CN220474628U - Wide-spacing packaging imaging module and image sensor - Google Patents

Abstract

The application provides a wide-space packaging imaging module and an image sensor, wherein the wide-space packaging imaging module comprises two chip arrays which are arranged at intervals along a second direction; the chip array comprises a plurality of imaging chips distributed along a first direction, and the positions of the imaging chips in different chip arrays along the first direction are staggered with each other, wherein the first direction is perpendicular to a second direction; each imaging chip comprises a photosensitive element array and at least one bonding pad array which are respectively distributed along a first direction, and the photosensitive element array and the bonding pad array which are respectively included in each imaging chip are arranged at intervals along a second direction; the imaging chips included in the two chip arrays have a pitch of each photosensitive element array along the second direction larger than a minimum package size of a bonding pad array of any one imaging chip along the second direction. According to the technical scheme, the two rows of imaging chips can output data according to the same sequence, and data inversion processing is not needed for one row.

Description

Wide-spacing packaging imaging module and image sensor

Technical Field

The application belongs to the technical field of image acquisition and imaging, and particularly provides a wide-space packaging imaging module and an image sensor.

Background

In order to realize seamless scanning of full coverage of an object or an image, an imaging module of the conventional contact image sensor can adopt a mode that two arrays of chips are arranged in a staggered manner when the imaging module is packaged, but because a self-focusing lens is used, the imaging range is smaller, the limited space is smaller, photosensitive elements in the two arrays of chips need to be arranged compactly, and in order to shorten the distance between the photosensitive elements in the two arrays of chips, the respective photosensitive elements and bonding PADs (PADs) of the two arrays of chips adopt a mode of oppositely arranging and packaging, so that the packaging mode not only limits the diversified configuration of the chips, but also always has one array of chips in the two arrays of chips, the array order of the chips is opposite to the serial output order of the photosensitive chips in each chip, and the output order of the chips needs to be reversed one by one.

Currently, there is a seamless scanning image sensor that uses two rows of optical magnifying lenses instead of a self-focusing lens to magnify an object and fully cover the object, and according to the optical path calculation of the two rows of magnifying lenses, the distance between the two rows of chips is larger at the imaging position of the chip, and there is sufficient space, at this time, the photosensitive element array and the pad array of the chip have larger adjustment space, and the packaging form is greatly relieved due to the restriction of the size, so that the signal does not need to be inverted according to the configuration of the pixels of the two rows of chips in the same direction at the same time.

Disclosure of Invention

An object of the present utility model is to solve the above-mentioned problems in the prior art, and to provide a wide-pitch package imaging module and an image sensor using the same.

A first aspect of the present application provides a wide-pitch package imaging module, including two chip arrays spaced apart along a second direction;

the chip array comprises a plurality of imaging chips distributed along a first direction, and the positions of the imaging chips in different chip arrays along the first direction are staggered with each other, wherein the first direction is perpendicular to a second direction;

each imaging chip comprises a photosensitive element array and at least one bonding pad array which are respectively distributed along a first direction, and the photosensitive element array and the bonding pad array which are respectively included in each imaging chip are arranged at intervals along a second direction;

the imaging chips included in the two chip arrays have a pitch of each photosensitive element array along the second direction larger than a minimum package size of a bonding pad array of any one imaging chip along the second direction.

Further, the pitch is 11.2mm or more.

Alternatively, the number of pad arrays of each imaging chip is 1, and the pad arrays of each imaging chip are located on the same side of the photosensitive element array thereof along the second direction.

Alternatively, the number of pad arrays of each imaging chip is 2, and the pad arrays of each imaging chip are located on both sides of the photosensitive element array thereof along the second direction.

Further, at least one pad array of the imaging chip included in at least one chip array is located between the photosensitive element arrays of the imaging chips included in each of the two chip arrays along the second direction.

Further, the pad array includes a plurality of pads, each of which is electrically connected with at least one photosensitive element in the photosensitive element array of the imaging chip in which it is located.

Preferably, the data output sequence of each imaging chip in the chip array is opposite to the electric signal output sequence of the photosensitive element array in each imaging chip contained therein.

