CN220439576U - A wafer transfer device - Google Patents

Abstract

The utility model discloses a wafer transmission device, which comprises: a back plate; the turnover bottom plate is rotatably connected with the back plate and is provided with a wafer fixing seat for clamping a wafer; the turnover bottom plate has a first working state and a second working state; in a first working state, the overturning bottom plate and the backboard form an included angle, and the wafer fixing seat clamps the wafer; and in the second working state, the overturning bottom plate rotates relative to the back plate until the wafer is in a vertical state. The wafer transmission device can clamp the wafer to turn and move, so that the function of a mechanical arm is realized, the structure is simple, and the transmission efficiency is high; the movable travel of the wafer transmission device is relatively smaller, the transmission is more flexible, and the transmission speed is higher; the wafer can be directly sent into the cleaning input module by the wafer transmission device, and the whole process moves in a wet environment, so that the adverse effect of the drying of polishing liquid on the wafer is effectively prevented.

Description

A wafer transfer device

Technical field

The utility model belongs to the field of semiconductor integrated circuit chip manufacturing, and in particular relates to a wafer transmission device.

Background technique

Chemical mechanical polishing planarization equipment usually includes a semiconductor equipment front-end module (EFEM), a cleaning unit and a polishing unit. EFEM mainly includes a wafer storage cassette, a wafer transfer robot and an air purification system; the cleaning unit mainly includes a varying number of megasonic cleaning components, roller brush cleaning components, drying components and devices for transferring wafers between components, etc. ; The polishing unit mainly includes polishing table, polishing head, polishing liquid supply system and polishing pad dressing system.

In an existing chemical mechanical polishing planarization equipment, the wafer transfer between the polishing unit and other areas is realized through a polishing transfer table and a robot. The polishing transfer table mainly completes the delivery and retrieval of wafers by cooperating with the robot, and plays a bridge role between peripheral equipment and the core part of chemical mechanical polishing planarization.

The existing double-claw manipulator has two clamping claws, which can grab two wafers at a time. It can take out polished wafers and put in unpolished wafers at the same time, and then send the polished wafers in. The cleaning unit inputs the device, and then takes the wafers to be polished that the EFEM robot has taken out of the cassette from the EFEM, and then proceeds to the next cycle.

However, due to the complex structure of the double-claw manipulator, its movement is relatively slow and its transmission efficiency is low, so it cannot meet the demand for high film transfer speed. Moreover, the double-claw manipulator is expensive, needs to operate in a wet environment, is difficult to manufacture, has a complex structure, and its stability and reliability need to be verified.

To sum up, how to provide a wafer transfer equipment and method that can improve wafer transfer efficiency is an urgent problem that needs to be solved by those skilled in the art.

Utility model content

In order to overcome the shortcomings of the existing technology, the present invention provides a wafer transfer device with high transmission efficiency, simple structure and small space required for transmission.

The technical solution adopted by this utility model to solve the technical problem is: a wafer transmission device, including:

back panel;

The flip bottom plate is rotatably connected to the back plate and is provided with a wafer holder for clamping the wafer;

The flip bottom plate has a first working state and a second working state;

In the first working state, the flip bottom plate and the back plate form an angle, and the wafer holder clamps the wafer;

In the second working state, the flip bottom plate is rotated relative to the back plate until the wafer is in a vertical state.

Further, the wafer holder includes at least two support structures and movable clamping jaws. At least part of the movable clamping jaws is movable to cooperate with the supporting structures to clamp or loosen the wafer.

Further, at least part of the telescopic movement of the moving clamping jaw is used to clamp or loosen the wafer in cooperation with the supporting structure; or at least part of the rotational movement of the moving clamping jaw is used to clamp or loosen the wafer in cooperation with the supporting structure.

Further, the support structure includes a body connected to the flip bottom plate, a first inclined surface provided on the body, and a second inclined surface in a flared shape with the first inclined surface.

Further, the support structure further includes a third inclined surface, which is at an angle with the second inclined surface, for guiding the wafer to be clamped between the first inclined surface and the second inclined surface.

Further, there is a groove between the first inclined surface and the second inclined surface.

Further, the flip bottom plate is provided with a nozzle for spraying liquid onto the wafer to moisten it.

Further, a supporting plate is provided above the flip bottom plate, which is perpendicular to the back plate for horizontally supporting the wafer.

Further, the supporting plate has a notch or an openable window structure.

Further, the back panel is connected with a lifting guide rail.

