CN220456371U - Multi-level storage and loading system for front-loading wafer transfer boxes - Google Patents

Abstract

A multi-layer storage and loading system for a front-opening wafer transfer box, including a storage unit and an inlet and outlet unit. The storage unit includes a housing, a first surface of the housing includes an inlet and outlet port, and a second surface of the housing includes a plurality of loading ports; a multi-layer storage mechanism is provided inside the housing to carry a plurality of front-opening wafer transfers. a box; a lifting mechanism for axially moving the multi-layer storage mechanism to a plurality of positions; a plurality of lid opening mechanisms attached to a plurality of loading ports on the second surface. The loading and unloading unit is arranged on the first surface of the housing and includes an loading and unloading platform for carrying a front-opening wafer transfer box; a code reading mechanism is arranged on one side of the loading and unloading platform for identifying the front-opening wafer transfer box. The coding; the driving mechanism is used to drive the incoming and outgoing material platform. The setting position of the loading and unloading platform corresponds to the loading and unloading port, and the driving mechanism drives the loading and unloading platform to transfer the front-opening wafer transfer box into and out of the storage unit from the loading and unloading port through the loading and unloading platform.

Description

Multi-level storage and loading system for front-loading wafer transfer boxes

Technical field

The utility model relates to a storage and loading system for a wafer transfer box, in particular to a multi-layer storage and loading system for a front-opening wafer transfer box.

Background technique

The integrated circuit manufacturing process involves dozens or even hundreds of different processes on the semiconductor wafer, including etching, development, diffusion, ion implantation, heat treatment, vapor deposition and other processes. Every time a process is completed, the semiconductor wafer is It will be transported to the next process for processing. In order to transport semiconductor wafers between these many different process sites, semiconductor manufacturers usually place one or more semiconductor wafers in a front-opening wafer transfer unit (FOUP) to protect these semiconductor wafers during transportation. During storage and transportation, it is not affected by pollutants such as dust particles, organic gases, and vapors.

After the semiconductor wafer is placed in the front-opening wafer transfer box, the front-opening wafer transfer box can generally be transported between various process stations through equipment such as robotic arms and overhead cranes. After arriving at the process site, the front-opening wafer transfer box is placed on the loading system to prepare for loading the front-opening wafer transfer box onto the process equipment of the site for processing.

The loading system is equipped with a code reading mechanism and a carrying platform, and the front-opening wafer transfer box is placed on the carrying platform. Before the process begins, the code reading mechanism will begin to read the code on the front-opening wafer transfer box to confirm that the processing batch number or material number is correct. Then, the loading system will transport the front-opening wafer transfer box to the connection port of the process equipment, and open the front cover of the front-opening wafer transfer box through the cover opening mechanism, so that the robot arm of the process equipment can pick up or deliver the semiconductor. The wafer enters the processing equipment for processing.

When the semiconductor wafer is processed at the process equipment station, the robot arm will deliver the processed semiconductor wafer back to the front-opening wafer transfer box. After all the semiconductor wafers are put back into the front-opening wafer transfer box, the lid is closed, and then the robot arm or overhead crane transports the front-opening wafer transfer box from the loading system to the next process station. During this process, since the loading system can only place one front-loading wafer transfer box at a time and process the semiconductor wafer in the process equipment, when the processing is completed, it is necessary to replace the next front-loading wafer transfer box. , it is necessary to wait for the completed front-opening wafer transfer box to be transported by the overhead crane to the next process station before the next front-opening wafer transfer box can be transported to the loading system. As a result, the process equipment must wait idle and cannot operate continuously, affecting production capacity. In other words, when the front-opening wafer transfer box needs to feed or withdraw materials into and out of the process equipment, it all passes through the same loading system. However, this loading system can only load one front-opening wafer transfer box at a time, which seriously affects the smoothness of the process. degree and production capacity. The current solution to the conflict between the open wafer transfer box and the loading system is to install at least two loading systems.