The second aspect of the present application provides an image sensor, including aforesaid wide-pitch package imaging module and lens module, the lens module include with two magnifying lens arrays that two chip arrays set up in one-to-one correspondence, wide-pitch package imaging module is located on the image plane of magnifying lens array.

Preferably, the included angle of the optical axes of the two magnifying lens arrays is between 8 ° and 12 °.

Preferably, the image sensor further comprises a frame body fixedly accommodating the lens module and the wide-pitch package imaging module;

the object plane of the magnifying lens array is positioned outside the frame body;

the frame body is provided with an opening for enabling light rays on the object plane to enter the magnifying lens array.

According to the wide-space packaging imaging module provided by the embodiment of the application, according to the amplification imaging principle of the two rows of optical amplifying lenses and the characteristics of the light path propagation path, the distance between the two rows of chips is increased at the imaging position of the chips, and a sufficient space is provided, so that the pad array can be arranged between the photosensitive element arrays of the two rows of chips, and meanwhile, the pixels of the two rows of chips are configured in the same direction, so that signals do not need to be subjected to inversion processing, the processing steps of subsequent image splicing are simplified, and the data calculation amount is effectively reduced.

Drawings

FIG. 1 is a side cross-sectional view of a prior art image sensor;

FIG. 2 is a top view of the chip array of FIG. 1;

FIG. 3 is a side cross-sectional view of an image sensor provided in accordance with some embodiments of the present application;

FIG. 4 is a structural top view of a wide-pitch packaged imaging module provided in accordance with some embodiments of the present application;

FIG. 5 is a structural top view of a wide-pitch packaged imaging module provided in accordance with some embodiments of the present application;

fig. 6 is a structural top view of a wide-pitch packaged imaging module provided in accordance with some embodiments of the present application.

Reference numerals in the figures

1: first chip array, 10, first magnifying lens array, 11: first photosensitive element array, 12: first pad array, 13: first imaging chip, 2: second chip array, 20: second magnifier lens array, 21: second photosensitive element array, 22: second pad array, 23: second imaging chip, 30: self-focusing lens, 31 cylindrical pupil, 7: object plane, 8, 9: chip array, 81, 91: photosensitive element array, 82, 92: pad array, 83, 93: and (5) an imaging chip.

Detailed Description

Hereinafter, the present application will be further described with reference to the drawings based on preferred embodiments, and various components on the drawings are enlarged or reduced for easy understanding, but this is not intended to limit the scope of the present application.

In the description of the embodiments of the present application, it should be noted that, if the terms "upper," "lower," "inner," "outer," and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or an azimuth or a positional relationship that a product of the embodiments of the present application conventionally puts in use, it is merely for convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present application. Furthermore, in the description of the present application, the terms first, second, etc. are used herein for distinguishing between different elements, but not necessarily for describing a sequential or chronological order of manufacture, and may not be construed to indicate or imply a relative importance, and their names may be different in the detailed description of the present application and the claims.

The terminology used in this description is for the purpose of describing the embodiments of the present application and is not intended to be limiting of the present application. It should also be noted that unless explicitly stated or limited otherwise, the terms "disposed," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the two components can be connected mechanically, directly or indirectly through an intermediate medium, and can be communicated internally. The specific meaning of the terms in this application will be specifically understood by those skilled in the art.

Fig. 1 is a side sectional view of a conventional image sensor, the sectional line of which is in the Y-axis direction, and fig. 2 is a plan view of the chip arrays 8, 9 in fig. 1. As shown in fig. 1 and 2, the image sensor includes a self-focusing lens 30 and two chip arrays 8 and 9 extending in the X-axis direction, which is generally referred to as a main scanning direction and a Y-axis direction is generally referred to as a sub-scanning direction in the field of image scanning technology.

