CN220122327U - Laser module and medical device - Google Patents
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- CN220122327U CN220122327U CN202321621673.XU CN202321621673U CN220122327U CN 220122327 U CN220122327 U CN 220122327U CN 202321621673 U CN202321621673 U CN 202321621673U CN 220122327 U CN220122327 U CN 220122327U
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- 230000003287 optical effect Effects 0.000 claims abstract description 190
- 238000007493 shaping process Methods 0.000 claims abstract description 34
- 230000006835 compression Effects 0.000 claims abstract description 18
- 238000007906 compression Methods 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims description 44
- 239000004065 semiconductor Substances 0.000 claims description 25
- 239000000523 sample Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims 3
- 238000000034 method Methods 0.000 abstract description 4
- 238000009434 installation Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000002826 coolant Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 208000003351 Melanosis Diseases 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012994 industrial processing Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/18—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves
- A61B18/20—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by applying electromagnetic radiation, e.g. microwaves using laser
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N5/00—Radiation therapy
- A61N5/06—Radiation therapy using light
- A61N5/067—Radiation therapy using light using laser light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
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- H—ELECTRICITY
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0239—Combinations of electrical or optical elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
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Abstract
Description
技术领域Technical field
本申请涉及光学技术领域,具体而言,涉及一种激光模组和医疗装置。This application relates to the field of optical technology, specifically, to a laser module and a medical device.
背景技术Background technique
高功率半导体激光器具有体积小、重量轻、效率高、寿命长等优点,已广泛用于工业加工、熔覆、泵浦以及医疗等领域,成为新世纪发展快、成果多、学科渗透广、应用范围大的核心器件之一。High-power semiconductor lasers have the advantages of small size, light weight, high efficiency, and long life. They have been widely used in industrial processing, cladding, pumping, medical and other fields. They have become a fast-developing, multi-awarded, widely penetrated, and widely used device in the new century. One of the core devices with a wide range of products.
在医疗美容领域,激光的主要应用在于祛斑、脱毛等。然而,现有的半导体激光器产品所输出的光斑规格尺寸固定,在使用过程中无法根据需求灵活切换光斑,且均匀度也欠佳,使得半导体激光设备的应用受到了很大的限制,难以满足多场景的使用需求。In the field of medical beauty, the main applications of laser are freckle removal, hair removal, etc. However, the spot size output by existing semiconductor laser products is fixed, and the spot cannot be flexibly switched according to needs during use, and the uniformity is also poor, which greatly limits the application of semiconductor laser equipment and makes it difficult to meet the needs of many users. Scenario usage requirements.
实用新型内容Utility model content
本申请的目的在于,针对上述现有技术中的不足,提供一种激光模组和医疗装置。The purpose of this application is to provide a laser module and a medical device to address the above deficiencies in the prior art.
为实现上述目的,本申请实施例采用的技术方案如下:In order to achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:
本申请实施例的一方面,提供一种激光模组,包括固定座和多个光学头,多个光学头用于替换设置于固定座的出光侧,在固定座内沿光路依次设置有光源和快轴压缩单元,在光学头内设置有整形单元,光源出射的光束经快轴压缩单元在快轴方向压缩后由整形单元整形并出射形成均匀光斑,其中,经任意两个光学头出射的均匀光斑的尺寸不同。In one aspect of the embodiment of the present application, a laser module is provided, including a fixed base and a plurality of optical heads. The plurality of optical heads are used to replace the light exit side of the fixed base. A light source and a light source are sequentially arranged along the optical path in the fixed base. The fast axis compression unit is provided with a shaping unit in the optical head. The light beam emitted by the light source is compressed in the fast axis direction by the fast axis compression unit and then shaped by the shaping unit and emitted to form a uniform spot. Among them, the light beam emitted by any two optical heads is uniform. The sizes of the light spots vary.
可选的,固定座包括相互固定的光源基座和冷却基座,光源和快轴压缩单元均设置于光源基座内,光学头可拆卸的设置于冷却基座,在冷却基座内设置有用于对光源基座和光学头散热的第一冷却通路。Optionally, the fixed base includes a light source base and a cooling base that are fixed to each other. The light source and the fast axis compression unit are both arranged in the light source base. The optical head is detachably arranged in the cooling base. It is useful to set it in the cooling base. The first cooling path is used to dissipate heat from the light source base and the optical head.
可选的,第一冷却通路包括U形通路以及分别连接于U形通路两端的输入通路和输出通路,冷却基座具有用于连接光学头的连接部,U形通路分布于连接部内以至少对光学头散热。Optionally, the first cooling passage includes a U-shaped passage and an input passage and an output passage respectively connected to both ends of the U-shaped passage. The cooling base has a connection part for connecting the optical head, and the U-shaped passage is distributed in the connection part to at least Optical head heat dissipation.
可选的,在输入通路和输出通路之间还连通有与U形通路并联的支路,U形通路的流通截面的面积大于支路的流通截面的面积。Optionally, a branch path connected in parallel with the U-shaped path is connected between the input path and the output path, and the area of the circulation cross-section of the U-shaped path is larger than the area of the circulation cross-section of the branch path.
可选的,在光源基座内还设置有第二冷却通路,第二冷却通路的输入端口和输出端口沿输入通路的流通方向依次间隔的连通至输入通路。Optionally, a second cooling channel is also provided in the light source base, and the input port and the output port of the second cooling channel are connected to the input channel at intervals along the flow direction of the input channel.
