CN220290779U - Transfer table, calibration device and die bonder - Google Patents

Abstract

The utility model relates to the field of die bonding, in particular to a transfer table, a calibration device and a die bonder, wherein the transfer table is used for bearing chips in a chip mounter/eutectic machine; comprises a transfer suction nozzle seat and a driving component; the top of the transfer suction nozzle seat is provided with an adsorption device for adsorbing and fixing the loaded chip; the driving component is connected with the bottom of the transfer suction nozzle seat and drives the transfer suction nozzle seat to rotate and/or move. The chip which is carried by the rotary suction nozzle seat is positioned and regulated through the driving component, and the chip can be accurately mounted only by corresponding to one datum point of the circuit board to be mounted during mounting, so that the accuracy of chip mounting is greatly improved.

Description

Transfer table, calibration device and die bonder

[ field of technology ]

The utility model relates to the technical field of die bonding, in particular to a transfer table, a calibration device and a die bonder.

[ background Art ]

Along with the continuous development of industrial technology, the technology of the semiconductor manufacturing industry is gradually improved, the integration level of a circuit board is higher and higher, the accuracy of chip positioning and mounting is required to be higher, and sometimes the position error of one chip is extremely small, but the mounting quality of the whole substrate is greatly affected after the errors of a large number of chips are overlapped. The position of the chip mounted on the circuit board is designed in advance precisely, and how to mount the chip in a precise positioning way to ensure the whole quality is a difficulty of the breakthrough of the current industry requirements.

[ utility model ]

In order to solve the problem of low chip mounting accuracy, the utility model provides a transfer table, a calibration device and a die bonder.

The utility model provides a transfer table for bearing chips in a chip mounter/eutectic machine; comprises a transfer suction nozzle seat and a driving component;

the top of the transfer suction nozzle seat is provided with an adsorption device for adsorbing and fixing the loaded chip; the driving component is connected with the bottom of the transfer suction nozzle seat and drives the transfer suction nozzle seat to rotate and/or move.

Preferably, the adsorption device comprises a connecting cavity, at least one adsorption hole and an extraction opening; the adsorption hole is arranged on the top surface of the transfer suction nozzle seat, the extraction opening is arranged on the side surface of the transfer suction nozzle seat, and the adsorption hole is communicated with the extraction opening through the connecting cavity.

Preferably, the driving assembly comprises a rotary driving piece, wherein the top of the rotary driving piece is connected with the bottom of the transfer nozzle seat and is used for driving the transfer nozzle seat to axially rotate.

Preferably, the driving assembly comprises a movable driving piece, the top of the movable driving piece is connected with the bottom of the transfer nozzle seat, and the movable driving piece drives the transfer nozzle seat to move along a preset track.

The utility model also provides a calibration device, which comprises a central control module, a mechanical arm and the central turntable;

the central control module is respectively and electrically connected with the transfer platform and the mechanical arm; the mechanical arm is provided with a position identification component;

the position identification component acquires the position information of the chip carried on the transfer table and sends the position information to the central control module, and the central control module compares the received position information with preset position information and correspondingly controls the transfer table and/or the mechanical arm to carry out position adjustment based on a comparison result.

Preferably, the mechanical arm is provided with a lifting driving piece and a translation driving piece, the translation driving piece controls the mechanical arm to move along the direction perpendicular to the preset track of the movement driving piece, and the lifting driving piece controls the mechanical arm to move along the up-down direction.

Preferably, the position recognition component comprises two cameras with different focal lengths, and the mechanical arm is further provided with a suction nozzle, wherein the suction nozzle is arranged between the two cameras and used for sucking chips borne on the middle turntable.

The utility model also provides a die bonder, which comprises a feeding device, a discharging device, a mounting assembly and the calibrating device.

Preferably, the mounting assembly comprises a glue dipping device and a mounting device, wherein the glue dipping device comprises a glue drawing area and a transfer disc, and the transfer disc is used for bearing the substrate.

Preferably, the mounting device comprises an operation table, the feeding device is used for conveying the substrate to the glue dipping device, the glue dipping device is used for dipping the substrate and conveying the dipped substrate to the operation table, and the calibration device is used for conveying the chip at the calibrated position to the operation table to be assembled with the substrate.