Specifically, two rows of columnar light holes 31 are arranged on the self-focusing lens 30, the material of the self-focusing lens is light-transmitting materials such as glass and acrylic, and the light emitted from the object surface 7 can be imaged on the chip arrays 8 and 9, wherein the chip array 8 comprises a plurality of imaging chips 83, the surface of each imaging chip 83 is provided with a photosensitive element array 81 extending along the X axis and a bonding pad array 82 extending in parallel with the photosensitive element array, the photosensitive element array 81 comprises a plurality of photosensitive elements for receiving light signals so as to convert photoelectric signals in the chip, and the bonding pad array 82 comprises a plurality of bonding pads, and each bonding pad is respectively electrically connected with one or a plurality of photosensitive elements; the pad is an interface of VDD, GND, input/output signals, etc., and an internal circuit of the chip is connected to an external circuit, thereby realizing an input/output function.

The imaging chips 83 may be disposed on a circuit board made of a PCB or the like, and metal wires (i.e., signal pins) led out through the pads are connected to corresponding circuits on the PCB.

Similarly, in the chip array 9, each imaging chip 93 is provided with the photosensitive element array 91 and the pad array 92 in the same manner. The working principle and working mode of the above photosensitive chip are known to those skilled in the art, and are not described herein.

In the case of imaging using the self-focusing lens 30, the imaging range of the chip arrays 8, 9 is small, and as shown in fig. 1, the diameter of the two rows of columnar photo holes 31 is phi 0.6mm, and the size of a single imaging chip is 18.29mm long and 0.3mm wide, since it is necessary to arrange the photosensitive elements as close as possible to or near the optical axis in order to ensure the sharpness of the resulting image, that is, each of the photosensitive element arrays 81 in the chip array 8 and each of the photosensitive element arrays 91 in the chip array 9 needs to be compactly arranged in the Y-axis direction, and at this time, each of the two chip arrays can only adopt an opposed arrangement of the photosensitive element arrays and the pad arrays to draw the distance between the photosensitive elements in the two chip arrays. The imaging module obtained by the packaging mode can also cause the problem that signals output by two chip arrays are reversely output.

Taking fig. 2 as an example, in the drawing, each imaging chip of the chip array 8 sequentially outputs signals acquired by its photosensitive element array in the order of the positive direction of the X-axis, and for each imaging chip, each photosensitive element of its photosensitive element array 81 serially outputs electric signals acquired by scanning in the direction indicated by the arrow of the dotted line below it, that is, in the chip array, the output order of each imaging chip and the output order of the photosensitive element array 81 inside the imaging chip are the same; in contrast, in the chip array 9, since the photosensitive element arrays in the respective imaging chips serially output the scanned electric signals in the directions of the dotted arrows below the chip array 9, the output order of the respective imaging chips is opposite to the output order of the photosensitive element arrays 91 inside the imaging chips, and therefore, in the subsequent image stitching process, it is necessary to perform the order reversal process on the electric signals output from the respective chips of the chip array 9, respectively.

Fig. 3 illustrates a side cross-sectional view of an image sensor provided according to some embodiments of the present application, as illustrated in fig. 3, which includes a lens module composed of a first magnifier lens array 10 and a second magnifier lens array 20, wherein the first magnifier lens array 10 and the second magnifier lens array 20 are disposed at intervals along a Y-axis direction, each lens array includes a plurality of magnifier lenses disposed at intervals along an X-axis direction (perpendicular to a paper surface direction in the drawing), and the plurality of magnifier lenses included in the first magnifier lens array 10 and the plurality of magnifier lenses included in the second magnifier lens array 20 are arranged alternately along the X-axis direction.

In some preferred embodiments, the individual magnifier lenses have the same dimensions and optical parameters to facilitate mass production, wherein the lens may be circular in shape, etc. Preferably, the magnifying lens may be manufactured in an elongated shape in order to achieve miniaturization of the product structure.

Further, the optical axes of the amplifying lenses of the first amplifying lens array 10 are parallel to each other, the optical axes of the amplifying lenses of the second amplifying lens array are parallel to each other, and the optical axes of the two amplifying lens arrays intersect at the object plane 7 at an included angle θ, preferably, the angle θ is between 8 ° and 12 °, and after the light emitted from the image on the object plane 7 passes through the amplifying lenses according to the calculation of the optical path of the amplifying lenses, the light is amplified and imaged on the image plane of each amplifying lens, and by arranging the corresponding imaging chip on the image plane, the light signal can be received by the photosensitive element thereof and converted into an electrical signal to be serially output, thereby realizing the effect of scanning the high-resolution object plane by the chip with low resolution.

