CN220556327U - Measuring device and electronic apparatus - Google Patents

Abstract

The application relates to a measuring device and an electronic apparatus. The measuring device comprises a PCB and an inertial measuring unit; the PCB is provided with a plurality of separation grooves which are not communicated with each other, so that an isolation area surrounded by the plurality of separation grooves is formed on the PCB, and the isolation area is positioned in a non-boundary area of the PCB; the inertial measurement unit is arranged in the isolation area to reduce stress of the inertial measurement unit in the working process of the measurement device. Based on the measuring device, the problem that the sensing precision is reduced due to the fact that an inertial measuring unit is stressed can be avoided.

Description

Measuring device and electronic apparatus

Technical Field

The application relates to the technical field of circuit board layout, in particular to a measuring device and electronic equipment.

Background

Currently, inertial Measurement Units (IMUs) are provided in devices such as drones to sense changes in attitude, acceleration, altitude, etc. of the device through the IMU.

In the related art, the IMU is generally fixed on a PCB board in the device by a fixing component such as a screw. However, such a fixation may cause the IMU to be mechanically stressed when the device is moved, thereby degrading the accuracy of the IMU's perception of data.

Disclosure of Invention

Accordingly, it is necessary to provide a measuring device and an electronic apparatus for solving the problem that the inertial measurement unit is stressed and the perceived accuracy is lowered.

In a first aspect, the present application provides a measurement device. The measuring device comprises a PCB and an inertial measuring unit;

the PCB is provided with a plurality of separation grooves which are not communicated with each other, so that an isolation area surrounded by the plurality of separation grooves is formed on the PCB, and the isolation area is positioned in a non-boundary area of the PCB;

the inertial measurement unit is arranged in the isolation area to reduce stress of the inertial measurement unit in the working process of the measurement device.

In one embodiment, the plurality of spacing grooves includes a first spacing groove and a second spacing groove having an L shape, and the first spacing groove and the second spacing groove are opened oppositely.

In one embodiment, the plurality of spacing grooves comprise a first groove and a second groove which are symmetrically arranged, and notches of the first groove and the second groove are opposite.

In one embodiment, the main board region of the PCB board is connected to the isolation region by connection regions located on opposite sides of the isolation region.

In one embodiment, the connection region comprises a flexible circuit board or a coaxial line.

In one embodiment, the isolation region is further provided with a GPS component and/or an antenna component.

In one embodiment, the antenna assembly is an antenna having a weight greater than a predetermined weight threshold.

In one embodiment, the PCB is prepared by PCB jointed boards, and jointed board connection positions of the PCB during jointed board preparation are arranged at target edges of the PCB; the target edge is the other edges of the four edges of the PCB except the first edge with the smallest distance from the isolation area.

In a second aspect, the present application also provides an electronic device comprising a measuring apparatus as described in any one of the first aspects above.

In one embodiment, the electronic device is a drone, a robot, a motion camera, or a cradle head.

In the measuring device and the electronic equipment, the measuring device comprises a PCB and an inertial measuring unit; the PCB is provided with a plurality of separation grooves which are not communicated with each other, so that an isolation area surrounded by the plurality of separation grooves is formed on the PCB, and the isolation area is positioned in a non-boundary area of the PCB; the inertial measurement unit is arranged in the isolation area. In this way, the isolation region is separated from other regions of the PCB by a plurality of spacing grooves to form islands. The inertial measurement unit is arranged in the isolation area, and because of the spacing groove, when the measurement device works, the stress generated by other components on the PCB borne by the inertial measurement unit is greatly reduced. In addition, as a plurality of spacing grooves exist and are not communicated with each other, a plurality of connecting parts are arranged between the isolation areas and other areas of the PCB, and the isolation areas are positioned in non-boundary areas of the PCB, the balance of the inertial measurement unit in the working process of the measuring device can be greatly improved, and the inertial measurement unit cannot shake due to vibration of the PCB and the like. By combining, the influence of all factors on the inertial measurement unit can be greatly reduced, so that the perception precision of the inertial measurement unit is effectively ensured.

