CN220641426U - Wafer box clamping jaw device and air transport vehicle - Google Patents

Abstract

The embodiment of the specification provides a wafer box clamping jaw device and air transport vehicle, including base plate and two sets of clamping jaw mechanisms, two sets of clamping jaw mechanisms can remove for the base plate, install drive assembly on the base plate, drive assembly drives two sets of clamping jaw mechanisms and is close to each other or keep away from each other to distance between two sets of clamping jaw mechanisms increases or reduces, the base plate top has set gradually first sensor and second sensor along keeping away from the base plate direction, the base plate bottom is connected with the elastic component, the one end that the base plate was kept away from to the elastic component is connected with the mounting panel, the locating piece is installed to the mounting panel bottom, the mounting panel top is provided with the measuring staff. Through setting up first sensor and second sensor, when clamping jaw mechanism normally centre gripping wafer box, the measuring rod triggers first sensor, and first sensor is changed to off state by on state, and when clamping jaw mechanism is unusual when the centre gripping wafer box, the measuring rod triggers the second sensor, reminds the staff to centre gripping unusual.

Description

Wafer box clamping jaw device and air transport vehicle

Technical Field

The utility model relates to the field of semiconductor handling equipment, in particular to a wafer box clamping jaw device and an air transport vehicle.

Background

Loadport (loader) is a loader provided at the front end of a processing apparatus such as a photolithography machine, for temporarily storing wafer cassettes. The OHT (overhead hoist transfer, air transporter) places the cassette loaded with wafers to be processed on the Loadport by a gripper device thereon, or takes the cassette loaded with wafers that have been processed out of the Loadport and transports it to a storage device or to the next station.

When the clamping jaw device of the existing air transport vehicle clamps the wafer box, when the wafer box is placed abnormally or foreign matters exist on the wafer box, the clamping jaw device is easy to clamp between the clamping jaw device and the wafer box when the wafer box is clamped, and accidents such as falling of the wafer box are caused.

Disclosure of Invention

In view of the above, the present utility model provides a wafer cassette clamping jaw device and an air transporter that can reliably clamp and safely transport.

The utility model provides the following technical scheme: the wafer box clamping jaw device comprises a substrate and two groups of clamping jaw mechanisms, wherein the two groups of clamping jaw mechanisms can move relative to the substrate, a driving assembly is arranged on the substrate, the driving assembly drives the two groups of clamping jaw mechanisms to be close to or far away from each other so as to enable the distance between the two groups of clamping jaw mechanisms to be increased or decreased, a first sensor and a second sensor are arranged at the top of the substrate along the direction far away from the substrate, a mounting plate is arranged below the substrate, the mounting plate is connected with the substrate through one or more movable connecting assemblies, an elastic piece is arranged between the substrate and the mounting plate, a positioning block is arranged at the bottom of the mounting plate, a detection rod is arranged at the top of the mounting plate, and the detection rod penetrates through the substrate;

wherein:

a distance between the first sensor and the substrate is smaller than a distance between the second sensor and the substrate;

when the clamping jaw device clamps the wafer box, the substrate moves towards the direction close to the wafer box, the positioning block moves towards the direction close to the substrate after contacting with the top of the wafer box, and the positioning block drives the detection rod to move towards the direction close to the first sensor and the second sensor through the mounting plate, so that the detection rod triggers the first sensor and/or the second sensor;

the first sensor generates a signal indicating that the wafer box is clamped normally when triggered;

and when the second sensor is triggered or the first sensor and the second sensor are triggered at the same time, a signal indicating that the wafer box is not clamped normally is generated.

Preferably, the driving assembly comprises a motor, a bidirectional screw rod and two groups of slide block connecting plates, the motor is mounted on the base plate through a bracket, the output end of the motor is connected with the bidirectional screw rod to drive the bidirectional screw rod to rotate, the two groups of slide block connecting plates are respectively connected with two sides of the bidirectional screw rod in a threaded manner, and the two groups of slide block connecting plates are respectively connected with the two groups of clamping jaw mechanisms.

Preferably, the driving assembly further comprises a sliding rail and a ball nut seat, the sliding block connecting plate is in threaded connection with the bidirectional screw rod through the ball nut seat, the sliding rail is mounted on the base plate, and the sliding block connecting plate is in sliding connection with the sliding rail. When the bidirectional screw rod rotates, the two slide block connecting plates are driven to be close to each other or far away from each other.

Preferably, the clamping jaw device further comprises a third sensor, a fourth sensor and a detection sheet, wherein the third sensor and the fourth sensor are both arranged on the base plate, and the detection sheet is arranged on at least one sliding block connecting plate; the detection sheet triggers the fourth sensor when the clamping jaw device is in an initial state, and triggers the third sensor when the clamping jaw device clamps the wafer box.

Preferably, the clamping jaw mechanism comprises a vertical plate, a connecting plate and a supporting plate, wherein the connecting plate is connected with the driving assembly, the connecting plate and the supporting plate are both installed on one side, close to the wafer box, of the vertical plate, the vertical plate comprises a clamping section and a connecting section connected with the clamping section, the width of the clamping section is gradually reduced along the direction away from the connecting section, and when the clamping jaw mechanism clamps the wafer box, the supporting plate is contacted with the bottom of the second clamping part of the wafer box.

