CN220094222U - Wafer grinding device - Google Patents
Wafer grinding device Download PDFInfo
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- CN220094222U CN220094222U CN202321451409.6U CN202321451409U CN220094222U CN 220094222 U CN220094222 U CN 220094222U CN 202321451409 U CN202321451409 U CN 202321451409U CN 220094222 U CN220094222 U CN 220094222U
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- cleaning
- grinding
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Abstract
The utility model provides a wafer grinding device, which comprises a grinding table and a wafer bearing table which are oppositely arranged, wherein the wafer bearing table is used for bearing a wafer and can move the wafer towards the grinding table, and a grinding pad is arranged on the grinding table and can rotate along with the grinding table; the grinding liquid feeder is arranged at the side edge of the grinding table and can rotate to the upper part of the grinding table in the horizontal plane, and is provided with a liquid feeding port used for dripping grinding liquid to the grinding pad; the cleaning mechanism is arranged on the side edge of the grinding table and is close to the grinding liquid supplier, and can rotate in the horizontal plane to the position above the grinding table to be in contact with the grinding pad, so as to remove pollutants on the grinding pad. The wafer grinding device provided by the utility model improves the reliability and efficiency of wafer grinding and increases the production yield of wafers.
Description
Technical Field
The utility model relates to the technical field of chemical mechanical polishing, in particular to a wafer polishing device.
Background
Chemical mechanical polishing (Chemical Mechanical Polishing, CMP) in a chip manufacturing process is a technique for global planarization of a wafer surface by physical and chemical reactions. The polishing pad is adhered to the polishing disc, the polishing liquid is loaded in the polishing process, and the wafer is polished on the surface of the polishing pad. After polishing, the polishing pad is cut by the polishing finishing disk to remove polishing products, so that the surface of the polishing pad is activated, and the polishing efficiency is ensured to be stable.
In the prior art, there may be crystallization of the polishing liquid or dropping of diamond particles from the polishing and trimming disc, which results in scratch on the surface of the wafer, and reduces the yield and cleaning efficiency of the wafer.
Disclosure of Invention
The utility model aims at a wafer grinding device, which improves the reliability and efficiency of wafer grinding and increases the production yield of wafers.
In order to achieve the above object, in a first aspect, the present utility model provides a wafer polishing apparatus, including a polishing table and a wafer carrying table disposed opposite to each other, where the wafer carrying table is used for carrying a wafer and is capable of moving the wafer toward the polishing table;
the grinding pad is arranged on the grinding table and can rotate along with the grinding table;
the grinding liquid feeder is arranged at the side edge of the grinding table and can rotate to the upper part of the grinding table in the horizontal plane, and is provided with a liquid feeding port used for dripping grinding liquid to the grinding pad;
the cleaning mechanism is arranged on the side edge of the grinding table and is close to the grinding liquid supplier, and can rotate in the horizontal plane to the position above the grinding table to be in contact with the grinding pad, so as to remove pollutants on the grinding pad.
In some embodiments, the cleaning mechanism comprises a cleaning arm and a first rotating mechanism, wherein the cleaning arm is arranged on the first rotating mechanism, and a cleaning piece is arranged on the cleaning arm;
when the cleaning piece is positioned at the cleaning position above the grinding table, the first rotating mechanism drives the cleaning arm and the cleaning piece to rotate around the axial direction of the cleaning arm so as to enable the cleaning piece to be in contact with the grinding pad.
In some embodiments, the cleaning mechanism further comprises a second rotation mechanism;
the second rotating mechanism is arranged on the side edge of the grinding table, the first rotating mechanism is arranged on the second rotating mechanism, the rotating shaft of the second rotating mechanism is perpendicular to the horizontal plane, and the second rotating mechanism is used for driving the first rotating mechanism and the cleaning arm to rotate to the position above the grinding table in the horizontal plane.
In some embodiments, the cleaning member is a brush.
In some embodiments, the slurry supply includes a third rotation mechanism and a slurry supply arm;
the liquid supply arm is arranged on the third rotating mechanism, and one side, far away from the third rotating mechanism, of the liquid supply arm is provided with the liquid supply port;
the third rotating mechanism is arranged on the side edge of the grinding table and is close to the second rotating mechanism, and the third rotating mechanism is used for driving the liquid supply arm to rotate to the position above the grinding table in the horizontal plane.