Utility model content

In view of this, the purpose of the present invention is to provide a multi-layer storage and loading system for a front-opening wafer transfer box. Different from the original loading system, the front-opening wafer transfer box proposed by the present invention The multi-layer storage and loading system has a storage unit, which contains a multi-layer storage mechanism, and a plurality of front-opening wafer transfer boxes can be pre-fed and stored in the multi-layer storage mechanism through the loading and unloading unit. This multi-layer storage mechanism can store at least two front-loading wafer transfer boxes. Therefore, when one of the front-loading wafer transfer boxes has completed the process processing, the processing equipment can continue to load the other front-loading wafer transfer box. The wafer transfer box starts the processing process, and the processed front-opening wafer transfer box can be unloaded at the same time. The front-opening wafer transfer box is moved out of the storage unit to the loading and unloading unit, and then the front-opening wafer transfer box is moved by the overhead crane. The open wafer pod is transported to the next station, where another front-open wafer pod is placed for processing.

Therefore, the multi-layer storage and loading system of the front-opening wafer transfer box proposed by the present invention can separate the loading process and the loading and unloading process of the front-opening wafer transfer box from the manufacturing process to avoid conflicts with each other. In other words, through the multi-layer storage mechanism in the storage unit, a plurality of front-opening wafer transfer boxes can be transported and stored in the storage unit in advance, so that the process equipment can continuously load semiconductor wafers without interruption of material supply. At the same time, the processed front-opening wafer transfer box can also be temporarily placed in a multi-layer storage mechanism or unloaded without affecting the loading and supply of materials. The multi-layer storage and loading system of the front-opening wafer transfer box proposed by this utility model can effectively improve the smoothness of the process, and therefore can greatly increase the production capacity.

In order to achieve the above object, the present invention provides a multi-layer storage and loading system for a front-opening wafer transfer box, including a storage unit and an inlet and outlet unit. The storage unit includes a shell, a multi-layer storage mechanism, a lifting mechanism and a plurality of lid opening mechanisms. The first surface of the housing has an inlet and outlet port, and the second surface of the housing includes a plurality of loading ports; a multi-layer storage mechanism is provided inside the housing to carry a plurality of front-opening wafer transfer boxes; the lifting mechanism is used to The multi-layer storage mechanism is axially moved to a plurality of positions; a plurality of lid opening mechanisms are attached to a plurality of loading ports on the second surface of the housing. The feeding and discharging unit is arranged on the first surface of the housing and includes a feeding and discharging platform, a code reading mechanism and a driving mechanism. The loading and unloading platform is used to carry the front-opening wafer transfer box; the code reading mechanism is arranged on one side of the loading and unloading platform to identify the code on the front-opening wafer transfer box; the driving mechanism is used to drive the loading and unloading platform. Wherein, the discharging position of the discharging and discharging platform corresponds to the discharging and discharging port, and the driving mechanism drives the discharging and discharging platform so that the front-opening wafer transfer box is transported in and out of the storage unit through the discharging and discharging port through the discharging and discharging platform.

In one embodiment of the present invention, the above-mentioned multi-layer storage mechanism includes a storage frame, and the storage frame has at least two layers and can be used to carry at least two front-opening wafer transfer boxes.

In one embodiment of the present invention, the above-mentioned multi-layer storage mechanism includes a plurality of single-layer and independently movable platforms.

In one embodiment of the present invention, the above-mentioned lifting mechanism includes a lifting platform provided at the bottom of the housing.

In one embodiment of the present invention, the above-mentioned lifting mechanism further includes a plurality of slide rails arranged vertically inside the housing, and the multi-layer storage mechanism is attached to the plurality of slide rails, so that the multi-layer storage mechanism can move along the slide rails. Move to multiple locations.

In an embodiment of the present invention, the plurality of cap opening mechanisms include at least two cap opening mechanisms attached to at least two loading ports among the plurality of loading ports.

In an embodiment of the present invention, the number of the plurality of lid opening mechanisms and the number of the plurality of loading ports may be equal or unequal.

In one embodiment of the present invention, the bottom of the above-mentioned storage unit and the loading and unloading unit further includes a plurality of supporting members and a plurality of multi-directional wheels.

Description of drawings

Figure 1 is a schematic diagram of a common loading system.