可选的,激光模组还包括半导体制冷器,光学头经半导体制冷器连接于冷却基座,半导体制冷器的热面与冷却基座贴合,半导体制冷器的冷面用于对光学头散热。Optionally, the laser module also includes a semiconductor refrigerator. The optical head is connected to the cooling base through the semiconductor refrigerator. The hot surface of the semiconductor refrigerator is attached to the cooling base. The cold surface of the semiconductor refrigerator is used to dissipate heat from the optical head. .
可选的,在光学头上设置有第一凹槽,在第一凹槽内嵌设有第一磁吸部,固定座还包括设置于冷却基座的磁吸座,在磁吸座上设置有第二凹槽,在第二凹槽内嵌设有用于与第一磁吸部贴合的第二磁吸部。Optionally, a first groove is provided on the optical head, and a first magnetic suction part is embedded in the first groove. The fixing base further includes a magnetic suction base provided on the cooling base, and is provided on the magnetic suction base. There is a second groove, and a second magnetic attraction part for fitting with the first magnetic attraction part is embedded in the second groove.
可选的,在磁吸座上设置有多个探针,在光学头上设置有用于与部分探针接触的触点,任意两个光学头上的触点所接触的探针不同。Optionally, a plurality of probes are provided on the magnetic base, and contacts for contacting some of the probes are provided on the optical head. The contacts on any two optical heads contact different probes.
可选的,在固定座和光学头上分别设置有相互配合插接的定位销和定位孔。Optionally, the fixing base and the optical head are respectively provided with positioning pins and positioning holes that are mated with each other.
可选的,整形单元包括导光元件,在光学头内设置有限位台阶和压框,压框用于配合限位台阶将导光元件夹持固定于光学头;Optionally, the shaping unit includes a light guide element, and a limit step and a pressure frame are provided in the optical head. The pressure frame is used to clamp and fix the light guide element to the optical head in conjunction with the limit step;
或,整形单元包括沿光路依次设置的多个第一光学透镜,在光学头内设置有限位台阶和压框,压框用于配合限位台阶将多个第一光学透镜夹持固定于光学头,在相邻第一光学透镜之间还设置有间隔圈。Or, the shaping unit includes a plurality of first optical lenses arranged sequentially along the optical path, and a limiting step and a pressing frame are provided in the optical head. The pressing frame is used to clamp and fix the plurality of first optical lenses to the optical head in conjunction with the limiting step. , a spacer ring is also provided between adjacent first optical lenses.
可选的,当整形单元包括导光元件时,导光元件为光波导,整形单元还包括第二光学透镜,光波导穿设于光学头内,且位于第二光学透镜的出光侧;自第二光学透镜出射的光束能够通过光波导后出射。Optionally, when the shaping unit includes a light guide element, the light guide element is an optical waveguide, and the shaping unit also includes a second optical lens, and the optical waveguide is installed in the optical head and is located on the light exit side of the second optical lens; The light beams emitted from the two optical lenses can pass through the optical waveguide and then be emitted.
可选的,当整形单元包括导光元件时,导光元件为导光柱,整形单元还包括第二光学透镜,导光柱穿设于光学头内,且位于第二光学透镜的出光侧;自第二光学透镜出射的光束能够通过导光柱后出射。Optionally, when the shaping unit includes a light guide element, the light guide element is a light guide column, and the shaping unit also includes a second optical lens, and the light guide column is installed in the optical head and is located on the light exit side of the second optical lens; from the first The light beams emitted from the two optical lenses can be emitted after passing through the light guide column.
可选的,当整形单元包括导光元件时,导光元件为反射腔,反射腔穿设于光学头内,自固定座出射的光束能够通过反射腔反射后出射。Optionally, when the shaping unit includes a light guide element, the light guide element is a reflective cavity, and the reflective cavity is installed in the optical head. The light beam emitted from the fixed base can be reflected by the reflective cavity and then emitted.
可选的,在光学头的出光口还设置有位于整形单元出光侧的保护窗。Optionally, the light outlet of the optical head is also provided with a protective window located on the light outlet side of the shaping unit.
本申请实施例的另一方面,提供一种医疗装置,包括上述任一种的激光模组。Another aspect of the embodiment of the present application provides a medical device, including any of the above laser modules.
本申请的有益效果包括:The beneficial effects of this application include:
本申请提供了一种激光模组和医疗装置,包括固定座和多个光学头,多个光学头用于替换设置于固定座的出光侧,在固定座内沿光路依次设置有光源和快轴压缩单元,在光学头内设置有整形单元,光源出射的光束经快轴压缩单元在快轴方向压缩后由整形单元整形并出射形成均匀光斑,其中,经任意两个光学头出射的均匀光斑的尺寸不同。可以按照当前的需求使得固定座搭配多个光学头中的任一个进行使用,而在需求发生变化时,便可以将固定座当前搭配的光学头拆下,替换为另一个能够满足新需求的光学头,也即,每个光学头均能够和固定座可拆卸连接,由此,满足不同的使用需求和场景,并且由于在更换不同光学头的过程中,固定模块使用不变,因此,能够有效的降低用户的使用成本。This application provides a laser module and medical device, including a fixed base and multiple optical heads. The multiple optical heads are used to replace the light exit side of the fixed base. A light source and a fast axis are sequentially arranged along the optical path in the fixed base. The compression unit is provided with a shaping unit in the optical head. The light beam emitted by the light source is compressed in the fast axis direction by the fast axis compression unit and then shaped by the shaping unit and emitted to form a uniform light spot. Among them, the uniform light spot emitted by any two optical heads is Sizes vary. The mount can be used with any one of multiple optical heads according to current needs. When the needs change, the optical head currently paired with the mount can be removed and replaced with another optical head that can meet the new needs. head, that is, each optical head can be detachably connected to the fixed base, thereby meeting different usage needs and scenarios, and since the fixed module remains unchanged during the replacement of different optical heads, it can effectively Reduce user costs.
