CN220650739U - Chip testing device - Google Patents

Abstract

The utility model provides a chip testing device, comprising: and the rotary table of each station is provided with at least one chip test seat. The slip ring includes a brush assembly and a conductive ring assembly. The heating signals and the temperature detection signals corresponding to all chips on each station are electrically connected to the brush wire groups corresponding to the respective stations, and the chip test seat on each station and the brush wire groups corresponding to the respective stations synchronously rotate along with the rotary table. The heating signals and the temperature detection signals on the corresponding stations of the conducting ring assembly are connected to the temperature controller and the processor. The rotary test mechanism can be used for increasing heating test conditions and meeting different test environments of chips. The multi-channel signal can be collected and sent simultaneously through the rotating terminal (the brush assembly) inside the slip ring, the rotating table can be tested in 360-degree rotating circulation, the ring signal receiving and outputting signals are normal, and the signals are not interfered in the processing. The signal transmission is uninterrupted, and the transmission signal line is not wound.

Description

Chip testing device

Technical Field

The utility model belongs to the technical field of chip testing, and particularly relates to a chip testing device.

Background

When the chip in the semiconductor industry is produced in mass, the chip needs to be tested at high temperature, and the accuracy, stability and high efficiency of the test temperature are particularly important for the chip. The chip is fixed on the chip test seat for testing, the heating element of the chip test seat heats the chip, and whether the chip reaches the preset temperature or not is measured by adopting the thermocouple. The heating signal wire and the thermocouple temperature detection signal wire of the chip test seat are connected to the processor, and the processor controls the heating element according to the thermocouple temperature detection signal, so that the high-temperature closed-loop control test of the chip is realized. The high-temperature closed-loop control test is relatively simple for one chip test, and thousands of chips on one wafer need to be tested with high efficiency, and how to realize the high-temperature closed-loop control test of a plurality of chips on one chip test seat and how to realize the high-temperature closed-loop control test of a plurality of chips on a plurality of chip test seats become the problems to be solved.

Disclosure of Invention

The utility model aims to provide a chip testing device which can realize that a rotary testing mechanism increases heating testing conditions and meets different testing environments of chips. The multi-channel signal can be collected and sent simultaneously through the rotating terminal (the brush assembly) inside the slip ring, the rotating table can be tested in 360-degree rotating circulation, the ring signal receiving and outputting signals are normal, and the signals are not interfered in the processing. The signal transmission is uninterrupted, and the transmission signal line is not wound.

The utility model provides a chip testing device, comprising:

a rotary table on which Fang Zhoujuan areas define a number of different stations; at least one chip test seat is arranged on the rotary table of each station and is used for fixing and heating a plurality of chips to be tested, and the temperature of the chips is tested by a temperature sensor after the chips are heated; the same chip test seat sequentially passes through the plurality of different stations along with the rotation of the rotary table;

a slip ring including a brush assembly including a brush and a brush lead set led out from the brush, and a conductive ring assembly; the conducting ring assembly comprises a conducting ring and a conducting ring wire harness group led out from the conducting ring; the conducting rings are in one-to-one correspondence with the electric brushes and are in contact with each other to realize electric connection; the brush assembly and the rotary table synchronously rotate;

the heating signals and the temperature detection signals corresponding to all chips on each station are electrically connected to the brush wire groups corresponding to the stations respectively, and the chip test seat on each station and the brush wire groups corresponding to the stations synchronously rotate along with the rotary table;

the conducting ring assembly is kept static in the rotating process of the rotating table, heating signals and temperature detection signals on the corresponding stations of the conducting ring assembly are connected to a temperature controller and a processor, and the processor heats the chip test seat through the temperature controller to realize temperature closed-loop control.

Further, the plurality of different stations comprise four stations which are uniformly distributed, and the four stations are respectively: the chip to be tested is placed in the station, the horizontal station of the chip in the chip test seat is detected, the temperature of the chip is tested in the station, and the chip is taken away after the chip is tested.

Further, the slip ring is positioned above the middle area of the rotary table; the chip testing device further comprises a rotor signal processing circuit board, wherein the rotor signal processing circuit board is arranged in an annular area which is arranged on the rotating table and is positioned at the outer side of the slip ring and is measured in the chip testing seat of the peripheral ring; and the brush lead group on each station is electrically connected with the heating signals and the temperature detection signals corresponding to all chips on the station through the bonding pads on the rotor signal processing circuit board.