Compared with the prior art, the transfer table, the calibration device and the die bonder have the following advantages:

1. the transfer table is used for bearing chips in a chip mounter/eutectic machine; comprises a transfer suction nozzle seat and a driving component;

the top of the transfer suction nozzle seat is provided with an adsorption device for adsorbing and fixing the loaded chip; the driving component is connected with the bottom of the transfer suction nozzle seat and drives the transfer suction nozzle seat to rotate and/or move. The transfer suction nozzle seat is driven to move through the driving component, so that the chip borne on the transfer suction nozzle seat is positioned and adjusted, and the efficiency and the accuracy of chip mounting are improved.

2. The adsorption device comprises a connecting cavity, at least one adsorption hole and an extraction opening; the absorption hole sets up at transfer suction nozzle seat top surface, and the extraction opening sets up in transfer suction nozzle seat side, and the absorption hole passes through the connecting chamber with the extraction opening and communicates. When the adsorption device works, air enters from the adsorption hole and exits from the extraction hole, the chip is fixed by the suction force generated by air flow, and the chip can be firmly designed without damage to the chip.

3. The driving component comprises a rotary driving piece, wherein the top of the rotary driving piece is connected with the bottom of the transfer nozzle seat and is used for driving the transfer nozzle seat to axially rotate. The axial rotation of the transfer suction nozzle seat can adjust the axial angle error of the chip.

4. The driving component comprises a movable driving piece, wherein the top of the movable driving piece is connected with the bottom of the transfer nozzle seat, and the movable driving piece drives the transfer nozzle seat to move along a preset track. The design of the movable driving piece can adjust the position error of the chip in the preset track direction.

5. The utility model also provides a calibration device, which comprises a central control module, a mechanical arm and the central turntable;

the central control module is respectively and electrically connected with the central turntable and the mechanical arm; the mechanical arm is provided with a position identification component;

the position identification component acquires the position information of the chip carried on the transfer table and sends the position information to the central control module, and the central control module compares the received position information with preset position information and correspondingly controls the transfer table and/or the mechanical arm to carry out position adjustment based on a comparison result. The direction and the displacement of the chip to be adjusted are obtained by comparing the actual position of the chip with the preset position of the chip, and the turntable and the mechanical arm are controlled to be adjusted synchronously in different directions, so that the chip returns to the preset position, and the chip mounting efficiency and accuracy are improved.

6. The mechanical arm is provided with a lifting driving piece and a translation driving piece, the translation driving piece controls the mechanical arm to move along the direction perpendicular to the preset track of the movement driving piece, and the lifting driving piece controls the mechanical arm to move along the up-down direction. The mechanical arm moves to the position above the chip through the driving piece, namely the position error of the chip in the moving direction of the mechanical arm can be adjusted through the movement of the mechanical arm, and the chip is not dependent on the turntable; because the mechanical arm and the middle rotary table can work simultaneously, the chip can adjust the positions in two directions simultaneously, and the chip adjusting efficiency is greatly improved.

7. The position identification assembly comprises two cameras with different focal lengths, and the mechanical arm is also provided with a suction nozzle which is arranged between the two cameras and used for sucking chips borne on the turntable. Through setting up the camera of different focal lengths for the chip size who bears does not need extra change the camera when changing, has further improved the practicality.

8. The utility model also provides a die bonder, which has the same beneficial effects as the above-mentioned transfer table and calibration device, and will not be described herein.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of the overall structure of a transfer platform according to a first embodiment of the present utility model.

Fig. 2 is an exploded view of a transfer table according to a first embodiment of the present utility model.

Fig. 3 is a cross-sectional view of a transfer nozzle base of a transfer table according to a first embodiment of the present utility model.

Fig. 4 is a schematic diagram of the whole structure of a calibration device according to a second embodiment of the present utility model.

FIG. 5 is a schematic diagram of a calibration device according to a second embodiment of the present utility model

Fig. 6 is a flowchart illustrating steps of a calibration method according to a second embodiment of the present utility model.

Fig. 7 is a detailed flowchart of the calibration method step S1 according to the second embodiment of the present utility model.

Fig. 8 is a detailed flowchart of the calibration method step S2 according to the second embodiment of the present utility model.

Fig. 9 is a schematic structural diagram of a die bonder according to a third embodiment of the utility model.

Fig. 10 is a flowchart illustrating steps of a die bonding method according to a third embodiment of the present utility model.

Fig. 11 is a detailed flowchart of a step F2 of the die bonding method according to the third embodiment of the utility model.

Fig. 12 is a flowchart showing another detail of the step F2 of the die bonding method according to the third embodiment of the utility model.

