CN220108314U - Interface signal transmission device and electronic equipment - Google Patents

Abstract

The present disclosure relates to an interface signal transmission device and an electronic apparatus, the interface signal transmission device includes: the circuit board comprises a first circuit board, a second circuit board and a connector, wherein the first circuit board comprises a signal layer plate; at least part of the second circuit board is attached and connected with the signal laminate along the first direction; the connector is mounted to the second circuit board such that signals are transmitted to the connector through the signal plane and the second circuit board. Compared with the prior art, the method and the device have the advantages that extra devices are avoided, the insertion loss of a high-speed interface passage is reduced, and the problem that reflection is caused by discontinuous impedance in the prior art is solved, so that the signal quality cannot meet the standards of the USB alliance.

Description

Interface signal transmission device and electronic equipment

Technical Field

The disclosure relates to the technical field of data transmission, and in particular relates to an interface signal transmission device and electronic equipment.

Background

More and more electronic devices currently support a USB 3.2 interface or a DisplayPort (DP) interface, and the rates of these interfaces are relatively high, for example, the transmission rate of USB 3.2gen2 is 10Gbps, and the transmission rate of dp1.2 is 5.4Gbps/lane. The higher the interface transmission rate means that the signal quality is required more severely, and one criterion for measuring the signal quality is the insertion loss, the lower the insertion loss, the better the signal quality received by the receiving end.

Currently, when the insertion loss of the interface signal transmission device does not meet the design requirement, the driving capability of the signal is increased by adding a driver device, namely a signal repeater chip, so as to meet the requirement of the insertion loss of the receiving end.

However, by adding a driver device, there are the following disadvantages: on the one hand, the cost is increased, on the other hand, the difficulty is brought to the layout and wiring of the printed circuit board due to the addition of the driver device, the complexity of the system is increased, meanwhile, the power consumption is increased, and because additional devices are added, the devices need software for configuration, extra workload is brought, the complexity of a software and hardware system is increased, and the standards of the USB alliance cannot be met.

Disclosure of Invention

In order to overcome the problems in the related art, the present disclosure provides an interface signal transmission device and an electronic device.

According to a first aspect of embodiments of the present disclosure, there is provided an interface signal transmission apparatus, including:

a first circuit board comprising a signal lamina;

the second circuit board is at least partially connected with the signal laminate in a laminating way along the first direction; and

and the connector is connected with the second circuit board, so that signals sent by the processor arranged on the first circuit board are transmitted to the connector through the signal laminate and the second circuit board.

In some embodiments, the first circuit board has a first hardness and the second circuit board has a second hardness, the second hardness being less than the first hardness.

In some embodiments, the first circuit board is a printed circuit board and the second circuit board is a flexible circuit board.

In some embodiments, the first circuit board further includes a first layer and a second layer, the first layer and the second layer being stacked along the first direction, the signal layer being stacked along the first direction between the first layer and the second layer,

the interface signal transmission device further comprises:

and the signal output assembly is arranged on the outer surface of the first layer plate.

In some embodiments, the interface signal transmission device further comprises:

the signal wire is arranged in the signal laminate and the second circuit board, the first circuit board is provided with a duct which is communicated with the first laminate and the signal laminate, one end of the signal wire penetrates through the duct to be connected with the signal output assembly, and the other end of the signal wire is connected with the connector.

In some embodiments, the interface signal transmission device further comprises:

and the capacitor is positioned on the outer surface of the second circuit board.

In some embodiments, the other end of the signal line is connected to a first end of the capacitor, and a second end of the capacitor is connected to the connector.

In some embodiments, the interface signal transmission device further comprises:

and the data line is detachably connected with the connector.

In some embodiments, the first circuit board further comprises:

and the third layer board, the first layer board, the signal layer board and the second layer board are arranged in a lamination manner along the first direction, and a power line is arranged in the third layer board.

According to a second aspect of embodiments of the present disclosure, there is provided an electronic device comprising an interface signal transmission apparatus according to any one of the embodiments of the first aspect.