附图说明Description of the drawings
为了更清楚地说明本申请实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,应当理解,以下附图仅示出了本申请的某些实施例,因此不应被看作是对范围的限定,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他相关的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application and therefore do not It should be regarded as a limitation of the scope. For those of ordinary skill in the art, other relevant drawings can be obtained based on these drawings without exerting creative efforts.
图1为本申请实施例提供的一种激光模组的结构示意图;Figure 1 is a schematic structural diagram of a laser module provided by an embodiment of the present application;
图2为本申请实施例提供的一种固定模块的侧视图;Figure 2 is a side view of a fixed module provided by an embodiment of the present application;
图3为本申请实施例提供的一种固定模块的爆炸图;Figure 3 is an exploded view of a fixed module provided by an embodiment of the present application;
图4为本申请实施例提供的一种冷却基座和冷却通路的结构示意图;Figure 4 is a schematic structural diagram of a cooling base and a cooling passage provided by an embodiment of the present application;
图5为本申请实施例提供的一种固定模块的俯视图;Figure 5 is a top view of a fixed module provided by an embodiment of the present application;
图6为本申请实施例提供的一种光学头的结构示意图;Figure 6 is a schematic structural diagram of an optical head provided by an embodiment of the present application;
图7为本申请实施例提供的一种光学头的爆炸图;Figure 7 is an exploded view of an optical head provided by an embodiment of the present application;
图8为本申请实施例提供的另一种光学头的结构示意图之一;Figure 8 is one of the structural schematic diagrams of another optical head provided by an embodiment of the present application;
图9为本申请实施例提供的另一种光学头的结构示意图之二;Figure 9 is a second structural schematic diagram of another optical head provided by an embodiment of the present application;
图10为本申请实施例提供的另一种光学头的剖面图;Figure 10 is a cross-sectional view of another optical head provided by an embodiment of the present application;
图11为本申请实施例提供的另一种光学头的爆炸图;Figure 11 is an exploded view of another optical head provided by an embodiment of the present application;
图12为本申请实施例提供的又一种光学头的结构示意图之一;Figure 12 is one of the structural schematic diagrams of yet another optical head provided by an embodiment of the present application;
图13为本申请实施例提供的又一种光学头的结构示意图之二;Figure 13 is a second structural schematic diagram of another optical head provided by an embodiment of the present application;
图14为本申请实施例提供的又一种光学头的剖面图;Figure 14 is a cross-sectional view of yet another optical head provided by an embodiment of the present application;
图15为本申请实施例提供的又一种光学头的爆炸图;Figure 15 is an exploded view of yet another optical head provided by an embodiment of the present application;
图16为本申请实施例提供的再一种光学头的剖面图。Figure 16 is a cross-sectional view of yet another optical head provided by an embodiment of the present application.
图标:100-固定模块;110-光源基座;111-视窗;120-冷却基座;121-连接部;122-输入通路;123-U形通路;124-输出通路;125-支路;126-输入端口;127-输出端口;128-座体;130-半导体制冷器;140-磁吸座;141-第二磁吸部;142-定位孔;150-探针;161-螺钉;162-接水头;500-光学头;501-安装腔;502-第一凹槽;503-定位销;510-保护窗;520-第一磁吸部;530-压框;540-触点;550-间隔圈;560-导光柱;561-弹性圈;570-反射腔;600-整形单元;610-第一透镜;620-光波导;621-波导座;630-第二透镜;640-第三透镜;650-第四透镜;660-第五透镜;670-第六透镜。Icon: 100-fixed module; 110-light source base; 111-window; 120-cooling base; 121-connection; 122-input channel; 123-U-shaped channel; 124-output channel; 125-branch; 126 -Input port; 127-Output port; 128-Base; 130-Semiconductor refrigerator; 140-Magnetic seat; 141-Second magnetic part; 142-Positioning hole; 150-Probe; 161-Screw; 162- Water head; 500-optical head; 501-installation cavity; 502-first groove; 503-positioning pin; 510-protection window; 520-first magnetic part; 530-pressure frame; 540-contact; 550- Spacer ring; 560-light guide column; 561-elastic ring; 570-reflective cavity; 600-shaping unit; 610-first lens; 620-optical waveguide; 621-waveguide base; 630-second lens; 640-third lens ; 650-Fourth lens; 660-Fifth lens; 670-Sixth lens.
具体实施方式Detailed ways
为使本申请实施例的目的、技术方案和优点更加清楚,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本申请一部分实施例,而不是全部的实施例。通常在此处附图中描述和示出的本申请实施例的组件可以以各种不同的配置来布置和设计。In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments These are part of the embodiments of this application, but not all of them. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
因此,以下对在附图中提供的本申请的实施例的详细描述并非旨在限制要求保护的本申请的范围,而是仅仅表示本申请的选定实施例。需要说明的是,在不冲突的情况下,本申请的实施例中的各个特征可以相互结合,结合后的实施例依然在本申请的保护范围内。Accordingly, the following detailed description of the embodiments of the application provided in the appended drawings is not intended to limit the scope of the claimed application, but rather to represent selected embodiments of the application. It should be noted that, as long as there is no conflict, various features in the embodiments of the present application can be combined with each other, and the combined embodiments are still within the protection scope of the present application.
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步定义和解释。It should be noted that similar reference numerals and letters represent similar items in the following figures, therefore, once an item is defined in one figure, it does not need further definition and explanation in subsequent figures.
