating fins configured to dissipate heat.

The color temperature of the LED panel is controlled by adding the replaceable optical filter of the lamp ring to the LED panel.

Drawings

Fig. 1 is a perspective view of an LED panel according to an embodiment of the present application.

Fig. 2 is a perspective exploded view of the LED panel of fig. 1.

FIG. 3 is an enlarged view of a portion of the adhesive layer of the LED panel

Fig. 4 is a partial enlarged view of a heat sink fin of the LED panel

Description of the main reference signs

100. An LED panel; 11. a first insulating case; 12. a second insulating case; 121. a power interface; 122. a heat dissipation layer; 123. a heat radiation fin; 20. an LED lamp; 30. an LED chip; 31. an LED substrate; 40. a filter layer; 41. an adhesive layer; 50. a lamp ring.

Detailed Description

Embodiments of the present application will now be described with reference to the accompanying drawings, in which it is apparent that the embodiments described are merely some, but not all embodiments of the present application.

It is noted that when one component is considered to be "connected" to another component, it may be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed" on another element, it can be directly on the other element or intervening elements may also be present. The terms "top," "bottom," "upper," "lower," "left," "right," "front," "rear," and the like are used herein for illustrative purposes only.

Some embodiments of the present application are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.

Embodiments of the present application provide an LED panel, comprising:

Referring to fig. 1-4, embodiments of the present application provide an LED panel 100, comprising: a housing including a first insulating case 11 and a second insulating case 12 provided on the first insulating case 11; the LED lamps 20 are arranged in the second insulating shell 12 to be linearly arranged in the second insulating shell 12, and the LED lamps 20 are used for changing the distribution of light rays and changing the color temperature; the LED chip 30 is arranged in the first insulating shell 11 and is attached to the bottom surface of the first insulating shell 11, the LED chip 30 comprises an LED substrate 31, and the LED substrate 31 is arranged in the second insulating shell 12 and is attached to the LED lamp 20; a filter layer 40 disposed between the second insulating layer and the LED lamp 20, wherein the filter layer 40 is used for changing the color temperature of the LED panel 100, the filter layer 40 includes an adhesive layer 41, and the adhesive layer 41 is disposed on the first insulating layer and is attached to the filter layer 40; the lamp ring 50 is disposed under the filter layer 40 and attached to the same for increasing the color temperature of the LED panel 100.

In particular, the housing is used to protect the internal components from the external environment while providing mechanical support. The LED lamp 20 generates light, and the distribution of the light can be adjusted by changing the arrangement thereof, and the color temperature (color property of the light) can be changed. The LED chip 30 is arranged in the first insulating shell 11 and is attached to the bottom surface of the first insulating shell 11, the LED chip 30 comprises an LED substrate 31, and the LED substrate 31 is arranged in the second insulating shell 12 and is attached to the LED lamp 20: the LED chip 30 is a core component of the panel, and is responsible for the light emitting function. The lamp ring 50 is under the filter layer 40 to influence light propagation of the filter layer 40 by emitting light, thereby enhancing the overall color temperature of the LED panel 100.

Further, by attaching the LED chip 30 to the bottom surface of the insulating case, heat dissipation and electrical isolation are achieved, and the performance and stability of the LED are improved. The filter layer 40 changes its spectral composition when LED light passes therethrough, thereby adjusting the color temperature of the LED panel 100. The user can customize the color temperature of the LED panel by adjusting the filter layer 40 to better accommodate different lighting requirements. By attaching the LED chip 30 to the bottom surface of the insulating case, heat dissipation and electrical isolation are achieved, and the performance and stability of the LED are improved. The brightness and the color temperature of the panel are allowed to be adjusted by a user according to the needs, and the panel is suitable for different scenes and environments. In this way, the color temperature characteristics of the LED panel can be adjusted and improved over a larger range. The brightness and the color temperature of the panel are allowed to be adjusted by a user according to the needs, and the panel is suitable for different scenes and environments. The stability and durability of the LED panel are enhanced. The LED panel can realize flexible adjustment of light temperature and distribution of the lamp according to the requirements and application scenes of users.

In one embodiment, the housing is a resin.