The attached drawings are used for identifying and describing:

1. a transfer table; 2. a mechanical arm; 3. a central control module; 100. a substrate feeding device; 200. a glue dipping device; 300. an operation table; 400. a calibration device; 500. chip loading device; a blanking device 600;

11. a transfer nozzle seat; 12. a drive assembly; 21. a location identification component;

111. an adsorption device; 121. a rotary driving member; 122 moving the driving member; 211. a camera; 212. a suction nozzle;

1111. adsorption holes; 1112. an extraction opening; 1113. and a connecting cavity.

[ detailed description ] of the utility model

The present utility model will be described in further detail with reference to the accompanying drawings and examples of implementation in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

In the present utility model, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present utility model and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.

Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present utility model will be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the terms "mounted," "configured," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; may be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements, or components. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Referring to fig. 1 and 2, a first embodiment of the present utility model provides a transfer table 1 for carrying chips in a chip mounter/eutectic machine; comprises a transfer nozzle seat 11 and a driving component 12 connected with one end of the transfer nozzle seat 11; the transfer nozzle seat 11 is used for adsorbing the chip to be transferred, and the driving component 12 drives the transfer nozzle seat 11 to rotate and/or move, so that positioning adjustment of the chip adsorbed on the transfer nozzle seat 11 is realized, and the efficiency and accuracy of chip mounting are improved.

Specifically, referring to fig. 3, an adsorption device 111 is disposed at an end of the transfer nozzle seat 11 away from the driving component 12, and the adsorption device 111 includes a connection cavity 1113, at least one adsorption hole 1111, and an extraction opening 1112. The adsorption hole 1111 is formed in the top surface of the end, far away from the driving component 12, of the transfer nozzle seat 11, and the air suction opening 1112 is formed in the side surface of the transfer nozzle seat 11, and the adsorption hole 1111 is communicated with the air suction opening 1112 through the connecting cavity 1113. The adsorption device 111 adsorbs and fixes the loaded chip through the adsorption holes 1111.

It will be appreciated that the suction opening 1112 may be connected to an external suction device, the suction hole 1111 is communicated with the suction opening 1112 through the connection cavity 1113, and when the suction device is in operation, air flows from the suction hole 1111 to the suction opening 1112 through the connection cavity 1113, the chip covered on the suction hole 1111 is fixed on the upper surface of the transfer nozzle seat 11 by air suction, and meanwhile, the air suction will not damage the surface of the chip, so that the chip can be perfectly fixed on the transfer nozzle seat 11.

It should be noted that, the transfer nozzle seat 11 may be provided with a plurality of adsorption holes 1111 with the same or different diameters to correspondingly place chips with different sizes. It should be appreciated that the size of the chip should be larger than the adsorption holes 1111 that it covers to avoid the chip from falling into the connection cavity 1113 through the adsorption holes 1111. The large-size chip needs larger suction force to be stable, so that the large suction hole is needed to be matched with the air extraction equipment to manufacture the larger suction force for sucking the chip when carrying the large-size chip. The plurality of adsorption holes 1111 with different diameters are arranged on the transfer nozzle seat 11 to be suitable for chips with different sizes, so that the practicability of the transfer table 1 is improved.

Specifically, the adsorption holes 1111 may be arranged on the upper surface of the relay nozzle seat 11 in a straight line, may be arranged on the upper surface of the relay nozzle seat 11 in a staggered manner, or may be arranged on the upper surface of the relay nozzle seat 11 in an array surrounding manner. The setting may be specifically performed according to actual conditions, and is not limited herein.

As can be appreciated, the transfer table 1 is used to carry chips during die bonding, the chips are placed on the suction holes 1111 on the upper surface of the transfer nozzle base 11, the suction holes 1111 are partially or completely covered, and the suction device 111 generates suction force so that the chips are fixed on the transfer nozzle base 11.

Further, reference points are defined on the transfer table 1 to facilitate the calibration of the chip position or for the calibration of external vision components.

Optionally, the center point defining the adsorption hole 1111 is a reference point; or, a reference point is provided at an arbitrary position on the top surface of the transfer table 1 spaced from the suction hole 1111.

Specifically, the center point defining the adsorption hole 1111 is defined as a reference point, and a chip fixing region is defined within a certain range with the reference point as the center. When the chip is placed on the chip fixing area, the center of the chip is opposite to the datum point, and the phenomenon that the chip is overturned due to uneven suction is avoided. It should be understood that errors are inevitably generated when the chip is transferred to the relay nozzle holder 11 and is fixed by suction, and the driving assembly 12 drives the relay nozzle holder 11 to move so as to adjust the chip position.