Further, the chip testing device further comprises a rotary divider, the rotary table and the brush assembly are fixed on the rotary divider, and the rotary table and the brush assembly synchronously rotate along with the rotation of the rotary divider.

Further, the fixed support is installed to the lower extreme of brush subassembly, the fixed support contains U type sunken, U type sunken of fixed support is fixed downwards on the rotatory decollator, rotatory process of rotatory decollator drives the brush subassembly is rotatory.

Further, the slip ring further comprises an interface positioned at the top of the slip ring, and the conducting ring wire harness group is led out from the interface and connected to the temperature controller.

Further, each station further comprises a base plate located between the rotary table and the chip test seat, the base plate is made of heat insulation materials, and the base plate is a station signal processing circuit board corresponding to each station.

Further, at least four chips are arranged on each chip test seat, each chip test seat comprises a base, a plurality of floating plates are formed on the base, the chips are fixed on the floating plates for testing, heating elements are formed between the lower peripheral area of the floating plates and the base, and the chips are placed on the floating plates for heating.

Further, after the chip is heated according to the preset temperature, a thermocouple is used for testing whether the actual temperature value of the heated chip reaches the preset temperature; and the probes of the thermocouples are contacted with the chips in one-to-one correspondence through the fixture to test.

Further, each station is correspondingly provided with one chip test seat, and four chips are placed and fixed on one chip test seat; 2 paths of heating signals are led out for the heating element, 2 paths of temperature detection signals are led out for the temperature sensor, namely 4 paths of signals are led out for one chip, and the brush lead group on each station corresponds to 16 paths of signals led out by four chips on the station; the brush wire groups on the four stations are mutually independent; the conducting ring wire harness groups on the four stations are mutually independent.

Compared with the prior art, the utility model has the following beneficial effects:

the utility model provides a chip testing device, comprising: and the rotating platform of each station is provided with at least one chip test seat which is used for fixing and heating a plurality of chips to be tested. The slip ring includes a brush assembly and a conductive ring assembly. The heating signals and the temperature detection signals corresponding to all chips on each station are electrically connected to the brush wire groups corresponding to the respective stations, and the chip test seat on each station and the brush wire groups corresponding to the respective stations synchronously rotate along with the rotary table. The heating signals and the temperature detection signals on the corresponding stations of the conducting ring assembly are connected to a temperature controller and a processor, and the processor heats the chip test seat through the temperature controller to realize temperature closed-loop control. The rotary test mechanism can be used for increasing heating test conditions and meeting different test environments of chips. The multi-channel signal can be collected and sent simultaneously through the rotating terminal (the brush assembly) inside the slip ring, the rotating table can be tested in 360-degree rotating circulation, the ring signal receiving and outputting signals are normal, and the signals are not interfered in the processing. The signal transmission is uninterrupted, and the transmission signal line is not wound.

Drawings

Fig. 1 is a schematic diagram of a chip testing apparatus according to an embodiment of the utility model.

Fig. 2 is a schematic diagram of an internal structure of a slip ring in a chip testing device according to an embodiment of the utility model.

Fig. 3 is a schematic diagram of a testing principle of a chip testing device according to an embodiment of the utility model.

Wherein, the reference numerals are as follows:

10-rotating a table; 11-backing plate; s-chip test seat; 12-a base; 13-floating plates; 14-chip; 15-a rotor signal processing circuit board; 16-bonding pads; 20-slip rings; 21-a fixed disk; 22-interface; 23-brushes; 24-brush wire sets; 25-conducting rings; 26-conductive loop wire harness.

Detailed Description

The utility model is described in further detail below with reference to the drawings and the specific examples. The advantages and features of the present utility model will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are not to scale precisely, but rather merely for the purpose of facilitating and clearly aiding in the description of the embodiments of the utility model.

For ease of description, some embodiments of the present application may use spatially relative terms such as "above" …, "" below "…," "top," "below," and the like to describe one element or component's relationship to another element(s) or component(s) as illustrated in the various figures of the embodiments. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or components described as "below" or "beneath" other elements or components would then be oriented "above" or "over" the other elements or components. The terms "first," "second," and the like, herein below, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that such terms so used are interchangeable under appropriate circumstances.