Specifically, the housing serves as an external protection layer for the LED panel, and serves to protect internal components, insulation, mechanical support, and the like. The resin has the unique advantages that the resin is used as the shell material, for example, the resin has good insulating property, so that the internal electronic elements can be effectively isolated, and the electrical risk is reduced; the resin also has good corrosion resistance and mechanical strength, and can protect internal elements from the external environment and damage. By using resin as the housing material, the safety, durability and stability of the LED panel are improved.

Further, during the manufacturing process, the resin may be processed into an appropriate shape, such as the outer shape of the housing. Then, LED elements (such as the LED lamp 20, the LED chip 30, etc.) will be mounted inside and connected with the power line. Finally, the resin cures to form a strong enclosure in which the internal components are completely enclosed. By employing a resin housing in the LED panel, better protection and isolation can be provided for the panel while providing significant advantages in terms of safety, durability and stability. This helps to expand the application field of the LED panel, meeting the lighting requirements in different scenarios.

In one embodiment, ten of the lamp rings 50 are arranged side by side on the LED substrate 31 and attached to the LED substrate 31, and the lamp rings 50 are used for changing the color temperature of the LED panel 100.

Specifically, the lamp ring 50 is disposed and adhered on the LED substrate 31 to influence the light propagation of the filter layer 40 by emitting light, thereby adjusting and improving the overall color temperature of the LED panel 100. By controlling the light emitting characteristics of the lamp ring 50, the color temperature of the LED panel 100 can be effectively adjusted to satisfy the lighting effect under different scenes and demands. The LED substrate 31 is provided with a plurality of lamp rings 50, and the lamp rings 50 may be part of LED light emitting elements or may be additional light emitting components. When the LED lamp 20 is lighted, the lamp ring 50 emits light that passes through the filter layer 40 and is changed, thereby affecting the overall color temperature of the light.

Further, such an LED panel can create a warm, pleasant or lively light effect by adjusting the light color temperature of the lamp ring 50 in a scene where a lighting atmosphere needs to be changed, such as a restaurant, a shop or a home lighting. By controlling the light color of the light ring 50 in an artistic exhibition, museum or cultural place, a unique visual effect can be created for the exhibited article, enhancing the viewing experience of the spectator. By arranging the lamp rings 50 side by side on the LED substrate 31 and attaching, a more flexible and personalized color temperature adjustment can be achieved in the LED panel, providing a customized lighting solution for different environments and applications.

In one embodiment, the adhesive layer 41 is double-sided tape.

Specifically, the adhesive layer 41 is an important component for bonding the filter layer 40 and the first insulating layer together. The filter layer 40 can be firmly fixed on the first insulating layer by using double sided adhesive tape as the material of the adhesive layer 41 with reliable adhesion. The use of double sided tape ensures a stable connection between the filter layer 40 and the insulating layer, preventing them from being separated or displaced during use, thereby ensuring the stability and reliability of the LED panel.

Further, during the manufacturing process, the double-sided tape is first cut to an appropriate size and shape, and then attached to an appropriate position of the first insulating layer. Next, the filter layer 40 is placed on the double sided adhesive and an appropriate pressure is applied to ensure that they adhere firmly together. Finally, the adhesive layer 41 forms a firm bond after curing, and the filter layer 40 is tightly connected with the insulating layer. By using double sided tape as the adhesive layer 41 material, a secure connection between the filter layer 40 and the insulating layer can be ensured in the LED panel, providing a stable, reliable panel for lighting applications, while creating more possibilities for lighting effects in different scenarios and requirements.

In one embodiment, the second insulating layer includes a heat dissipation layer 122 disposed under the LED chip 30 for dissipating heat.

In particular, the presence of the heat dissipation layer 122 helps to effectively dissipate heat generated by the LED chip 30, preventing adverse effects of overheating on LED performance and lifetime, thereby maintaining stability and long-term reliability of the LED panel. The use of the heat dissipation layer 122 can improve the thermal management efficiency of the LED panel, extend the service life of the LED, and ensure that the LED remains stable during operation.