It will be appreciated that when a reference point is set at any position spaced from the suction hole 1111, there is also a determinable distance relationship between the boundary of the chip defining region and the reference point.

Referring to fig. 2 again, further, the driving assembly 12 includes a rotation driving member 121, and the top of the rotation driving member 121 is connected to the bottom of the relay nozzle seat 11 for driving the relay nozzle seat 11 to axially rotate so as to adjust the axial angle error of the chip.

It can be understood that when the chip is placed on the transfer nozzle seat 11, the accuracy limited by the device may generate an error of a placement angle, so that the actual placement position of the chip may be in error with the preset position, the transfer nozzle seat 11 is driven to axially rotate by the rotation driving member 121, and specifically, the axial rotation of the transfer nozzle seat 11 means that the transfer nozzle seat 11 rotates around an R axis located at a center point of an upper surface of the transfer nozzle seat 11 and perpendicular to the upper surface of the transfer nozzle seat 11, so as to adjust an angle error generated when the chip is placed.

Further, the driving assembly 12 includes a moving driving member 122, the top of the moving driving member 122 is connected to the bottom of the relay nozzle seat 11, and the moving driving member 122 drives the relay nozzle seat 11 to move along a preset track to adjust the position error of the chip in the preset track direction.

It will be appreciated that the chip may be displaced in other directions than the error in the angle of placement when placed. In the present embodiment, the preset track of the moving driving member 122 is the width direction of the transfer nozzle seat 11, i.e. the Y-axis direction; the moving driving member 122 drives the transfer nozzle base 11 to move in the Y-axis direction, so as to eliminate the position error of the chip on the Y-axis.

The movement driving member 122 may be a Y-axis movement, an X-axis movement, or a movement in other directions, and may be specifically set according to the actual situation, and is not limited herein.

It should be noted that, the chip is initially placed in the loading area, the chip in the loading area is identified by the position identifying component 21 on the mechanical arm 2, the identified chip is sucked, then the mechanical arm 2 moves to the upper side of the transfer table 1, the sucked chip is placed in the chip fixing area on the upper surface of the transfer nozzle seat 11 by the reference point on the upper surface of the transfer nozzle seat 11 of the position identifying component 21 on the mechanical arm 2, and finally the chip is sucked by the suction device 111 of the transfer table 1, and is fixed on the transfer table 1.

Referring to fig. 4 and 5, a calibration device 400 is further provided according to a second embodiment of the present utility model, which includes a central control module 3, a mechanical arm 2, and a transfer table 1 as described above.

The central control module 3 is respectively and electrically connected with the transfer table 1 and the mechanical arm 2; the mechanical arm 2 is provided with a position identification component 21;

the position recognition component 21 acquires the position information of the chip carried on the turntable 1 and sends the position information to the central control module 3, the central control module 3 compares the received position information with preset position information, if the actual position of the chip is consistent with the preset position, the chip position does not need to be regulated, and the mechanical arm 2 can directly absorb the chip; if the actual position of the chip deviates from the preset position, the central control module 3 calculates the deviation direction and the deviation amount of the actual position of the chip from the preset position, and correspondingly controls the adjustment of the corresponding direction and displacement of the turntable 1 and/or the mechanical arm 2 according to the calculated deviation direction and the calculated deviation amount.

As can be appreciated, during calibration, the mechanical arm 2 is moved above the turntable 1 first, and then the camera 211 arranged on the mechanical arm 2 is used to take a picture to obtain the position information of the chip on the turntable 1; the central control module 3 performs position identification and position comparison on the photo, calculates the deviation direction and the deviation amount of the actual chip position and the preset position when the actual chip position deviates from the preset position, generates an adjusting instruction according to the calculated deviation direction and the calculated deviation amount, controls the central turntable 1 to adjust the R axis and/or the Y axis according to the adjusting instruction, and controls the mechanical arm 2 to adjust and move to the upper part of the chip in the X axis. It should be understood that the transfer table 1 may perform movement along the R axis and/or the Y axis, and the mechanical arm 2 may perform movement along the X axis; the combination of the two can adjust the chip to any position.

It can be understood that the mechanical arm 2 and the turntable 1 are two independent structures in the calibration device 400, and the movement between the two structures is not blocked, so that the movement adjustment of the turntable 1 and the mechanical arm 2 can be performed synchronously, so as to improve the adjustment efficiency.