The embodiment of the utility model provides a chip testing device, which comprises:

a rotary table, wherein a Fang Zhoujuan area on the rotary table defines a plurality of different stations; at least one chip test seat is arranged on the rotary table of each station and is used for fixing and heating a plurality of chips to be tested, and the temperature of the chips is tested by a temperature sensor after the chips are heated; the same chip test seat sequentially passes through a plurality of different stations along with the rotation of the rotary table;

the slip ring comprises an electric brush assembly and a conducting ring assembly, wherein the electric brush assembly comprises an electric brush and an electric brush wire group led out from the electric brush; the conducting ring assembly comprises a conducting ring and a conducting ring wire harness group led out from the conducting ring; the conducting rings are in one-to-one correspondence with the brushes and are in contact with each other to realize electric connection; the brush assembly and the rotary table synchronously rotate;

the chip test seat and the corresponding brush wire group on each station synchronously rotate along with the rotary table;

the conducting ring assembly is kept static in the rotating process of the rotating table, heating signals and temperature detection signals on all stations corresponding to the conducting ring assembly are connected to the temperature controller and the processor, and the processor heats the chip test seat through the temperature controller to realize temperature closed-loop control.

Fig. 1 is a schematic diagram of a chip testing apparatus according to an embodiment of the utility model. Fig. 2 is a schematic diagram of an internal structure of a slip ring in a chip testing device according to an embodiment of the utility model. Fig. 3 is a schematic diagram of a testing principle of a chip testing device according to an embodiment of the utility model.

Specifically, as shown in fig. 1 to 3, the chip test apparatus includes: the rotary table 10, the peripheral region above the rotary table 10 defines a number of different stations. Illustratively, four stations are uniformly distributed on the rotary table 10, wherein station a is a chip placement station to be tested, station B is a horizontal station for detecting chips 14 in the chip test seat S, station C is a chip temperature test station, and station D is a chip removal station after testing.

At least one chip test seat S is fixedly arranged on the rotary table 10 of each station, the chip test seat S is used for fixing and heating a plurality of chips 14 to be tested, the number of the chips 14 on one chip test seat S is not limited, and the chips can be arranged according to actual needs. The chip 14 is heated and then temperature is measured by a temperature sensor. Illustratively, each station includes a backing plate 11, a die test socket S on the backing plate 11, and a rotor signal processing circuit board 15 between the die test socket S and the slip ring 20. The base plate 11 can be made of heat-insulating materials, and the base plate 11 can be a station signal processing circuit board corresponding to each station. Four backing plates 11 are uniformly fixed on the rotary table 10.

The same die test station S, with the die 14 mounted thereon, passes through all of the different stations in sequence as the rotary table 10 rotates. It should be appreciated that while the rotary table 10 is rotating, the station is unchanged from rotation, e.g., the station in front of the slip ring 20 is always station C (chip temperature test station). In this way, the four stations on the rotary table 10 all work synchronously, and the testing efficiency is remarkably improved. For example, the first four chips on the chip test bench S are performing chip removal actions at station D (note that temperature testing has been completed before); the second batch of four chips placed on the chip test seat S are executing test temperature actions at the station C; the third batch of four chips placed on the chip test seat S are executing the horizontal detection action at the station B; station a is performing the action of placing a fourth batch of four chips onto the chip test socket S.

After the four stations complete one cycle, the rotary table 10 rotates 90 ° to perform the next cycle test. The chip test seat S positioned on the station D before rotation rotates to the station A, and a fifth batch of four chips are placed on the chip test seat S on the station A after rotation; synchronously, rotating the chip test seat S positioned on the station A before rotation to the station B for horizontal detection; the chip test seat S positioned on the station B before rotation rotates to the station C to perform temperature testing action; the chip test seat S positioned on the station C before rotation rotates to the station D to take the chip away. Thereafter, the rotary table 10 is rotated by 90 degrees again to perform the cyclic test.

The slip ring 20 is located above the middle region of the rotary table 10. The slip ring 20 comprises a housing, a brush assembly and a conducting ring assembly within the housing, the brush assembly comprising a plurality of spaced brushes 23 and a brush lead set 24 leading from the brushes 23; the conducting ring assembly comprises a plurality of conducting rings 25 which are axially distributed along the slip ring 20 and a conducting ring wire harness group 26 which is led out from the conducting rings 25; the conductive rings 25 and the brushes 23 are distributed in one-to-one correspondence and contact to realize electric connection. The number of conductive rings 25 and brushes 23 in the slip ring 20 varies according to the needs of the device, and the slip ring 20 is, for example, a hollow slip ring.

