CN220079167U - Coating device - Google Patents

Abstract

The utility model provides a coating device, and belongs to the technical field of coating. The film plating device comprises an evaporator; the distance between the compensation plate and the evaporator is a first distance, the compensation plate is arranged on the evaporation side of the evaporator, and the compensation plate is provided with a plurality of through holes; the support plate is arranged on one side of the compensation plate, which is away from the evaporator, and the distance between the support plate and the compensation plate is a second distance. By utilizing the coating device provided by the utility model, the inter-chip difference of the thickness of the metal film prepared on the carrier plate can be reduced.

Description

Coating device

Technical Field

The utility model relates to the technical field of coating, in particular to a coating device.

Background

Along with the increasing requirements on line width fineness in the micro LED (Micro LED) industry, the requirements on metal film forming uniformity and incidence angle are higher, the general specification of equipment in the related technology is 3% -5% of THK (Thickness) U%, the Thickness difference between films is larger, and defects such as mura and dotted lines can be caused due to margin deficiency of process yield when a higher PPI (Pixels Per Inch) product is produced in the future.

Disclosure of Invention

In view of the above, the present utility model provides a coating device.

The utility model provides the following technical scheme: a coating device comprising:

an evaporator;

the distance between the compensation plate and the evaporator is a first distance, the compensation plate is arranged on the evaporation side of the evaporator, and a plurality of through holes are formed in the compensation plate;

the carrying disc is arranged on one side of the compensation plate, which is away from the evaporator, and the distance between the carrying disc and the compensation plate is a second distance.

Further, the coating device further comprises a driving device, the driving device is arranged on one side, away from the compensation plate, of the carrying disc, and an output shaft of the driving device is connected with the carrying disc.

Further, the axis of the compensation plate, the axis of the carrier disc and the axis of the output shaft of the driving device are coincident.

Further, the thickness of the compensation plate gradually increases from the center to the edge;

the apertures of the through holes gradually increase from the center of the compensation plate to the edge.

Further, the thickness of the compensation plate gradually decreases from the center to the edge; the apertures of the plurality of through holes gradually decrease from the center of the compensation plate to the edge.

Further, the ratio of the distance from the evaporator to the axis of the compensation plate to the radius of the compensation plate is m, wherein the value range of m is 1 < m < 1.5.

Further, the evaporators are at least in a plurality of groups;

the plurality of groups of evaporators are arranged at intervals, and the distances between the plurality of groups of evaporators and the axis of the compensation plate are equal;

the distance from the evaporator to the axis of the compensation plate is less than the radius of the compensation plate.

Further, the thickness of the compensation plate is d, wherein the value range of d is 0.1cm-0.4cm.

Wherein the first distance is L1 and the second distance is L2;

meets the requirement that L1 is more than L2 and is more than or equal to 8cm.

Further, the aperture of the through hole is r, wherein the value range of r is 0.2cm-1cm.

Further, the ratio between the L1 and the L2 is n, wherein the value range of n is 1 < n.ltoreq.3.

Further, the diameter of the compensation plate is larger than the diameter of the carrier plate.

Embodiments of the present utility model have the following advantages: through set up the compensation plate between year dish and evaporimeter to when making the through-hole on the compensation plate of evaporimeter evaporation material, the phenomenon of diffraction can take place promotes the homogeneity of the evaporation material that passes the compensation plate, so that the evaporation material that passes the compensation plate can more even attach on year dish under the effect of diffraction in order to form the wafer, thereby greatly reduced the difference between the thickness of the wafer of adhesion on different year dish surfaces, in order to promoted the homogeneity and the coating film quality of coating film thickness.

In order to make the above objects, features and advantages of the present utility model more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural view of a first embodiment of a film plating apparatus according to some embodiments of the present utility model;

FIG. 2 is a schematic view showing a view angle of a compensation plate in a first embodiment of a plating apparatus according to some embodiments of the present utility model;

FIG. 3 is a schematic view showing a second embodiment of a coating device according to some embodiments of the present utility model;

fig. 4 is a schematic view showing a structure of a compensating plate according to a second embodiment of a plating apparatus according to some embodiments of the present utility model.