Preferably, each clamping jaw mechanism is provided with a first positioning block and a second positioning block, wherein:

the first positioning block is provided with two first guide surfaces, and an included angle between the two first guide surfaces is alpha 1; the second positioning block is provided with two second guide surfaces, and an included angle between the two second guide surfaces is alpha 2; wherein, 0 degree is more than alpha 1 and less than 180 degrees, 0 degree is more than alpha 2 and less than 180 degrees;

the wafer box comprises a wafer box body, wherein the wafer box body is provided with a first clamping part and a second clamping part, the outer walls of the two opposite sides of the wafer box body are respectively provided with a first guided surface, and the second clamping part is provided with a second guided surface;

wherein:

the first guided surface of the first clamping part can slide along the first guiding surface of the first positioning block, and the second guided surface of the second clamping part can slide along the second guiding surface of the second positioning block;

the first positioning block and the second positioning block are configured to: when each clamping jaw mechanism moves close to the wafer box, a first guiding surface and a first guided surface are at least partially contacted and relatively slid to realize positioning guiding with first precision; then at least one second guiding surface and at least one second guided surface are at least partially contacted and relatively slid to realize positioning guiding with second precision, so as to allow the two second guiding surfaces to be abutted with the two second guided surfaces one to one.

Preferably, the first positioning block and the second positioning block are both installed on one side of each clamping jaw mechanism, which is close to the wafer box, and the first positioning block is arranged above or below the second positioning block;

the first positioning block is provided with a U-shaped groove, two opposite side walls of the U-shaped groove form two first guide surfaces in a one-to-one mode, and the distance between the two first guide surfaces is gradually increased along the direction from the bottom of the U-shaped groove to the notch of the U-shaped groove;

the second positioning block is a V-shaped protruding block, two opposite side outer walls of the second positioning block form two second guide surfaces in a one-to-one mode, and the distance between the two second guide surfaces is gradually reduced along the direction from one end of the second positioning block, which is connected with the clamping jaw mechanism, to the protruding end of the second positioning block;

wherein:

the narrowest interval between the two first guide surfaces is larger than the narrowest interval between the two second guide surfaces;

when the two second guide surfaces of the second positioning block are in one-to-one abutting contact with the two second guided surfaces of the second clamping part, a gap is formed between at least one first guide surface of the first clamping part and one first guided surface of the first positioning block.

Preferably, the clamping jaw mechanism further comprises a fifth sensor, the fifth sensor is mounted on one side of the vertical plate, which is close to the wafer box, and when the clamping jaw mechanism clamps the wafer box, the outer protruding portion of the wafer box triggers the fifth sensor.

Preferably, at least two guide blocks are further arranged at the bottom of the substrate, the at least two guide blocks are distributed on adjacent or opposite outer sides of the wafer box, and an inclined plane is arranged on one side, close to the wafer box, of each guide block.

Preferably, the movable coupling assembly comprises a positioning guide sleeve and a positioning guide rod, and the elastic piece is a spring, wherein:

one of the positioning guide sleeve and the positioning guide rod is fixed with the base plate, and the other of the positioning guide sleeve and the positioning guide rod is fixed with the mounting plate; the positioning guide sleeve is movably sleeved on the outer side of the positioning guide rod, and a disengagement preventing structure for preventing the positioning guide rod from disengaging from the positioning guide sleeve is arranged between the positioning guide sleeve and the positioning guide rod;

the movable coupling assembly further comprises a fixed plate, the fixed plate is arranged on the positioning guide sleeve, and the fixed plate is connected with the base plate;

the spring is sleeved outside the positioning guide rod, wherein when the mounting plate is stressed and then approaches to the base plate, the spring is stressed and elastically deforms.

An air transport vehicle comprising a vehicle body, a travelling device coupled to the top of the vehicle body, a transverse transfer device connected to the vehicle body, and a lifting device connected to the transverse transfer device, wherein the air transport vehicle is further provided with a wafer cassette clamping jaw device according to any one of the above, the wafer cassette clamping jaw device is mounted on the lifting device, and the wafer cassette clamping jaw device can lift relative to the vehicle body.

Compared with the prior art, the at least one technical scheme adopted by the utility model has the beneficial effects that at least the beneficial effects comprise:

the driving component drives the two groups of clamping jaw mechanisms to move towards the directions close to or far away from each other, so that the distance between the two groups of clamping jaw mechanisms is increased or reduced, clamping or loosening of the wafer box is achieved, the first sensor and the second sensor are arranged, when the clamping jaw device clamps the wafer box, the positioning block is contacted with the top of the wafer box, then the detection rod is driven to move towards the directions close to the first sensor and the second sensor, when the clamping jaw mechanisms clamp the wafer box normally, the detection rod triggers the first sensor to generate a signal indicating that the wafer box is clamped normally, when the wafer box is in an inclined abnormal posture for example, the detection rod is lifted to a higher position than the condition of normal clamping, so that the detection rod triggers the second sensor, and in this case, a signal indicating that the wafer box is clamped normally is generated, and the signal can be used for reminding workers of abnormal clamping. Some of the advantageous effects of further developments of the utility model can also be seen with reference to the description of the embodiments.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a top view of a wafer cassette clamping jaw apparatus provided by the present utility model;