在本申请的描述中,需要说明的是,术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,或者是该申请产品使用时惯常摆放的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。此外,术语“第一”、“第二”、“第三”等仅用于区分描述,而不能理解为指示或暗示相对重要性。In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship where the product of this application is commonly placed when used. It is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply. The devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the application. In addition, the terms "first", "second", "third", etc. are only used to distinguish descriptions and shall not be understood as indicating or implying relative importance.
此外,术语“水平”、“竖直”等术语并不表示要求部件绝对水平或悬垂,而是可以稍微倾斜。如“水平”仅仅是指其方向相对“竖直”而言更加水平,并不是表示该结构一定要完全水平,而是可以稍微倾斜。In addition, the terms "horizontal", "vertical", etc. do not mean that the component is required to be absolutely horizontal or suspended, but may be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical". It does not mean that the structure must be completely horizontal, but can be slightly tilted.
在本申请的描述中,还需要说明的是,除非另有明确的规定和限定,术语“设置”、“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should also be noted that, unless otherwise clearly stated and limited, the terms "setting", "installation", "connecting" and "connecting" should be understood in a broad sense. For example, it can be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood on a case-by-case basis.
本申请实施例的一方面,提供一种激光模组,如图1所示,包括固定模块100和多个光学头500,其中,固定模块100包括固定座和设置在固定座内的光源和快轴压缩单元,并且光源和快轴压缩单元沿光路依次设置,以便于光源出射的光束经快轴压缩单元在快轴方向压缩后能够弱化光束在快轴发散角和慢轴发散角之间的差异,从而提供较高质量的光束,有利于匀化光强。In one aspect of the embodiment of the present application, a laser module is provided. As shown in FIG. 1 , it includes a fixed module 100 and a plurality of optical heads 500 . The fixed module 100 includes a fixed base and a light source and fastener disposed in the fixed base. Axial compression unit, and the light source and fast axis compression unit are arranged sequentially along the optical path, so that the light beam emitted from the light source can be compressed in the fast axis direction by the fast axis compression unit to weaken the difference between the fast axis divergence angle and the slow axis divergence angle of the beam , thereby providing a higher quality beam, which is conducive to homogenizing the light intensity.
多个光学头500可以替换设置于固定座的出光侧,在光学头500内设置有位于快轴压缩单元出光侧的整形单元600,由此,光源出射的光束经快轴压缩单元在快轴方向压缩后由整形单元600整形并最终由光学头500出射形成均匀光斑,其中,经任意两个光学头500出射的均匀光斑的尺寸不同。如此,多个光学头500便具有配件属性,可以按照当前的需求使得固定座搭配多个光学头500中的任一个进行使用,而在需求发生变化时,便可以将固定座当前搭配的光学头500拆下,替换为另一个能够满足新需求的光学头500,也即,每个光学头500均能够和固定座可拆卸连接,由此,满足不同的使用需求和场景,并且由于在更换不同光学头500的过程中,固定模块100使用不变,因此,能够有效的降低用户的使用成本。Multiple optical heads 500 can be alternatively arranged on the light exit side of the fixed base. The optical head 500 is provided with a shaping unit 600 located on the light exit side of the fast axis compression unit. Thus, the light beam emitted from the light source passes through the fast axis compression unit and is shaped in the fast axis direction. After compression, it is shaped by the shaping unit 600 and finally emitted by the optical head 500 to form a uniform light spot, where the size of the uniform light spot emitted by any two optical heads 500 is different. In this way, the multiple optical heads 500 have accessory attributes, and the holder can be used with any one of the multiple optical heads 500 according to current needs. When the needs change, the optical head currently matched with the holder can be used. 500 is removed and replaced with another optical head 500 that can meet new needs. That is, each optical head 500 can be detachably connected to the fixed base, thereby meeting different usage needs and scenarios, and due to different replacement requirements During the process of installing the optical head 500, the fixed module 100 remains unchanged, therefore, the user's usage cost can be effectively reduced.
具体的,例如图1所示,提供一个固定模块100和三个光学头500,在使用时,可以根据需求,将三个光学头500中的任一个安装至固定座,从而沿用前述光路最终由光学头500出射形成均匀光斑,而在使用需求变化时,可以对均匀光斑的规格尺寸进行调整,即将当前安装至固定座的光学头500拆下,然后更换另一个能够满足新需求的光学头500,以便于激光模组最终由更换后的光学头500出射的均匀光斑的尺寸对应变化,满足用户的预期。当然,本申请对于与固定模块100搭配的光学头500的数量不做限制,还可以是四个、五个等等。Specifically, for example, as shown in Figure 1, a fixed module 100 and three optical heads 500 are provided. During use, any one of the three optical heads 500 can be installed on the fixed base according to the needs, so that the aforementioned optical path is finally used. The optical head 500 emits a uniform light spot, and when the use requirements change, the specifications and sizes of the uniform light spot can be adjusted, that is, the optical head 500 currently installed on the fixed base is removed, and then replaced with another optical head 500 that can meet the new needs. , so that the size of the uniform light spot emitted by the laser module from the replaced optical head 500 changes correspondingly to meet the user's expectations. Of course, this application does not limit the number of optical heads 500 matched with the fixed module 100, and it can also be four, five, and so on.
可选的,如图5所示,固定模块100的宽度a可以是小于33mm,例如31mm,以便于能够方便用户手持,提高用户的使用体验。Optionally, as shown in FIG. 5 , the width a of the fixed module 100 may be less than 33 mm, such as 31 mm, so as to facilitate the user to hold it and improve the user's experience.
