CN220023489U - Electromagnetic shielding structure, circuit board and vehicle-mounted monitoring equipment - Google Patents

Abstract

The utility model is suitable for the technical field of vehicle-mounted equipment, and provides an electromagnetic shielding structure, a circuit board and vehicle-mounted monitoring equipment, wherein the electromagnetic shielding structure comprises a heat conduction component, and the heat conduction component is arranged on an electronic element; the shielding component is arranged on the periphery of the electronic element in a surrounding mode; the heat dissipation part is arranged on one side of the heat conduction part, which is away from the electronic element, and is connected with the shielding assembly, and one side of the heat conduction part, which is away from the electronic element, is abutted against the heat dissipation part; the shielding component and the radiating piece can enclose a shielding space, and the electronic element is accommodated in the shielding space; the circuit board comprises a board body and an electromagnetic shielding structure; the vehicle-mounted monitoring equipment comprises an electromagnetic shielding structure and/or a circuit board; the utility model enables the heat conduction component to be directly abutted against the electronic element and the heat dissipation piece, thereby reducing the heat conduction path, improving the heat conduction efficiency, and simultaneously realizing the electromagnetic shielding of the electronic element by arranging the shielding component to be matched with the heat dissipation piece, thereby saving materials and reducing the materials and manufacturing cost.

Description

Electromagnetic shielding structure, circuit board and vehicle-mounted monitoring equipment

Technical Field

The utility model belongs to the technical field of vehicle-mounted equipment, and particularly relates to an electromagnetic shielding structure, a circuit board and vehicle-mounted monitoring equipment.

Background

At present, the design in the field of vehicle-mounted monitoring equipment generally adopts a design mode of matching a shielding cover with a shielding frame to meet electromagnetic compatibility shielding performance, for example, a scheme of radiating fins, a first heat conducting material, a shielding cover, the shielding frame and a second heat conducting material is adopted to realize heat dissipation and electromagnetic shielding, but a heat conducting path of the scheme is subjected to a process of increasing heat resistance for three times, so that the heat conducting effect is poor, the heat conducting efficiency is low, and the material cost is high.

At present, a scheme of digging holes in the shielding cover is also available, and the scheme can save a second heat conducting material, so that a heat conducting path is optimized, but the digging holes can enable the shielding cover to radiate electromagnetic waves outwards, namely, the electromagnetic shielding performance is poor.

In summary, the current vehicle-mounted monitoring equipment cannot meet the requirements of heat dissipation performance, shielding performance and cost at the same time.

Disclosure of Invention

Aiming at the problems, the utility model provides an electromagnetic shielding structure, a circuit board and vehicle-mounted monitoring equipment, and at least solves the problem that the vehicle-mounted monitoring equipment in the prior art cannot meet the requirements of heat dissipation performance, shielding performance and cost at the same time.

An embodiment of the present utility model provides an electromagnetic shielding structure, including:

a heat conductive member disposed on the electronic component;

a shielding assembly disposed around a peripheral side of the electronic component;

the heat dissipation piece is arranged on one side of the heat conduction component, which is away from the electronic element, and is connected with the shielding assembly, and one side of the heat conduction component, which is away from the electronic element, is abutted against the heat dissipation piece;

the shielding component and the radiating piece can enclose a shielding space, and the electronic component is accommodated in the shielding space.

In some embodiments, the shielding assembly includes a shielding frame and a shielding member, the shielding frame is disposed around a peripheral side of the electronic component, and opposite sides of the shielding member are respectively connected to the shielding frame and the heat sink.

In some embodiments, the shielding member is conductive foam, and the shielding member is arranged between the heat dissipation member and the shielding frame in a state of being deformed by pressure so as to fill a gap between the heat dissipation member and the shielding frame.

In some embodiments, the shield is assembled by a rigid release film and positioned on a side of the heat sink facing the shield frame.

In some embodiments, the shielding frame includes at least four side walls, a plurality of side walls are sequentially connected and surround the electronic component, the shielding member is connected to one side of the side wall facing the heat dissipation member, and the side wall, the shielding member and the heat dissipation member jointly enclose the shielding space.

