CN220411464U - Cover tape for packaging electronic components - Google Patents
Cover tape for packaging electronic components Download PDFInfo
- Publication number
- CN220411464U CN220411464U CN202321163304.0U CN202321163304U CN220411464U CN 220411464 U CN220411464 U CN 220411464U CN 202321163304 U CN202321163304 U CN 202321163304U CN 220411464 U CN220411464 U CN 220411464U
- Authority
- CN
- China
- Prior art keywords
- cover tape
- layer
- conductive polymer
- tape body
- cutting frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 55
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000012793 heat-sealing layer Substances 0.000 claims abstract description 10
- 230000003068 static effect Effects 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920005990 polystyrene resin Polymers 0.000 claims description 3
- 238000012856 packing Methods 0.000 abstract description 8
- 230000006978 adaptation Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 8
- 230000005611 electricity Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model relates to the technical field of electronic component packaging, in particular to a cover tape for electronic component packaging, which comprises a cover tape body, wherein both sides of the cover tape body are provided with parting lines, and the other side of each parting line is provided with a side group tape; the cover tape body comprises a substrate layer, wherein one side of the substrate layer is provided with a conductive polymer layer, the other side of the conductive polymer layer is provided with a heat sealing layer, and the other side of the substrate layer is provided with an antistatic layer. This lid area is used in electronic component packing is through setting up the cutting frame line at lid area body middle part for later stage when the packing, can break away from lid area body more easily with the recess adaptation on the carrier tape, thereby promote packing speed, in addition, make whole product conductivity good through setting up conductive polymer layer, can be fast with static drainage, thereby avoid damaging electronic component itself, simultaneously, set up antistatic layer, can make the lid area body in the lapping period, avoid mutual adhesion, release lid area body more easily.
Description
Technical Field
The utility model relates to the technical field of electronic component packaging, in particular to a cover tape for electronic component packaging.
Background
Electronic components for surface mounting such as transistors, diodes, capacitors, and piezoresistors represented by I C are usually provided by being packaged in a package composed of a carrier tape having recesses formed continuously therein and a cover tape heat-sealable with the carrier tape.
When the cover tape is packaged, the cover tape and the carrier tape need to be matched, and the cover tape is integrally formed, so that the cover tape is troublesome in separating from the cover tape body, meanwhile, the problem of deviation from a workpiece easily occurs in the cover tape conveying process, in addition, in the small and light electronic components, static electricity between the cover tape and the components is generated due to friction in transportation, the electronic components with static electricity are attached to the cover tape, thereby causing process accidents such as poor pick-up and the like, and meanwhile, after static electricity is generated, the cover tape is easily adhered to each other in the cover tape coiling period, and the cover tape is not easy to release.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides the cover tape for packaging the electronic component, which has the advantages of easy detachment from the cover tape, reduced damage caused by static electricity and the like.
In order to achieve the purpose of easily separating the cover tape and reducing the damage caused by static electricity, the utility model provides the following technical scheme: the cover tape for packaging the electronic parts comprises a cover tape body, wherein dividing lines are arranged on two sides of the cover tape body, and edge group tapes are arranged on the other side of the dividing lines;
the cover tape body comprises a substrate layer, wherein one side of the substrate layer is provided with a conductive polymer layer, the other side of the conductive polymer layer is provided with a heat sealing layer, and the other side of the substrate layer is provided with an antistatic layer.
Further, the cover tape body is a composite tape body composed of a substrate layer, a conductive polymer layer, a heat sealing layer and an antistatic layer, the edge group tape is a single material tape body, and the width of the parting line is 0.2-0.3 cm.
Further, the cover belt body is provided with a cutting frame wire, and the cutting frame wire is positioned in the middle of the cover belt body.
Further, the cutting frame wires are provided with a plurality of cutting holes, the intervals of the cutting frame wires are 0.3-0.5 cm, the cutting frame wires are rectangular, the cutting frame wires are composed of a plurality of cutting holes, and the intervals among the cutting holes are 1-2 mm.
Further, the heat sealing layer is a polystyrene resin layer, the antistatic layer is coated with a static discharge agent, and the surface resistance value of the antistatic layer is less than 1.0E+12Ω.
Compared with the prior art, the utility model provides the cover tape for packaging the electronic component, which has the following beneficial effects:
this lid area is used in electronic component packing is through setting up the cutting frame line at lid area body middle part for later stage when the packing, can break away from lid area body more easily with the recess adaptation on the carrier tape, thereby promote packing speed, in addition, make whole product conductivity good through setting up conductive polymer layer, can be fast with static drainage, thereby avoid damaging electronic component itself, simultaneously, set up antistatic layer, can make the lid area body in the lapping period, avoid mutual adhesion, release lid area body more easily.
Drawings
FIG. 1 is a top view of a cover tape of the present utility model;
FIG. 2 is a schematic side cross-sectional view of a cover tape of the present utility model.