Referring to fig. 6-8, the calibration device 400 calibrates the chip by:

s1: transferring the chip from the feeding area to the transfer table 1 through the mechanical arm 2;

s2: the chip pattern on the transfer table is acquired through the position identification component on the mechanical arm, the chip pattern contains the azimuth information of the chip, the chip pattern is compared with the preset pattern, and the azimuth of the chip is adjusted through the transfer table based on the comparison result.

It should be noted that the azimuth information of the chip includes the offset of the chip position and the preset position in each direction.

Further, step S1 specifically fixes the chip on the transfer table 1 by the following steps.

S11: the chip in the feeding area is identified 21 through a position identification component on the mechanical arm 2, and the identified chip is absorbed through the mechanical arm 2;

s12: recognizing a reference point on the transfer table 1 through a position recognition component 21 on the mechanical arm 2, and placing the sucked chip in a chip fixing area on the transfer table 1;

s13: the chip is adsorbed by the transfer table 1, and the chip is fixed.

Further, after the chip is fixed, the position recognition component 21 obtains the position information of the chip and sends the position information to the central control module 3, the central control module 3 compares the received position information with preset position information, if the actual position of the chip is consistent with the preset position, the position of the chip is not required to be regulated, and the mechanical arm 2 can directly absorb the chip; if the actual position of the chip deviates from the preset position, the central control module 3 calculates the deviation direction and the deviation amount of the actual position of the chip from the preset position, and correspondingly controls the adjustment of the corresponding direction and displacement of the turntable 1 and/or the mechanical arm 2 according to the calculated deviation direction and the calculated deviation amount. The method specifically comprises the following steps:

s21: acquiring the position information of the chip on the turntable through a visual identification component 21 on the mechanical arm 2;

s22: comparing the obtained chip position information with preset chip position information to obtain the deviation direction and the deviation amount between the actual chip and the preset chip position;

s23: generating a regulating instruction of the middle rotary table 1 according to the obtained deviation direction and the deviation amount;

s24: and controlling the turntable 1 to perform position adjustment according to the adjustment instruction of the turntable 1.

It will be appreciated that in this embodiment, the turntable 1 is adjusted only in the R-axis and Y-axis, the error in the X-axis being adjusted by the robot arm 2.

Further, a lifting driving piece and a translation driving piece are arranged on the mechanical arm 2, the translation driving piece controls the mechanical arm 2 to move along the direction perpendicular to the preset track of the movement driving piece, and the lifting driving piece controls the mechanical arm 2 to move along the up-down direction.

It should be noted that, in this embodiment, the translation driving member of the mechanical arm 2 controls the mechanical arm 2 to move along the direction of the transfer table 1, i.e. the X-axis direction. The mechanical arm 2 moves to the position above the chip according to the instruction of the central control module 3, the moving distance at this time includes the offset error amount of the chip in the X axis, it should be understood that the central turntable 1 does not adjust the error in the X axis direction, that is, the chip adjusted by the central turntable 1 may have an error in the X axis direction, and at this time, the error in the X axis direction is eliminated by the movement of the mechanical arm 2 in the X axis, that is, the mechanical arm 2 moves to the suction nozzle 212 opposite to the reference point on the central turntable 1. The lifting driving piece controls the mechanical arm to descend to be close to the chip so as to suck the chip.

Further, the position recognition assembly 21 includes two cameras 211 with different focal lengths, the mechanical arm 2 is further provided with a suction nozzle 212, and the suction nozzle 212 is disposed between the two cameras 211 and is used for sucking the chip carried on the intermediate turntable 1.

It will be appreciated that the position recognition component 21 is implemented by taking a picture through the camera 211 and then performing picture recognition on the picture. The position recognition assembly 21 includes a long focal length camera 211 and a short focal length camera 211 for recognizing a small-sized chip and a large-sized chip, respectively. The position recognition component 21 can adaptively select the corresponding camera 211 to photograph according to the chip size placed on the transfer table 1, so that the operation of replacing the camera 211 due to the chip size change is reduced, and the practicability is improved.

The suction nozzle 212 is disposed between the two cameras 211, and the imaging points of the two cameras 211 are all directly below the suction nozzle 212. When the mechanical arm 2 moves above the chip, the center point of the suction nozzle 212 is opposite to the center point of the chip, and at this time, the mechanical arm 2 moves down to suck the chip by the suction nozzle 212.

Referring to fig. 9, a die bonder is further provided according to a third embodiment of the present utility model, which includes a loading device, a unloading device 600, a mounting assembly, and the calibration device 400 as described above.