可选的,请结合图2和图3所示,固定座包括相互固定的光源基座110和冷却基座120,其中,光源和快轴压缩单元均设置于光源基座110内,光学头500则可拆卸的设置于冷却基座120,在冷却基座120内设置有用于流通冷却媒介的第一冷却通路,由此,通过冷却基座120内置的第一冷却通路可以对光源基座110和光学头500进行散热,避免激光模组工作过热造成损坏的同时,也能够降低激光模组的表面温度,从而提高用户使用体验,例如光学头500可能需要与用户皮肤接触,因此,通过冷却基座120对其进行降温后,能够降低光学头500的表面温度,方便用户使用。Optionally, as shown in Figure 2 and Figure 3, the fixed base includes a light source base 110 and a cooling base 120 that are fixed to each other. The light source and fast axis compression unit are both arranged in the light source base 110. The optical head 500 The cooling base 120 is detachably provided with a first cooling passage for circulating the cooling medium. Therefore, the light source base 110 and the light source base 110 can be cooled by the first cooling passage built in the cooling base 120 . The optical head 500 dissipates heat to avoid damage caused by overheating of the laser module. It can also reduce the surface temperature of the laser module, thereby improving the user experience. For example, the optical head 500 may need to be in contact with the user's skin. Therefore, by cooling the base 120 after cooling it, the surface temperature of the optical head 500 can be reduced, making it convenient for the user to use.
可选的,如图4所示,为了有效提高对光学头500的散热效果,第一冷却通路包括U形通路123以及分别连接于U形通路123两端的输入通路122和输出通路124,以便于冷却媒介可以沿输入通路122流经U形通路123后由输出通路124流出,冷却基座120具有相互固定的座体128和连接部121,输入通路122和输出通路124可以分布于座体128,U形通路123可以分布于连接部121,并且光源基座110可以固定设置于座体128(例如图3所示,通过螺钉161将光源基座110固定至座体128),连接部121可以用于连接光学头500,由此,通过U形通路123能够提高对光学头500的散热效果,有效降低光学头500的表面温度。在此基础上,请参照图2至图4所示,固定设置于座体128上的光源基座110还可以与连接部121的一侧贴合设置,以便于U形通路123也能够帮助光源基座110进行散热,此时,可以使得光学头500位于连接部121背离光源基座110的一侧,由此,即可以充分利用U形通路123帮助光源基座110和光学头500进行散热,同时,该种分布方式,也能够便于光源基座110内光源经快轴压缩单元出射的光束经光源基座110上的视窗111后顺利的穿过连接部121上开设的光通道而入射光学头500内的整形单元600。Optionally, as shown in Figure 4, in order to effectively improve the heat dissipation effect of the optical head 500, the first cooling channel includes a U-shaped channel 123 and an input channel 122 and an output channel 124 respectively connected to both ends of the U-shaped channel 123, so as to facilitate The cooling medium can flow through the U-shaped passage 123 along the input passage 122 and then flow out from the output passage 124. The cooling base 120 has a base 128 and a connecting portion 121 fixed to each other. The input passage 122 and the output passage 124 can be distributed in the base 128. The U-shaped passage 123 can be distributed in the connecting part 121, and the light source base 110 can be fixedly arranged on the base 128 (for example, as shown in FIG. 3, the light source base 110 is fixed to the base 128 through screws 161), and the connecting part 121 can be When connecting the optical head 500, the U-shaped passage 123 can improve the heat dissipation effect of the optical head 500 and effectively reduce the surface temperature of the optical head 500. On this basis, please refer to FIGS. 2 to 4 . The light source base 110 fixedly installed on the base 128 can also be disposed in close contact with one side of the connecting portion 121 , so that the U-shaped passage 123 can also assist the light source. The base 110 dissipates heat. At this time, the optical head 500 can be located on the side of the connecting portion 121 away from the light source base 110. Therefore, the U-shaped passage 123 can be fully utilized to help the light source base 110 and the optical head 500 dissipate heat. At the same time, this distribution method can also facilitate the light beam emitted by the fast-axis compression unit from the light source base 110 to pass through the window 111 on the light source base 110 and then smoothly pass through the light channel opened on the connecting part 121 and enter the optical head. Shaping unit 600 within 500.
可选的,如图3所示,为了便于输入管路和输出管路外接水管,可以在输入管路和输出管路的外端口设置有接水头162。Optionally, as shown in Figure 3, in order to facilitate the external connection of the input pipeline and the output pipeline to water pipes, a water connection head 162 can be provided at the outer port of the input pipeline and the output pipeline.
可选的,请继续参照图4所示,在输入通路122和输出通路124之间还可以连通有与U形通路123并联的支路125,即输入通路122内的冷却媒介除可以经U形通路123流入输出通路124外,还可以经支路125流入输出通路124,并且可以使得U形通路123的流通截面的面积大于支路125的流通截面的面积,以便于能够使得U形通路123的流速较快,进而加强连接部121的散热能力。应当理解的是,U形通路123可以倒置为图4所示的状态,以便于水流能够从低处经U形通路123流道高处,然后再流道低处的输出通路124,保证散热效果。Optionally, please continue to refer to Figure 4. A branch 125 connected in parallel with the U-shaped passage 123 can also be connected between the input passage 122 and the output passage 124. That is, the cooling medium in the input passage 122 can not only pass through the U-shaped passage In addition to flowing into the output passage 124, the passage 123 can also flow into the output passage 124 through the branch passage 125, and the flow cross-sectional area of the U-shaped passage 123 can be larger than the flow cross-section area of the branch passage 125, so that the U-shaped passage 123 can be The flow rate is faster, thereby enhancing the heat dissipation capability of the connecting part 121. It should be understood that the U-shaped passage 123 can be inverted to the state shown in Figure 4, so that the water flow can flow from the lower part through the high part of the U-shaped passage 123 and then to the output passage 124 at the lower part of the flow passage to ensure the heat dissipation effect. .