FIG. 2 is a side view of a wafer cassette clamping jaw apparatus provided by the present utility model;

FIG. 3 is a schematic view of the connection structure between the mounting plate, the test bar and the elastic member of the wafer cassette clamping jaw apparatus provided by the present utility model;

FIG. 4 is a schematic view of a clamping jaw mechanism of the clamping jaw device for wafer cassettes according to the present utility model;

FIG. 5 is a schematic view of a wafer cassette according to the present utility model;

FIG. 6 is a schematic view of the clamping jaw mechanism of the clamping jaw device for wafer cassette according to the present utility model when not engaged with the wafer cassette;

FIG. 7 is a schematic view of a wafer cassette clamping jaw apparatus according to the present utility model;

fig. 8 is a schematic structural view of an air transporter provided by the present utility model.

In the figure, 1, a substrate; 2. a motor; 3. a two-way screw rod; 4. a slide block connecting plate; 5. a slide rail; 6. a first sensor; 7. a second sensor; 8. a first sensor; 9. a second sensor; 10. a detection sheet; 11. a jaw mechanism; 111. a vertical plate; 112. a connecting plate; 113. a supporting plate; 114. a U-shaped positioning block; 115. a V-shaped positioning block; 12. a positioning block; 13. a mounting plate; 14. a detection rod; 15. a movable coupling assembly; 151. positioning a guide rod; 152. a spring; 153. positioning a guide sleeve; 154. a fixing plate; 16. a guide block; 17. a wafer cassette; 171. a first clamping part; 172. a second clamping portion; 100. a ceiling; 101. a track; 200. a traveling device; 300. a transverse transfer device; 400. a lifting device; 500. a wafer cassette clamping jaw device; 600. fall protection device 700, automobile body.

Detailed Description

Embodiments of the present application are described in detail below with reference to the accompanying drawings.

Other advantages and effects of the present application will become apparent to those skilled in the art from the present disclosure, when the following description of the embodiments is taken in conjunction with the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. The present application may be embodied or carried out in other specific embodiments, and the details of the present application may be modified or changed from various points of view and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present application, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, apparatus may be implemented and/or methods practiced using any number and aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.

It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concepts of the application by way of illustration, and only the components related to the application are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.

In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.

The following describes the technical solutions provided by the embodiments of the present application with reference to the accompanying drawings.

As shown in fig. 1-7, a wafer box clamping jaw device comprises a substrate 1 and two groups of clamping jaw mechanisms 11, wherein the two groups of clamping jaw mechanisms 11 can move relative to the substrate 1, a driving assembly is mounted on the substrate 1, the driving assembly drives the two groups of clamping jaw mechanisms 11 to be close to or far away from each other so as to increase or decrease the distance between the two groups of clamping jaw mechanisms 11, a first sensor 6 and a second sensor 7 are arranged at the top of the substrate 1 along the direction far away from the substrate 1, a mounting plate 13 is arranged below the substrate 1, the mounting plate 13 is connected with the substrate 1 through one or more movable connecting assemblies, an elastic piece is arranged between the substrate 1 and the mounting plate 13, a positioning block 12 is mounted at the bottom of the mounting plate 13, a detection rod 14 is arranged at the top of the mounting plate 13, and the detection rod 14 penetrates through the substrate 1;

when the clamping jaw device clamps the wafer box 17, the substrate 1 moves towards the direction approaching the wafer box 17, the positioning block 12 contacts with the top of the wafer box 17 and then moves towards the direction approaching the substrate 1, and the positioning block 12 drives the detection rod 14 to move towards the direction approaching the first sensor 6 and the second sensor 7 through the mounting plate 13, so that the detection rod 14 triggers the first sensor 6 and/or the second sensor 7.

The first sensor 6 is disposed above the substrate 1, and the second sensor 7 is disposed above the first sensor 6, and the relative orientation of the above may be directly above or laterally above, and the present utility model is not limited thereto. Thus, the distance between the first sensor 6 and the substrate 1 is smaller than the distance between the second sensor 7 and the substrate 1.

When the wafer box 17 is grabbed, the clamping jaw device moves to the upper side of the wafer box 17, the clamping jaw device moves to the direction close to the wafer box 17, the positioning block 12 is contacted with the top of the wafer box 17, along with the fact that the clamping jaw device continues to move downwards, the positioning block 12 moves to the direction close to the substrate 1, the elastic piece 15 is compressed, and the positioning block 12 drives the detection rod 14 to move to the direction close to the first sensor 6 and the second sensor 7 through the mounting plate 13.