Further, the mounting assembly comprises a glue dipping device 200 and a mounting device, a glue drawing area and a transfer disc are arranged on the glue dipping device 200, the transfer disc is arranged in the glue drawing area, and the transfer disc is used for bearing the substrate. After a plurality of substrates are placed on the transfer disc, the transfer disc is placed on a glue drawing area, so that single feeding of the plurality of substrates can be realized; and in the same way, a plurality of substrates with glue painting completed are moved to the transfer disc and then are sent to the operation area, so that the single feeding of a plurality of substrates can be realized. By this operation, the patch efficiency can be greatly improved.

It should be noted that, the loading device includes a substrate loading device 100 and a chip loading device 500, and the substrate loading device 100 is disposed near the glue dipping device 200, so as to shorten the substrate transportation path and provide overall die bonding efficiency.

Further, the mounting device includes an operation table 300, the loading device is used for conveying the substrate to the glue dipping device 200, the glue dipping device 200 dips the substrate and conveys the dipped substrate to the operation table 300, and the calibration device 400 conveys the chip in the calibrated position to the operation table to be assembled with the substrate.

As can be appreciated, the whole process of die bonding by the die bonder is as follows: firstly, the substrate feeding device 100 conveys the substrate to the glue dipping device 200 for glue dipping treatment, and the chip feeding device 500 conveys the chip to the transfer table 1 of the calibration device 400 for position calibration; and then the dipped substrate is sent to a preset position of the operation table 300 by using the movable mechanical arm 2, and finally the calibrated chip is transported to the preset position of the operation table 300 for mounting with the substrate.

Referring to fig. 10, the following die bonding method is specifically used to achieve die bonding, and includes the following steps:

f1: the chip feeding device 500 acquires a chip and calibrates the chip by using the calibration device 400;

f2: the substrate feeding device 100 obtains a substrate, places the substrate in a glue drawing area of the glue dipping device 200, and performs glue drawing/dispensing on a preset position on the substrate;

f3: moving at least one substrate after finishing the painting/dispensing to an operation area on the operation table 300;

f4: the calibrated chip is movably attached to a substrate in an operation area and is placed at a preset position on the corresponding substrate;

and F5: the substrate on which the chip mounting is completed is subjected to blanking by the blanking device 600.

It will be appreciated that the purpose of both the painting and dispensing is to better secure the chip to the substrate. It should be understood that the drawing glue is to draw a certain line segment or pattern on the substrate by using glue, and the dispensing is to dispense glue at a corresponding position on the substrate; the specific implementation flow of the two methods has certain differences.

Referring to fig. 11 and 12, specifically, the following steps are applied to draw the glue on the substrate;

F21A: identifying a preset position on the substrate by a position identification component 21 on the mechanical arm 2;

F22A: and drawing glue at a preset position through a glue supply device on the mechanical arm 2.

Dispensing the substrate by the following steps:

F21B: identifying a preset position on the substrate by a position identification component 21 on the mechanical arm 2;

F22B: the mechanical arm 2 moves to the glue feeding device for glue dipping;

F22B: and (5) dipping the dipped glue to a preset position.

Compared with the prior art, the chip calibration method, the die bonding method and the die bonding device provided by the utility model have the following beneficial effects:

1. the chip calibration method provided by the embodiment of the utility model comprises the following steps:

s1: transferring the chip from the feeding area to a transfer table through a mechanical arm;

s2: the chip pattern on the transfer table is acquired through the position identification component on the mechanical arm, the chip pattern contains the azimuth information of the chip, the chip pattern is compared with the preset pattern, and the azimuth of the chip is adjusted through the transfer table based on the comparison result. The rotation and/or movement adjustment of the middle rotary table can eliminate the position deviation of the middle rotary table when the chip is placed, so that the accuracy of the patch is improved.

2. The step S1 of the embodiment of the utility model specifically further comprises the following steps:

s11: the chip in the feeding area is identified through a position identification component on the mechanical arm, and the identified chip is absorbed through the mechanical arm;

s12: identifying a datum point on the turntable through a position identification component on the mechanical arm, and placing the sucked chip in a chip fixing area on the turntable;

s13: and the chip is adsorbed by the transfer table, so that the chip is fixed.

Providing the setting of the chip fixing area and the identification of the reference point avoids a large positional shift when the chip is placed.