Description of main reference numerals:

a 100-evaporator; 200-compensating plates; 210-a through hole; 300-carrying disc; 400-wafer; 500-drive device.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the templates herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Because the evaporator of the existing equipment is arranged below the edge of the wafer or right below the center of the wafer, the wafer is fixed through the wafer bearing jig, however, in the evaporation process of the evaporator, the concentration of evaporation substances of the wafer positioned at the center of the bearing jig is larger than that of the edge, so that the difference between the thickness of a coating film on the wafer positioned at the center of the bearing jig and the thickness of the coating film on the wafer positioned at the edge of the bearing jig is larger, and the production requirement is difficult to meet.

As shown in fig. 1 and 2, some embodiments of the present utility model provide a plating device, which is mainly applied to metal plating, and improves the uniformity of the thickness and the quality of the plating.

Wherein the coating device includes an evaporator 100, and the evaporator 100 is capable of evaporating a substance placed in the evaporator 100. For example, a metal material is placed in the evaporator 100, and the metal material can be melted and evaporated by the evaporator 100.

In addition, the film plating device further includes a compensation plate 200, wherein a distance between the compensation plate 200 and the evaporator 100 is a first distance, the compensation plate 200 faces the evaporation side of the evaporator 100, and specifically, the compensation plate 200 faces the evaporation port of the evaporator 100, so that the substance evaporated by the evaporator 100 can be attached to the compensation plate 200 along the evaporation direction of the evaporation port of the evaporator 100.

By providing a plurality of through holes 210 spaced apart from each other in the compensating plate 200, the substances evaporated by the evaporator 100 can pass through the through holes 210.

It should be noted that the number of the through holes 210 may be specifically set according to practical situations. In addition, the arrangement of the plurality of through holes 210 on the compensation plate 200 includes any one of a matrix arrangement or a circular array. The shape of the through hole 210 may be any one of a polygon, a circle, an ellipse, a letter, a number, or a special shape, and may be specifically set according to practical situations.

In addition, the interval between any adjacent two through holes 210 may be specifically set according to the actual situation, and is not specifically limited in the present embodiment.

Specifically, the shape of the compensation plate 200 may be any one or a combination of two or more of a polygon, a circle, an ellipse, or a special shape.

Preferably, in this embodiment, the shape of the compensation plate 200 is circular.

The film plating device further comprises a carrier plate 300, wherein the carrier plate 300 is arranged on one side of the compensation plate 200 away from the evaporator 100, and the distance between the carrier plate 300 and the compensation plate 200 is a second distance.

Preferably, the carrier plate 300 faces the compensation plate 200, and the carrier plate 300 is facing the compensation plate 200.

In addition, the shape of the carrier tray 300 may be any one or a combination of two or more of a polygon, a circle, an ellipse, and a special shape.

Preferably, in this embodiment, the carrier plate 300 is circular in shape.

It should be noted that, by facing the carrier plate 300 to the compensation plate 200, the substances evaporated by the evaporator 100 can be attached to the surface of the carrier plate 300 through the through holes 210.

It should be noted that, by arranging the compensation plate 200 between the carrier plate 300 and the evaporator 100, when the material evaporated by the evaporator 100 passes through the through holes 210 on the compensation plate 200, diffraction can occur, and since the compensation plate 200 is provided with a plurality of through holes 210 spaced apart from each other, the evaporated material passing through the compensation plate 200 can be more uniformly attached to the carrier plate 300 under the action of diffraction to form the wafer 400, so that the difference between the thicknesses of the wafers 400 attached to different carrier plate surfaces is greatly reduced, and uniformity of the coating thickness and quality of the coating are improved.

Further, the film plating device further comprises a driving device 500, wherein the driving device 500 is arranged on one side of the carrier plate 300 away from the compensation plate 200, and an output shaft of the driving device 500 is connected with the carrier plate 300, so that when the driving device 500 operates, the carrier plate 300 can be driven to rotate along the axis of the output shaft of the driving device 500 while the output shaft of the driving device 500 rotates.