The beneficial effects of the utility model are: 1) The wafer transfer device can clamp the wafer for flipping and moving, realizing the function of the manipulator. It has a simple structure, is not prone to failure, and has high transmission efficiency; 2) the movable stroke of the wafer transfer device is relatively Smaller, the transmission is more flexible and the transmission speed is faster; 3) The transmission speed is fast and less prone to failure; 4) The wafer can be directly sent to the cleaning input module from the wafer transfer device, and the entire process is moved in a humid environment, effectively preventing The drying of the polishing fluid on the wafer has an adverse effect on the wafer; 5) The wafer transfer device can transport the polished wafer directly to the cleaning module, omitting the step of transferring and transferring the wafer through a wet environment robot, thus avoiding the need for wafer transfer. Damaged during multiple transfers; 6) The transfer occupies a small space; 7) The cleaning input module can quickly transfer the wafer to the designated position, and the transfer efficiency is higher; 8) The external transfer device can place the wafer to the closest The cleaning box of the cleaning input module saves the transmission steps in the cleaning process; 9) The cleaning unit of the cleaning module can be set up in multiple columns to speed up the cleaning speed.

Description of the drawings

Figure 1 is a perspective view of the utility model. At this time, the flip bottom plate is in the first working state.

Figure 2 is a perspective view of the utility model, when the flip bottom plate is in the second working state.

Figure 3 is the first perspective view of the utility model. At this time, there is also a supporting plate above the flip bottom plate.

Figure 4 is the second perspective view of the utility model. At this time, there is a supporting plate above the flip bottom plate.

Figure 5 is a schematic three-dimensional structural diagram of the support structure in the present utility model.

Figure 6 is a schematic three-dimensional structural diagram of the box in the present utility model.

Figure 7 is a schematic front structural view of the box in the present utility model.

Figure 8 is a schematic top view of the box structure of the utility model.

Figure 9 is a schematic structural diagram of the cooperation between the wafer transfer device and the box in the present utility model.

Figure 10 is a schematic top view of the structure of the wafer transfer device used in chemical mechanical planarization equipment in the present invention.

Figure 11 is a schematic three-dimensional structural diagram of the wafer transfer device in the present invention applied to chemical mechanical planarization equipment.

Detailed ways

In order to enable those in the technical field to better understand the solution of the present utility model, the technical solution in the embodiment of the present utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the present utility model. Obviously, the described The embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts should fall within the scope of protection of the present utility model.

A wafer transfer device includes a back plate 11 and a flip bottom plate 12 rotatably connected to the back plate 11 through a rotating shaft 17. The flip bottom plate 12 is provided with a wafer holder 13 for clamping the wafer 2. The rotating shaft 17 is provided at the lower end of the back plate 11 . Of course, in other embodiments, the rotational connection between the back plate 11 and the flip bottom plate 12 may not be realized through the rotating shaft 17 , but may be realized through other structures in the prior art.

As shown in Figures 1 and 2, the flip bottom plate 12 has a first working state and a second working state. In the first working state, the flip bottom plate 12 forms an angle with the back plate 11, so that the wafer holder 13 can be horizontal. Hold wafer 2. In this embodiment, the included angle is 90°. Of course, in other embodiments, the included angle may not be 90°, or the wafer holder 13 tends to hold the wafer 2 horizontally.

In the second working state, the flip bottom plate 12 rotates relative to the back plate 11 until the wafer 2 is in a vertical state. At this time, the flip bottom plate 12 and the back plate 11 may be parallel to each other. The vertical state here does not necessarily mean that it is completely vertical to the ground, but it can also tend to be vertical.

No matter in the first working state or the second working state, the wafer 2 clamped by the wafer holder 13 is parallel to the flip bottom plate 12 .

The back plate 11 can move up and down. When the flip bottom plate 12 is in the second working state, it can move up and down along with the back plate 11 . Specifically, the back plate 11 cooperates with the sliding rail 16 , and the sliding rail 16 can be installed on the top opening of the box 3 .

In order to keep the flip bottom plate 12 in a relatively humid environment when it is in the first working state, as shown in Figure 6, the box 3 includes an upper body 31 and a lower body 32. The width of the upper body 31 is greater than that of the lower body 32. width. Therefore, when the flip bottom plate 12 is in the first working state, it is located in the upper body 31 , and when the flip bottom plate 12 is converted from the first working state to the second working state, it can enter the lower body 32 .