The technical scheme provided by the embodiment of the disclosure can comprise the following beneficial effects: the first circuit board comprises a signal layer board, and at least part of the second circuit board is connected with the signal layer board in a fitting way along a first direction; the connector is connected with the second circuit board, so that signals sent by the processor arranged on the first circuit board are transmitted to the connector through the signal laminate and the second circuit board.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic structural diagram of an interface signal transmission device in the prior art.

Fig. 2 is a diagram of the path insertion loss of an interface signal transmission device according to the prior art.

Fig. 3 is a schematic structural view of an interface signal transmission apparatus according to an exemplary embodiment.

Fig. 4 is a schematic structural view of another interface signal transmission apparatus according to an exemplary embodiment.

Fig. 5 is a schematic structural view of yet another interface signal transmission device according to an exemplary embodiment.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.

In the current electronic device architecture, taking USB 3.2gen 2 as an example, the whole signal path in the interface signal transmission device is generally a central processing unit-BTB connector (board-to-board connector) -flexible circuit board-Type-C connector, and signal layer exchange is usually required for multiple times on a motherboard and a flexible circuit board because of the problem of layout and wiring, and for the high-speed signal, the layer exchange will bring impedance discontinuity, further bring reflection problem, so that the signal quality cannot meet the standard of the USB alliance.

In the related art, taking USB (Universal Serial Bus ) as an example, the overall path loss is relatively large, as shown in fig. 1, when the insertion loss of the interface signal transmission device does not meet the design requirement, the driving capability of the signal is usually increased by adding the receiver device 3, i.e. the signal repeater chip (NB 7VPQ 904M), so as to meet the requirement of the insertion loss of the receiving end. The whole signal path in the interface signal transmission device is as follows: CPU 2-driver device 3-BTB connector (board-to-board connector) 4-flexible circuit board 5-Type-C connector 6. The signal is routed on the main board 1 for about 57mm, four layers are needed, the signal is routed on the flexible circuit board 5 for about 160mm, and one layer is needed, as shown in fig. 2, the insertion loss diagram of the channel of the interface signal transmission device is shown in fig. 2, and by adding the driver device, the insertion loss of the channel is reduced from 7dB to 2dB, and the whole channel loss is reduced. However, by adding the driver device, the difficulty of layout and wiring of the printed circuit board is increased, the power consumption and the cost are increased, and because additional devices are added, the devices need software for configuration, extra workload is brought, and the complexity of a software and hardware system is increased.

In order to solve the above technical problems, the present disclosure provides an interface signal transmission device. As shown in fig. 3 to 5, an interface signal transmission apparatus includes: a first circuit board 10, a second circuit board 20, and a connector 30.

The first circuit board 10 includes a signal laminate 101; at least part of the second circuit board 20 is attached to the signal laminate 101 along the first direction; the connector 30 is connected to the second circuit board 20 so that signals from the processor mounted on the first circuit board 10 are transmitted to the connector 30 through the signal laminate 101 and the second circuit board 20.

The first circuit board 10 may be a rectangular board, a circular board, or a circuit board with another shape, which is not specifically limited in this disclosure.

The second circuit board 20 may be a rectangular plate, a circular plate, or a circuit board with another shape, and the shapes of the second circuit board 20 and the first circuit board 10 may be the same or different, which is not specifically limited in this disclosure.

The connector 30 may be a USB connector, for example, a Type-C connector, type-C being an industry standard connector, also known as USB-C, for transmitting data and power over a single cable. The battery can be used for charging and data transmission of notebook computers and smart phones. The Type-C connector has smaller appearance size and higher-density design appearance, the USB 3.2 standard supports the speed of 2.56GB/S, the functions of transmitting video signals, sound signals and the like are not more than 24, the pins of the Type-C are newly added with CC pins to charge USB Power Delivery (USB PD), the transmission power supports the power output of 20V5A with the highest power of 100W at the USB PD, the CC pins can judge the inserting direction of the USB-C, the transmission modes of other pins are controlled, and the front and back of the USB-C connector is not divided finally. Type-C also has a new set of SUB pins that support Alternate Mode, suitable for transmitting non-USB signals, which may be used for HDMI transmission, MHL video transmission, etc. In the USB4.0 protocol specification, the Type-C connector may implement a bi-directional highest rate 40Gbps communication rate when the communication device satisfies the GEN2 2 x 2 mode.