In some embodiments, the first sensor 6 and the second sensor 7 adopt opposite-emitting photoelectric sensors, if the detecting rod 14 moves between the transmitting end and the receiving end of the first sensor 6, the first sensor 6 is triggered, the first sensor 6 is turned from an on state to an off state, at this time, the clamping jaw mechanisms 11 can implement a grabbing action, and the driving assembly drives the two groups of clamping jaw mechanisms 11 to move towards each other, so that the distance between the two groups of clamping jaw mechanisms 11 is reduced, and the wafer box 17 is clamped by the two groups of clamping jaw mechanisms 11. When the clamping jaw mechanism 11 abnormally clamps the wafer box 17, that is, when the clamping jaw mechanism 11 is excessive, the wafer box 17 is not placed in place, or when foreign matters exist on the wafer box 17, the moving distance of the positioning block 12 is larger than the moving distance during normal clamping, the detection rod 14 is lifted to be blocked between the transmitting end and the receiving end of the second sensor 7, the second sensor 7 is triggered, and the second sensor 7 is changed from an on state to an off state.

The signal generated during the detection of the sensor can be transmitted to the control system, so that the staff can be reminded of abnormal clamping.

In some embodiments, when the detection lever 14 triggers the second sensor 7, it may be arranged that when the detection lever 14 only shields the second sensor 7, not the first sensor 6. Alternatively, in some embodiments, when the detection lever 14 triggers the second sensor 7, it may be arranged to simultaneously shield the second sensor 7 and the first sensor 6 when the detection lever 14. Wherein, as soon as the second sensor 7 is triggered, the corresponding detection lever 14 has been lifted to a position corresponding to the abnormal state.

In some embodiments, if the first sensor 6 is turned from the on state to the off state and the second sensor 7 is still in the on state, the gripping action can be performed by the gripper mechanism 11; if the first sensor 6 is still in the on state, it indicates an abnormality, and the gripping operation cannot be performed.

It should be further noted that the distance between the second sensor 7 and the detection rod 14 is larger than the distance between the first sensor 6 and the detection rod 14, and at least a part of the width of the detection rod 14 is larger than the width of the emitted light of the first sensor 6 and the second sensor 7, so as to ensure that the detection rod 14 can reliably trigger the first sensor 6 and the second sensor 7.

In some embodiments, the first sensor 6 and the second sensor 7 may be proximity switches, or other types of sensors, and may be capable of detecting that the detecting rod 14 is lifted to a position where the wafer cassette can be held normally and lifted to a position where the wafer cassette cannot be held normally.

As shown in fig. 1-2, in some embodiments, the driving assembly includes a motor 2, a bidirectional screw rod 3, and two sets of slider connecting plates 4, the motor 2 is mounted on the base plate 1 through a bracket, an output end of the motor 2 is connected with the bidirectional screw rod 3 through a transmission belt mechanism to drive the bidirectional screw rod to rotate, two sets of slider connecting plates 4 are respectively connected with two sides of the bidirectional screw rod 3 in a threaded manner, two sets of slider connecting plates 4 are respectively connected with two sets of clamping jaw mechanisms 11, the two sets of slider connecting plates 4 are driven by the motor 2 to rotate by driving the bidirectional screw rod 3, the two sets of slider connecting plates 4 respectively move along directions in which the bidirectional screw rod 3 approaches to or moves away from each other, and the two sets of slider connecting plates 4 respectively drive the two sets of clamping jaw mechanisms 11 to move, so as to adjust a distance between the two sets of clamping jaw mechanisms 11.

In other embodiments, the driving assembly may have other structures, and only needs to ensure that the distance between the two groups of jaw mechanisms 11 can be adjusted, so as to realize the clamping and unclamping actions.

As shown in fig. 1-2, further, the driving assembly further includes a sliding rail 5 and a ball nut seat, the sliding block connecting plate 4 is in threaded connection with the bidirectional screw rod 3 through the ball nut seat, the sliding rail 5 is installed on the base plate 1, the sliding block connecting plate 4 is in sliding connection with the sliding rail 5, the sliding rail 5 is arranged, the sliding block connecting plate 4 is in sliding connection with the sliding rail 5, the sliding rail 5 can play a role in limiting and guiding the sliding block connecting plate, the moving direction of the sliding block connecting plate 4 is guaranteed, meanwhile, the threaded connection between the sliding block connecting plate 4 and the bidirectional screw rod 3 is realized through the ball nut seat, and the sliding block connecting plate 4 can move along the bidirectional screw rod 3 when the bidirectional screw rod 3 rotates.

In other embodiments, the slider connecting plate 4 may be directly screwed to the bidirectional screw rod 3, and may be set according to actual situations.

As shown in fig. 1-2, in some embodiments, the clamping jaw device further includes a third sensor 8, a fourth sensor 9, and a detecting piece 10, where the third sensor 8 and the fourth sensor 9 are both mounted on the base plate 1, the detecting piece 10 is mounted on at least one of the slide connecting plates 4, the detecting piece 10 triggers the fourth sensor 9 when the clamping jaw device is in an initial state (corresponding to a position when the clamping jaw mechanism does not clamp the wafer cassette), the detecting piece 10 triggers the third sensor 8 when the clamping jaw device clamps the wafer cassette 17, and by providing the detecting piece 10, the detecting piece 10 triggers the fourth sensor 9 when the clamping jaw device does not work; the detecting piece 10 is arranged on the slide block connecting plate 4, when the slide block connecting plate 4 moves, the detecting piece 10 is driven to move together, when the clamping jaw mechanism 11 clamps the wafer box 17, the detecting piece 10 just triggers the third sensor 8, and whether the clamping jaw mechanism 11 clamps the wafer can be judged through the conditions of the third sensor 8 and the fourth sensor 9.