Drawings

In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings required for the descriptions of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

FIG. 1 is a schematic diagram of a measuring device according to an embodiment;

FIG. 2 is a schematic diagram of a non-boundary region in one embodiment;

FIG. 3 is a schematic diagram of a method for forming a partition in an embodiment;

FIG. 4 is a schematic diagram of another embodiment of a method for forming a partition;

FIG. 5 is a schematic view of a PCB area in one embodiment;

fig. 6 is a schematic view of a PCB area in another embodiment;

FIG. 7 is a schematic view of a measuring device according to another embodiment;

FIG. 8 is a schematic view of a measuring device according to another embodiment;

FIG. 9 is a schematic diagram of a PCB panel design in one embodiment;

FIG. 10 is a schematic diagram of simulated stress analysis of an island of a PCB in one embodiment;

FIG. 11 is a schematic diagram of simulated stress analysis of an island of a PCB in another embodiment;

FIG. 12 is a performance test result of an inertial measurement unit in one embodiment;

FIG. 13 is a performance test result of an inertial measurement unit in another embodiment.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

An inertial measurement unit (Inertial measurement unit, abbreviated as IMU) is a device for measuring three-axis attitude angles (or angular rates) and accelerations of an object. Gyroscopes and accelerometers are core functions of inertial measurement units, some of which may also contain magnetometer functions. Taking an IMU in an unmanned aerial vehicle as an example, the IMU is generally located at a core position of the unmanned aerial vehicle, and is used for sensing changes of data such as an attitude, an acceleration, a height and the like of the unmanned aerial vehicle. Therefore, the unmanned aerial vehicle IMU performance is determined by the zero Bias (Bias) and scale factor (Scale Factor Error) consistency of the unmanned aerial vehicle IMU at rest.

Unlike conventional IC products in similar packages, the IMU contains movable micromechanical structures, which may be stressed as the drone moves, resulting in reduced accuracy in its detection of data.

In view of the foregoing, embodiments of the present application provide a measurement device to solve the above-mentioned problems.

Referring to fig. 1, a schematic structural diagram of a measurement device according to an embodiment of the present application is shown. The measuring device 100 comprises a PCB board 101 and an inertial measurement unit 102.

The PCB is provided with a plurality of spacing grooves 101a which are not communicated with each other, so that an isolation area 101b formed by surrounding the plurality of spacing grooves 101a is formed on the PCB, and the isolation area 101b is positioned in a non-boundary area of the PCB; the inertial measurement unit 102 is disposed in the isolation region 101b to reduce stress on the inertial measurement unit 102 during operation of the measurement device 100.

PCB, an abbreviation of Printed Circuit Board, called printed circuit board, is also called printed circuit board, is an important electronic component, is a support for electronic components, is a carrier for electronic components to be electrically connected to each other, and generally each component in electronic equipment can be printed on PCB board 101 to work.

For an electronic device including an IMU, such as an unmanned plane, a robot, a motion camera, or a cradle head, which is not fully illustrated herein, the IMU may be disposed on the PCB board 101. Accordingly, the measuring apparatus 100 provided in the embodiments of the present application may be included in these electronic devices.

Alternatively, the number of the open space grooves 101a may be two as shown in fig. 1.

Wherein the isolation region 101b is located in a non-boundary region of the PCB board 101. The non-boundary region refers to a region on the PCB board 101 that does not include the center point of the PCB board 101 and the edge of the PCB board 101, in other words, can be understood as a region abutting the edge of the PCB board 101. This is exemplified below.

Referring to fig. 2, the non-boundary region is surrounded by two spacing grooves 101a, in other words, the non-boundary region includes an inner region surrounded by the outer edges of each spacing groove 101 a. Specifically, the distance between the non-boundary region and the first edge J1 of the PCB 101 is a first spacing distance L1; the distance between the non-boundary region and the second edge J2 of the PCB 101 is a second spacing distance L2; the distance between the non-boundary region and the third edge J3 of the PCB board 101 is a third separation distance L3; the distance between the non-boundary region and one boundary Z1 of the central region of the PCB board 101 is a fourth separation distance L4, or the distance between the non-boundary region and the central point Y of the PCB board 101 is a fifth separation distance L5.