As shown in FIG. 8 , a wafer holder 33 is provided in the box 3 , which is used to support the vertical wafer 2 on the flip bottom plate 12 , and the number thereof is one or two or more. When the number of wafer holders 33 is two, one of them is used to receive the wafer 2 on the flip bottom plate 12, and the other one can stay on the side, supporting the wafer 2 on it, waiting for transfer; or, another One stays on the side, and there is no wafer supported on it. The specific status is not limited. The two wafer holders 33 can move synchronously or be controlled independently.

The wafer holder 13 includes at least two support structures 14 and movable clamping jaws 15. The positions of the supporting structures 14 are relatively fixed. At least part of the movable clamping jaws 15 is movable, so that the movable clamping jaws 15 and the supporting structure 14 cooperate to clamp or Relax wafer 2.

Here, at least part of the moving jaw 15 can be movable, including telescopic movement and rotational movement, and is not specifically limited.

As shown in FIG. 5 , the support structure 14 includes a body 141 connected to the flip bottom plate 12 , a first inclined surface 142 provided on the body 141 , and a second inclined surface 143 that is flared with the first inclined surface 142 . The first inclined surface 142 is inclined from top to bottom and from outside to inward. The wafer 2 is placed on the first inclined surface 142. The second inclined surface 143 cooperates with the first inclined surface 142 to clamp the wafer 2 so that the upper and lower side edges of the wafer 2 are respectively It is in contact with the second bevel 143 and the first bevel 142 to reduce the contact area between the support structure 14 and the wafer 2 to avoid damaging the surface of the wafer 2 .

The support structure 14 also includes a third inclined surface 144, which is at an angle with the second inclined surface 143, and is inclined from top to bottom, from outside to inward, with a large slope, and plays a guiding role for guiding the wafer 2 to the clamping surface. Between the first inclined surface 142 and the second inclined surface 143 . The first inclined surface 142 and the second inclined surface 143 may be directly connected, or a groove 145 may be provided between them.

In other words, the wafer 2 can slide along the third inclined surface 144 and onto the first inclined surface 142, and then the wafer 2 can be pressed against the first inclined surface 142 and the second inclined surface 142 by telescopic extrusion or rotational extrusion of the moving clamp 15. The inclined surface 143 moves until the side wall contacts the groove 145 or is close to the groove 145 .

As shown in Figures 3 and 4, in order to increase the efficiency of wafer transmission, the flip bottom plate 12 is used to support the wafers to be cleaned. A support plate 18 can also be provided on the back plate 11 and above the flip bottom plate 12. The supporting plate 18 is used to horizontally support the wafer 2 to be polished. The supporting plate 18 is designed to have a gap or an openable window structure. The wafer 2 on the supporting plate 18 can be transferred by a robot or the like. Exposing the above-mentioned notch or opening the window so that the wafer can be transferred to the flip bottom plate 12 can be implemented by the existing technology and will not be described again.

In order to keep the wafer 2 in a moist state, a nozzle 19 can also be provided on the flip bottom plate 12 , which can spray pure water to wet the wafer 2 to prevent the polishing liquid on the wafer 2 to be cleaned from drying and condensing and damaging the wafer 2 .

As shown in Figures 10 and 11, a chemical mechanical planarization equipment includes a polishing module 4, a cleaning input module 5, and a cleaning module 6, which are arranged in sequence. The cleaning input module 5 includes a box 3 and the above-mentioned wafer transfer device.

The wafer 2 is transferred horizontally from the polishing module 4 to the wafer transfer device. By flipping the bottom plate 12 to convert from the first working state to the second working state, the wafer 2 is converted to the vertical state and is temporarily stored in the box 3, waiting for external transfer. The device transfers it to the cleaning module 6. At this time, the wafer 2 may be transferred in a vertical state to adapt to the cleaning module 6.

The cleaning module 6 includes at least two rows of cleaning units 61 . Each row of cleaning units 61 includes a plurality of cleaning boxes arranged at intervals. The box 3 extends to both sides to form a left body 34 and a right body 35 corresponding to the pre-cleaning unit 61 . Since the wafer can move to both sides of the box 3 in a vertical state, the widths of the left body 34 and the right body 35 can be substantially equal to the width of the lower body 32 of the box 3 .