Figure 2 is a schematic diagram of a multi-layer storage and loading system of a front-opening wafer transfer box according to an embodiment of the present invention.

Figure 3 is a schematic diagram of the material inlet and outlet unit according to an embodiment of the present invention.

Figure 4 is a schematic diagram of a storage frame according to an embodiment of the present invention.

Explanation of reference signs: 10-generally common loading system; 20-multi-layer storage and loading system of front-opening wafer transfer box; 100-front-opening wafer transfer box; 200-storage unit; 210-casing; 211-First surface; 212-Second surface; 213-Inlet and outlet port; 220-Multi-layer storage mechanism; 221-Storage frame; 230-Opening mechanism; 300-Inlet and outlet unit; 310-Inlet and outlet platform; 320- Code reading mechanism; 330-driving mechanism; 500-support; 600-multi-directional wheel.

Detailed ways

The following will describe an embodiment of a multi-layer storage and loading system of a front-opening wafer transfer box of the present invention with reference to the relevant drawings. For the sake of clarity and convenience in the illustration of the drawings, the dimensions of each component in the drawings are May be exaggerated or reduced in proportion. In the following description and/or claims, the technical terms used should be interpreted with their commonly used meanings known to those of ordinary skill in the art. To facilitate understanding, the same elements in the following embodiments are denoted by the same meaning. symbols to illustrate. The terms "including", "including", "having", etc. mentioned in this utility model are all open terms, that is, they mean "including but not limited to".

Please refer to Figure 1, which is a schematic diagram of a common loading system 10. As shown in the figure, the general loading system 10 can only place one front-opening wafer transfer box 100. When unprocessed semiconductor wafers are placed in the front-opening wafer transfer box 100 and transported by a crane or a robot arm, After the front-opening wafer transfer box 100 is placed on the loading system 10, the loading system 10 transports the front-opening wafer transfer box 100 to the process equipment, and then the cover opening mechanism opens the front-opening wafer transfer box 100. When the front cover is opened, the robot arm picks up and delivers the semiconductor wafers into the process equipment for processing. At this time, the front-loading wafer transfer box 100 will continue to be placed on the loading system 10 . After the semiconductor wafers in the front-opening wafer transfer box 100 are processed, the cover opening mechanism closes the front cover of the front-opening wafer transfer box 100 , and then the loading system 10 opens the front-opening wafer transfer box 100 It is transported to the crane pick-up area, and then the front-opening wafer transfer box 100 is transported by the crane to the next process station. It should be noted that the processing equipment at this time is in a state of waiting for materials, and it must wait until another front-opening wafer transfer box 100 to be processed is transported to the loading system 10 before materials can be loaded again and semiconductor wafer processing can be started. As a result, the capacity utilization rate of the process equipment cannot be improved.

Please refer to FIGS. 2 to 4 , which are schematic diagrams of a multi-layer storage and loading system of a front-opening wafer transfer box proposed by the present invention. The utility model provides a multi-layer storage and loading system 20 for a front-opening wafer transfer box, which includes a storage unit 200 and a material loading and unloading unit 300. The storage unit includes a housing 210, a multi-layer storage mechanism 220, a lifting mechanism (not shown in the figure) and a plurality of lid opening mechanisms 230. The first surface 211 of the housing 210 has an inlet and outlet port 213, and the second surface 212 of the housing 210 includes a plurality of loading ports (overlapping with the lid opening mechanism 230 in the figure); a multi-layer storage mechanism 220 is provided inside the housing 210 , used to carry a plurality of front-opening wafer transfer boxes 100; the lifting mechanism is used to axially move the multi-layer storage mechanism 220 to multiple positions; a plurality of opening mechanisms 230 are attached to a plurality of second surfaces 212 of the housing 210 loading port. The loading and unloading unit 300 is disposed on the first surface 211 of the housing 210 and includes a loading and unloading platform 310 , a code reading mechanism 320 and a driving mechanism 330 . The loading and unloading platform 310 is used to carry the front-opening wafer transfer box 100; the code reading mechanism 320 is disposed on one side of the loading and unloading platform 310 to identify the code on the front-opening wafer transfer box 100; the driving mechanism 330 is used for To drive the loading and unloading platform 310. The discharging position of the discharging and discharging platform 310 corresponds to the discharging and discharging port 213 , and the driving mechanism 330 drives the discharging and discharging platform 310 so that the front-opening wafer transfer box 100 is transferred into and out of the storage unit 200 from the discharging and discharging port 213 through the discharging and discharging platform 310 .