It will be appreciated that the values of the spacing distances L1 to L5 are different, and the positions of the non-boundary regions formed on the PCB board 101 are different, however, L1 may be smaller than a predetermined distance threshold, which may be set to a smaller value, so that the non-boundary regions are close to the edge of the PCB board 101.

The values of L1 to L5 are not particularly limited, and may be determined according to actual requirements.

It will be appreciated that the non-boundary area shown in fig. 2 is relatively close to the first edge J1, and in fact, the non-boundary area may be disposed close to other edges of the PCB board 101, which is not fully illustrated herein, and falls within the scope of the embodiments of the present application.

Based on this, when the inertial measurement unit 102 is disposed within the isolation region 101b, the inertial measurement unit 102 is located within the "island" due to the presence of the spacer grooves 101 a. In other words, the "islands" are disposed inside the PCB board 101 and are stressed at multiple points. On the one hand, the stress to which the inertial measurement unit 102 is subjected can be reduced; on the other hand, when the measuring device 100 works, if the PCB 101 vibrates, the multipoint stress can keep the balance of the inertial measurement unit 102, so as to avoid the occurrence of larger amplitude and dependent vibration and even whip, and ensure the measurement stability of the IMU.

The measuring device 100 includes a PCB 101 and an inertial measurement unit 102; the PCB 101 is provided with a plurality of spacing grooves 101a which are not communicated with each other, so that an isolation area 101b surrounded by the plurality of spacing grooves 101a is formed on the PCB 101, and the isolation area 101b is positioned in a non-boundary area of the PCB 101; wherein the inertial measurement unit 102 is disposed within the isolation region 101 b. In this way, the isolation region 101b is separated from other regions of the PCB board 101 by the plurality of spacer grooves 101a, and an island is formed. The inertial measurement unit 102 is disposed in the isolation region 101b, and the stress generated by other components on the PCB board 101, which the inertial measurement unit 102 is subjected to when the measurement device 100 is in operation, is greatly reduced due to the presence of the spacer grooves 101 a. In addition, since the plurality of spacing grooves 101a exist, and the spacing grooves 101a are not communicated with each other, a plurality of connection parts are formed between the isolation areas 101b and other areas of the PCB board 101, and in addition, the isolation areas 101b are located in non-boundary areas of the PCB board 101, so that the balance of the inertial measurement unit 102 in the working process of the measuring device 100 can be greatly improved, and the inertial measurement unit 102 cannot shake due to vibration of the PCB board 101. In combination, the influence of various factors on the inertial measurement unit 102 can be greatly reduced, thereby effectively ensuring the perceived accuracy of the inertial measurement unit 102.

The design of the spacer groove 101a will be described below. The following two ways of opening the spacer grooves 101a are provided in the embodiment of the present application, and it is understood that on this basis, the spacer grooves 101a may be provided in other similar shapes, so that the desired effect may be achieved.

In an alternative embodiment, the plurality of spacers 101a includes a first spacer 101a1 and a second spacer 101a2 having an L shape, and the first spacer 101a1 and the second spacer 101a2 are oppositely opened.

Please refer to the schematic diagram of the opening mode of the spacing groove shown in fig. 3. Here, the first spacer 101a1 is exemplified as the first spacer 101a1, and thus, the first spacer 101a1 may be considered to be formed of two parts, the first part may have a first length C1 and the second part may have a second length C2. It is to be understood that the specific values of C1 and C2 may be determined according to actual needs, and are not specifically limited herein, and the first spacer groove 101a1 may be made to have an L shape.

Similarly, for the second spacing groove 101a2, the length of the first portion may be the third length C3 and the length of the fourth portion may be the fourth length C4. The specific values of C3 and C4 may be determined according to actual requirements, and the second spacer groove 101a2 may be made to have an L shape.

Alternatively, the widths of the first spacer grooves 101a1 and the second spacer grooves 101a2 may be determined according to requirements, and the stress applied to the IMU may be reduced.

In addition, the first and second spacers 101a1 and 101a2 are opened relatively, that is, as shown in fig. 3, the first portions of the first and second spacers 101a1 and 101a2 are opened relatively, and the second portions of the first and second spacers 101a1 and 101a2 are opened relatively.

It should be noted that, the distance between the first spacer groove 101a1 and the second spacer groove 101a2 may be determined according to the requirement, for example, may be determined according to the size of the inertial measurement unit 102, so that the enclosed isolation region 101b may be sufficient to provide the inertial measurement unit 102.

In another alternative embodiment, the plurality of spaced grooves includes a first groove 101a3 and a second groove 101a4 symmetrically opened, and the notches of the first groove 101a3 and the second groove 101a4 are opposite.

Please refer to the schematic diagram of the opening mode of the spacer slot shown in fig. 4. Among them, the first groove 101a3 and the second groove 101a4 can be considered to be constituted of three parts, respectively. Specifically, the length of the first portion of the first groove 101a3 may be a first groove length m1, the length of the second portion of the first groove 101a3 may be a second groove length m2, and the length of the third portion of the first groove 101a3 may be a third groove length m3. Alternatively, m1 may be equal to m3.

The length of the first portion of the second groove 101a4 may be a fourth groove length m4, the length of the second portion of the second groove 101a4 may be a fifth groove length m5, and the length of the third portion of the second groove 101a4 may be a sixth groove length m6. Alternatively, m4 may be equal to m6.

Alternatively, the specific values of m1 to m6 may be determined according to actual needs, and are not limited herein, and the first groove 101a3 and the second groove 101a4 may be formed with the recesses thereof opposite to each other as shown in fig. 4.

Alternatively, the widths of the portions of the first groove 101a3 and the second groove 101a4 may be determined according to requirements, so that the stress applied to the IMU may be reduced.

It should be noted that, the distance between the first groove 101a3 and the second groove 101a4 may be determined according to the requirement, for example, may be determined according to the size of the inertial measurement unit 102, so that the enclosed isolation area 101b may be sufficient to provide the inertial measurement unit 102.

In this embodiment, first, the isolation area 101b is located in a non-boundary area of the PCB board 101, which is close to the edge of the PCB board 101, so that stress transferred from other areas of the PCB board 101 to the isolation area 101b and finally reaching the inertial measurement unit 102 can be reduced, so that the influence of the stress on the inertial measurement unit 102 is smaller, thereby reducing noise and zero offset, so as to ensure that the inertial measurement unit 102 perceives data with better performance, and improve the control accuracy of the inertial measurement device 100. On the basis, the isolation area 101b is separated from the edge of the PCB 101 through the separation groove 101a, so that when the PCB 101 vibrates, the inertia measurement unit 102 is not greatly influenced by edge shaking, the stability and balance of the inertia measurement unit 102 are maintained, and the perception precision of the inertia measurement unit 102 is further ensured. In addition, various opening modes of the spacing groove 101a are provided in the application, so that the design of the PCB 101 is more flexible.

In one embodiment, the main board region 101c of the PCB board 101 is connected to the isolation region 101b through connection regions 101d located at opposite sides of the isolation region 101 b.

Please refer to fig. 5, which illustrates a schematic diagram of a PCB board area provided in an embodiment of the present application. In fig. 5, the spacer groove 101a includes a first spacer groove 101a1 and a second spacer groove 101a2 as an example.

Please refer to fig. 6, which illustrates another schematic diagram of a PCB board area provided in an embodiment of the present application. In fig. 6, the first groove 101a3 and the second groove 101a4 are included in the spacer groove 101 a.

It is to be understood that, in addition to the case where two connection regions 101d are located on the left and right opposite sides of the isolation region 101b as shown in the drawings, when a plurality of spacer grooves 101a are defined as the isolation region 101b in other directions, each connection region 101d may be located in other opposite directions, for example, two connection regions 101d are located on the upper and lower opposite sides of the isolation region 101 b.