Further, the heat sink layer 122 is typically made of a highly thermally conductive material, such as thermally conductive silicone. It is placed at the bottom of the LED chip 30 in close contact with the chip surface. When the LED lamp 20 is lighted, the LED chip 30 generates heat. The heat sink layer 122 conducts this heat from the chip to the surrounding environment, thereby achieving a heat sink effect. By introducing the heat dissipation layer 122 into the LED panel, the heat accumulation problem can be effectively solved, the thermal management efficiency of the LED can be improved, the LED panel can be ensured to maintain stable and reliable performance in different environments and applications, and the service life of the LED panel can be prolonged.

In one embodiment, the heat dissipation layer 122 is a thermally conductive silica gel.

Specifically, the heat-conducting silica gel is used as the material of the heat dissipation layer 122, has excellent heat conduction performance, and can effectively conduct the heat generated by the LED chip 30 to the surrounding environment, so as to prevent the LED panel from being damaged by overheating. The heat conduction silica gel can improve the heat conduction efficiency of the LED panel, keep the stable working temperature of the LED and prolong the service life and performance of the LED.

Further, the thermally conductive silicone is generally coated on the bottom of the LED chip 30 in a thin film or paste form, in close contact with the chip surface. When the LED lamp 20 is lighted, the chip generates heat. The thermally conductive silicone, by virtue of its high thermal conductivity, rapidly transfers this heat to the heat sink layer 122, thereby dispersing the heat into the surrounding environment.

In a specific embodiment, the second insulating case 12 includes two power interfaces 121, and the two power interfaces 121 are respectively disposed at two ends of the second insulating case 12, and the power interfaces 121 are used for supplying power to the LED panel 100.

Specifically, the power interface 121 is a bridge connecting the LED panel and the power source, and is used to provide power supply for the LED panel 100, so as to ensure that the LED works normally. The power interface 121 is provided to enable the LED panel to be conveniently connected to a power source, realize a power supply function, and ensure normal brightness and stability of the LED panel. Further, two power interfaces 121 are respectively located at both ends of the second insulating housing 12, and are typically designed in the form of plugs or sockets connected to an external power source. When the LED panel is installed in a corresponding application scenario, a user may connect the LED panel to a power source by plugging in the power interface 121. The power interface 121 transmits power to the circuit of the LED panel through a wire, and provides power required for the LED chip 30 and the LED lamp 20, so that the LED lamp 20 emits light normally.

Further, the power interface 121 serves as a power connection portion of the LED panel, and has a function of connecting an external power source to the LED panel 100, so that the LED panel can be operated normally. The LED panel is convenient to install, connect and maintain, is suitable for various lighting scenes, and provides convenience for the use of the LED panel. The LED panel may be installed in various indoor lighting fixtures, such as a desk lamp, a pendant lamp, etc. The arrangement of the power interface 121 makes it simple to install and replace the LED panel, and the user can realize illumination by simply inserting the power interface 121.

In one embodiment, the optical filter is an optical film.

Specifically, the optical filter is an optical element disposed in the LED panel for adjusting and changing the spectral distribution of light to achieve a specific color temperature effect. The beneficial effects are that: by using the optical film as the optical filter, the LED panel can effectively change the color and the color temperature of light so as to meet the illumination requirements under different scenes and requirements. Optical films are typically made of specific materials and have specific optical properties. They can selectively absorb, transmit or reflect light of a specific wavelength, thereby changing the color and spectral distribution of the light.

Further, the method comprises the steps of. In the LED panel, an optical film is placed between the second insulating layer and the LED lamp 20. When the light emitted from the LED lamp 20 passes through the filter, the filter selectively changes the color components of the light, thereby achieving a desired color temperature effect. By using optical films of different colors, special lighting effects, such as colored lights, special effects of lights, etc., can be provided for specific scenes or decorative requirements. The optical film is used as a part of the optical filter and has the function of adjusting and changing the spectral distribution of the LED panel. By selecting proper materials and designs, the LED lighting device can realize the effects of color temperature adjustment, light color change and the like, and provides more flexibility and originality for LED lighting.

In one embodiment, the LED substrate 31 is aluminum.