In this embodiment, the driving device 500 is a driving motor.

It can be appreciated that since the compensation plate 200 is disposed between the carrier plate 300 and the evaporator 100 to improve uniformity and quality of the coating film on the carrier plate 300 by the compensation plate 200, the carrier plate 300 can be driven to rotate along the axis of the output shaft of the driving device 500 by the driving device 500, so that the evaporated materials passing through different through holes 210 can be kept relatively uniform, thereby further improving uniformity of the coating film on the carrier plate 300, further reducing variability of thickness of the wafer 400 on the carrier plate 300, and improving quality of the coating film.

Additionally, in some embodiments, the thickness of the compensation plate 200 is d, where d has a value ranging from 0.1cm < d < 0.4cm, it is understood that d may have a value ranging from any of 0.1cm < d < 0.4cm, 0.2cm < d < 0.4cm, and 0.3cm < d < 0.4cm.

It should be noted that, when the thickness of the compensation plate 200 is less than 0.1cm, the wall of the through hole 210 on the compensation plate 200 has substantially the same blocking performance to the evaporation material, that is, the compensation plate 200 cannot form different blocking performances to the evaporation material at different positions, so that the uniformity of the thickness of the wafer 400 formed on the surface of the carrier plate 300 cannot be effectively realized; in addition, when the thickness of the compensating plate 200 is greater than 0.4cm, the surface area of the inner wall of the through hole 210 is increased due to the greater thickness of the compensating plate 200, so that a great amount of evaporation material adheres to the inner wall of the through hole 210 when passing through the through hole 210, i.e., the evaporation material passing through the through hole 210 is greatly reduced, which not only affects the coating efficiency, but also increases the coating cost and wastes resources.

Based on the above, the thickness of the compensation plate 200 is controlled to be between 0.1cm and 0.4cm in this embodiment, and in this interval, not only the adhesion amount of the evaporation material on the inner wall of the through hole 210 can be effectively reduced, but also the difference of the evaporation material passing through different through holes 210 can be balanced, so that the amount of the evaporation material passing through different through holes 210 can be kept uniform, thereby improving the uniformity of the thickness of the wafer 400 at different positions on the carrier plate 300.

Further, the first distance is L1, and the second distance is L, where L1 > L2 is greater than or equal to 8cm, and it is understood that by increasing the distance between the evaporator 100 and the compensating plate 200, the substance evaporated by the evaporator 100 can be completely covered on the compensating plate 200.

In addition, by controlling the distance between the compensation plate 200 and the carrier plate 300, the evaporation material passing through the through holes 210 of the compensation plate 200 is prevented from escaping to the outside of the carrier plate 300, and at the same time, the adhesion dead zone is prevented from occurring when the evaporation material passing through the through holes 210 is adhered to the carrier plate 300, so that the quality of the coating film on the carrier plate 300 and the uniformity of the thickness of the coating film are improved.

As shown in fig. 2, in some embodiments of the present utility model, since the shape of the compensation plate 200 and the shape of the carrier plate 300 are both circular, the axis of the compensation plate 200 and the axis of the carrier plate 300 coincide with the axis of the output shaft of the driving device 500. In this way, when the driving device 500 operates, the carrier plate 300 always keeps the state of being opposite to the compensation plate 200 in the process of driving the carrier plate 300 to rotate by the output shaft of the driving device 500, so as to improve the uniformity and stability of the coating device in the coating process on the carrier plate 300.

In this embodiment, the axis of the evaporation port of the evaporator 100 coincides with the axis of the compensation plate 200, so that the material in the evaporator 100 can cover the compensation plate 200 during evaporation, so as to reduce the waste of the material evaporated by the evaporator 100.

Specifically, the aperture of the through hole 210 is r, where the value range of r is 0.2cm < r < 1cm. It is understood that the value of r is within any range of 0.2cm < r < 1cm, 0.3cm < r < 1cm, 0.4cm < r < 1cm, 0.5cm < r < 1cm, 0.6cm < r < 1cm, 0.7cm < r < 1cm, 0.8cm < r < 1cm, and 0.9cm < r < 1cm.