For the above-mentioned enlarged imaging characteristics and optical axis angle characteristics of the lens module, as shown in fig. 3, in some preferred embodiments of the present application, the imaging module employs a wide-pitch package imaging module, fig. 4 further shows, in some embodiments, a structural top view of the wide-pitch package imaging module, as shown in fig. 3 and 4, the wide-pitch package imaging module is disposed on an image plane of the lens module, and includes a first chip array 1 and a second chip array 2 disposed at intervals along a Y-axis direction, where the first chip array 1 includes a plurality of first imaging chips 13 distributed along the X-axis direction, the second chip array 2 includes a plurality of second imaging chips 23 distributed along the X-axis direction, and positions of the respective first imaging chips 13 and second imaging chips 23 along the X-axis direction are staggered with each other.

Further, in the embodiment shown in fig. 3 and fig. 4, the upper surface of each first imaging chip 13 is provided with a first photosensitive element array 11 that is distributed at intervals along the X-axis direction, and a first pad array 12 that is also distributed at intervals along the X-axis direction, as described above, each first imaging chip 13 may be disposed on a circuit board made of PCB material, and signal pins are led out through each pad of the first pad array 12 to form a signal line and connected to a corresponding circuit on the circuit board; similarly, the upper surface of each second imaging chip 23 is provided with second photosensitive element arrays 21 spaced apart in the X-axis direction, and one second pad array 22 also spaced apart in the X-axis direction.

In some preferred embodiments, each first imaging chip 13 and each second imaging chip 23 have the same dimensions and specifications for ease of mass production, i.e., the first imaging chip 13 and the second imaging chip 23 are identical imaging chips.

Further, in the embodiment shown in fig. 3 and fig. 4, the distance between the first photosensitive element array 11 and the second photosensitive element array 21 along the Y-axis direction is greater than the minimum package size of the first pad array 12 and the second pad array 22 along the Y-axis direction, so that at least one of the first pad array 12 or the second pad array 22 may be located between the first photosensitive element array 11 and the second photosensitive element array 21, and thus each of the first imaging chip 13 and the second imaging chip 23 of the whole imaging module may be packaged in a homodromous manner.

Specifically, in the embodiment of fig. 3 and 4, the distance D between the first photosensitive element array 11 and the second photosensitive element array 21 in the Y axis is 11.2mm, the effective length of each imaging chip is 18.29mm, and the width is 0.3mm, and the package length of the first pad array 12 and the second pad array 22 along the Y axis can be controlled to be 0.6mm, which is far less than 11.2mm, considering the lead length connected to the pads, and therefore, as shown in fig. 3 and 4, each second pad array 22 can be disposed between each first photosensitive element array 11 and each second photosensitive element array 21, and each first pad array 12 can be disposed on the side of each first photosensitive element array 11 away from the second photosensitive element array 21, by which arrangement, as shown in fig. 3 and 4, each photosensitive element in each first photosensitive element array 11 and each second photosensitive element array 21 can be serially output an electrical signal in the same order.

Obviously, each first pad array 12 may be disposed between each first photosensitive element array 11 and each second photosensitive element array 21, and each second pad array 22 may be disposed on a side of each second photosensitive element array 21 away from the first photosensitive element array 11.

Fig. 5 is a top view showing a structure of a wide-pitch package imaging module according to another preferred embodiment of the present application, which is different from the embodiment shown in fig. 4 in that a data output sequence (an arrow direction of an X-axis in the drawing) of each imaging chip is opposite to an electrical signal output sequence (an arrow direction of a dotted line in the drawing) of a photosensitive element array in each imaging chip included therein, and in that an image on an object plane is reversely collected by the photosensitive element array of the imaging chip when the amplifying lens performs the amplifying imaging, and therefore, if the electrical signal output sequence of the photosensitive element array is the same as the output sequence of each imaging chip, it is also necessary to perform inversion processing on data of each imaging chip in a subsequent image stitching stage, and therefore, by the above arrangement, data of each imaging chip can be directly stitched, and the calculated amount of data processing is reduced.

