CN219873496U - Chip packaging heat radiation structure and electronic equipment - Google Patents
Chip packaging heat radiation structure and electronic equipment Download PDFInfo
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- CN219873496U CN219873496U CN202320564075.7U CN202320564075U CN219873496U CN 219873496 U CN219873496 U CN 219873496U CN 202320564075 U CN202320564075 U CN 202320564075U CN 219873496 U CN219873496 U CN 219873496U
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 22
- 230000005855 radiation Effects 0.000 title description 7
- 230000017525 heat dissipation Effects 0.000 claims abstract description 109
- 230000000712 assembly Effects 0.000 claims abstract description 21
- 238000000429 assembly Methods 0.000 claims abstract description 21
- 238000007789 sealing Methods 0.000 claims description 39
- 238000007667 floating Methods 0.000 claims description 36
- 239000012782 phase change material Substances 0.000 claims description 13
- 239000007787 solid Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 210000001503 joint Anatomy 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 12
- 230000008569 process Effects 0.000 abstract description 11
- 230000000694 effects Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000008645 cold stress Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model relates to the technical field of chips and discloses a chip packaging heat dissipation structure and electronic equipment, wherein the chip packaging heat dissipation structure comprises a circuit board, a chip, a heat dissipation unit and at least two anti-tilting fixing assemblies, the heat dissipation unit is positioned at one side of the circuit board, and the chip is positioned between the heat dissipation unit and the circuit board and fixedly connected with the heat dissipation unit and the circuit board; each anti-tilting fixing assembly comprises a guide post and a guide sleeve, wherein the guide post is fixedly arranged on the circuit board and extends to one side of the circuit board facing the heat radiating unit, the guide sleeve is fixedly arranged on the heat radiating unit, and the guide post extends beyond the surface of the chip at one side of the circuit board facing the heat radiating unit; the guide posts are inserted into the corresponding guide sleeves. The chip packaging heat dissipation structure and the electronic equipment improve the problem that the radiator is easy to incline in the process of installing or detaching the radiator.
Description
Technical Field
The present utility model relates to the field of chip technologies, and in particular, to a chip package heat dissipation structure and an electronic device.
Background
With the rapid development of the electronic industry, various electronic devices gradually show a trend of high integration and miniaturization, and the heat productivity and heat flux density of electronic devices are also continuously increasing. In order to solve the problem of heat dissipation of high-power chips, the packaging mode of the chips is evolving from Lid (with metal cover) to Lid (without metal cover).
The radiator is one of main components for radiating heat of electronic devices such as chips, and the weight and the volume of the radiator are increased to meet the heat radiation requirement. When the chip adopts the Lidless packaging form, the radiator is fixed above the chip by adopting screw locking or buckling. In the process of installing or detaching the larger and larger radiator, the conditions such as inclination of the radiator and the like are easy to occur, so that the local instant acting force is overlarge when the radiator is contacted with the chip, and the chip is damaged.
Disclosure of Invention
The utility model provides a chip packaging heat dissipation structure and electronic equipment, which are used for solving the problem that a radiator is easy to incline in the process of installing or detaching the radiator.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
the chip packaging heat dissipation structure comprises a circuit board, a chip, a heat dissipation unit and at least two anti-tilting fixing assemblies, wherein the heat dissipation unit is positioned on one side of the circuit board, and the chip is positioned between the heat dissipation unit and the circuit board and fixedly connected with the heat dissipation unit and the circuit board;
each anti-tilting fixing assembly comprises a guide post and a guide sleeve, wherein the guide post is fixedly arranged on the circuit board and extends to one side of the circuit board facing the heat radiating unit, the guide sleeve is fixedly arranged on the heat radiating unit, and the guide post exceeds the surface of the chip on one side of the circuit board facing the heat radiating unit; the guide posts are inserted into the corresponding guide sleeves.
In the scheme, when the chip packaging heat dissipation structure is assembled, each guide sleeve is made to be opposite to the corresponding guide post respectively, and then the heat dissipation unit is moved, so that each guide sleeve is made to sleeve the corresponding guide post into the guide sleeve respectively and slide along the corresponding guide post until the surface of the heat dissipation unit is in contact with the surface of the chip. When the heat radiation unit is detached from the chip, the heat radiation unit is moved in the opposite direction, and each guide sleeve slides along the corresponding guide post until the guide sleeve is separated from the corresponding guide post. Therefore, in the process of installing and detaching the heat radiating unit, the guide posts can act together with the corresponding guide sleeves to play a role in guiding the movement of the heat radiating unit, so that the possibility of tilting the heat radiating unit is reduced, the heat radiating unit is prevented from tilting even, the possibility of damaging the chip is further reduced, and the chip is prevented from being damaged even.
Optionally, two of said anti-tilt securing assemblies are included;
the cross section of the heat radiating unit parallel to the circuit board is rectangular, and the cross section comprises a first side and a second side which are adjacent; when the first edge is larger than or equal to the second edge, one of the two guide sleeves is arranged in the middle of the second edge, and the other guide sleeve is arranged in the middle of the second edge opposite to the first edge.
Optionally, each anti-tilting fixing assembly further includes a first limiting member;
each guide post extends out of the corresponding guide sleeve on one side of the circuit board facing the heat radiating unit, and each first limiting piece is fixedly arranged at one end of the corresponding guide post, which extends out of the corresponding guide sleeve;
when the chip packaging heat dissipation structure is in a natural state, gaps are reserved among the guide sleeve, the circuit board and the corresponding first limiting piece.