In some embodiments, the bottom surface of the liquid supply arm facing the grinding table is provided with a plurality of cleaning openings which are distributed at intervals and used for spraying cleaning liquid to clean the grinding pad or the cleaning mechanism.
In some embodiments, the end surface of the liquid supply arm far away from one end of the third rotating mechanism is further provided with the cleaning port.
In some embodiments, the perpendicular distance between the fluid supply arm and the grinding table is greater than the perpendicular distance between the cleaning elements and the grinding table.
In some embodiments, the cleaning element is located directly below the fluid supply arm when both the fluid supply arm and the cleaning element are located at the side of the polishing platen.
In some embodiments, a polishing pad is positioned above and in contact with the polishing pad.
The wafer grinding device provided by the utility model has the following beneficial effects:
1. the cleaning efficiency of the polishing pad is improved.
2. The damage of pollutants (dropped diamond particles or grinding liquid crystals) to the wafer is reduced, and the yield of the wafer is improved.
3. The cleaning mechanism is convenient to clean.
Drawings
FIG. 1 is a top view of a wafer polishing apparatus according to an embodiment of the present utility model;
FIG. 2 is a side view of a wafer polishing apparatus according to an embodiment of the present utility model;
fig. 3 is a schematic view of a liquid supply arm according to an embodiment of the present utility model.
Reference numerals:
a polishing table 1, a wafer carrier 2, a polishing pad 3, a polishing liquid supplier 4, a liquid supply arm 41, a liquid supply port 411, a cleaning port 412, a third rotation mechanism 42, a cleaning mechanism 5, a cleaning member 51, a first rotation mechanism 52, a second rotation mechanism 53, and a polishing pad 6.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described below, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items.
Fig. 1 is a top view of a wafer polishing apparatus according to an embodiment of the present utility model.
Fig. 2 is a side view of a wafer polishing apparatus according to an embodiment of the present utility model.
Referring to fig. 1 and 2, an embodiment of the present utility model provides a wafer polishing apparatus, which includes a polishing table 1, a wafer carrier table 2, a polishing pad 3, a polishing liquid supply 4, and a cleaning mechanism 5. The polishing table 1 and the wafer carrying table 2 are oppositely arranged, specifically, the polishing table 1 is located below the wafer carrying table 2. The wafer carrying table 2 is used for carrying a wafer, and can move the wafer towards the polishing table 1 so as to enable the wafer to be abutted against the polishing pad 3 arranged on the polishing table 1. When the polishing pad 3 rotates along with the polishing table 1, polishing of the wafer is achieved.
The polishing liquid supplier 4 is disposed above one side of the polishing table 1, the polishing liquid supplier has a liquid supplying arm 41, the liquid supplying arm 41 is provided with a liquid supplying opening 411, the liquid supplying opening 411 faces the polishing pad 3, the liquid supplying arm 41 of the polishing liquid supplier can rotate in a horizontal plane, and the liquid supplying arm 41 has a length such that the liquid supplying opening 411 can cover the radius of the polishing table 1 when the liquid supplying arm 41 rotates to a liquid supplying position above the polishing table.
When the liquid supply arm 41 horizontally rotates to the liquid supply position, the polishing liquid is dropped onto the polishing pad 3 through the liquid supply port 411.
The cleaning mechanism 5 is disposed above one side of the polishing table 1 and near the polishing liquid supply 4, the cleaning mechanism 5 has a cleaning arm, and the cleaning arm is rotatable in a horizontal plane, and contacts the polishing pad 3 when the cleaning arm rotates to a cleaning position above the polishing table.
The cleaning mechanism 5 is used to remove contaminants from the polishing pad 3 when the cleaning arm is rotated to the cleaning position to contact the polishing pad 3.
The contaminants may be diamond particles falling from the polishing pad 6 or crystals of the polishing liquid on the polishing pad 3.
In this embodiment, by disposing the cleaning mechanism 5 near the polishing liquid supply device, the reliability and efficiency of wafer polishing are improved, and the production yield of wafers is increased. And can realize the washing to clean mechanism 5 when the lapping liquid feed ware washs, the convenience is washd to clean mechanism 5.