Of the two main components of the slip ring 20, the conducting ring 25 and the brush 23, either the conducting ring 25 rotates and the brush 23 is stationary, or the brush 23 rotates and the conducting ring 25 is stationary, these two operating conditions being not essentially different, corresponding to the rotation of one of the stator and the rotor, one stationary and the other, which are engaged by bearings. In this example, the brushes 23 rotate and the conducting ring 25 is stationary, and the brush assembly part corresponds to a rotor and the conducting ring assembly part corresponds to a stator.

The chip testing apparatus further includes a rotation divider (not shown), for example, provided below the rotary table 10, and the motor drives the rotation divider to rotate by 90 °. The rotary table 10 is fixed to the rotary divider, and the rotary table 10 rotates in synchronization with the rotary divider. The brush assembly is fixed on the rotary divider, and the brush assembly and the rotary divider synchronously rotate, so that the brush assembly, the rotary table and the rotary divider synchronously rotate.

The brush wire groups 24 at each station are electrically connected to the heating signals and temperature detection signals corresponding to all chips 14 at the respective stations via pads 16 on the rotor signal processing circuit board 15. The rotor signal processing circuit board 15 is fixedly arranged in an annular area of the rotary table 10, which is positioned outside the slip ring 20 and is measured in the chip test seat S of the peripheral ring.

The conducting ring assembly is fixed to be kept static during the rotation of the rotary table 10, and a conducting ring wire harness 26 led out of the conducting rings 25 in the conducting ring assembly is led out of the interface 22 and connected to the temperature controller. During rotation of the rotary table 10, the conductive ring assembly remains stationary, and thus the conductive ring harness 26.

The brush assembly rotates in synchronization with the rotary divider, and a brush wire group 24 led out from a brush 23 in the brush assembly is connected to the pad 16 of the rotor signal processing circuit board 15. Since the brush assembly rotates with the rotary divider and the pads 16 of the rotor signal processing circuit board 15 fixed to the rotary table 10 also rotate synchronously, the brush wire groups 24 led out by the brushes 23 in the brush assembly are relatively stationary with the pads 16, so that the brush wire groups 24 do not wind together during the rotation of the rotary table 10.

The lower end of the brush assembly of the slip ring 20 may be provided with a fixing bracket (also called a slip ring fork), the fixing bracket (not shown) includes a U-shaped recess, and the U-shaped recess of the fixing bracket is clamped (fixed) on the rotating divider downward, so that the rotating divider rotates the brush assembly of the slip ring 20.

The chip testing apparatus further comprises a fixing plate 21, and the conductive ring assembly of the slip ring 20 is fixed at a rest position near the chip testing apparatus by the fixing plate 21, and the fixing plate 21 is fixed with the housing of the slip ring 20.

The chip 14 is fixed on the chip test seat S, the chip test seat S comprises a base 12, a plurality of floating plates 13 are formed on the base 12, the chip 14 is fixed on the floating plates 13 for testing, and springs are formed between the floating plates 13 and the base 12 so that the chip 14 is flexibly contacted in the mounting, fixing and testing processes, and the chip 14 is prevented from being damaged. Illustratively, a spring is formed between the lower middle region of the floating plate 13 and the base 12. A heating element, such as a heating ring or a heating wire, is formed between the lower peripheral region of the floating plate 13 and the susceptor 12. The heating element solves the heat source problem of test requirements in a high-temperature environment, and can be powered and heated by a 5V power supply, for example. The temperature sensor detects the heated temperature of each chip, and the temperature sensor can adopt a thermocouple.