In some embodiments, the heat sink comprises a heat sink plate connected to the shielding assembly and enclosing the shielding space;

the heat conduction component is abutted against one side of the heat dissipation plate, which faces the electronic element.

In some embodiments, a side of the heat dissipation plate facing away from the shielding assembly is convexly provided with a plurality of protruding parts.

In some embodiments, the heat dissipation element is made of any one of copper, aluminum, copper alloy, aluminum alloy and silicon carbide ceramic.

The embodiment of the utility model also provides a circuit board, which comprises:

the board body is provided with an electronic element;

and the shielding component is arranged on the plate body.

The embodiment of the utility model also provides vehicle-mounted monitoring equipment which comprises the electromagnetic shielding structure and/or the circuit board.

The utility model makes an improved design aiming at the problem that the vehicle-mounted monitoring equipment in the prior art cannot meet the requirements of heat radiation performance, shielding performance and cost simultaneously, adopts a mode of matching a shielding component with a heat radiation piece to form a shielding space so as to ensure the electromagnetic shielding performance of the equipment, and adopts a mode of matching a heat conduction component with the heat radiation piece to directly radiate heat so as to reduce a heat conduction path so as to ensure the heat radiation performance of the equipment;

the utility model has simple structure, and the heat conducting component is directly abutted against the electronic element and the heat radiating piece, thereby reducing the heat conducting path, improving the heat conducting efficiency, and simultaneously realizing the electromagnetic shielding of the electronic element by arranging the shielding component and matching with the heat radiating piece, thereby saving materials, reducing the material and manufacturing cost and having strong practicability.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of a circuit board according to an embodiment of the present utility model.

Fig. 2 is a schematic bottom view of the circuit board shown in fig. 1.

Fig. 3 is a schematic perspective sectional view at A-A in fig. 2.

Fig. 4 is a schematic perspective view of the circuit board shown in fig. 1 after the heat sink is removed.

Fig. 5 is a schematic perspective view of a heat dissipation element in the circuit board shown in fig. 1.

Fig. 6 is a second perspective view of the heat sink in the circuit board shown in fig. 1.

The meaning of the labels in the figures is:

100. an electromagnetic shielding structure;

10. a heat conductive member;

20. a heat sink; 21. a heat dissipation plate; 211. a boss;

30. a shielding assembly; 31. a shielding frame; 311. a sidewall; 312. a stiffening beam; 32. a shield;

40. shielding the space;

200. a circuit board;

50. a plate body;

60. an electronic component.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the present utility model will be further described in detail below with reference to the accompanying drawings, i.e., embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

At present, the design in the field of vehicle-mounted monitoring equipment generally adopts a design mode of matching a shielding cover with a shielding frame to meet electromagnetic compatibility shielding performance, for example, adopts a scheme of radiating fins, a first heat conducting material, a shielding cover, the shielding frame and a second heat conducting material to realize heat radiation and electromagnetic shielding, but a heat conducting path of the scheme is subjected to a process of increasing heat resistance for three times, so that the heat conducting effect is poor, the heat conducting efficiency is low, and the material cost is high; there are also solutions for boring holes in the shield, which can reduce the second heat conducting material, thus optimizing the heat conducting path, but boring holes can make the shield radiate electromagnetic waves outwards, i.e. the electromagnetic shielding performance is poor.

Therefore, the electromagnetic shielding structure, the circuit board and the vehicle-mounted monitoring equipment provided by the utility model enable the heat conduction component to be directly abutted against the electronic element and the heat dissipation piece, so that the heat conduction path is reduced, the heat conduction efficiency is improved, and meanwhile, the shielding component is arranged to be matched with the heat dissipation piece to realize electromagnetic shielding of the electronic element, so that the materials are saved, and the materials and the manufacturing cost are reduced.

In order to describe the technical scheme of the utility model, the following description is made with reference to specific drawings and embodiments.