Fig. 6 is a top view of a wide-pitch package imaging module according to another preferred embodiment of the present application, in which each first imaging chip 13 includes two first pad arrays 12, and the two first pad arrays 12 are located on two sides of the first photosensitive element array 11 along the Y-axis direction; similarly, each second imaging chip 23 includes two second pad arrays 22, and the two second pad arrays 22 are located on both sides of the second photosensitive element array 21 in the Y-axis direction.

Obviously, when the above-mentioned patch method is adopted, between each of the first photosensitive element array 11 and the second photosensitive element array 21, a row of the first pad array 12 and a row of the second pad array 22 will be included at the same time.

Through the packaging mode, the same-direction output of signals is realized, and meanwhile, different signal pins can be connected through the bonding pads positioned on the two sides of the photosensitive element array, so that the variety of input and output signals is increased.

Some preferred embodiments of the present application provide an image sensor further comprising a frame (not shown), the lens module and the wide-pitch package imaging module being fixedly accommodated inside the frame, the frame preferably being made of a light-impermeable hard material and being provided with openings at positions intersecting the optical axes of the respective magnifier lenses of the magnifier lens array, the object plane 7 of the respective magnifier lens array being located outside the frame, light rays emanating from the object plane 7 entering the magnifier lens array along the openings.

While the foregoing is directed to embodiments of the present application, other and further embodiments of the utility model may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims (10)

1. The utility model provides a wide interval encapsulation imaging module, includes two chip arrays that set up along the second direction interval, its characterized in that:

the chip array comprises a plurality of imaging chips distributed along a first direction, and the positions of the imaging chips in different chip arrays along the first direction are staggered with each other, wherein the first direction is perpendicular to a second direction;

each imaging chip comprises a photosensitive element array and at least one bonding pad array which are respectively distributed along a first direction, and the photosensitive element array and the bonding pad array which are respectively included in each imaging chip are arranged at intervals along a second direction;

the imaging chips included in the two chip arrays have a pitch of each photosensitive element array along the second direction larger than a minimum package size of a bonding pad array of any one imaging chip along the second direction.

2. The wide-pitch packaged imaging module of claim 1, wherein:

the spacing is greater than or equal to 11.2mm.

3. The wide-pitch packaged imaging module of claim 1, wherein:

the number of the pad arrays of each imaging chip is 1, and the pad arrays of each imaging chip are positioned on the same side of the photosensitive element array along the second direction.

4. The wide-pitch packaged imaging module of claim 1, wherein:

the number of the pad arrays of each imaging chip is 2, and the pad arrays of each imaging chip are positioned on two sides of the photosensitive element array along the second direction.

5. The wide-pitch packaged imaging module of claim 3 or 4, wherein:

at least one pad array of the imaging chip included in at least one chip array is located between the photosensitive element arrays of the imaging chips included in each of the two chip arrays along the second direction.

6. The wide-pitch packaged imaging module of claim 1, wherein:

the pad array includes a plurality of pads, each of which is electrically connected with at least one photosensitive element in the photosensitive element array of the imaging chip in which it is located.

7. The wide-pitch packaged imaging module of claim 1, wherein:

the data output sequence of each imaging chip in the chip array is opposite to the electric signal output sequence of the photosensitive element array in each imaging chip contained in the chip array.

8. An image sensor, comprising:

the wide-pitch packaged imaging module of claim 1;

the lens module comprises two magnifying lens arrays which are arranged in one-to-one correspondence with the two chip arrays, and the wide-interval packaging imaging module is positioned on the image surface of the magnifying lens arrays.

9. The image sensor of claim 8, wherein:

the included angle of the optical axes of the two magnifying lens arrays is between 8 degrees and 12 degrees.

10. The image sensor of claim 9, wherein:

the frame body is fixedly used for accommodating the lens module and the wide-interval package imaging module;

the object plane of the magnifying lens array is positioned outside the frame body;

the frame body is provided with an opening for enabling light rays on the object plane to enter the magnifying lens array.