3. The step S2 of the embodiment of the utility model specifically further comprises the following steps:

s21: acquiring a chip pattern on the turntable through a position identification component on the mechanical arm;

s22: comparing the obtained chip pattern with a preset chip pattern to obtain the azimuth difference between the chip and the preset chip pattern;

s23: generating a transfer table adjusting instruction according to the obtained azimuth difference;

s24: and controlling the transfer table to carry out azimuth adjustment according to the transfer table adjusting instruction.

According to the deviation between the actual position of the chip and the preset position, the turntable is used for adjusting and eliminating the deviation in the correspondence control, so that the accuracy of the patch is ensured.

4. The transfer table adjustment instruction of the embodiment of the utility model comprises movement and rotation. The transfer table can move in multiple directions, so that the efficiency and accuracy of chip position adjustment are improved.

5. The embodiment of the utility model also provides a die bonding method, which comprises the chip calibration method according to any one of the above, and specifically comprises the following steps:

f1: acquiring a chip and calibrating the chip by adopting the chip calibration method according to any one of the above;

f2: obtaining a substrate, placing the substrate in a glue drawing area, and carrying out glue drawing/dispensing on a preset position on the substrate;

f3: moving at least one substrate after finishing painting/dispensing to an operation area;

f4: the calibrated chip is movably attached to a substrate in an operation area and is placed at a preset position on the corresponding substrate;

and F5: and (5) blanking the substrate on which the chip is attached. Before the chip is mounted, the chip is calibrated and adjusted, so that the position deviation before the chip is mounted is eliminated, and the accuracy of the chip mounting is improved.

6. The transfer of the chip, the transfer of the substrate and the mounting of the chip in the embodiment of the utility model can be operated by the same mechanical arm or different mechanical arms. The same mechanical arm is used for operation, so that the arrangement of the mechanical arm can be reduced, and the cost is reduced; and a plurality of relations can be synchronously carried out by adopting different mechanical arms for operation, so that the patch efficiency is greatly improved.

7. The middle rotary table is arranged in the glue drawing area, and can be used for finishing the feeding of a plurality of substrates (placed in the glue drawing area) at a time, and also can be used for moving a plurality of substrates subjected to glue drawing to the operation area. The loading and unloading of a plurality of base plates of single completion has improved paster efficiency greatly.

8. The embodiment of the utility model also provides a die bonding device, which can realize the die bonding method according to any one of the above, and has the same beneficial effects as the chip calibration method or the die bonding method, and will not be described herein.

Compared with the prior art, the transfer table, the calibration device and the die bonder have the following advantages:

1. the transfer table is used for bearing chips in a chip mounter/eutectic machine; comprises a transfer suction nozzle seat and a driving component;

the top of the transfer suction nozzle seat is provided with an adsorption device for adsorbing and fixing the loaded chip; the driving component is connected with the bottom of the transfer suction nozzle seat and drives the transfer suction nozzle seat to rotate and/or move. The transfer suction nozzle seat is driven to move through the driving component, so that the chip borne on the transfer suction nozzle seat is positioned and adjusted, and the efficiency and the accuracy of chip mounting are improved.

2. The adsorption device comprises a connecting cavity, at least one adsorption hole and an extraction opening; the absorption hole sets up at transfer suction nozzle seat top surface, and the extraction opening sets up in transfer suction nozzle seat side, and the absorption hole passes through the connecting chamber with the extraction opening and communicates. When the adsorption device works, air enters from the adsorption hole and exits from the extraction hole, the chip is fixed by the suction force generated by air flow, and the chip can be firmly designed without damage to the chip.

3. The driving component comprises a rotary driving piece, wherein the top of the rotary driving piece is connected with the bottom of the transfer nozzle seat and is used for driving the transfer nozzle seat to axially rotate. The axial rotation of the transfer suction nozzle seat can adjust the axial angle error of the chip.

4. The driving assembly comprises a moving driving piece, wherein the top of the moving driving piece is connected with the bottom of the rotating driving piece, and the moving driving piece drives the transfer suction nozzle seat to move along a preset track. The design of the movable driving piece can adjust the position error of the chip in the preset track direction.

5. The utility model also provides a calibration device, which comprises a central control module, a mechanical arm and the central turntable;

the central control module is respectively and electrically connected with the central turntable and the mechanical arm; the mechanical arm is provided with a position identification component;

the position identification component acquires the position information of the chip carried on the transfer table and sends the position information to the central control module, and the central control module compares the received position information with preset position information and correspondingly controls the transfer table and/or the mechanical arm to carry out position adjustment based on a comparison result. The direction and the displacement of the chip to be adjusted are obtained by comparing the actual position of the chip with the preset position of the chip, and the turntable and the mechanical arm are controlled to be adjusted synchronously in different directions, so that the chip returns to the preset position, and the chip mounting efficiency and accuracy are improved.