Referring to fig. 1 to 3, the embodiment of the first aspect of the present utility model provides an electromagnetic shielding structure 100 for shielding electromagnetic waves of an electronic component 60, which may be applied to a circuit board 200, and the circuit board 200 may be a Printed Circuit Board (PCB) or a flexible circuit board (FPC) or the like; the electromagnetic shielding structure 100 includes a heat conductive member 10, a shielding assembly 30, and a heat sink 20.

The heat conducting component 10 is abutted against the electronic element 60, the heat radiating piece 20 is arranged on one side of the heat conducting component 10 away from the electronic element 60, and one side of the heat conducting component 10 away from the electronic element 60 is abutted against the heat radiating piece 20, so that the heat conducting component 10 can directly conduct heat of the electronic element 60 to the heat radiating piece 20 and radiate the heat to the outside through the heat radiating piece 20, thereby reducing heat conduction paths and improving heat conduction efficiency; the heat conductive member 10 may be a heat conductive silicone sheet, or may be a graphene sheet, a heat conductive silicone grease layer, a heat conductive paste layer, or other various heat conductive structures.

The shielding component 30 is arranged around the periphery of the electronic element 60, meanwhile, the shielding component 30 is also connected with the heat dissipation piece 20, the shielding component 30 and the heat dissipation piece 20 can enclose a shielding space 40, and the electronic element 60 is accommodated in the shielding space 40, so that the electromagnetic shielding effect is achieved, and the electromagnetic wave of the electronic element 60 is prevented from leaking and radiating outwards; specifically, when the electromagnetic shielding structure 100 is applied to the circuit board 200, the shielding component 30 is located between the board body 50 of the circuit board 200 and the heat dissipation member 20, i.e. one end of the shielding component 30 is connected to the board body 50 of the circuit board 200 and the other end is connected to the heat dissipation member 20, so that the circuit board 200, the shielding component 30 and the heat dissipation member 20 together form a closed shielding space 40 to prevent electromagnetic waves from radiating to the outside; the shield assembly 30 may be spaced from the electronic component 60 as needed, or may be abutted against the electronic component 60.

Since the heat sink 20 is used for heat dissipation and needs to cooperate with the shielding assembly 30 to form the shielding space 40, the heat sink 20 has good electromagnetic shielding performance in addition to good heat conduction performance, and specifically, the heat sink 20 may be a silicon carbide ceramic heat sink or a heat dissipation member made of various heat conduction materials such as copper alloy, aluminum alloy and the like and having electromagnetic shielding performance.

The embodiment of the utility model has the beneficial effects that: the heat conducting component 10 is directly contacted with the electronic element 60 and the heat radiating piece 20, so that heat emitted by the electronic element 60 can be directly conducted to the heat radiating piece 20 through the heat conducting component 10 and radiated to the outside, a heat conduction path is reduced, the heat conduction efficiency is improved, and meanwhile, the cost is reduced; the shielding space 40 is formed by the shielding assembly 30 in cooperation with the heat sink 20, and the electronic component 60 is accommodated in the shielding space 40, thereby ensuring good electromagnetic shielding performance and reducing material and manufacturing costs.

Referring to fig. 3, 4, and 6, in one embodiment, the shield assembly 30 includes a shield frame 31 and a shield 32.

The shielding frame 31 is disposed around the periphery of the electronic component 60, and is used for shielding electromagnetic waves radiated from the periphery of the electronic component 60; the shielding frame 31 may have a frame structure or other structure capable of surrounding the peripheral side of the electronic component 60.

The opposite sides of the shielding member 32 are respectively connected to the shielding frame 31 and the heat dissipation member 20, that is, the shielding member 32 is disposed between the shielding frame 31 and the heat dissipation member 20 along the height direction of the shielding frame 31, the shielding member 32 is used for filling the gap between the shielding frame 31 and the heat dissipation member 20 so as to ensure the sealing of the shielding space 40, thereby ensuring good electromagnetic shielding performance, and according to the function of the shielding member 32, the shielding member 32 can be a frame structure, or can be a plurality of strip-shaped, sheet-shaped or other members with various shapes; the shield 32 may be mounted on one side of the shield frame 31 in the height direction of the shield frame 31 when mounted, and then the heat sink 20 may be brought into contact with the shield 32, or the shield 32 may be mounted on one side of the heat sink 20 facing the electronic component 60 when mounted, and then the heat sink 20 may be mounted on the shield frame 31 and the shield 32 may be brought into contact with the shield frame 31.