In this embodiment, the isolation region 101b is connected with the main board region 101c through the connection region 101d, where, because the two connection regions 101d are located at two opposite sides of the isolation region 101b, the inertial measurement unit 102 located in the isolation region 101b is stable enough, and larger shake is avoided, so that the sensing accuracy of the inertial measurement unit 102 is ensured, and measurement abnormality is avoided.

Alternatively, the connection region 101d may include a flexible wiring board or a coaxial line. In other words, the components disposed in the isolation region 101b may be connected to the main board region 101c through a flexible circuit board (FPC, flexible Printed Circuit board), or may be connected to the main board region 101c through a coaxial line.

Alternatively, the main board region 101c of the PCB board 101 may be provided with a CPU (central processing unit ) of the electronic device, and thus the inertial measurement unit 102 in the isolation region 101b may be connected to the CPU of the main board region 101c through a flexible wiring board or a coaxial line of the connection region 101 d. In this way, the CPU may directly acquire the data sensed by the inertial measurement unit 102, and further store, process, or send the sensed data, for example, the data sensed by the inertial measurement unit 102 acquired by the CPU may be copied to a computer for performing a simulation test or the like.

In one embodiment, as shown in fig. 7, a schematic structural diagram of another measurement device provided in an embodiment of the present application is shown, and as shown in fig. 8, a schematic structural diagram of another measurement device provided in an embodiment of the present application is shown. If the electronic device further includes other components such as the GPS103 and/or the antenna 104, the isolation area 101b may further include the GPS component 103 and/or the antenna component 104. The electronic device including the GPS component 103 and the antenna component 104 is exemplified in fig. 7 and 8, except that the shape of the spacing groove 101a is different.

Alternatively, as shown in FIG. 7, the GPS assembly 103 and antenna assembly 104 may be disposed on either side of the inertial measurement unit 102.

Alternatively, the setting positions of the inertial measurement unit 102, the GPS component 103 and the antenna component 104 in the isolation area 101b may be determined according to the weights of the three, so that the weight distribution of the isolation area 101b may be balanced as much as possible.

Alternatively, the setting positions of the inertial measurement unit 102, the GPS component 103 and the antenna component 104 in the isolation area 101b may be determined according to the volumes of the three components, so that the volume distribution of the isolation area 101b may be balanced as much as possible.

In one embodiment, antenna assembly 104 is an antenna having a weight greater than a preset weight threshold.

Wherein, a plurality of antennas can be included in the electronic device, and the weight of each antenna can be different. Alternatively, the antenna assembly 104 disposed in the isolation region 101b may include all antennas in the electronic device, or the antenna assembly 104 may include an antenna having a weight greater than a predetermined weight threshold among the plurality of antennas disposed in the isolation region 101b, and the other antennas may be disposed in the main board region 101c.

In this embodiment, because the area of the main board area 101c is relatively larger, the set components are also more, and the antenna with the weight greater than the preset weight threshold is integrated in the isolation area 101b to configure the weight of the isolation area 101b and the main board area 101c to be balanced as much as possible, so when the measuring device 100 works, even if the PCB board 101 vibrates, the whole PCB board 101 reaches weight balance, and the inertia measuring unit 102 is in an island, so that the inertia measuring unit 102 can be prevented from vibrating or swinging to a greater extent, and the sensing precision of the inertia measuring unit 102 is ensured.

In one embodiment, the PCB 101 is prepared by PCB splicing, and the splicing connection position of the PCB 101 when the splicing is prepared is set at the target edge of the PCB 101; the target edge is the other edge than the first edge having the smallest distance from the isolation region 101b among the four edges of the PCB board 101.

Before the printed circuit board 101 leaves the factory, a plurality of printed circuit boards 101 can be spliced to form a large printed circuit board shape, and then the large printed circuit board is split after leaving the factory to obtain each printed circuit board 101.

In the panel design, each PCB 101 is jointed by the connecting position,

wherein, the connection position of the PCB board 101 should not be located around the inertial measurement unit 102. Specifically, the board connection position of the PCB board 101 at the board preparation is set on the other edges of the PCB board 101 except the first edge having the smallest distance from the isolation region 101 b. For example, referring to fig. 2, the target edge is other edges than the first edge J1 of the PCB board 101.