To further explain, in the multi-layer storage and loading system 20 of the front-opening wafer transfer box of the present invention, when a front-opening wafer transfer box 100 is transported by a crane and placed on the loading and unloading platform 310 of the loading and unloading unit 300 After that, the code reading mechanism 320 can read the code on the front-opening wafer transfer box 100. After confirming that the incoming batch number is correct, the driving mechanism 330 of the incoming and outgoing material unit 300 can drive the feeding platform 310, and The front-opening wafer transfer box 100 is transferred into the housing 210 of the storage unit 200 from the inlet and outlet ports 213 of the storage unit 200 , and the front-opening wafer transfer box 100 is placed in a layer of the multi-layer storage mechanism 220 . Then, the driving mechanism 330 moves the discharging and discharging platform 310 from the housing 210 back to the discharging position of the discharging and discharging unit 300 .

Please refer to Figure 2 and Figure 4. Before the front-opening wafer transfer box 100 is transferred into the storage unit 200 , the layer of the multi-layer storage mechanism 220 where the front-opening wafer transfer box 100 is to be stored can be moved in advance through a lifting mechanism to a position corresponding to the inlet and outlet port 213 position, so that the front-opening wafer transfer box 100 is placed at a preset position. For example, the first front-opening wafer transfer box 100 can be first placed on the uppermost layer of the multi-layer storage mechanism 220, and then the lifting mechanism moves the multi-layer storage mechanism 220 upward to allow the multi-layer storage mechanism 220 to move upward. The position of the second layer is aligned with the inlet and outlet ports 213 , and then the inlet and outlet platform 310 transfers the second front-opening wafer transfer box 100 and places it in the second layer of the multi-layer storage mechanism 220 . By analogy, the number of layers of the multi-layer storage mechanism 220 can be adjusted according to actual production needs to cooperate with automated loading operations.

In one embodiment, the number of layers of the multi-layer storage mechanism 220 is at least 2 layers, preferably 3 layers, and most preferably 4 layers.

It should be understood that in order to allow the multi-layer storage mechanism 220 to move axially within the housing 210, the internal space of the housing 210 is sufficient to accommodate approximately twice the number of layers of the multi-layer storage mechanism 220, so that the multi-layer storage mechanism 220 can Move axially so that both the uppermost layer and the lowermost layer can correspond to the material inlet and outlet ports 213.

In addition, the multi-layer storage mechanism 220 can move each layer independently or move each layer simultaneously. For example, as shown in FIG. 4 , in one embodiment, the multi-layer storage mechanism 220 may include a storage frame 221 as shown in FIG. 4 , and the storage frame 221 has at least two layers and can be used to carry at least two Front-loading wafer transfer box 100. In another embodiment, the multi-layer storage mechanism 220 includes a plurality of single-layer and independently movable platforms.

In one embodiment, the lifting mechanism may be, for example, a lifting platform disposed at the bottom of the housing 210 to support and axially move the multi-layer storage mechanism to multiple positions.

In another embodiment, the lifting mechanism for axially moving the multi-layer storage mechanism 220 to multiple positions of the present invention further includes a plurality of slide rails (not shown in the drawings) vertically disposed inside the housing 210 , and the multi-layer storage mechanism 220 is attached to a plurality of slide rails, so that the multi-layer storage mechanism can move axially to multiple positions along the slide rails. It should be understood that the purpose of using slide rails in this embodiment is mainly to allow the multi-layer storage mechanism 220 to stably slide to a set position using the slide rails, so as not to cause vibration, jitter or collision during the movement, ensuring that The front-loading wafer transfer box 100 stored in each layer of the multi-layer storage mechanism 220 will not be damaged. Of course, those of ordinary skill in the technical field to which this utility model belongs can use this concept to carry out equal technical conversion to achieve the purpose of stably moving the multi-layer storage mechanism 220 and avoid vibration and jitter, which should be included in the scope of protection claimed by this utility model. Inside. For example, in another embodiment, the upright sides of the storage frame 221 can be attached with pulleys to the slide rails vertically disposed inside the housing 210, so that the storage frame 221 can stably move axially along the slide rails through the lifting mechanism. move.