In some embodiments, a third sensor 8 and a fourth sensor 9 are disposed on an end of the substrate 1 near a clamping jaw mechanism 11, and a detecting plate 10 is disposed on the slider connecting plate 4 correspondingly connected to the clamping jaw mechanism 11; a third sensor 8 and a fourth sensor 9 are arranged at one end of the base plate 1 near the other clamping jaw mechanism 11, and a detecting sheet 10 is arranged on the slide block connecting plate 4 correspondingly connected with the clamping jaw mechanism 11. In this way, the positions of the two jaw mechanisms 11 relative to the substrate 1 can be detected separately.

In some embodiments, a detecting piece 10 is disposed on the slide connecting plate 4 connected to any one of the two clamping jaw mechanisms 11, and a third sensor 8 and a fourth sensor 9 triggered by the detecting piece 10 on the substrate 1, so that the two clamping jaw mechanisms 11 move synchronously, and thus, the position of the slide connecting plate 4 connected to any one of the two clamping jaw mechanisms is detected relative to the substrate 1, so that the state of the clamping jaw mechanism 11 can be obtained.

As shown in fig. 4-7, in some embodiments, the clamping jaw mechanism 11 includes a vertical plate 111, a connecting plate 112, and a supporting plate 113, where the connecting plate 112 is connected to the driving assembly, and the connecting plate 112 and the supporting plate 113 are both installed on a side of the vertical plate 111 near the wafer cassette 17, and the vertical plate 111 includes a clamping section and a connecting section connected to the clamping section. The clamping section and the connecting section are fixed together or integrally formed. Along keeping away from the direction of linkage segment, the width of centre gripping section reduces gradually, works as clamping jaw mechanism 11 centre gripping wafer box 17, layer board 113 with the bottom of the second clamping part 172 of wafer box 17 contacts, drives riser 111 through the drive assembly and moves, realizes the motion of clamping jaw mechanism 11, when snatching wafer box 17, and layer board 113 contacts with the bottom of the second clamping part 172 of wafer box 17, and two risers 111 distribute in the both sides of wafer box 17, realize the centre gripping fixed to wafer box 17.

In some embodiments, the width of the gripping section of the riser 111 is small, so that the jaw device can be easily miniaturized, on the basis of which it can further have the advantage of avoiding the action of an assembly on the loader table or of facilitating the installation of components on the loader table that do not interfere with the jaw device.

As shown in fig. 4-7, in some embodiments, each jaw mechanism 11 is provided with a first positioning block and a second positioning block.

The first positioning block is provided with two first guide surfaces, and the included angle between the two first guide surfaces is alpha 1; the second positioning block is provided with two second guide surfaces, and the included angle between the two second guide surfaces is alpha 2; wherein, 0 DEG is more than alpha 1 and less than 180 DEG, 0 DEG is more than alpha 2 and less than 180 deg.

The outer walls of the two opposite sides of the wafer box 17 are respectively provided with a first clamping part 171 and a second clamping part 172, wherein the first clamping part 171 is provided with two first guided surfaces, and the second clamping part is provided with two second guided surfaces 172.

In some embodiments, the first positioning block is a V-shaped positioning block 115, the second positioning block is a U-shaped positioning block 114, the V-shaped positioning block 115 and the U-shaped positioning block 114 are both installed on one side of the vertical plate 111 near the wafer box 17, the U-shaped positioning block 114 includes a straight section and two groups of positioning sections, the two groups of positioning sections are respectively located at two ends of the straight section, and a U-shaped groove is formed between the two positioning sections. The end surfaces of the two groups of positioning sections, which are close, are provided with inclined surfaces, and one inclined surface is correspondingly used as a first guide surface.

The width of the U-shaped positioning block 114 is larger than the width of the V-shaped positioning block 115. Specifically, in some embodiments, the two inclined surfaces of the two positioning sections have a larger distance between one ends of the two inclined surfaces, which are far away from the straight section (the positions correspond to the notches of the U-shaped grooves), and a smaller distance between one ends of the two inclined surfaces, which are close to the straight section, and the positions at the straight section correspond to the bottoms of the U-shaped grooves, so that an opening structure that the bottoms of the grooves are expanded towards the notches is formed.

The V-shaped positioning block 115 has a V-shaped projection protruding from the gripper mechanism 11 toward the wafer cassette, i.e., toward the inside of the gripper mechanism 11. Thus, the two outer side walls of the V-shaped positioning block 115 constitute two second guide surfaces.

The U-shaped positioning block 114 cooperates with the first clamping portion 171 of the wafer cassette 17 to perform a first precision guiding, and the V-shaped positioning block 115 cooperates with the second clamping portion 172 of the wafer cassette 17 to perform a second precision guiding.