Illustratively, one die test socket S is provided at one station, and four dies 14 are placed and fixed on the die test socket S. For each chip 14, 2 heating signals are led out for the heating element, 2 thermocouple temperature detection signals are led out for the thermocouple, 4 signals are led out for one chip, then 16 signals are led out for four chips on one station, the 16 signals are connected to the bonding pads 16 of the rotor signal processing circuit board 15, the brush wire group 24 on one station comprises a plurality of parallel wire bundles which are respectively and electrically connected to the bonding pads 16 of the rotor signal processing circuit board 15, and a common power supply part can be combined and processed on the bonding pads 16 on the rotor signal processing circuit board 15. The brush wire group 24 on one station corresponds to 16 paths of signals led out by four chips. Correspondingly, the brush wire group 24 on the four stations is led out 64 paths of signals corresponding to 16 chips. The brush wire groups 24 on the four stations are mutually independent and do not affect each other; accordingly, four sets of mutually independent sets 26 of conductive loop bundles are led out of the interface 22. The brush wire groups 24 on each station are in one-to-one correspondence with the conducting ring wire harness groups 26 and are electrically connected through the contact of the brushes 23 and the conducting rings 25. The transmission signal line is not wound, and the slip ring mechanism is used for realizing the heating test condition of the rotary test mechanism, so that different test environments of the chip are met. The synchronous heating of 16 chips 1-16 in FIG. 3 is realized, and the real-time monitoring of the temperature is realized. 360-degree rotation test of the rotary table is realized, and 16 single-point chips are independently heated. The signal connection and control during rotation test can be realized, and the chip heating test requirement is met.

The integration of the heating system and the temperature detection system is realized through the slip ring terminal (the electric brush assembly), and the heating control signal and the temperature detection signal of the whole set of high temperature system are integrated and then are linked into a unified temperature controller through the signal integration conversion card. The temperature controller and the processor can be linked through the RS485 signal transfer card, so that the temperature controller can output instructions through the processor, and the temperature controller can heat the chip test seat S through the signal integration card, so that the signal acquisition work is completed. Specifically, a temperature adjusting circuit may be provided in the temperature controller of the present embodiment to adjust the output current, and the current flows through a heating element (power resistor) with a small resistance to generate heat to heat the chip 14. The back surface of each floating plate 13 is provided with a heating element, and a chip 14 is placed on the floating plate 13 for heating. After heating to the preset temperature, a thermocouple (not shown) is used to test whether the actual temperature value of the heated chip 14 reaches the preset temperature, and temperature calibration is achieved. In the actual test, four thermocouple probes can simultaneously contact four chips through the fixture to perform the test. If the thermocouple test temperature is lower than the preset temperature, the processor transmits an instruction to the temperature controller to control the heating element to continue heating, for example, a temperature regulating circuit in the temperature controller increases the output current to enable the heating element to continue heating.

The chip testing device of the embodiment can realize that the rotary testing mechanism increases heating testing conditions and meets different testing environments of chips. The multi-path (for example, 64 paths) signals can be collected and transmitted simultaneously through the rotating terminal (the brush assembly) inside the slip ring, the 360-degree rotating cycle test of the rotating table can be met, the ring signals are normally received and output, and the signals are not interfered in the processing. The signal transmission is uninterrupted, and the transmission signal line is not wound.

According to the utility model, the plurality of chip test seats are arranged on the rotary table, the stations synchronously work, and after the work of the rotary table is completed, the rotary table rotates by 90 degrees to enter the next circulation work, so that the efficiency is remarkably improved. The heating signal wires and the thermocouple temperature detection signal wires on the plurality of chip test seats are prevented from being wound together along with rotation. The high-temperature test device realizes ordered chips on a plurality of chip test seats, mutually noninterferes wiring harnesses and has high efficiency.

In summary, the present utility model provides a chip testing apparatus, comprising: and the rotating platform of each station is provided with at least one chip test seat which is used for fixing and heating a plurality of chips to be tested. The slip ring includes a brush assembly and a conductive ring assembly. The heating signals and the temperature detection signals corresponding to all chips on each station are electrically connected to the brush wire groups corresponding to the respective stations, and the chip test seat on each station and the brush wire groups corresponding to the respective stations synchronously rotate along with the rotary table. The heating signals and the temperature detection signals on the corresponding stations of the conducting ring assembly are connected to a temperature controller and a processor, and the processor heats the chip test seat through the temperature controller to realize temperature closed-loop control. The rotary test mechanism can be used for increasing heating test conditions and meeting different test environments of chips. The multi-channel signal can be collected and sent simultaneously through the rotating terminal (the brush assembly) inside the slip ring, the rotating table can be tested in 360-degree rotating circulation, the ring signal receiving and outputting signals are normal, and the signals are not interfered in the processing. The signal transmission is uninterrupted, and the transmission signal line is not wound.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the method disclosed in the embodiment, the description is relatively simple since it corresponds to the device disclosed in the embodiment, and the relevant points refer to the description of the method section.