Referring to fig. 3, in the present embodiment, the shielding member 32 is conductive foam, which has good electromagnetic shielding performance, light material, good corrosion resistance and oxidation resistance, and certain elasticity; when the heat sink 20 is connected to the shielding frame 31, the shielding member 32 is in a pressed state between the shielding frame 31 and the heat sink 20, that is, the shielding member 32 is deformed between the shielding frame 31 and the heat sink 20 under pressure, and the shielding member 32 can fill the gap between the heat sink 20 and the shielding frame 31 by virtue of the elasticity of the shielding member 32, so that good electromagnetic shielding performance is ensured.

Referring to fig. 3, further, the shielding member 32 is mounted on a side of the heat dissipation member 20 facing the shielding frame 31, and the shielding member 32 is assembled and positioned on the heat dissipation member 20 through a hard release film, and the conductive foam is of a flexible structure, so that the yield is difficult to ensure due to the fact that dislocation and the like easily occur in the mounting process, and therefore the difficulty in mounting and positioning can be reduced, and the conductive foam can be ensured to be accurately fixed at a required position by using the hard release film for mounting, so that the product yield is improved; the specific installation mode of the conductive foam is as follows: the shape of the hard release film is corresponding to the heat dissipation piece 20, the conductive foam is fixed on the edge of the hard release film according to the requirement, then the hard release film is opposite to the heat dissipation piece 20 and is attached to the heat dissipation piece 20, and finally the hard release film is pulled out and the conductive foam is fixed on the heat dissipation piece 20.

Referring to fig. 4, in the present embodiment, the shielding frame 31 includes at least four side walls 311, and the plurality of side walls 311 are sequentially connected to form a frame structure surrounding the electronic component 60, fig. 4 is an embodiment in which the four side walls 311 are connected end to form a square frame structure, the electronic component 60 is located in the frame structure, and the side walls 311 can shield electromagnetic waves radiated from the electronic component 60 to the peripheral side.

The shielding member 32 is connected to a side of the side wall 311 facing the heat dissipation member 20, when the shielding member 32 is fixed to the heat dissipation member 20, the shielding member 32 abuts against the side wall 311 and deforms to fill a gap between the side wall 311 and the heat dissipation member 20, and at this time, the side wall 311, the shielding member 32 and the heat dissipation member 20 together enclose a shielding space 40, the electronic component 60 is accommodated in the shielding space 40, and electromagnetic waves cannot radiate to the outside.

Referring to fig. 4, in this embodiment, the shielding frame 31 further includes reinforcement beams 312, the reinforcement beams 312 are configured to ensure structural stability of the shielding frame 31, fig. 4 is an embodiment when there are four side walls 311, at this time, two reinforcement beams 312 are respectively connected to two opposite side walls 311 at two ends of the reinforcement beams 312, so as to ensure structural stability of the shielding frame 31.

It can be understood that, since the opposite sides of the heat conducting component 10 are respectively abutted against the electronic component 60 and the heat dissipating member 20, the electronic component 60 should not be located under the reinforcing beam 312, i.e. the projection of the electronic component 60 on the heat dissipating member 20 does not overlap with the projection of the reinforcing beam 312 on the heat dissipating member 20, so as to ensure that the heat conducting component 10 can be abutted against the heat dissipating member 20 and conduct heat stably.

The beneficial effects of this embodiment lie in: the shielding frame 31 is matched with the heat dissipation piece 20 to form the shielding space 40, and the shielding piece 32 is utilized to fill the gap between the shielding frame 31 and the heat dissipation piece 20, so that the electromagnetic shielding effect is ensured, the shielding cover is saved, the cost is reduced, and meanwhile, the heat conduction component 10 can be directly abutted to the heat dissipation piece 20 due to the reduction of the shielding cover, so that the heat conduction path is reduced, and the heat conduction efficiency is improved.