In some embodiments, the cleaning mechanism 5 further comprises a second rotation mechanism 53. The second rotating mechanism 53 is disposed on a side of the polishing table 1, a rotation axis of the second rotating mechanism 53 is perpendicular to a horizontal plane, and the second rotating mechanism 53 is configured to drive the cleaning arm to rotate in the horizontal plane to a position above the polishing table 1, so that the cleaning arm is located at the cleaning position.
Further, the cleaning mechanism 5 further includes a first rotating mechanism 52, the first rotating mechanism 52 is disposed on the second rotating mechanism 53, the cleaning arm is disposed on the first rotating mechanism 52, and the cleaning member 51 is disposed on the cleaning arm.
In the initial state, the cleaning member 51 is horizontally oriented so that the cleaning member 51 does not contact the polishing pad 3.
When the cleaning arm is horizontally rotated to the cleaning position by the first rotation mechanism 52, the first rotation mechanism 52 drives the cleaning arm and the cleaning member 51 to rotate around the axial direction of the cleaning arm so that the cleaning member 51 is brought into contact with the polishing pad 3.
As shown in fig. 2, in this embodiment, the cleaning member 51 is a brush, the second rotating mechanism 53 drives the first rotating mechanism 52, the cleaning arm and the brush to rotate above the polishing table 1 in a horizontal plane, so that the cleaning arm rotates to move to the cleaning position, and then the first rotating mechanism 52 drives the brush to rotate 90 ° around the axial direction of the cleaning arm until the brush is downward, so that the brush is perpendicular to the polishing pad 3 and contacts with the polishing pad 3.
As shown in fig. 1, after the polishing pad 3 is cleaned, the first rotating mechanism 52 drives the brush to reversely rotate by 90 ° to make the brush parallel to the polishing pad 3, and then the second rotating mechanism 53 drives the first rotating mechanism 52 and the cleaning member 51 to rotate in a horizontal plane, so that the first rotating mechanism 52 and the cleaning member 51 move to the side edge of the polishing table 1.
Fig. 3 is a schematic view of a liquid supply arm according to an embodiment of the present utility model.
Referring to fig. 1 to 3, in some embodiments, the polishing liquid supply device 4 includes a third rotation mechanism 42 and a liquid supply arm 41, where the liquid supply port 411 is disposed on a side of the liquid supply arm 41 away from the third rotation mechanism 42, and the liquid supply port 411 is used to drop polishing liquid to the polishing pad 3. The liquid supply arm 41 is provided on the third rotation mechanism 42. The third rotating mechanism 42 is disposed at a side of the polishing table 1 and near the second rotating mechanism 53, and the third rotating mechanism 42 is configured to drive the liquid supply arm 41 to rotate above the polishing table 1 in a horizontal plane, so that the liquid supply arm 41 moves to the liquid supply position.
As shown in fig. 1, when the liquid supply arm 41 and the cleaning member 51 are both above the polishing table 1, the liquid supply arm 41 and the cleaning member 51 are parallel. As shown in fig. 2, when the liquid supply arm 41 and the cleaning member 51 are both located at the side of the polishing table 1, the cleaning member 51 is located directly below the liquid supply arm 41. Therefore, the vertical distance between the liquid supply arm 41 and the polishing table 1 should be greater than the vertical distance between the cleaning member 51 and the polishing table 1.
When the cleaning member 51 is located right below the liquid supply arm 41, the cleaning member 51 can be cleaned by the cleaning member when the liquid supply arm 41 is flushed under high pressure, so that the cleaning member 51 is conveniently cleaned.
Further, the bottom surface of the liquid supply arm 41 facing the polishing table 1 is provided with the liquid supply opening 411 and a plurality of cleaning openings 412 distributed at intervals, so that the liquid supply opening 411 and the cleaning openings 412 are disposed downward. The cleaning port 412 is used for spraying cleaning liquid to clean the polishing pad 3 or the cleaning member 51 on the cleaning mechanism 5, and the liquid supply port 411 is used for dripping the polishing liquid onto the polishing pad 3. Wherein the cleaning liquid may be ultrapure water.