In some embodiments, the U-shaped positioning block 114 is provided to roughly guide the clamping jaw mechanism 11, the external dimension of the first clamping portion 171 is identical to the U-shaped positioning block 114, the V-shaped positioning block 115 finely guides the clamping jaw mechanism 11, and the external dimension of the second clamping portion 172 is identical to the V-shaped positioning block 115, so that the clamping jaw mechanism 11 can accurately, stably and effectively grasp the clamped wafer box 17, and safe and efficient production is realized.

In some embodiments, the spacing between the narrowest portions of the two first guiding surfaces is larger than the spacing between the narrowest portions of the two second guiding surfaces, and the first clamping portion 171 and the second clamping portion 172 can be adaptively matched according to the sizes of the first positioning block and the second positioning block, so that the first clamping portion 171 is larger than the second clamping portion 172, so that the first clamping portion 171 on the wafer cassette 17 can easily contact and be guided to the first positioning block during the clamping positioning guiding process, and as the first clamping portion 171 on the wafer cassette 17 is gradually aligned with the clamping jaw mechanism 11, the second clamping portion 172 contacts with the first positioning block and is guided to a more accurate alignment position, so as to ensure that the clamping jaw device reliably clamps the wafer cassette.

The cooperation of the first positioning block and the second positioning block also has the advantages that the clamping jaw device has compact structural characteristics, and the miniaturization of the clamping jaw mechanism 11 is matched, so that avoidance is realized or components which do not interfere with the clamping jaw mechanism 11 are allowed to be more easily installed on the loader table.

In some embodiments, the two second guiding surfaces of the second positioning block are in one-to-one abutting contact with the two second guided surfaces of the second clamping portion, so that when the second clamping portion 172 is in a relatively precise aligned state with the first positioning block, a gap is formed between one first guiding surface of the first clamping portion 171 and one first guided surface of the first positioning block; alternatively, a gap is provided between one of the first guide surfaces of the first clamping portion 171 and one of the first guided surfaces of the first positioning block, and a gap is provided between the other of the first guide surfaces of the first clamping portion 171 and the other of the first guided surfaces of the first positioning block; this facilitates contact and alignment of the second guide surface with the second clamping portion 172 after the first clamping portion 171 contacts the first positioning block, and at the same time, the second positioning block and the second clamping portion 172 can contact each other and be further finely guided by the guiding action of the first positioning block when the clamping jaw is further close to the wafer cassette, so as to achieve alignment.

In some embodiments, the shapes of the first positioning block and the second positioning block are not limited to the U-shaped or V-shaped structures, and the shapes of the first positioning block and the second positioning block can be deformed according to the above guiding alignment, which is not limited in the present utility model.

Further, the first clamping portion 171 is located at a position on the wafer box 17 corresponding to the U-shaped positioning block 114, the second clamping portion 172 is located at a position on the wafer box 17 corresponding to the V-shaped positioning block 115, the first clamping portion 171 is located above the second clamping portion 172, and a V-shaped positioning groove corresponding to the V-shaped positioning block 115 is formed in the second clamping portion 172.

It should be noted that, the U-shaped positioning block 12 protrudes inward relative to the V-shaped positioning block 115, and the V-shaped positioning block 115 and the U-shaped positioning block 114 are designed according to the shape of the wafer box 17, so that the V-shaped positioning block 115 and the U-shaped positioning block 114 respectively cooperate with different protruding portions of the wafer box 17.

As shown in fig. 4 to 7, in some embodiments, the clamping jaw mechanism 11 further includes a fifth sensor, where the fifth sensor is installed on a side of the vertical plate 111 near the wafer box 17, when the clamping jaw mechanism 11 clamps the wafer box 17, the fifth sensor is triggered by an external protruding portion of the wafer box 17, and by providing the fifth sensor on the vertical plate 111, when the clamping jaw mechanism 11 normally clamps the wafer box 17, the fifth sensor is triggered by an external protruding portion of the wafer box 17, and by feedback information of the fifth sensor, a position of the clamping jaw mechanism 11 can be detected, and whether there is feedback of information of a clamped object in the clamping jaw mechanism 11 can also be detected.

As shown in fig. 2, in some embodiments, at least two guide blocks 16 are further disposed at the bottom of the substrate 1, at least two guide blocks 16 are distributed on adjacent or opposite outer sides of the wafer box 17, by disposing the guide blocks 16, when the substrate 1 moves in a direction approaching to the wafer box 17, the guide blocks 16 contact with the outer wall of the wafer box 17, the guide blocks 16 can perform coarse guide on the wafer box 17 before clamping and carrying, and an inclined plane is disposed on one side of the guide blocks 16 close to the wafer box 17, and by disposing an inclined plane at the lower end of the guide blocks 16, it is ensured that the clamping jaw device does not incline when being lowered.

In this embodiment, four guide blocks 16 are provided, and the four guide blocks 16 are reasonably distributed on the clamping jaw assembly substrate 1 according to the size of the wafer cassette 17, and in other embodiments, the number of the guide blocks 16 may be other numbers, and may be set according to practical situations.