Referring to fig. 5 and 6, in an embodiment, the heat dissipation member 20 includes a heat dissipation plate 21, where the heat dissipation plate 21 at least covers the shielding frame 31, the heat conducting component 10 and the electronic component 60, the shielding assembly 30 of the heat dissipation plate 21 is connected to the shielding member 32, and the heat dissipation plate 21, the shielding frame 31 and the shielding member 32 can jointly enclose a shielding space 40; the heat conducting member 10 abuts against a side of the heat dissipating plate 21 facing the electronic component 60, so that heat of the electronic component 60 can be conducted to the heat dissipating plate 21 through the heat conducting member 10.

The heat dissipation plate 21 may be a plate-shaped member, or may be a plate-shaped or other-shaped member; since the heat dissipation plate 21 needs to have both good heat conduction performance and electromagnetic shielding performance, the heat dissipation plate 21 may be made of copper alloy, silicon carbide ceramic, aluminum alloy or other materials with both good heat conduction performance and electromagnetic shielding performance.

In the embodiment, a plurality of protruding portions 211 are disposed on one side of the heat dissipation plate 21 facing away from the electronic component 60, the protruding portions 211 are protruding along the direction facing away from the electronic component 60, and the protruding portions 211 are used for increasing the contact area between the heat dissipation member 20 and the outside, in particular increasing the contact area on one side of the heat dissipation member 20 facing the outside, so as to improve the heat dissipation effect; the protruding portion 211 may be integrally formed with the heat dissipation plate 21, and the protruding portion 211 may be fixed to the heat dissipation plate 21 by welding, bonding, or the like.

The beneficial effects of this embodiment lie in: the specific structure of the heat dissipation piece 20 is provided, the heat dissipation plate 21 is arranged to form a shielding space 40 by matching the shielding frame 31 and the shielding piece 32, so that the electromagnetic shielding performance is ensured, and meanwhile, the heat dissipation plate 21 can also enable the heat dissipation piece 20 to have a larger contact area with the outside, so that the heat dissipation effect is ensured; the protrusion 211 is provided on the heat dissipation plate 21 to further increase the contact area of the heat dissipation member 20 with the outside, thereby enhancing the heat dissipation effect.

In an embodiment, the heat conducting member 10 may be any of silicone grease, silica gel or graphite, and the heat conducting member 10 may be a layered structure, or may be a sheet-like, plate-like, strip-like or other structure with various shapes.

The electromagnetic shielding structure 100 provided in the embodiment of the first aspect of the present utility model has the following beneficial effects:

1. the heat conducting component 10 is directly contacted with the electronic element 60 and the heat radiating piece 20, so that heat emitted by the electronic element 60 can be directly conducted to the heat radiating piece 20 through the heat conducting component 10 and radiated to the outside, a heat conduction path is reduced, the heat conduction efficiency is improved, and meanwhile, the cost is reduced;

2. the shielding assembly 30 is matched with the heat dissipation piece 20 to form the shielding space 40, and the electronic element 60 is accommodated in the shielding space 40, so that good electromagnetic shielding performance is ensured, and meanwhile, the material and manufacturing cost are reduced;

3. the combination of the shielding frame 31 and the shielding piece 32 is used for replacing the shielding frame 31 and the shielding cover, so that the electromagnetic shielding performance is ensured, the installation and manufacturing cost is reduced, and meanwhile, the heat conduction component 10 can be directly contacted with the electronic element 60 and the heat dissipation piece 20, so that the heat conduction path is reduced, and the heat conduction efficiency is improved;

4. the heat dissipation plate 21 is arranged to be matched with the shielding frame 31 and the shielding piece 32 to form the shielding space 40, so that electromagnetic shielding performance is guaranteed, meanwhile, the protruding portion 211 is arranged on the heat dissipation plate 21, the contact area between the heat dissipation piece 20 and the outside is increased, and therefore the heat dissipation effect is enhanced.