The signal layer 101 is used for transmitting signals, the signal layer 101 may be a rectangular plate, a circular plate, or a circuit board with other shapes, and the shapes of the signal layer 101 and the first circuit board 10 may be the same or different, which is not specifically limited in this disclosure.

It should be noted that, the first direction may be a thickness direction when the first circuit board 10 and the second circuit board 20 are in different planes, or may be an extension direction when the first circuit board 10 and the second circuit board 20 are in the same plane, which is not specifically limited in the present disclosure.

The present disclosure provides an interface signal transmission device, wherein a signal is sent by a processor installed on a first circuit board 10, the signal is transmitted to a second circuit board 20 by a signal layer board 101 through a via hole, the signal is transmitted to a connector 30 by the second circuit board 20, and the connector 30 is connected with external equipment to realize signal transmission; the first circuit board 10 comprises a signal layer board 101, and at least part of the second circuit board 20 is connected with the signal layer board 101 along the first direction in a fitting way; the connector 30 is mounted on the second circuit board 20, so that signals are transmitted to the connector 30 through the signal laminate 101 and the second circuit board 20, and compared with the prior art, the connector has the advantages that extra devices are avoided, the insertion loss of a high-speed interface passage is reduced, the problem that reflection is caused by discontinuous impedance in the prior art is solved, and the signal quality cannot meet the standard of the USB alliance.

In some embodiments, as shown in fig. 3-5, the first circuit board 10 has a first hardness and the second circuit board 20 has a second hardness, the second hardness being less than the first hardness.

The second circuit board 20 has a certain flexibility relative to the first circuit board 10, and is beneficial to flexibility of layout of the electronic device on the basis of meeting design requirements.

In the embodiment of the present disclosure, at least a portion of the second circuit board 20 and the signal layer board 101 in the first circuit board 10 are attached and connected along the first direction, so that an additional BTB connector is avoided, the insertion loss of the high-speed interface path is reduced, and the problem that reflection is caused by discontinuous impedance in the prior art is solved, so that the signal quality cannot meet the standard of the USB alliance.

Further, the first circuit board 10 is a printed circuit board, and the second circuit board 20 is a flexible circuit board.

The printed circuit board (Printed Circuit Board, abbreviated as PCB) is also called a printed circuit board, and is an important electronic component, a support for electronic components, and a carrier for interconnecting electrical appliances in the electronic components.

The flexible printed circuit board (Flexible Printed Circuit, abbreviated as FPC) is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility.

In the embodiment of the disclosure, at least part of the flexible circuit board is attached to the signal laminate 101 in the printed circuit board along the first direction, so that an additional BTB connector is avoided, the insertion loss of the high-speed interface path is reduced, and the problem that reflection is caused by discontinuous impedance in the prior art is solved, so that the signal quality cannot meet the standard of the USB alliance.

In some embodiments, as shown in fig. 3-5, the first circuit board 10 further includes a first board (not shown) and a second board (not shown), the first board and the second board being stacked in a first direction, the signal board 101 being stacked in the first direction between the first board and the second board,

the interface signal transmission device of (a) further comprises: a signal output assembly 40.

The signal output assembly 40 is mounted to the outer surface of the first laminate.

Wherein the signal laminate 101 is arranged between the first laminate and the second laminate. The first layer plate may be a rectangular plate, a circular plate, or other shapes, which is not particularly limited in this disclosure.

The second layer plate may be a rectangular plate, may be a circular plate, may be in other shapes, and may be the same shape or different from the first layer plate.