As shown in fig. 1, in some embodiments of the present utility model, since the evaporation port of the evaporator 100 is aligned with the compensation plate 200, that is, the straight distance between the through hole 210 located near the center of the compensation plate 200 and the evaporation port is smaller than the straight distance between the through hole 210 located at the edge of the compensation plate 200 and the evaporation port, it is understood that when the material in the evaporator 100 is evaporated, the evaporated material passes through the through hole 210 at the center of the compensation plate 200 and then passes through the through hole 210 at the edge of the compensation plate 200.

Therefore, in order to reduce the difference of the thickness of the plating film on the different carrier plates 300, the thickness of the compensating plate 200 is gradually increased from the center to the edge, and the aperture of the plurality of through holes 210 is gradually increased from the center to the edge of the compensating plate 200, so that the path of the through holes 210 passing through the center portion of the compensating plate 200 is increased when the evaporator 100 is operated, a part of the evaporated material can be adhered to the inner wall of the through holes 210, and the amount of the evaporated material passing through the through holes 210 in the middle of the compensating plate 200 by the evaporator 100 is small, so that the amount of the evaporated material passing through the different through holes 210 of the compensating plate 200 can be uniform, thereby reducing the difference of the evaporated material passing through the different through holes 210 of the compensating plate 200, and improving the uniformity and stability of the thickness of the different wafers 400 formed on the surface of the carrier plates 300.

Illustratively, the aperture of the through hole disposed at the edge of the compensation plate 200 is r1, the aperture of the through hole 210 disposed at the center of the compensation plate 200 is r0, the aperture of the through hole 210 disposed between the center and the edge of the compensation plate 200 is r2, wherein the value range of r1 is 0.7cm < r1 < 1cm, the value range of r0 is 0.2cm < r0 < 0.4cm, and the value range of r2 is 0.4cm < r1 < 0.7cm, so as to realize that the aperture of the through hole 210 gradually increases from the center of the compensation plate 200 to the edge, and the aperture sizes of the through holes 210 in different areas on the compensation plate 200 are controlled to further improve the uniformity of the thickness of the wafer 400 formed on the carrier plate 300 and the coating accuracy by further improving the amount of evaporated materials passing through the through holes 210 in different areas.

As shown in fig. 3 and 4, in some embodiments of the present utility model, the evaporators 100 are at least multiple groups, and it is understood that the number of the evaporators 100 may be any number of two or more groups, which may be specifically set according to practical situations.

Wherein, the plurality of groups of evaporators 100 are arranged at intervals, the plurality of groups of evaporators 100 are equal in distance from the axes of the compensation plates 200, and the distances between the axes of any two adjacent evaporators 100 are equal.

For example, when the number of the evaporators 100 is two, the axes of the two groups of evaporators 100 are symmetrical about the axis of the compensation plate 200, that is, the two groups of evaporators 100 are symmetrical about the axis of the compensation plate 200, so that the substances evaporated by the two groups of evaporators 100 can be uniformly covered on the compensation plate 200 during the operation of the two groups of evaporators 100, the situation that the concentration of the locally evaporated substances is higher on the compensation plate 200 is avoided, and the concentration difference of the evaporated substances in different areas on the compensation plate 200 is reduced.

For example, when the number of the evaporators 100 is three or more, the axes of the plurality of sets of evaporators 100 are connected to form a regular polygon structure, and the concentration of the evaporation material passing through the through holes 210 of the compensation plate 200 can be increased by increasing the number of the evaporators 100 to increase the concentration of the evaporation material, so that the coating speed and the coating efficiency on the carrier tray 300 can be increased.

Further, the distance from the evaporator 100 to the axis of the compensation plate 200 is smaller than the radius of the compensation plate 200, so as to reduce the escape of the evaporated substances of the evaporator 100 to the outside of the compensation plate 200, and reduce the waste of resources and save the coating cost while improving the coating speed.