For example, please refer to fig. 9, which illustrates a schematic design of a PCB panel according to an embodiment of the present application. It should be noted that, in fig. 9, the spacer groove 101a includes the first spacer groove 101a1 and the second spacer groove 101a2 as an example, and the spacer groove 101a includes the first groove 101a3 and the second groove 101a4, which are similar to each other in terms of the arrangement of the board connecting positions of the PCB boards.

In the embodiment of the present application, the connection position is not disposed near the edge of the isolation region 101b, thereby ensuring that the stress to which the inertial measurement unit 102 is subjected is reduced as much as possible when the board is split.

In one embodiment, the PCB 101 is fabricated by PCB singulation. In the case of PCB board separation, a milling cutter or laser cutting is used to separate the boards, so as to minimize the influence of stress, vibration, etc. on the inertial measurement unit 102 during board separation.

In order to make the effect of the measuring device provided by the embodiment of the application clearer, simulation test results of two PCB designs are given below.

Please refer to fig. 10, which illustrates a schematic diagram of simulation stress analysis of a PCB board island according to an embodiment of the present disclosure; please refer to fig. 11, which illustrates another schematic diagram of simulation stress analysis of island of a PCB board according to an embodiment of the present application. In fig. 10, a first groove 101a1 and a second groove 101a2 are formed, and in fig. 11, a first groove 101a3 and a second groove 101a4 are formed.

In addition, please refer to fig. 12, which shows the performance test result of the inertial measurement unit in the PCB board when the first and second spacing grooves 101a1 and 101a2 are opened. Referring to fig. 13, the performance test result of the inertial measurement unit in the PCB board when the first groove 101a3 and the second groove 101a4 are opened is shown. As can be seen from comparing the results of fig. 12 and fig. 13, in both schemes, the test data of the inertial measurement unit is not disturbed in a plurality of frequency bands, and the sensing accuracy can be ensured.

In addition, based on the measuring device, whether the data sensed by the inertial measurement unit is correct or not can be rapidly confirmed, so that the testing efficiency of the inertial measurement unit can be improved.

In an embodiment, there is also provided an electronic device comprising a measuring apparatus as in any of the embodiments above.

In one embodiment, the electronic device is an unmanned aerial vehicle, a robot, a motion camera, or a cradle head.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims (10)

1. The measuring device is characterized by comprising a PCB and an inertial measuring unit;

the PCB is provided with a plurality of separation grooves which are not communicated with each other, so that an isolation area surrounded by the plurality of separation grooves is formed on the PCB, and the isolation area is positioned in a non-boundary area of the PCB;

the inertial measurement unit is arranged in the isolation area so as to reduce stress borne by the inertial measurement unit in the working process of the measurement device.

2. The device of claim 1, wherein the plurality of spacer grooves comprises first and second spacer grooves having an L-shape, and the first and second spacer grooves are oppositely open.

3. The device of claim 1, wherein the plurality of spaced apart slots comprise first and second symmetrically formed slots, and wherein the first and second slots are opposite in notch.

4. The device of claim 1, wherein the motherboard region of the PCB board is connected to the isolation region by connection regions on opposite sides of the isolation region.

5. The device of claim 4, wherein the connection region comprises a flexible circuit board or a coaxial line.

6. The apparatus of claim 1, wherein the isolation region further has a GPS component and/or an antenna component disposed thereon.

7. The apparatus of claim 6, wherein the antenna assembly is an antenna having a weight greater than a preset weight threshold.

8. The apparatus according to any one of claims 1 to 7, wherein the PCB board is prepared by splicing a PCB board, and a board connecting position of the PCB board during board preparation is set at a target edge of the PCB board; the target edge is other edges except the first edge with the smallest distance from the isolation area in the four edges of the PCB.

9. An electronic device, characterized in that it comprises a measuring device according to any one of claims 1 to 8.

10. The electronic device of claim 9, wherein the electronic device is an unmanned aerial vehicle, a robot, a motion camera, or a cradle head.