It will be appreciated that the first laminate may serve as the top layer of the first circuit board 10 and the second laminate may serve as the bottom layer of the first circuit board 10.

The signal output assembly 40 is used for outputting signals, and further, the signal output assembly 40 may adopt a central processing unit (Central Processing Unit, abbreviated as CPU), the central processing unit sends out USB signals, the USB signals are transmitted to the second circuit board 20 through the signal layer board 101 of the first circuit board 10, then the USB signals are transmitted to the connector 30 through the second circuit board 20, at least part of the second circuit board 20 is attached to the signal layer board 101 in the first circuit board 10 along the first direction, so that the addition of an additional BTB connector is avoided, and the insertion loss of a high-speed interface path is reduced.

In the embodiment of the disclosure, the signal output component 40 sends out a USB signal, the USB signal is transmitted to the second circuit board 20 through the signal layer board 101 of the first circuit board 10, then the USB signal is transmitted to the connector 30 through the second circuit board 20, at least part of the second circuit board 20 is attached to the signal layer board 101 in the first circuit board 10 along the first direction, so that the addition of an additional BTB connector is avoided, the insertion loss of a high-speed interface channel is reduced, the problem that reflection is caused by impedance discontinuity in the prior art is solved, and the signal quality cannot meet the standard of the USB alliance.

In some embodiments, as shown in fig. 3-5, the interface signal transmission device further comprises: a signal line 50.

The signal wire 50 is disposed in the signal laminate 101 and the second circuit board 20, the first circuit board 10 is provided with a hole (not shown in the figure) for communicating the first laminate with the signal laminate 101, one end of the signal wire 50 is connected to the signal output assembly 40 through the hole, and the other end of the signal wire 50 is connected to the connector 30.

It will be appreciated that the signal lines 50 are used to transmit USB signals, and the signal lines 50 are typically disposed on the inner layer of the first circuit board 10, and electrical components, such as a CPU, a capacitor, and the like, are required to be mounted on the top and bottom layers of the first circuit board 10. Since the CPU, the capacitor and other electrical components occupy most of the area of the first circuit board 10, the signal line 50 cannot be laid, and usually the USB signal is laid on the signal layer board 101, which is the inner layer of the first circuit board 10, to the signal line 50.

The portion of the signal wire 50 in the signal layer board 101 of the first circuit board 10 may be circular, S-shaped, or wavy, which is not specifically limited in this disclosure.

The portion of the signal line 50 in the second circuit board 20 may be circular, S-shaped, or wavy, and the portion of the signal line 50 in the second circuit board 20 may be the same as or different from the portion of the signal line 50 in the signal layer board 101 of the first circuit board 10, which is not specifically limited in this disclosure.

The hole may be a hole for laser to punch at the outer surface of the first circuit board 10 where the signal output component 40 is installed, the hole penetrates through the first layer board to reach the signal layer board 101, one end of the signal wire 50 penetrates through the hole to be connected with the signal output component 40, the laser punching makes the other end of the signal wire 50 reach the second circuit board 20 from the signal layer board 101 through primary layer exchange and be connected with the connector 30, the signal wire 50 reaches the second circuit board 20 from the signal layer board 101 through primary layer exchange, and then the signal output by the signal output component 40 reaches the connector 30 only through primary via hole.

In the embodiment of the disclosure, the signal output assembly 40 sends out the USB signal, the USB signal is transmitted from the signal layer board 101 of the first circuit board 10 to the second circuit board 20 through the signal line 50, then the USB signal is transmitted to the connector 30 through the signal line 50 in the second circuit board 20, at least part of the second circuit board 20 and the signal layer board 101 in the first circuit board 10 are attached and connected along the first direction, so that the whole channel of the whole interface signal transmission device has only one through hole, the loss of the whole channel is greatly reduced, the addition of an additional BTB connector is avoided, the insertion loss of the high-speed interface channel is reduced, and the problem that the signal quality cannot meet the standard of the USB alliance due to the reflection caused by the discontinuous impedance in the prior art is solved.