可选的,请结合图3和图4,在光源基座110内还设置有第二冷却通路,第二冷却通路的输入端口126和输出端口127分别与座体128内的输入通路122连通,由此,流入输入通路122的冷却媒介先流入第二冷却通路,对光源基座110进行散热后,再回到输入通路122,沿U形通路123和支路125流入输出通路124。第二冷却通路的输入端口126和输出端口127沿输入通路122内冷却媒介的流通方向依次间隔设置,以便于冷却媒介能够经输入端口126流入第二冷却通路,然后再由输出端口127流回输入通路122。Optionally, please refer to Figure 3 and Figure 4, a second cooling passage is also provided in the light source base 110, and the input port 126 and the output port 127 of the second cooling passage are respectively connected with the input passage 122 in the base 128. Therefore, the cooling medium flowing into the input channel 122 first flows into the second cooling channel to dissipate heat from the light source base 110 , then returns to the input channel 122 , and flows into the output channel 124 along the U-shaped channel 123 and the branch channel 125 . The input port 126 and the output port 127 of the second cooling passage are sequentially spaced along the flow direction of the cooling medium in the input passage 122, so that the cooling medium can flow into the second cooling passage through the input port 126, and then flow back to the input through the output port 127. Passage 122.
可选的,为了进一步的提高散热,如图2和图3所示,激光模组还包括半导体制冷器130,此时,光学头500可以经半导体制冷器130连接于冷却基座120,即半导体制冷器130可以固定至冷却基座120的连接部121(如图3所示,半导体制冷器130可以经螺钉161固定至连接部121),更具体的,可固定至连接部121背离光源基座110的一侧。由此,方便光学头500通过可拆卸的方式连接至半导体制冷器130背离连接部121的一侧,半导体制冷器130的热面与冷却基座120贴合,半导体制冷器130的冷面可以与光学头500贴合设置,由此,光学头500产生的热量可以经半导体制冷器130的冷面进行快速冷却,并且由冷却基座120对半导体制冷器130的热面进行快速散热。Optionally, in order to further improve heat dissipation, as shown in Figures 2 and 3, the laser module also includes a semiconductor refrigerator 130. At this time, the optical head 500 can be connected to the cooling base 120 through the semiconductor refrigerator 130, that is, the semiconductor refrigerator 130. The refrigerator 130 can be fixed to the connection portion 121 of the cooling base 120 (as shown in FIG. 3 , the semiconductor refrigerator 130 can be fixed to the connection portion 121 via screws 161 ), and more specifically, can be fixed to the connection portion 121 facing away from the light source base. 110 on one side. Therefore, it is convenient for the optical head 500 to be detachably connected to the side of the semiconductor refrigerator 130 away from the connecting portion 121 , the hot surface of the semiconductor refrigerator 130 is attached to the cooling base 120 , and the cold surface of the semiconductor refrigerator 130 can be connected to the cooling base 120 . The optical head 500 is arranged in close contact with each other, so that the heat generated by the optical head 500 can be quickly cooled through the cold surface of the semiconductor refrigerator 130 , and the hot surface of the semiconductor refrigerator 130 can be quickly dissipated by the cooling base 120 .
可选的,如图2和图3所示,光学头500可以采用磁吸的方式与固定座进行可拆卸连接,具体的,固定座还可以包括磁吸座140,磁吸座140可以固定至半导体制冷器130的冷面(如图3所示,可以通过螺钉161将磁吸座140固定至半导体制冷器130的冷面),光学头500可以经磁吸座140以磁吸的连接方式连接至半导体制冷器130,也即实现光学头500与固定座的可拆卸连接。Optionally, as shown in Figures 2 and 3, the optical head 500 can be detachably connected to the fixed base by magnetic attraction. Specifically, the fixed base can also include a magnetic base 140, and the magnetic base 140 can be fixed to The cold surface of the semiconductor refrigerator 130 (as shown in FIG. 3 , the magnetic base 140 can be fixed to the cold surface of the semiconductor refrigerator 130 through the screws 161 ), and the optical head 500 can be connected through the magnetic base 140 in a magnetic connection. to the semiconductor refrigerator 130, that is, the detachable connection between the optical head 500 and the fixed base is realized.