As shown in fig. 3, in some embodiments, the movable coupling assembly 15 includes a positioning guide sleeve 153 and a positioning guide rod 151, and the elastic member is a spring 152, where:

one of the positioning guide sleeve 153 and the positioning guide rod 151 is fixed with the base plate, and the other of the positioning guide sleeve 153 and the positioning guide rod 151 is fixed with the mounting plate 13; the positioning guide sleeve 153 is movably sleeved on the outer side of the positioning guide rod 151, and a disengagement preventing structure for preventing the positioning guide rod 151 from disengaging from the positioning guide sleeve is arranged between the positioning guide sleeve 153 and the positioning guide rod 151;

the movable coupling assembly further comprises a fixing plate 154, the fixing plate 154 is mounted on the positioning guide sleeve 153, and the fixing plate 154 is connected with the base plate 1;

the spring 152 is sleeved outside the positioning guide rod 151, wherein when the mounting plate 13 is forced to approach the base plate 1, the spring 152 is forced and elastically deformed.

When the wafer box 17 is grabbed, the positioning block 12 pushes the mounting plate 13 to move towards the direction approaching the substrate 1, the mounting plate 13 drives the positioning guide rod 151 to move towards the inside of the positioning guide sleeve 153, the spring 152 is compressed, and the mounting plate 13 drives the detection rod 14 to move towards the direction approaching the first sensor 6 and the second sensor 7.

In some embodiments, the springs 152 may cushion the motion impact between the locating block 12 and the wafer cassette when they are in contact when they are in close proximity to each other.

In some embodiments, the spring 152 may generate a restoring force between the mounting plate 13 and the base plate 1 after the mounting plate 13 approaches the base plate 1 to help the mounting plate 13 to reset away from the base plate 1, so as to prevent abnormal clamping.

It should be noted that, when the jaw apparatus is not in operation, the positioning block 12 has a downward force due to gravity, and the spring 152 may be in a stretched state along the positioning guide rod 151, or may be in a state of being as long as or being compressed in some embodiments according to the deformation of the coupling relationship of the spring 152.

As shown in fig. 8, an air transporter comprises a car body 700, a travelling device coupled to the top of the car body 700, a transverse transfer device 300 connected to the car body 700, a lifting device 400 connected to the transverse transfer device 300, a wafer cassette clamping jaw device 500 according to any one of the above-mentioned claims, wherein the wafer cassette clamping jaw device 500 is mounted on the lifting device 400, the wafer cassette clamping jaw device 500 can lift relative to the car body 700, the travelling device is matched with a track 101, the track is mounted on a ceiling 100, and a falling protection device 600 is mounted on the lower part of the car body 700 to prevent the wafer cassette from falling.

The same and similar parts of the embodiments in this specification are all mutually referred to, and each embodiment focuses on the differences from the other embodiments. In particular, for the method embodiments described later, since they correspond to the system, the description is relatively simple, and reference should be made to the description of some of the system embodiments.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present application should be covered in the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. The wafer box clamping jaw device is characterized by comprising a substrate and two groups of clamping jaw mechanisms, wherein the two groups of clamping jaw mechanisms can move relative to the substrate, a driving assembly is arranged on the substrate, the driving assembly drives the two groups of clamping jaw mechanisms to be close to or far away from each other, a first sensor and a second sensor are arranged at the top of the substrate along the direction far away from the substrate, a mounting plate is arranged below the substrate, the mounting plate is connected with the substrate through one or more movable connecting assemblies, an elastic piece is arranged between the substrate and the mounting plate, a positioning block is arranged at the bottom of the mounting plate, a detection rod is arranged at the top of the mounting plate, and the detection rod penetrates through the substrate;

wherein:

a distance between the first sensor and the substrate is smaller than a distance between the second sensor and the substrate;

when the clamping jaw device clamps the wafer box, the substrate moves towards the direction close to the wafer box, the positioning block moves towards the direction close to the substrate after contacting with the top of the wafer box, and the positioning block drives the detection rod to move towards the direction close to the first sensor and the second sensor through the mounting plate, so that the detection rod triggers the first sensor and/or the second sensor;

the first sensor generates a signal indicating that the wafer box is clamped normally when triggered;

and when the second sensor is triggered or the first sensor and the second sensor are triggered at the same time, a signal indicating that the wafer box is not clamped normally is generated.

2. The wafer cassette clamping jaw device according to claim 1, wherein the driving assembly comprises a motor, a bidirectional screw rod and two groups of sliding block connecting plates, the motor is mounted on the base plate, the output end of the motor is connected with the bidirectional screw rod to drive the bidirectional screw rod to rotate, the two groups of sliding block connecting plates are respectively connected with two sides of the bidirectional screw rod in a threaded manner, and the two groups of sliding block connecting plates are respectively connected with the two groups of clamping jaw mechanisms;

the driving assembly further comprises a sliding rail and a ball nut seat, one sliding block connecting plate is in threaded connection with the two-way screw rod through one ball nut seat, the sliding rail is arranged on the base plate, and the sliding block connecting plate is in sliding connection with the sliding rail; wherein:

and when the bidirectional screw rod rotates, the two slide block connecting plates are driven to be close to each other or far away from each other.