6. The mechanical arm is provided with a lifting driving piece and a translation driving piece, the translation driving piece controls the mechanical arm to move along the direction perpendicular to the preset track of the movement driving piece, and the lifting driving piece controls the mechanical arm to move along the up-down direction. The mechanical arm moves to the position above the chip through the driving piece, namely the position error of the chip in the moving direction of the mechanical arm can be adjusted through the movement of the mechanical arm, and the chip is not dependent on the turntable; because the mechanical arm and the middle rotary table can work simultaneously, the chip can adjust the positions in two directions simultaneously, and the chip adjusting efficiency is greatly improved.

7. The position identification assembly comprises two cameras with different focal lengths, and the mechanical arm is also provided with a suction nozzle which is arranged between the two cameras and used for sucking chips borne on the turntable. Through setting up the camera of different focal lengths for the chip size who bears does not need extra change the camera when changing, has further improved the practicality.

8. The utility model also provides a die bonder, which has the same beneficial effects as the above-mentioned transfer table and calibration device, and will not be described herein.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the utility model, but any modifications, equivalents, improvements, etc. within the principles of the present utility model should be included in the scope of the present utility model.

Claims (10)

1. A transfer table for bearing chips in a chip mounter/eutectic machine; the method is characterized in that: comprises a transfer suction nozzle seat and a driving component;

the top of the transfer suction nozzle seat is provided with an adsorption device for adsorbing and fixing the loaded chip; the driving component is connected with the bottom of the transfer nozzle seat and drives the transfer nozzle seat to rotate and move along a preset track, and the preset track is along the Y axis of the transfer nozzle seat or the X axis direction corresponding to the Y axis.

2. A transfer table as claimed in claim 1, characterized in that: the adsorption device comprises a connecting cavity, at least one adsorption hole and an extraction opening; the adsorption hole is arranged on the top surface of the transfer suction nozzle seat, the extraction opening is arranged on the side surface of the transfer suction nozzle seat, and the adsorption hole is communicated with the extraction opening through the connecting cavity.

3. A transfer table as claimed in claim 1, characterized in that: the driving assembly comprises a rotary driving piece, wherein the top of the rotary driving piece is connected with the bottom of the transfer nozzle seat and is used for driving the transfer nozzle seat to axially rotate.

4. A transfer table as claimed in claim 1, characterized in that: the driving assembly comprises a movable driving piece, the top of the movable driving piece is connected with the bottom of the transfer nozzle seat, and the movable driving piece drives the transfer nozzle seat to move along a preset track.

5. A calibration device, characterized by: comprising a central control module, a robotic arm and a central turret according to any one of claims 1-4;

the central control module is respectively and electrically connected with the transfer platform and the mechanical arm; the mechanical arm is provided with a position identification component;

the position identification component acquires the position information of the chip carried on the transfer table and sends the position information to the central control module, and the central control module compares the received position information with preset position information and correspondingly controls the transfer table and/or the mechanical arm to carry out position adjustment based on a comparison result.

6. The calibration device of claim 5, wherein: the mechanical arm is provided with a lifting driving piece and a translation driving piece, the translation driving piece controls the mechanical arm to move along the direction perpendicular to the preset track of the movement driving piece, and the lifting driving piece controls the mechanical arm to move along the up-down direction.

7. The calibration device of claim 5, wherein: the position identification assembly comprises two cameras with different focal lengths, a suction nozzle is further arranged on the mechanical arm, and the suction nozzle is arranged between the two cameras and used for sucking chips borne on the transfer table.

8. A die bonder, which is characterized in that: comprising a loading device, a unloading device, a mounting assembly and a calibration device according to any one of claims 5-7.

9. The die bonder as claimed in claim 8, wherein: the mounting assembly comprises a glue dipping device and a mounting device, wherein the glue dipping device comprises a glue drawing area and a transfer disc, and the transfer disc is used for bearing a substrate.

10. The die bonder as claimed in claim 9, wherein: the mounting device comprises an operation table, the feeding device is used for conveying the substrate to the glue dipping device, the glue dipping device is used for dipping the substrate and conveying the dipped substrate to the operation table, and the calibration device is used for conveying the chip at the calibrated position to the operation table for assembly with the substrate.