具体的,如图6至图7、图8至图11或图12至图15所示,在光学头500靠近磁吸座140的一侧可以设置有第一凹槽502,第一磁吸部520可以嵌设在第一凹槽502内,具体的可以通过螺钉161固定至第一凹槽502内,由此,第一磁吸部520的表面就能够与第一凹槽502的底面、侧面进行充分接触,由此,增大第一磁吸部520与光学头500的接触面积,如图3所示,在磁吸座140靠近光学头500的一侧设置有第二凹槽,在第二凹槽内嵌设有第二磁吸部141,由此,第二磁吸部141的表面也能够与第二凹槽的底面、侧面进行充分接触,在第一磁吸部520与第二磁吸部141吸合时,光学头500连接至磁吸座140,并且第一磁吸部520和第二磁吸部141相对的表面可以贴合,由此,能够通过第一磁吸部520和第二磁吸部141对光学头500上的热量进行充分传导,以便于由半导体制冷器130进行冷却。第一磁吸部520和第二磁吸部141可以是耐高温磁铁。Specifically, as shown in Figures 6 to 7, Figures 8 to 11, or Figures 12 to 15, a first groove 502 can be provided on the side of the optical head 500 close to the magnetic base 140, and the first magnetic portion 520 can be embedded in the first groove 502, and specifically can be fixed to the first groove 502 through screws 161. Therefore, the surface of the first magnetic part 520 can be in contact with the bottom surface and side surface of the first groove 502. Full contact is made, thereby increasing the contact area between the first magnetic suction part 520 and the optical head 500. As shown in FIG. 3, a second groove is provided on the side of the magnetic suction base 140 close to the optical head 500. The second magnetic suction part 141 is embedded in the two grooves. Therefore, the surface of the second magnetic suction part 141 can also fully contact the bottom surface and side surface of the second groove. When the first magnetic suction part 520 and the second When the magnetic suction part 141 is attracted, the optical head 500 is connected to the magnetic suction base 140 , and the opposite surfaces of the first magnetic suction part 520 and the second magnetic suction part 141 can be attached, so that the first magnetic suction part 520 can pass through and the second magnetic attraction portion 141 to fully conduct the heat on the optical head 500 so that it can be cooled by the semiconductor refrigerator 130 . The first magnetic attraction part 520 and the second magnetic attraction part 141 may be high temperature resistant magnets.
具体在设置时,还可以在第一磁吸部520和第二磁吸部141相贴合的表面分别设置导热片,通过导热片可以对第一凹槽502和第二凹槽的槽口进行封闭,并使得导热片表面与光学头500表面平齐,方便两个导热片进行贴合。导热片的材质可以与第一磁吸部520和第二磁吸部141的材质一致。Specifically, during installation, thermal conductive sheets can also be disposed on the surfaces where the first magnetic attraction portion 520 and the second magnetic attraction portion 141 are in contact, and the openings of the first groove 502 and the second groove can be modified through the thermal conductive sheets. Close it, and make the surface of the thermal conductive sheet flush with the surface of the optical head 500 to facilitate the fitting of the two thermal conductive sheets. The material of the thermal conductive sheet may be consistent with the material of the first magnetic attraction part 520 and the second magnetic attraction part 141 .
可选的,如图1至图15所示,在磁吸座140上可以设置有多个探针150,在光学头500上设置有触点540,其中,在光学头500固定至磁吸座140上时,光学头500上的触点540可以与部分探针150接触,由此,对应触发信号。为了能够方便识别固定模块100搭配的光学头500,可以使得任意两个光学头500上的触点540所接触的探针150不同,以便于每个光学头500都能够触发不同的信号,进而实现对光学头500的识别,以便于控制器能够准确控制光源的功率与当前所搭配的光学头500进行匹配。Optionally, as shown in FIGS. 1 to 15 , multiple probes 150 may be provided on the magnetic base 140 , and contacts 540 may be provided on the optical head 500 , wherein the optical head 500 is fixed to the magnetic base. 140, the contact point 540 on the optical head 500 can contact part of the probe 150, thus corresponding to the trigger signal. In order to facilitate the identification of the optical heads 500 matched with the fixed module 100, the contacts 540 on any two optical heads 500 can be made to contact different probes 150, so that each optical head 500 can trigger different signals, thereby achieving The optical head 500 is identified so that the controller can accurately control the power of the light source to match the currently matched optical head 500 .
可选的,如图3和图7所示,在固定座的磁吸座140上设置有定位孔142,在光学头500上设置有定位销503,由此,在光学头500连接至磁吸座140时,可以通过定位销503插接于定位孔142的方式,以满足光学同轴度的要求。Optionally, as shown in Figures 3 and 7, a positioning hole 142 is provided on the magnetic base 140 of the fixed base, and a positioning pin 503 is provided on the optical head 500. Thus, when the optical head 500 is connected to the magnetic When the base 140 is installed, the positioning pin 503 can be inserted into the positioning hole 142 to meet the optical coaxiality requirements.
为了使得每个光学头500出射的均匀光斑的尺寸不同,对应的每个光学头500内的整形单元600也可以由不同形式组成,在整形单元600包括导光元件时,导光元件可以是光波导、导光柱或反射腔等,例如图6和图7示出了第一光学头500(其中的第一仅用于区分),第一光学头500内的整形单元600包括光波导620,为了便于安装,在光学头500内的安装腔501的内壁可以设置有限位台阶和压框530,在安装时,可以通过压框530配合限位台阶将光波导620夹持固定于安装腔501内。具体的,如图7所示,可以先在安装腔501内装入波导座621,然后再将光波导620装入波导座621,通过压框530将光波导620扣紧。压框530可以通过螺丝固定至光学头500。如图7所示,还可以在光波导620和压框530之间设置第二光学透镜,第二光学透镜包括第一透镜610,第一透镜610可以是凹面镜,由此,从固定模块100出射的光束经第一透镜610后由光波导620出射。In order to make the uniform light spot emitted by each optical head 500 have different sizes, the corresponding shaping unit 600 in each optical head 500 can also be composed of different forms. When the shaping unit 600 includes a light guide element, the light guide element can be a light guide element. Waveguide, light guide column or reflective cavity, etc., for example, FIG. 6 and FIG. 7 show the first optical head 500 (the first one is only used for distinction). The shaping unit 600 in the first optical head 500 includes an optical waveguide 620. In order to To facilitate installation, a limiting step and a pressure frame 530 can be provided on the inner wall of the installation cavity 501 in the optical head 500. During installation, the optical waveguide 620 can be clamped and fixed in the installation cavity 501 through the pressure frame 530 and the limitation step. Specifically, as shown in FIG. 7 , the waveguide base 621 can be installed in the installation cavity 501 first, and then the optical waveguide 620 can be installed into the waveguide base 621 , and the optical waveguide 620 can be fastened through the pressing frame 530 . The press frame 530 may be fixed to the optical head 500 through screws. As shown in FIG. 7 , a second optical lens may also be provided between the optical waveguide 620 and the pressure frame 530 . The second optical lens includes a first lens 610 , and the first lens 610 may be a concave mirror. Therefore, from the fixed module 100 The emitted light beam passes through the first lens 610 and then exits from the optical waveguide 620 .