In addition, the end surface of the liquid supply arm 41 far from one end of the third rotating mechanism 42 may be further provided with a cleaning opening 412, and the cleaning opening 412 is used for spraying a cleaning liquid to further ensure the cleaning effect on the polishing pad 3 or the cleaning mechanism 5.
In some embodiments, the wafer polishing apparatus further comprises a polishing conditioning disk 6, the polishing conditioning disk 6 being located above the polishing pad 3 and in contact with the polishing pad 3. The polishing pad 3 is cut by the polishing pad 6 to remove polishing products.
While embodiments of the present utility model have been described in detail hereinabove, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. It is to be understood that such modifications and variations are within the scope and spirit of the present utility model as set forth in the following claims. Moreover, the utility model described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (10)
1. A wafer polishing apparatus, comprising:
the wafer carrying table is used for carrying a wafer and can move the wafer towards the grinding table;
the grinding pad is arranged on the grinding table and can rotate along with the grinding table;
the grinding liquid feeder is arranged at the side edge of the grinding table and can rotate to the upper part of the grinding table in the horizontal plane, and is provided with a liquid feeding port for dripping grinding liquid to the grinding pad;
the cleaning mechanism is arranged on the side edge of the grinding table and is close to the grinding liquid supplier, and can rotate in the horizontal plane to the position above the grinding table to be in contact with the grinding pad, so as to remove pollutants on the grinding pad.
2. The wafer polishing apparatus according to claim 1, wherein the cleaning mechanism comprises a cleaning arm and a first rotating mechanism, the cleaning arm is provided on the first rotating mechanism, and a cleaning member is provided on the cleaning arm;
when the cleaning piece is positioned at the cleaning position above the grinding table, the first rotating mechanism drives the cleaning arm and the cleaning piece to rotate around the axial direction of the cleaning arm so as to enable the cleaning piece to be in contact with the grinding pad.
3. The wafer polishing apparatus as set forth in claim 2 wherein the cleaning mechanism further comprises a second rotation mechanism;
the second rotating mechanism is arranged on the side edge of the grinding table, the first rotating mechanism is arranged on the second rotating mechanism, the rotating shaft of the second rotating mechanism is perpendicular to the horizontal plane, and the second rotating mechanism is used for driving the first rotating mechanism and the cleaning arm to rotate to the position above the grinding table in the horizontal plane.
4. The wafer polishing apparatus as set forth in claim 2 wherein the cleaning member is a brush.
5. The wafer polishing apparatus as set forth in claim 3 wherein the polishing liquid supply comprises a third rotation mechanism and a liquid supply arm;
the liquid supply arm is arranged on the third rotating mechanism, and one side, far away from the third rotating mechanism, of the liquid supply arm is provided with the liquid supply port;
the third rotating mechanism is arranged on the side edge of the grinding table and is close to the second rotating mechanism, and the third rotating mechanism is used for driving the liquid supply arm to rotate to the position above the grinding table in the horizontal plane.
6. The wafer polishing apparatus according to claim 5, wherein a plurality of cleaning openings are provided on a bottom surface of the liquid supply arm facing the polishing table, the cleaning openings being used for spraying a cleaning liquid to clean the polishing pad or the cleaning mechanism.
7. The wafer polishing apparatus as set forth in claim 6 wherein said cleaning port is further provided in an end surface of said liquid supply arm remote from one end of said third rotation mechanism.
8. The wafer polishing apparatus according to claim 5, wherein a vertical distance between the liquid supply arm and the polishing table is greater than a vertical distance between the cleaning member and the polishing table.
9. The wafer polishing apparatus as set forth in claim 5 wherein the cleaning member is located directly below the liquid supply arm when both the liquid supply arm and the cleaning member are located at the side of the polishing platen.
10. The wafer polishing apparatus of claim 1, further comprising a polishing conditioning disk positioned above and in contact with the polishing pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321451409.6U CN220094222U (en) | 2023-06-07 | 2023-06-07 | Wafer grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321451409.6U CN220094222U (en) | 2023-06-07 | 2023-06-07 | Wafer grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220094222U true CN220094222U (en) | 2023-11-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321451409.6U Active CN220094222U (en) | 2023-06-07 | 2023-06-07 | Wafer grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220094222U (en) |
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2023
- 2023-06-07 CN CN202321451409.6U patent/CN220094222U/en active Active
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