As shown in fig. 3, in some embodiments of the present utility model, since the number of evaporators 100 is plural, the substances evaporated from the plurality of evaporators 100 are overlapped at the middle of the compensation plate 200 such that the concentration of the evaporated substances at the middle of the compensation plate 200 is increased, and the concentration of the evaporated substances at the edge of the compensation plate 200 is smaller than the concentration of the evaporated substances at the middle of the compensation plate 200.

Therefore, in the present embodiment, in order to reduce the difference between the concentration of the evaporation material passing through the middle and the edges of the compensation plate 200, in the present embodiment, the thickness of the compensation plate 200 is gradually reduced from the center to the edges, that is, by increasing the thickness of the center region of the compensation plate 200 to increase the path of the evaporation material passing through the through holes 210 of the center region of the compensation plate 200 to reduce the concentration of the evaporation material passing through the through holes 210 of the center region of the compensation plate 200.

In addition, by reducing the thickness of the edge of the compensation plate 200 to decrease the path of the evaporation material passing through the through-holes 210 of the edge region of the compensation plate 200, the concentration of the evaporation material passing through the through-holes 210 of the center region of the compensation plate 200 is increased.

Thereby, the uniformity of the thickness of the plating film and the quality of the plating film on the carrier plate 300 can be improved by reducing the concentration of the evaporation material passing through the center region of the compensation plate 200 while increasing the concentration of the evaporation material passing through the edge region of the compensation plate 200 so that the concentration of the evaporation material passing through the respective regions of the compensation plate 200 can be substantially maintained uniform.

Further, the apertures of the plurality of through holes 210 gradually decrease from the center to the edge of the compensation plate 200.

Since the evaporator 100 has a distance from the axis of the compensation plate 200 when the evaporator 100 is provided in plural, that is, the distance from the substance evaporated by the evaporator 100 to the center portion of the compensation plate 200 is increased, however, the substance evaporated by the evaporator 100 can be overlapped in the center region of the compensation plate 200 when the evaporators 100 are simultaneously operated, so that the concentration of the substance evaporated by the evaporator 100 in the center region of the compensation plate 200 can be increased, the concentration of the evaporated substance passing through the through holes 210 in the center region of the compensation plate 200 can be further increased by increasing the aperture of the through holes 210 in the center region of the compensation plate 200, and the concentration of the evaporated substance passing through the center region of the compensation plate 200 can be controlled by increasing the thickness of the center region of the compensation plate 200.

Meanwhile, by reducing the thickness of the edge of the compensation plate 200 to reduce the path of the evaporation material through the through holes 210 of the edge region of the compensation plate 200, the passing rate of the evaporation material is increased, and by reducing the aperture of the through holes 210 of the edge of the compensation plate 200 to control the concentration of the evaporation material passing through the through holes 210 of the edge of the compensation plate 200, the concentration of the evaporation material passing through the respective regions of the compensation plate 200 can be maintained substantially uniform, thereby increasing the coating speed and coating quality while increasing the uniformity of the coating thickness of the coating device on the carrier plate 300.

Based on any one of the above embodiments, in this embodiment, the diameter of the compensation plate 200 is larger than the diameter of the carrier plate 300, so that the evaporation material passing through the through hole 210 of the compensation plate 200 can completely cover the carrier plate 300, and a blank area on the carrier plate 300 is avoided, so as to improve the stability and the coating efficiency of the coating film on the carrier plate 300.

The compensation plate 200 can be fixed to one side of the evaporation port of the evaporator 100 by a supporting frame (not shown), and the distance between the compensation plate 200 and the evaporator 100 and the distance between the compensation plate 200 and the tray can be specifically set according to practical situations.

Further, since the evaporation material generated by the operation of the evaporator is diffused, in order to reduce the waste caused by the escape of the evaporation material from the edge of the compensation plate 200, the evaporation material can cover the compensation plate 200 completely, and the ratio between the distance from the evaporator to the axis of the compensation plate 200 and the radius of the compensation plate 200 is m, wherein the value range of m is 1 < m.ltoreq.1.5. It is understood that the value of m may be any real number greater than 1 and not greater than 1.5. In implementation, the value range of m can be 1 < m < 1.5, 1 < m < 1.4, 1 < m < 1.3, 1 < m < 1.2 or 1 < m < 1.1.