In some embodiments, as shown in fig. 3-5, the interface signal transmission device further comprises: a capacitor 60.

The capacitor 60 is located on the outer surface of the second circuit board 20.

The Capacitor 60 is an element for storing electric power and electric energy (potential energy), and the Capacitor 60 is disposed between the first circuit board 10 and the connector 30.

It will be appreciated that the second circuit board 20 may be a multi-layer board, in which two adjacent layers are stacked along the first direction, and the second circuit board 20 is a flexible circuit board.

In the embodiment of the disclosure, the signal output assembly 40 sends out a USB signal, the USB signal is transmitted from the signal layer board 101 of the first circuit board 10 to the second circuit board 20 through the signal line 50, then the USB signal is retransmitted to the connector 30 through the signal line 50 and the capacitor 60 in the second circuit board 20, at least part of the second circuit board 20 and the signal layer board 101 in the first circuit board 10 are bonded and connected along the first direction, so that the path of the whole interface signal transmission device has only one via hole, the loss of the whole path is greatly reduced, the addition of an additional BTB connector is avoided, the insertion loss of the high-speed interface path is reduced, and the problem that the signal quality cannot meet the standard of the USB alliance due to the reflection problem caused by the discontinuous impedance in the prior art is solved.

In some embodiments, as shown in fig. 3-5, the other end of the signal line 50 is connected to a first end of a capacitor 60, and a second end of the capacitor 60 is connected to the connector 30.

The first end of the capacitor 60 is an input end of the capacitor 60, and the second end of the capacitor 60 is an output end of the capacitor 60.

In the embodiment of the disclosure, the signal output assembly 40 sends out a USB signal, the USB signal is transmitted from the signal layer board 101 of the first circuit board 10 to the second circuit board 20 through the signal line 50, then the USB signal reaches the input end of the capacitor 60 through the signal line 50 in the second circuit board 20, and is transmitted to the connector 30 through the output end of the capacitor 60, at least part of the second circuit board 20 and the signal layer board 101 in the first circuit board 10 are attached and connected along the first direction, so that the whole interface signal transmission device has only one via hole, the loss of the whole channel is greatly reduced, the addition of an additional BTB connector is avoided, the insertion loss of the high-speed interface channel is reduced, the problem that the reflection problem is caused by the discontinuous impedance in the prior art is solved, and the signal quality cannot meet the standard of the USB alliance.

In some embodiments, as shown in fig. 5, the interface signal transmission device further includes: a data line 70.

The data line 70 is detachably connected to the connector 30.

The data line 70 is a USB data line, the data line 70 has a first interface, the connector 30 has an interface connected to the first interface, and the USB signal transmitted to the connector 30 is transmitted to the external device 80 through the data line 70.

Further, the connector 30 may be a USB connector, for example, a Type-C connector, i.e. the interface is a Type-C interface, and correspondingly, the first interface of the data line 70 is also a Type-C interface.

In the embodiment of the disclosure, the signal output assembly 40 sends out the USB signal, after the USB signal is transmitted to the connector 30, the USB signal is transmitted to the external device 80 connected to the data line 70, such as a USB disk, through the first interface connection of the interface data line 70 of the connector 30, the path of the whole interface signal transmission device has only one via hole, so that the loss of the whole path is greatly reduced, the addition of an additional BTB connector is avoided, the insertion loss of the high-speed interface path is reduced, and the problem that the signal quality cannot meet the standard of the USB alliance due to the reflection caused by the discontinuous impedance in the prior art is solved.

In some embodiments, as shown in fig. 3-5, the first circuit board 10 further includes: a third ply (not shown).

The third layer is stacked with the first layer, the signal layer 101, and the second layer along the first direction, and a power line (not shown) is disposed in the third layer.

Wherein the power line is laid in the whole third layer board for supplying power to the electric element. The first layer board, the signal layer board 101, the third layer board and the second layer board may be sequentially stacked, or the first layer board, the third layer board, the signal layer board 101 and the second layer board may be sequentially stacked, which is not particularly limited in this disclosure.