例如图8至图11示出了第二光学头500,第二光学头500内的整形单元600包括沿光路依次设置的多个第一光学透镜,在光学头500内设置有限位台阶和压框530,压框530用于配合限位台阶将多个第一光学透镜夹持固定于光学头500,如图8至图11所示,整形单元600包括沿光路依次设置的第二透镜630、第三透镜640和第四透镜650,然后最终由压框530将三个透镜压紧至光学头500。由此,入射整形单元600的光束可以依次经第二透镜630、第三透镜640和第四透镜650整形后出射形成均匀光斑,在相邻透镜之间还设置有间隔圈550,以便于通过间隔圈550定义相邻两个透镜在光路上的间距。For example, Figures 8 to 11 show a second optical head 500. The shaping unit 600 in the second optical head 500 includes a plurality of first optical lenses arranged sequentially along the optical path. A limited step and a pressing frame are provided in the optical head 500. 530, the pressing frame 530 is used to clamp and fix the plurality of first optical lenses to the optical head 500 in conjunction with the limiting step. As shown in Figures 8 to 11, the shaping unit 600 includes a second lens 630 and a third lens arranged sequentially along the optical path. The three lenses 640 and the fourth lens 650 are then finally pressed to the optical head 500 by the pressing frame 530 . Therefore, the light beam incident on the shaping unit 600 can be shaped in sequence by the second lens 630, the third lens 640 and the fourth lens 650 and then exit to form a uniform light spot. A spacer ring 550 is also provided between adjacent lenses to facilitate passing through the space. Circle 550 defines the distance between two adjacent lenses in the optical path.
又例如图12至图15示出了第三光学头500,在第三光学头500靠近固定座的一侧设置有第二光学透镜,第二光学透镜包括第五透镜660和第六透镜670,由此,入射整形单元600的光束可以依次经第五透镜660和第六透镜670整形后出射形成均匀光斑,在第三光学头500的另一侧可以设置有导光柱560,导光柱560可以通过橡胶、硅胶等弹性圈561与第三光学头500的出光口过盈配合。As another example, Figures 12 to 15 show the third optical head 500. A second optical lens is provided on the side of the third optical head 500 close to the fixed base. The second optical lens includes a fifth lens 660 and a sixth lens 670. Therefore, the light beam incident on the shaping unit 600 can be shaped in sequence by the fifth lens 660 and the sixth lens 670 before being emitted to form a uniform light spot. A light guide column 560 can be provided on the other side of the third optical head 500, and the light guide column 560 can pass through The elastic ring 561 such as rubber or silicone has an interference fit with the light outlet of the third optical head 500 .
又例如图16所示,示出了第四光学头,在第四光学头的出光侧设置穿设于光学头内的反射腔570,自固定模块出射的光束能够通过反射腔570反射后出射。As another example shown in FIG. 16 , a fourth optical head is shown. A reflection cavity 570 that penetrates the optical head is provided on the light exit side of the fourth optical head. The light beam emitted from the fixed module can be reflected by the reflection cavity 570 and then emitted.
此外,如图6至图7、图8至图11或图12至图15所示,在光学头500的出光口还设置有位于整形单元600出光侧的保护窗510,当然,保护窗510也可以位于导光柱560和第二光学透镜之间。In addition, as shown in Figures 6 to 7, Figures 8 to 11, or Figures 12 to 15, the light outlet of the optical head 500 is also provided with a protective window 510 located on the light exit side of the shaping unit 600. Of course, the protective window 510 is also It can be located between the light guide column 560 and the second optical lens.
本申请实施例的另一方面,提供一种医疗装置,该激光医疗装置包括上述的激光模组。由于上述的激光模组的具体结构及其有益效果均已在前文做了详细阐述,故本申请在此不再赘述。Another aspect of the embodiment of the present application provides a medical device. The laser medical device includes the above-mentioned laser module. Since the specific structure and beneficial effects of the above-mentioned laser module have been described in detail above, they will not be described again in this application.
以上所述仅为本申请的优选实施例而已,并不用于限制本申请,对于本领域的技术人员来说,本申请可以有各种更改和变化。凡在本申请的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本申请的保护范围之内。The above descriptions are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included in the protection scope of this application.
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CN120132236A (en) * | 2025-05-14 | 2025-06-13 | 武汉洛芙科技有限公司 | A home-use laser freckle removal and anti-aging beauty instrument |
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CN105411675B (en) * | 2015-12-18 | 2018-05-25 | 西安炬光科技股份有限公司 | A kind of medical treatment device based on high-power semiconductor laser |
CN108348766B (en) * | 2016-10-17 | 2019-10-18 | 西安炬光科技股份有限公司 | A semiconductor laser module and its method for non-invasive medical treatment |
CN111897134B (en) * | 2020-07-31 | 2022-02-25 | 西安炬光科技股份有限公司 | An optical module and medical laser device |
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