Specifically, the LED substrate 31 is a core component of the LED lamp 20 for supporting the LED chip 30 and providing electrical connection. Aluminum is selected as the material of the LED substrate 31, so that the LED substrate has good heat conduction performance and mechanical strength, and is beneficial to optimizing the heat dissipation effect and stability of the LED. The heat dissipation performance is excellent: the high heat conductivity of the aluminum substrate can effectively conduct heat generated by the LED chip 30 to the external environment, so that the working temperature of the LED is reduced, the stability of the LED is improved, and the service life of the LED is prolonged. Mechanical strength: aluminum has sufficient mechanical strength to support the LED chip 30 and other components, ensuring structural stability and reliability of the LED panel.

Further, the LED substrate 31 serves as a platform carrying the LED chip 30 and other related components, and provides power to the LEDs via electrical connections. When the LED chip 30 operates, a certain amount of heat is generated. The aluminum substrate has good thermal conductivity, and is capable of rapidly conducting heat from the LED chip 30 to the substrate surface and then radiating to the external environment through the case and the heat dissipation layer 122. Aluminum is selected as the material of the LED substrate 31, which contributes to improvement of heat dissipation effect, mechanical strength and stability of the LED panel. This advantage works in a variety of lighting applications, ensuring excellent performance and long life of the LED panel.

In a specific embodiment, the LED first insulating housing 11 includes heat dissipation scales, and the heat dissipation scales are disposed in the first insulating housing 11 and used for dissipating heat.

Specifically, in the LED panel, the LED chip 30 generates heat during operation, and heat dissipation is required to maintain a stable operating temperature. This feature introduces a heat dissipation scale, which is located within the LED first insulating case 11, for effectively dissipating heat generated from the LED chip 30 to ensure the performance and lifetime of the LED. The heat dissipation performance is excellent: the design of the heat dissipation scales helps to improve the heat dissipation effect of the LED panel, effectively conduct heat to the external environment, and prevent the LED chip 30 from being degraded or damaged due to overheating. Stability is enhanced: by controlling the operating temperature of the LED chip 30, the stability and reliability of the LED can be improved, the light decay phenomenon can be reduced, and the service life of the LED can be prolonged.

Further, a heat dissipation plate is located inside the LED first insulating case 11 adjacent to the LED chip 30. When the LED chip 30 operates, heat is generated, and the heat dissipation scales rapidly transfer the heat to the surfaces of the heat dissipation scales through heat conduction. The heat dissipation scales radiate heat to the outside through contacting with the environment, so that the heat dissipation of the LED is realized. Radiating scales are introduced into the first insulating shell 11 of the LED, so that the radiating performance of the LED panel is optimized, and the stability and the service life of the LED are improved.

The foregoing is merely exemplary of the present application and it should be noted herein that modifications may be made by those skilled in the art without departing from the inventive concept herein, which fall within the scope of the present application.

Claims

1. An LED panel, comprising;

the filter layer is arranged between the second insulating shell and the LED lamp and is used for changing the color temperature of the LED panel, and comprises an adhesive layer which is arranged on the first insulating shell and is attached to the filter layer;

2. The LED panel of claim 1, wherein said housing is a resin.

3. The LED panel of claim 1, wherein ten of said lamp rings are disposed side-by-side on said LED substrate and attached thereto, said lamp rings being adapted to change the color temperature of the LED panel.

4. The LED panel of claim 1, wherein said adhesive layer is double sided tape.

5. The LED panel of claim 1, wherein the second insulating housing comprises a heat sink layer disposed under the LED chip for dissipating heat.

6. The LED panel of claim 5, wherein said heat sink layer is a thermally conductive silicone.

7. The LED panel of claim 1, wherein the second insulating case comprises two power interfaces, the two power interfaces being respectively disposed at two ends of the second insulating case, the power interfaces being used to supply power to the LED panel.

8. The LED panel of claim 1, wherein said filter layer is an optical film.

9. The LED panel of claim 1, wherein the LED substrate is aluminum.

10. The LED panel of claim 1, wherein the first insulating housing comprises heat dissipating fins disposed within the first insulating housing, the heat dissipating fins configured to dissipate heat.