The second aspect of the present utility model also provides a circuit board 200, the circuit board 200 including a board body 50 and an electromagnetic shielding structure 100.

The board body 50 is provided with the electronic component 60, the shielding assembly 30 is arranged on the board body 50, specifically, one end of the shielding frame 31 is connected to the board body 50, the other end of the shielding frame 31 is connected to the shielding piece 32, one end of the shielding piece 32, which is away from the shielding frame 31, is connected to the heat dissipation plate 21, the board body 50, the shielding frame 31, the shielding piece 32 and the heat dissipation plate 21 enclose a shielding space 40, and the electronic component 60 is contained in the shielding space 40 to ensure electromagnetic shielding performance.

One side of the heat conducting member 10 is abutted against the electronic component 60, and the other side of the heat conducting member 10 opposite to the electronic component 60 is abutted against the heat dissipation plate 21, so as to realize heat conduction and ensure heat dissipation performance.

The third aspect of the present utility model further provides a vehicle-mounted monitoring device, which includes an electromagnetic shielding structure 100, where the electromagnetic shielding structure 100 can shield electromagnetic radiation of the electronic component 60 in the vehicle-mounted monitoring device, and can also play a role in heat dissipation of the electronic component 60.

The in-vehicle monitoring device may also include a circuit board 200, where the circuit board 200 is provided with an electromagnetic shielding structure 100 for shielding electromagnetic radiation of the electronic components 60 on the circuit board 200 and also for performing a heat dissipation function.

The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model, and are intended to be included in the scope of the present utility model.

Claims (10)

1. An electromagnetic shielding structure for shielding electromagnetic waves of an electronic component, the electromagnetic shielding structure comprising:

a heat conductive member disposed on the electronic component;

a shielding assembly disposed around a peripheral side of the electronic component;

the heat dissipation piece is arranged on one side of the heat conduction component, which is away from the electronic element, and is connected with the shielding assembly, and one side of the heat conduction component, which is away from the electronic element, is abutted against the heat dissipation piece;

the shielding component and the radiating piece can enclose a shielding space, and the electronic component is accommodated in the shielding space.

2. The electromagnetic shielding structure according to claim 1, wherein the shielding assembly includes a shielding frame and a shielding member, the shielding frame is disposed around a peripheral side of the electronic component, and opposite sides of the shielding member are respectively connected to the shielding frame and the heat sink.

3. The electromagnetic shielding structure according to claim 2, wherein the shielding member is conductive foam, and the shielding member is provided between the heat sink and the shielding frame in a state of being deformed by pressure so as to fill a gap between the heat sink and the shielding frame.

4. An electromagnetic shielding structure according to claim 2 or 3, wherein the shielding member is assembled by a hard release film and positioned on a side of the heat sink facing the shielding frame.

5. The electromagnetic shielding structure according to claim 2 or 3, wherein the shielding frame includes at least four side walls, a plurality of the side walls are sequentially connected and surround the electronic component, the shielding member is connected to a side of the side wall facing the heat dissipation member, and the side walls, the shielding member and the heat dissipation member together enclose the shielding space.

6. The electromagnetic shielding structure according to claim 1, wherein the heat radiation member includes a heat radiation plate connected to the shielding member and enclosing the shielding space;

the heat conduction component is abutted to one side of the heat dissipation plate, which faces the shielding assembly.

7. The electromagnetic shielding structure according to claim 6, wherein a side of the heat radiation plate facing away from the shielding member is convexly provided with a plurality of protruding portions.

8. The electromagnetic shielding structure according to claim 1, wherein the heat sink is made of any one of copper, aluminum, copper alloy, aluminum alloy, and silicon carbide ceramic.

9. A circuit board, comprising:

the board body is provided with an electronic element;

the electromagnetic shielding structure according to any one of claims 1 to 8, wherein the shielding member is provided on the board body.

10. An in-vehicle monitoring device comprising an electromagnetic shielding structure according to any one of claims 1-8, and/or a circuit board according to claim 9.