Please refer to FIG. 2 again. The second surface 212 of the storage unit 200 of the multi-layer storage and loading system 20 of the front-opening wafer transfer box of the present invention has a plurality of loading ports (overlapping with the cover opening mechanism 230 in the figure). , and a plurality of lid opening mechanisms 230 are attached to these plurality of loading ports. The loading port is mainly used to interface with the process equipment, so that the front-opening wafer transfer box 100 can be loaded into the process equipment for processing. It should be understood that the cover opening mechanism 230 is used to open the front cover of the front-opening wafer transfer box 100 before loading the front-opening wafer transfer box 100 into the process equipment. Each loading port is configured according to the Front-Opening Interface Mechanical Standard (FIMS), so that various process equipment can receive the front-opening wafer transfer box 100 and pick up the semiconductor wafers therein for processing and protection. Semiconductor wafers are protected from contamination during storage and transportation.

Since a plurality of front-loading wafer transfer boxes 100 can be stored in the multi-layer storage and loading system 20 of the front-loading wafer transfer box of the present invention, a plurality of front-loading wafer transfer boxes 100 can be provided simultaneously according to process requirements. 100 is used to load and process the process equipment. Therefore, the number of the aforementioned cap opening mechanisms 230 can also be set according to the number of loading ports and process requirements. In other words, for example, if two front-opening wafer transfer boxes 100 need to be opened at the same time, two cover opening mechanisms 230 can be provided. As another example, as shown in Figure 2, there are four loading ports in this figure. Therefore, if it is necessary to open the four front-opening wafer transfer boxes 100 at the same time, four openings can also be provided as shown in this figure. Lid mechanism 230.

Furthermore, since the multi-layer storage and loading system 20 of the front-opening wafer transfer box of the present invention has a plurality of loading ports, the position and number of the cover opening mechanisms 230 can be set according to actual operation requirements. For example: when there are 4 loading ports, 4 cover opening mechanisms 230 can be set up in each loading port (as shown in Figure 2), or with process equipment, only 2 cover opening mechanisms 230 can be set up in the housing. 210 in the middle position. During operation, the two front-opening wafer transfer boxes 100 are first opened, and then the other two unopened front-opening wafer transfer boxes 100 are moved to the opening mechanism 230 for opening. In addition, the plurality of cover opening mechanisms 230 can also be arranged in a discontinuous manner. For example, two cover opening mechanisms 230 can be arranged separately, and one cover opening mechanism 230 can be arranged on the uppermost layer corresponding to the loading port, and The other one is located at the bottom. Therefore, the number of decapping mechanisms 230 may or may not be equal to the number of loading ports.

Please refer to Figure 2 again. As shown in the figure, in order to allow the multi-layer storage and loading system 20 of the front-opening wafer transfer box of the present invention to be used for movement and operation in the factory area, the front-opening wafer transfer box of the present invention is In the multi-layer storage and loading system 20 of the wafer transfer box, a plurality of supports 500 and a plurality of multi-directional wheels 600 are provided at the bottom of the storage unit 200 and the loading and unloading unit 300 . It should be understood that the support member 500 is a generally existing adjustable support member, and its length can be adjusted. Therefore, during the movement process, the length of the support member 500 is first shortened so that it does not contact the ground, so that the utility model can The multi-level storage and loading system 20 of the front-loading wafer transfer box is mobile. After moving to the predetermined position, the length of the support member 500 is then lengthened so that it can stably support and fix the multi-layer storage and loading system 20 of the front-opening wafer transfer box of the present invention to avoid accidental movement during operation. equipment.