Specifically, the wafer holder 33 cooperates with the slide rail 37 to move the vertical wafer 2 to the left body 34 or the right body 35, and is provided at positions corresponding to the left body 34 and the right body 35. There is a spray mechanism 36 that can spray liquid onto the wafer 2 on the wafer holder 33 . In other words, there is liquid in the box 3 to keep it in a moist state. When the flip bottom plate 12 of the wafer transfer device is raised, lowered or turned over in the box 3, it is always in a relatively moist state, preventing the wafers to be cleaned from being cleaned. The polishing fluid on the wafer dries and condenses to damage the wafer, forming a good protective effect on the wafer.

A wafer transfer method includes the following steps:

The flip bottom plate 12 is in the first working state, and the wafer 2 of the polishing module 4 is transferred horizontally to the wafer holder 13. The wafer holder 13 supports the wafer 2 horizontally and clamps it; at this time, the flip bottom plate 12 is located in the box. Inside the body 3, specifically located in the upper body 31 of the box 3; or, at this time, even if the flip bottom plate 12 is not located in the box 3, it is close to the top opening of the box 3;

The flip bottom plate 12 rotates relative to the back plate 11 to the second working state, that is, the flip bottom plate 12 flips downward around the rotation axis 17 to become vertical, where it is perpendicular to the bottom surface of the box 3, and the wafer 2 is in a vertical state at this time;

The back plate 11 descends, driving the flip bottom plate 12 and the wafer 2 to move downward and enter the lower body 32 of the box 3;

The wafer 2 is translated through the wafer holder 33 to the left body 34 or the right body 35 of the cleaning input module 5 box 3. After completing the process of cleaning the input module 5, the wafer 2 is transferred to the cleaning module 6 in a vertical state. ; To complete the process of cleaning the input module 5 here, you can just wait to enter the state of the cleaning module 6; you can also perform preliminary cleaning while waiting, such as the spray mechanism 36 rinsing the surface of the wafer 2.

The above-mentioned specific embodiments are used to explain the present utility model, rather than to limit the present utility model. Within the spirit of the present utility model and the protection scope of the claims, any modifications and changes made to the present utility model fall within the scope of the present utility model. scope of protection.

Claims (10)

1. A wafer transfer apparatus, comprising:

a back plate (11);

a turnover bottom plate (12) rotatably connected to the back plate (11) and provided with a wafer fixing seat (13) for clamping the wafer (2);

the turnover bottom plate (12) has a first working state and a second working state;

in a first working state, the overturning bottom plate (12) and the back plate (11) form an included angle, and the wafer fixing seat (13) clamps the wafer (2);

in the second working state, the overturning bottom plate (12) rotates relative to the back plate (11) until the wafer (2) is in a vertical state.

2. The wafer transfer apparatus according to claim 1, wherein: the wafer fixing seat (13) comprises at least two supporting structures (14) and a movable clamping jaw (15), wherein at least part of the movable clamping jaw (15) can move to clamp or loosen the wafer (2) in cooperation with the supporting structures (14).

3. The wafer transfer apparatus according to claim 2, wherein: at least part of the moving clamping jaw (15) moves in a telescopic way so as to clamp or loosen the wafer (2) in cooperation with the supporting structure (14); alternatively, at least part of the rotational movement of the moving jaw (15) is used to clamp or unclamp the wafer (2) in cooperation with the support structure (14).

4. The wafer transfer apparatus according to claim 2, wherein: the supporting structure (14) comprises a body (141) connected with the turnover bottom plate (12), a first inclined plane (142) arranged on the body (141), and a second inclined plane (143) in a flaring shape with the first inclined plane (142).

5. The wafer transfer apparatus of claim 4, wherein: the support structure (14) further comprises a third bevel (144) at an angle to the second bevel (143) for guiding the wafer (2) to be clamped between the first bevel (142) and the second bevel (143).

6. The wafer transfer apparatus of claim 4, wherein: a groove (145) is formed between the first inclined surface (142) and the second inclined surface (143).

7. The wafer transfer apparatus according to claim 1, wherein: the turnover bottom plate (12) is provided with a nozzle (19) for spraying liquid to the wafer (2) to moisten the wafer.

8. The wafer transfer apparatus according to claim 1, wherein: and a supporting plate (18) is arranged above the turnover bottom plate (12) and is perpendicular to the back plate (11) so as to be used for horizontally supporting the wafer (2).

9. The wafer transfer apparatus of claim 8, wherein: the support plate (18) has a notch or has a window structure that can be opened and closed.

10. The wafer transfer apparatus according to claim 1, wherein: the backboard (11) is connected with a lifting guide rail.