It will be appreciated that the third laminate on which the power cord is laid is not capable of laying the power cord 50.

Based on the same inventive concept, the present disclosure also provides an electronic device. The electronic device comprises an interface signal transmission means as in any of the embodiments described above.

The electronic device may be a mobile phone, an intelligent wearable device such as a watch, or a terminal with an interface signal transmission device.

The present disclosure provides an electronic device with an interface signal transmission device, where a signal is transmitted to a second circuit board 20 through a via hole by a signal layer board 101, and then transmitted to a connector 30 by the second circuit board 20, and the connector 30 is connected with an external device to realize signal transmission; the first circuit board 10 comprises a signal layer board 101, and at least part of the second circuit board 20 is connected with the signal layer board 101 along the first direction in a fitting way; the connector 30 is mounted on the second circuit board 20, so that signals are transmitted to the connector 30 through the signal laminate 101 and the second circuit board 20, and compared with the prior art, the connector has the advantages that extra devices are avoided, the insertion loss of a high-speed interface passage is reduced, the problem that reflection is caused by discontinuous impedance in the prior art is solved, and the signal quality cannot meet the standard of the USB alliance.

It is understood that the term "plurality" in this disclosure means two or more, and other adjectives are similar thereto. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. The singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It is further understood that the terms "first," "second," and the like are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish one type of information from another and do not denote a particular order or importance. Indeed, the expressions "first", "second", etc. may be used entirely interchangeably. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure.

It will be further understood that the terms "center," "longitudinal," "transverse," "front," "rear," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience in describing the present embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operate in a particular orientation.

It will be further understood that "connected" includes both direct connection where no other member is present and indirect connection where other element is present, unless specifically stated otherwise.

It will be further understood that although operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results. In certain circumstances, multitasking and parallel processing may be advantageous.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims (10)

1. An interface signal transmission device, comprising:

a first circuit board comprising a signal lamina;

the second circuit board is at least partially connected with the signal laminate in a laminating way along the first direction; and

and the connector is connected with the second circuit board, so that signals sent by the processor arranged on the first circuit board are transmitted to the connector through the signal laminate and the second circuit board.

2. The interface signal transmission device of claim 1, wherein,

the first circuit board has a first hardness and the second circuit board has a second hardness, the second hardness being less than the first hardness.

3. The interface signal transmission device according to claim 2, wherein,

the first circuit board adopts a printed circuit board, and the second circuit board adopts a flexible circuit board.

4. An interface signal transmission device according to claim 3, wherein,

the first circuit board further includes a first layer board and a second layer board, the first layer board and the second layer board being stacked along the first direction, the signal layer board being stacked along the first direction between the first layer board and the second layer board,

the interface signal transmission device further comprises:

and the signal output assembly is arranged on the outer surface of the first layer plate.

5. The interface signal transmission device of claim 4, further comprising:

the signal wire is arranged in the signal laminate and the second circuit board, the first circuit board is provided with a duct which is communicated with the first laminate and the signal laminate, one end of the signal wire penetrates through the duct to be connected with the signal output assembly, and the other end of the signal wire is connected with the connector.

6. The interface signal transmission device of claim 5, further comprising:

and the capacitor is positioned on the outer surface of the second circuit board.

7. The interface signal transmission device of claim 6, wherein,

the other end of the signal line is connected with the first end of the capacitor, and the second end of the capacitor is connected with the connector.

8. The interface signal transmission device according to claim 1, further comprising:

and the data line is detachably connected with the connector.

9. The interface signal transmission device of claim 4, wherein the first circuit board further comprises:

and the third layer board, the first layer board, the signal layer board and the second layer board are arranged in a lamination manner along the first direction, and a power line is arranged in the third layer board.

10. An electronic device comprising an interface signal transmission means as claimed in any one of claims 1 to 9.