To sum up, the multi-layer storage and loading system 20 of the front-opening wafer transfer box of the present invention has the following advantages compared with the common loading system 10:

1. The storage unit 200 has a multi-layer storage mechanism 220 that can store a plurality of front-loading wafer transfer boxes 100 in multiple layers. After the front-loading wafer transfer box 100 completes the processing operation, the material unloading process is an independent operation, which will not affect the material supply, and the material supply can be continued without causing the equipment to be idle.

2. The pre-opening operation of single or multiple front-opening wafer transfer boxes 100 can be performed at a specific location at the same time.

3. The loading and unloading unit 300 can be used with the factory automation transfer system to transport the front-opening wafer transfer box 100 to improve process smoothness and productivity.

4. It can be moved independently according to the location of the process equipment in the factory. After it is moved to the predetermined position, it can be fixed and operated with high adjustability.

5. The front-opening wafer transfer box 100 is entered into the storage unit 200 before the front-end operation (opening the cover) is performed to avoid jitter or deviation of the semiconductor wafer material during the loading process.

Of course, the above-mentioned embodiments are only for illustration and do not limit the scope of the present invention. Any equivalent modifications or changes based on the multi-layer storage and loading system 20 of the front-opening wafer transfer box according to the above-mentioned embodiments will still be implemented. should be included in the scope of this utility model.

To sum up, it can be seen that the present utility model has indeed achieved the desired effect by breaking through the previous technology, and it is not easy to imagine for those who are familiar with this art.

The above is only illustrative and not restrictive. Any other equivalent modifications or changes that do not depart from the spirit and scope of the present invention should be included in the appended claims.

Claims (8)

1. A multi-layer storage and loading system for front-opening wafer transfer boxes, characterized by including: A storage unit including: A shell; a first surface and a second surface of the shell, the first surface includes a material inlet and outlet port, and the second surface includes a plurality of loading ports; A multi-layer storage mechanism is provided inside the housing to carry a plurality of front-opening wafer transfer boxes; a lifting mechanism for axially moving the multi-layer storage mechanism to multiple positions; a plurality of lid opening mechanisms attached to the plurality of loading ports on the second surface; An inlet and outlet unit is provided on the first surface of the housing, including: A loading and unloading platform is used to carry a front-opening wafer transfer box; A code reading mechanism is provided on one side of the loading and unloading platform to identify a code on the front-opening transfer box; and A driving mechanism used to drive the incoming and outgoing material platform; Wherein, the discharging position of the discharging and discharging platform corresponds to the discharging and discharging port, and the driving mechanism drives the discharging and discharging platform so that the front-opening wafer transfer box is transferred in and out of the storage unit from the discharging and discharging port through the discharging and discharging platform. 2. The multi-layer storage and loading system of the front-opening wafer transfer box according to claim 1, wherein the multi-layer storage mechanism includes a storage frame, and the storage frame has at least two layers for carrying At least 2 of these front-loading wafer transfer boxes. 3. The multi-layer storage and loading system of a front-opening wafer transfer box as claimed in claim 1, wherein the multi-layer storage mechanism includes a plurality of single-layer and independently movable platforms. 4. The multi-layer storage and loading system of a front-opening wafer transfer box as claimed in claim 1, wherein the lifting mechanism includes a lifting platform disposed at the bottom of the housing. 5. The multi-layer storage and loading system of the front-opening wafer transfer box as claimed in claim 1, wherein the lifting mechanism further includes a plurality of slide rails vertically disposed inside the housing, and the multi-layer storage system The mechanism is attached to the plurality of slide rails to enable the multi-layer storage mechanism to move axially to multiple positions along the slide rails. 6. The multi-layer storage and loading system of a front-opening wafer transfer box as claimed in claim 1, wherein the plurality of lid opening mechanisms comprise at least 2 lid opening mechanisms attached to the plurality of loading ports. of at least 2 load ports. 7. The multi-layer storage and loading system of a front-opening wafer transfer box as claimed in claim 1, wherein the number of the plurality of opening mechanisms and the number of the plurality of loading ports are equal or unequal. 8. The multi-layer storage and loading system of a front-opening wafer transfer box as claimed in claim 1, wherein the bottom of the storage unit and the loading and unloading unit further includes a plurality of supports and a plurality of multi-directional wheels.