3. The wafer cassette clamping jaw apparatus of claim 2, further comprising a third sensor, a fourth sensor, and a sensing tab, wherein:

the third sensor and the fourth sensor are both arranged on the base plate, and at least one slide block connecting plate is provided with the detection piece;

the detection sheet triggers the fourth sensor when the clamping jaw device is in an initial state, and triggers the third sensor when the clamping jaw device clamps the wafer box.

4. The wafer cassette clamping jaw apparatus of claim 1, wherein the clamping jaw mechanism comprises a riser, a link plate and a pallet, the link plate being connected to the drive assembly, the link plate and the pallet being mounted on a side of the riser adjacent to the wafer cassette, the riser comprising a clamping section and a connecting section connected to the clamping section, the clamping section having a width that gradually decreases in a direction away from the connecting section, the pallet being in contact with a bottom of the second clamping portion of the wafer cassette when the clamping jaw mechanism clamps the wafer cassette.

5. The wafer cassette clamping jaw apparatus of claim 4, wherein each of the clamping jaw mechanisms is provided with a first positioning block and a second positioning block, wherein:

the first positioning block is provided with two first guide surfaces, and an included angle between the two first guide surfaces is alpha 1; the second positioning block is provided with two second guide surfaces, and an included angle between the two second guide surfaces is alpha 2; wherein, 0 degree is more than alpha 1 and less than 180 degrees, 0 degree is more than alpha 2 and less than 180 degrees;

the wafer box comprises a wafer box body, wherein the wafer box body is provided with a first clamping part and a second clamping part, the outer walls of the two opposite sides of the wafer box body are respectively provided with a first guided surface, and the second clamping part is provided with a second guided surface;

wherein:

the first guided surface of the first clamping part can slide along the first guiding surface of the first positioning block, and the second guided surface of the second clamping part can slide along the second guiding surface of the second positioning block;

the first positioning block and the second positioning block are configured to: when each clamping jaw mechanism moves close to the wafer box, a first guiding surface and a first guided surface are at least partially contacted and relatively slid to realize positioning guiding with first precision; then at least one second guiding surface and at least one second guided surface are at least partially contacted and relatively slid to realize positioning guiding with second precision, so as to allow the two second guiding surfaces to be abutted with the two second guided surfaces one to one.

6. The wafer cassette clamping jaw apparatus of claim 5, wherein the first and second positioning blocks are each mounted to a side of each of the clamping jaw mechanisms proximate to the wafer cassette, the first positioning block being disposed above or below the second positioning block;

the first positioning block is provided with a U-shaped groove, two opposite side walls of the U-shaped groove form two first guide surfaces in a one-to-one mode, and the distance between the two first guide surfaces is gradually increased along the direction from the bottom of the U-shaped groove to the notch of the U-shaped groove;

the second positioning block is a V-shaped protruding block, two opposite side outer walls of the second positioning block form two second guide surfaces in a one-to-one mode, and the distance between the two second guide surfaces is gradually reduced along the direction from one end of the second positioning block, which is connected with the clamping jaw mechanism, to the protruding end of the second positioning block;

wherein:

the narrowest interval between the two first guide surfaces is larger than the narrowest interval between the two second guide surfaces;

when the two second guide surfaces of the second positioning block are in one-to-one abutting contact with the two second guided surfaces of the second clamping part, a gap is formed between at least one first guide surface of the first clamping part and one first guided surface of the first positioning block.

7. The wafer cassette clamping jaw apparatus of claim 5, wherein the clamping jaw mechanism further comprises a fifth sensor mounted to a side of the riser adjacent the wafer cassette, the fifth sensor being triggered by an external protrusion of the wafer cassette when the clamping jaw mechanism clamps the wafer cassette.

8. The wafer cassette clamping jaw apparatus of claim 1, wherein the base plate bottom is further provided with at least two guide blocks, at least two of the guide blocks being distributed on adjacent or opposite outer sides of the wafer cassette, the guide blocks being provided with a bevel on a side thereof adjacent to the wafer cassette.

9. The wafer cassette clamping jaw apparatus of claim 1, wherein the movable coupling assembly comprises a positioning guide sleeve and a positioning guide rod, the resilient member being a spring, wherein:

one of the positioning guide sleeve and the positioning guide rod is fixed with the base plate, and the other of the positioning guide sleeve and the positioning guide rod is fixed with the mounting plate; the positioning guide sleeve is movably sleeved on the outer side of the positioning guide rod, and a disengagement preventing structure for preventing the positioning guide rod from disengaging from the positioning guide sleeve is arranged between the positioning guide sleeve and the positioning guide rod;

the movable coupling assembly further comprises a fixed plate, the fixed plate is arranged on the positioning guide sleeve, and the fixed plate is connected with the base plate;

the spring is sleeved outside the positioning guide rod, wherein when the mounting plate is stressed and then approaches to the base plate, the spring is stressed and elastically deforms.

10. An air transport vehicle comprising a vehicle body, a travelling device coupled to the top of the vehicle body, a transverse transfer device connected to the vehicle body, and a lifting device connected to the transverse transfer device, wherein the air transport vehicle is further provided with a wafer cassette clamping jaw device according to any one of claims 1-9, the wafer cassette clamping jaw device is mounted on the lifting device, and the wafer cassette clamping jaw device is liftable relative to the vehicle body.