It should be noted that, by controlling the value range of m, the evaporation material escapes from the edge of the compensation plate 200 during the operation of the evaporator, so as to reduce the waste during the coating process, reduce the coating cost, and simultaneously enable the evaporation material to completely cover the compensation plate 200, so as to improve the coating efficiency.

In some embodiments of the present utility model, as shown in FIG. 1, the ratio between L1 and L2 is n, where n is 1 < n.ltoreq.3. It is understood that the value range of n is any range of 1 < n.ltoreq.3, 2 < n.ltoreq.3, 1 < n.ltoreq.2.

It should be noted that, when the value of n is smaller than 1, the distance between the evaporator and the compensation plate 200 is reduced, so that the coverage area of the evaporating material is reduced, which easily results in that the through holes 210 at the edge of the compensation plate 200 are not through by the evaporating material, so that the wafer 400 which cannot be formed at the edge area of the carrier plate 300 is caused, the film plating efficiency is affected, and the effective film plating area is wasted; when n is greater than 3, the distance between the evaporator and the compensation plate 200 is too large, so that a part of the evaporation material escapes from the outside of the compensation plate 200, and the evaporation material passing through the through holes 210 is reduced, which not only affects the coating efficiency, but also wastes the evaporation material and increases the coating cost.

Therefore, by controlling the value range of n, the evaporation material is prevented from escaping from the outside of the compensation plate 200, and meanwhile, the evaporation material is ensured to completely cover the compensation plate 200, so that the coating efficiency and the uniformity of the coating thickness on the carrier plate 300 are improved, the coating cost is reduced, and the space utilization rate of the coating device is improved.

Any particular values in all examples shown and described herein are to be construed as merely illustrative and not a limitation, and thus other examples of exemplary embodiments may have different values.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

The above examples merely represent a few embodiments of the present utility model, which are described in more detail and are not to be construed as limiting the scope of the present utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model.

Claims (10)

1. A coating device, comprising:

an evaporator;

the distance between the compensation plate and the evaporator is a first distance, the compensation plate is arranged on the evaporation side of the evaporator, and a plurality of through holes are formed in the compensation plate;

the support disc is arranged on one side, away from the evaporator, of the compensation plate, and the distance between the support disc and the compensation plate is a second distance.

2. The coating device of claim 1, further comprising a drive device disposed on a side of the carrier plate facing away from the compensation plate, an output shaft of the drive device being coupled to the carrier plate.

3. The plating device according to claim 2, wherein an axis of the compensation plate, an axis of the carrier plate, and an axis of an output shaft of the driving device are coincident.

4. The plating device according to claim 1, wherein the thickness of the compensation plate gradually increases from the center toward the edge;

the apertures of the through holes gradually increase from the center of the compensation plate to the edge.

5. The plating device according to claim 1, wherein the thickness of the compensation plate gradually decreases from the center toward the edge; the apertures of the plurality of through holes gradually decrease from the center of the compensation plate to the edge.

6. The coating apparatus according to claim 4 or 5, wherein a ratio between a distance from the evaporator to an axis of the compensation plate and a radius of the compensation plate is m, wherein m is in a value range of 1 < m.ltoreq.1.5.

7. The plating device according to claim 6, wherein the evaporators are at least plural groups;

the plurality of groups of evaporators are arranged at intervals, and the distances between the plurality of groups of evaporators and the axis of the compensation plate are equal;

the distance from the evaporator to the axis of the compensation plate is less than the radius of the compensation plate.

8. The coating device according to claim 1, wherein the thickness of the compensation plate is d, and the value of d is in the range of 0.1cm to 0.4cm;

wherein the first distance is L1 and the second distance is L2;

meets the requirement that L1 is more than L2 and is more than or equal to 8cm;

the aperture of the through hole is r, wherein the value range of r is 0.2cm-1cm.

9. The plating device according to claim 8, wherein the ratio between said L1 and said L2 is n, wherein n is 1 < n.ltoreq.3.

10. The plating device according to claim 1, wherein the diameter of the compensation plate is larger than the diameter of the carrier plate.