The foregoing description is only illustrative of the preferred embodiments of the present utility model, and is not intended to limit the scope of the claims, and any person skilled in the art may make any possible variations and modifications to the technical solution of the present utility model using the method and technical content disclosed above without departing from the spirit and scope of the utility model, so any simple modification, equivalent variation and modification made to the above embodiments according to the technical matter of the present utility model fall within the scope of the technical solution of the present utility model.

Claims (10)

1. A chip testing apparatus, comprising:

a rotary table on which Fang Zhoujuan areas define a number of different stations; at least one chip test seat is arranged on the rotary table of each station and is used for fixing and heating a plurality of chips to be tested, and the temperature of the chips is tested by a temperature sensor after the chips are heated; the same chip test seat sequentially passes through the plurality of different stations along with the rotation of the rotary table;

a slip ring including a brush assembly including a brush and a brush lead set led out from the brush, and a conductive ring assembly; the conducting ring assembly comprises a conducting ring and a conducting ring wire harness group led out from the conducting ring; the conducting rings are in one-to-one correspondence with the electric brushes and are in contact with each other to realize electric connection; the brush assembly and the rotary table synchronously rotate;

the heating signals and the temperature detection signals corresponding to all chips on each station are electrically connected to the brush wire groups corresponding to the stations respectively, and the chip test seat on each station and the brush wire groups corresponding to the stations synchronously rotate along with the rotary table;

the conducting ring assembly is kept static in the rotating process of the rotating table, heating signals and temperature detection signals on the corresponding stations of the conducting ring assembly are connected to a temperature controller and a processor, and the processor heats the chip test seat through the temperature controller to realize temperature closed-loop control.

2. The chip testing apparatus of claim 1, wherein the plurality of different stations comprises four stations uniformly distributed, each of: the chip to be tested is placed in the station, the horizontal station of the chip in the chip test seat is detected, the temperature of the chip is tested in the station, and the chip is taken away after the chip is tested.

3. The chip testing apparatus of claim 1, wherein the slip ring is located above a middle region of the rotary table; the chip testing device further comprises a rotor signal processing circuit board, wherein the rotor signal processing circuit board is arranged in an annular area which is arranged on the rotating table and is positioned at the outer side of the slip ring and is measured in the chip testing seat of the peripheral ring; and the brush lead group on each station is electrically connected with the heating signals and the temperature detection signals corresponding to all chips on the station through the bonding pads on the rotor signal processing circuit board.

4. The die testing apparatus of claim 1, further comprising a rotational divider, wherein the rotational stage and the brush assembly are each fixed to the rotational divider, and wherein the rotational stage and the brush assembly each rotate synchronously with rotation of the rotational divider.

5. The chip testing apparatus according to claim 4, wherein a fixing bracket is installed at a lower end of the brush assembly, the fixing bracket comprises a U-shaped recess, the U-shaped recess of the fixing bracket is downwardly fixed on the rotary divider, and the rotary divider rotates to rotate the brush assembly.

6. The chip testing apparatus of claim 1, wherein the slip ring further comprises an interface at a top of the slip ring, the conductive ring harness leading from the interface to connect to the temperature controller.

7. The chip testing apparatus of claim 1, further comprising a pad between the rotary table and the chip test seat at each of the stations, wherein the pad is made of a heat-insulating material, and the pad is a station signal processing circuit board corresponding to each of the stations.

8. The chip testing apparatus of claim 1, wherein at least four chips are provided on each of the chip test sockets, the chip test sockets comprise a base, a plurality of floating plates are formed on the base, the chips are fixed on the floating plates for testing, heating elements are formed between a lower peripheral area of the floating plates and the base, and the chips are placed on the floating plates for heating.

9. The chip testing apparatus of claim 8, wherein after the chip is heated at a preset temperature, a thermocouple is used to test whether an actual temperature value of the heated chip reaches the preset temperature; and the probes of the thermocouples are contacted with the chips in one-to-one correspondence through the fixture to test.

10. The chip testing apparatus according to claim 1, wherein each station is provided with one chip testing seat, and four chips are placed and fixed on one chip testing seat; 2 paths of heating signals are led out for the heating element, 2 paths of temperature detection signals are led out for the temperature sensor, namely 4 paths of signals are led out for one chip, and the brush lead group on each station corresponds to 16 paths of signals led out by four chips on the station; the brush wire groups on the four stations are mutually independent; the conducting ring wire harness groups on the four stations are mutually independent.