In the figure: 1. a cover tape body; 11. a base layer; 12. a conductive polymer layer; 13. a heat-sealing layer; 14. an antistatic layer; 2. dividing lines; 3. edge group belts; 4. cutting the wire.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-2, a cover tape for packaging electronic components includes a cover tape body 1, wherein dividing lines 2 are provided on both sides of the cover tape body 1, and a side group tape 3 is provided on the other side of the dividing lines 2.
The cover tape body 1 is a composite tape body composed of a substrate layer 11, a conductive polymer layer 12, a heat sealing layer 13 and an antistatic layer 14, the edge group tape 3 is a single material tape body, and the width of the parting line 2 is 0.2-0.3 cm.
In this embodiment, the cover tape body 1 includes a base layer 11, a conductive polymer layer 12 is disposed on one side of the base layer 11, a heat seal layer 13 is disposed on the other side of the conductive polymer layer 12, and an antistatic layer 14 is disposed on the other side of the base layer 11.
The conductive polymer layer 12 is a polyolefin resin and a polyether/polyolefin copolymer layer. The heat-sealing layer 13 is a polystyrene resin layer, and the antistatic layer 14 is coated with an electrostatic discharge agent, and the surface resistance value of the antistatic layer 14 is less than 1.0E+12Ω.
The surface resistance value of the antistatic layer 14 was measured by using J I SK6911 under the conditions of 30% RH and 23-25 ℃.
The cover tape body 1 is provided with a cutting frame wire 4, and the cutting frame wire 4 is positioned in the middle of the cover tape body 1.
In this embodiment, the cutting wire 4 is provided with a plurality of cutting holes, the intervals between the cutting wires 4 are 0.3-0.5 cm, the cutting wire 4 is rectangular, the cutting wire 4 is composed of a plurality of cutting holes, and the intervals between the cutting holes are 1-2 mm.
Each cutting frame wire 4 can correspond to a groove of the carrier tape, and when the inner side of the cutting frame wire 4 is stressed, the rectangular block at the inner side part of the cutting frame wire 4 can be separated from the cover tape body 1, so that the cover tape is thermally sealed to a film of an electronic component.
This embodiment is when using, through set up cutting frame line 4 at lid area body 1 middle part for later stage when the packing, can be completely with the recess adaptation on the carrier tape, thereby promote packing speed more easily, in addition, make whole product conductivity good through setting up conductive polymer layer 12, can be fast with static drainage, thereby avoid damaging electronic component itself, simultaneously, set up antistatic layer 14, can make lid area body 1 in the lapping period, avoid mutual adhesion, release lid area body 1 more easily.
The electrical components appearing herein are all electrically connected with the master controller and the power supply, the master controller can be a conventional known device for controlling a computer and the like, and the prior art of power connection is not described in detail herein.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The cover tape for packaging electronic components comprises a cover tape body (1), and is characterized in that: dividing lines (2) are arranged on two sides of the cover tape body (1), and edge group tapes (3) are arranged on the other side of the dividing lines (2);
the cover tape body (1) comprises a substrate layer (11), one side of the substrate layer (11) is provided with a conductive polymer layer (12), the other side of the conductive polymer layer (12) is provided with a heat sealing layer (13), and the other side of the substrate layer (11) is provided with an antistatic layer (14).
2. The cover tape for packaging electronic parts according to claim 1, wherein: the cover tape body (1) is a composite tape body composed of a substrate layer (11), a conductive polymer layer (12), a heat sealing layer (13) and an antistatic layer (14), the edge group tape (3) is a single material tape body, and the width of the parting line (2) is 0.2-0.3 cm.
3. The cover tape for packaging electronic parts according to claim 1, wherein: the cover tape is characterized in that a cutting frame wire (4) is arranged on the cover tape body (1), and the cutting frame wire (4) is positioned in the middle of the cover tape body (1).
4. A cover tape for packaging electronic parts according to claim 3, wherein: the cutting frame wires (4) are provided with a plurality of cutting holes, the intervals of the cutting frame wires (4) are 0.3-0.5 cm, the cutting frame wires (4) are rectangular, the cutting frame wires (4) are composed of a plurality of cutting holes, and the intervals among the cutting holes are 1-2 mm.
5. The cover tape for packaging electronic parts according to claim 1, wherein: the heat sealing layer (13) is a polystyrene resin layer, the antistatic layer (14) is coated with a static discharge agent, and the surface resistance value of the antistatic layer (14) is less than 1.0E+12Ω.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321163304.0U CN220411464U (en) | 2023-05-15 | 2023-05-15 | Cover tape for packaging electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321163304.0U CN220411464U (en) | 2023-05-15 | 2023-05-15 | Cover tape for packaging electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220411464U true CN220411464U (en) | 2024-01-30 |
Family
ID=89655760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321163304.0U Active CN220411464U (en) | 2023-05-15 | 2023-05-15 | Cover tape for packaging electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220411464U (en) |
-
2023
- 2023-05-15 CN CN202321163304.0U patent/CN220411464U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |