CN220009059U - High-density board made of circuit board reclaimed materials - Google Patents
High-density board made of circuit board reclaimed materials Download PDFInfo
- Publication number
- CN220009059U CN220009059U CN202321182996.3U CN202321182996U CN220009059U CN 220009059 U CN220009059 U CN 220009059U CN 202321182996 U CN202321182996 U CN 202321182996U CN 220009059 U CN220009059 U CN 220009059U
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- China
- Prior art keywords
- layer
- density board
- elastic rod
- spring
- butyl rubber
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- 239000000463 material Substances 0.000 title claims abstract description 23
- 229920001971 elastomer Polymers 0.000 claims abstract description 40
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229920005549 butyl rubber Polymers 0.000 claims abstract description 27
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 17
- 239000004570 mortar (masonry) Substances 0.000 claims abstract description 17
- 239000010959 steel Substances 0.000 claims abstract description 17
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 15
- 238000001179 sorption measurement Methods 0.000 claims abstract description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 2
- 239000003973 paint Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 230000002035 prolonged effect Effects 0.000 description 7
- 230000003139 buffering effect Effects 0.000 description 4
- 239000000835 fiber Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 229920002522 Wood fibre Polymers 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010793 electronic waste Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a high-density board made of circuit board reclaimed materials, which comprises a high-density board, wherein a material layer is arranged in the high-density board, the material layer comprises hard mortar, a steel plate layer, a butyl rubber layer, an activated carbon adsorption layer, an annular reinforcing ring and a rubber pad, a T-shaped rubber block is fixedly arranged on the lower end surface of the butyl rubber layer, a movable groove is arranged in the T-shaped rubber block, a spring A is arranged in the movable groove, an elastic rod is arranged on the lower end surface of the spring A, a rubber block positioned on the upper end surface of the activated carbon adsorption layer is fixedly arranged on the lower end surface of the elastic rod, and a spring B sleeved outside the elastic rod is arranged between the T-shaped rubber block and the rubber block. The utility model enhances the practicability of the high-density board by enhancing the dustproof and waterproof effects of the high-density board.
Description
Technical Field
The utility model relates to the technical field of high-density boards, in particular to a high-density board made of circuit board reclaimed materials.
Background
The circuit board is a flexible printed circuit board which is made of polyimide or polyester film and has high reliability and excellent flexibility, has the characteristics of high wiring density, light weight, thin thickness and good flexibility, and is combined with the hard circuit board according to related technological requirements through the working procedures of pressing and the like to form the circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics.
Along with the acceleration of the update speed of electronic products, the number of waste printed circuit boards of main components of electronic waste is also increasing. Pollution of waste PCBs to the environment is also attracting attention of various countries, so that the circuit board reclaimed materials are integrated to realize recycling, and the high-density board is manufactured.
The high-density board is one of boards, and is classified into low density, medium density and high density according to density. The raw materials can be divided into a fiber density board, a glued density board, a wood shaving density board and the like. The fiber density board is made up by immersing wood, tree branch and other objects in water, crushing and pressing, and is made up by using wood fibre or other plant fibre as raw material and applying urea-formaldehyde resin or other applicable adhesive.
However, the existing high-density board only plays a role in paving, has poor dampproof effect and compression resistance effect, and can influence the service life of the board; therefore, the existing requirements are not met, and a high-density board made of the reclaimed materials of the circuit board is provided.
Disclosure of Invention
The utility model aims to provide a high-density board made of circuit board reclaimed materials, which solves the problems that the prior high-density board provided in the background art only plays a role in laying, has poor dampproof effect and compression resistance, and can influence the service life and the like.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high density board that circuit board reclaimed materials made, includes the high density board, the inside of high density board is equipped with the material layer, the material layer includes hard mortar, steel sheet layer, butyl rubber layer, active carbon adsorbed layer, annular reinforcing ring and rubber pad, butyl rubber layer's lower terminal surface is fixed to be equipped with T type rubber piece, T type rubber piece's inside is equipped with the movable groove, movable groove's inside is equipped with spring A, spring A's lower terminal surface is equipped with the elastic rod, elastic rod's lower terminal surface is fixed to be equipped with the rubber piece that is located active carbon adsorbed layer up end, be equipped with the cover between T type rubber piece and the rubber piece and establish at the outside spring B of elastic rod.
Preferably, the inside of high density board is equipped with hard mortar, the lower terminal surface of hard mortar is equipped with the steel sheet layer, the lower terminal surface on steel sheet layer is equipped with the butyl rubber layer, the lower terminal surface on butyl rubber layer is equipped with the active carbon adsorbed layer, all glue through glue between hard mortar, steel sheet layer, butyl rubber layer, the active carbon adsorbed layer.
Preferably, the inside of butyl rubber layer is equipped with a plurality of annular reinforcing rings of evenly arranged, the inside of annular reinforcing ring is equipped with the rubber pad, annular reinforcing ring is hollow structure, the inside of annular reinforcing ring is equipped with organosilicon waterproof powder.
Preferably, the surface of the high-density board is coated with a waterproof coating. And a limiting plate is arranged between the elastic rod and the spring A.
Compared with the prior art, the utility model has the beneficial effects that:
according to the utility model, the waterproof effect on the high-density board is enhanced through the hard mortar, the steel plate layer, the butyl rubber layer and the activated carbon adsorption layer in the high-density board, so that the service life of the high-density board is prolonged, the T-shaped rubber block below the butyl rubber layer and the elastic rod play a role in buffering through the cooperation of the spring A, the compression resistance effect of the high-density board is improved, the service life is prolonged, when the high-density board has the influence of gravity, the T-shaped rubber block is downwards pressed, the elastic rod in the T-shaped rubber block moves in the movable groove and compresses the spring A on the upper end face of the movable groove, and the spring B sleeved outside the elastic rod between the T-shaped rubber block and the rubber block also has the compression buffering effect, so that the whole service life is prolonged.
Drawings
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a schematic view of the overall internal materials of the present utility model;
FIG. 3 is a schematic view of a partial structure of the compression buffer of the present utility model.
In the figure: 1. a high density board; 2. a material layer; 3. a hard mortar; 4. a steel plate layer; 5. a butyl rubber layer; 6. an activated carbon adsorption layer; 7. an annular reinforcing ring; 8. a rubber pad; 9. a spring A; 10. an elastic rod; 11. a spring B; 12. a rubber block; 13. a movable groove; 14. t-shaped rubber blocks.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1 to 3, an embodiment of the present utility model provides: the utility model provides a high density board that circuit board reclaimed materials made, including high density board 1, the inside of high density board 1 is equipped with material layer 2, material layer 2 includes hard mortar 3, steel sheet layer 4, butyl rubber layer 5, activated carbon adsorption layer 6, annular reinforcement circle 7 and rubber pad 8, the fixed T type rubber piece 14 that is equipped with of lower terminal surface of butyl rubber layer 5, the inside of T type rubber piece 14 is equipped with movable groove 13, the inside of movable groove 13 is equipped with spring A9, the lower terminal surface of spring A9 is equipped with elastic rod 10, the fixed rubber piece 12 that is equipped with of lower terminal surface of elastic rod 10 is located activated carbon adsorption layer 6 up end, be equipped with the cover between T type rubber piece 14 and the rubber piece 12 and establish the spring B11 outside at elastic rod 10.
Wherein, the inside of high density board 1 is equipped with hard mortar 3, and the lower terminal surface of hard mortar 3 is equipped with steel sheet layer 4, and the lower terminal surface of steel sheet layer 4 is equipped with butyl rubber layer 5, and the lower terminal surface of butyl rubber layer 5 is equipped with activated carbon adsorption layer 6, all glues through glue between hard mortar 3, steel sheet layer 4, butyl rubber layer 5, the activated carbon adsorption layer 6 layer upon layer.
Through the technical problems, the waterproof effect on the high-density board 1 is enhanced through the hard mortar 3, the steel plate layer 4, the butyl rubber layer 5 and the activated carbon adsorption layer 6 in the high-density board 1, the service life of the high-density board is prolonged, and then the high-density board is buffered through the cooperation of the springs A9 between the T-shaped rubber block 14 passing through the lower part of the butyl rubber layer 5 and the elastic rod 10.
And, the inside of butyl rubber layer 5 is equipped with a plurality of evenly arranged annular reinforcing rings 7, and the inside of annular reinforcing ring 7 is equipped with rubber pad 8, and annular reinforcing ring 7 is hollow structure, and the inside of annular reinforcing ring 7 is equipped with organosilicon waterproof powder, and the surface of high density board 1 scribbles waterproof coating. A limiting plate is arranged between the elastic rod 10 and the spring A9.
In summary, when the high-density board is used, the waterproof effect on the high-density board 1 is enhanced through the hard mortar 3, the steel plate layer 4, the butyl rubber layer 5 and the activated carbon adsorption layer 6 in the high-density board 1, the service life of the high-density board is prolonged, the buffering effect is achieved through the cooperation of the springs A9 between the T-shaped rubber block 14 below the butyl rubber layer 5 and the elastic rod 10, the compression effect of the high-density board 1 is improved, the service life is prolonged, when the high-density board is influenced by gravity, the T-shaped rubber block 14 is pressed downwards, the elastic rod 10 in the high-density board moves in the movable groove 13 and compresses the springs A9 on the upper end face of the high-density board, the springs B11 sleeved outside the elastic rod 10 between the T-shaped rubber block 14 and the rubber block 12 also have the compression buffering effect, and the whole service life is prolonged.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (4)
1. The utility model provides a high density board that circuit board reclaimed materials made, includes high density board (1), its characterized in that: the inside of high density board (1) is equipped with material layer (2), material layer (2) are including hard mortar (3), steel sheet layer (4), butyl rubber layer (5), active carbon adsorbed layer (6), annular reinforcement circle (7) and rubber pad (8), the fixed T type rubber piece (14) that is equipped with of lower terminal surface of butyl rubber layer (5), the inside of T type rubber piece (14) is equipped with movable groove (13), the inside of movable groove (13) is equipped with spring A (9), the lower terminal surface of spring A (9) is equipped with elastic rod (10), the lower terminal surface of elastic rod (10) is fixed to be equipped with rubber piece (12) that are located active carbon adsorbed layer (6) up end, be equipped with between T type rubber piece (14) and rubber piece (12) and overlap and establish at outside spring B (11) of elastic rod (10).
2. The high-density board made of recycled material for circuit board according to claim 1, wherein: the inside of high density board (1) is equipped with hard mortar (3), the lower terminal surface of hard mortar (3) is equipped with steel sheet layer (4), the lower terminal surface of steel sheet layer (4) is equipped with butyl rubber layer (5), the lower terminal surface of butyl rubber layer (5) is equipped with active carbon adsorption layer (6), all glue through glue between hard mortar (3), steel sheet layer (4), butyl rubber layer (5), active carbon adsorption layer (6) layer upon layer.
3. The high-density board made of recycled material for circuit board according to claim 1, wherein: the inside of butyl rubber layer (5) is equipped with a plurality of annular reinforcing rings (7) of evenly arranged, the inside of annular reinforcing ring (7) is equipped with rubber pad (8), annular reinforcing ring (7) are hollow structure, the inside of annular reinforcing ring (7) is equipped with organosilicon waterproof powder.
4. The high-density board made of recycled material for circuit board according to claim 1, wherein: the surface of the high-density board (1) is coated with waterproof paint, and a limiting plate is arranged between the elastic rod (10) and the spring A (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321182996.3U CN220009059U (en) | 2023-05-17 | 2023-05-17 | High-density board made of circuit board reclaimed materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321182996.3U CN220009059U (en) | 2023-05-17 | 2023-05-17 | High-density board made of circuit board reclaimed materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220009059U true CN220009059U (en) | 2023-11-14 |
Family
ID=88692608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321182996.3U Active CN220009059U (en) | 2023-05-17 | 2023-05-17 | High-density board made of circuit board reclaimed materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220009059U (en) |
-
2023
- 2023-05-17 CN CN202321182996.3U patent/CN220009059U/en active Active
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