Optionally, the heat dissipation unit includes radiating fin and set firmly in radiating fin is towards the samming board of chip one side, chip package heat dissipation structure still includes two at least floating coupling assembling, the heat dissipation unit still through each floating coupling assembling with the circuit board is connected.
Optionally, the heat dissipation fin comprises heat dissipation parts and avoidance parts corresponding to the floating connection components one by one;
the floating connecting assembly comprises bolts and floating connecting units, through holes corresponding to the corresponding bolts are formed in the positions, opposite to the avoiding portions, of the temperature equalizing plate, and the bolts penetrate through the corresponding through holes and are connected with the temperature equalizing plate through the corresponding floating connecting units.
Optionally, the floating connection unit includes a sealing cover fixedly arranged on one side of the temperature equalization plate, which is away from the chip, and in sealing fit with the temperature equalization plate, the head of the bolt and the corresponding through hole are both located in a corresponding area covered by the sealing cover, and the rod of the bolt passes through the corresponding through hole and can slide relative to the through hole; the floating connection unit further comprises a first elastic piece which is sleeved on the rod part of the bolt and is positioned between the head part of the bolt and the temperature equalizing plate, and the first elastic piece is contacted with the head part of the bolt and the temperature equalizing plate;
the floating connection unit further comprises a second elastic piece, a sealing ring and a second limiting piece, wherein the second elastic piece, the sealing ring and the second limiting piece are positioned on one side, away from the radiating fins, of the temperature equalization plate, the sealing ring is sleeved on the corresponding rod portion and is in sealing fit with the corresponding rod portion and the temperature equalization plate, the second limiting piece is fixedly sleeved on the rod portion, and the second elastic piece is positioned between the sealing ring and the second limiting piece and is in butt joint with the sealing ring and the second limiting piece; a phase change material is filled between the sealing cover and the temperature equalization plate, and is in a liquid state after the electronic equipment is electrified; after the electronic equipment is powered down, the phase change material is in a solid state and the first elastic piece is fixed in the phase change material.
Optionally, a friction layer is arranged on the inner wall of the sealing cover.
Optionally, four floating connection assemblies are included, and the four floating connection assemblies are distributed in a rectangular shape around the chip.
Optionally, the heat dissipation unit further includes a heat pipe fixedly disposed on the heat dissipation fin.
The utility model also provides electronic equipment, which comprises a case and any chip packaging heat dissipation structure provided in the technical scheme, wherein the chip packaging heat dissipation structure is arranged in the case.
In the scheme, the chip packaging heat dissipation structure of the electronic equipment comprises at least two anti-tilting fixing assemblies, when the chip packaging heat dissipation structure is assembled, each guide sleeve is respectively opposite to the corresponding guide post, then the heat dissipation unit is moved, and each guide sleeve is respectively sleeved in the corresponding guide post and slides along the corresponding guide post until the surface of the heat dissipation unit is contacted with the surface of the chip. When the heat radiation unit is detached from the chip, the heat radiation unit is moved in the opposite direction, and each guide sleeve slides along the corresponding guide post until the guide sleeve is separated from the corresponding guide post. Therefore, in the process of installing and detaching the heat radiating unit, the guide posts can act together with the corresponding guide sleeves to play a role in guiding the movement of the heat radiating unit, so that the possibility of tilting the heat radiating unit is reduced, the heat radiating unit is prevented from tilting even, the possibility of damaging the chip is further reduced, and the chip is prevented from being damaged even.
Optionally, the electronic device further includes a cushion pad, the chassis includes a case body and a case cover covered on the case body, and the cushion pad is clamped between the case cover and the heat dissipation unit.
Drawings
Fig. 1 is a cross-sectional view of a heat dissipation structure for chip package according to an embodiment of the present utility model;
fig. 2 is a schematic plan layout view of a heat dissipation structure of a chip package according to an embodiment of the present utility model.
Icon: 1-a circuit board; 2-chip; 3-a heat dissipation unit; 31-radiating fins; 32-homogenizing temperature plate; 4-an anti-tilt securing assembly; 41-a first limiting piece; 42-a guide post; 43-guiding sleeve; a 5-floating connection assembly; 51-bolts; 52-sealing the cover; 53-a first elastic member; 54-a second elastic member; 55-sealing rings; 56-a second limiting piece; 6-cushion pad; 7-phase change material; 100-case cover; 200-backboard.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1, the chip package heat dissipation structure provided in this embodiment includes a circuit board 1, a chip 2, a heat dissipation unit 3 and at least two anti-tilting fixing assemblies 4, wherein the heat dissipation unit 3 is located at one side of the circuit board 1, and the chip 2 is located between the heat dissipation unit 3 and the circuit board 1 and is fixedly connected with both the heat dissipation unit 3 and the circuit board 1. Each anti-tilting fixing assembly 4 comprises a guide post 42 fixed on the circuit board 1 and extending to one side of the circuit board 1 facing the heat dissipation unit 3, and a guide sleeve 43 fixed on the heat dissipation unit 3, wherein the guide post 42 extends beyond the surface of the chip 2 (i.e. the guide post 42 is higher than the surface of the chip 2) on one side of the circuit board 1 facing the heat dissipation unit 3. The guide posts 42 are inserted into corresponding guide sleeves 43.
In this solution, when the chip package heat dissipation structure is assembled, each guide sleeve 43 is made to face the corresponding guide post 42 respectively, and then the heat dissipation unit 3 is moved (for example, the heat dissipation unit is moved downward in the assembly process in the view angle shown in fig. 1), so that each guide sleeve 43 respectively sleeves the corresponding guide post 42 therein and slides along the corresponding guide post 42 until the surface of the heat dissipation unit 3 contacts with the surface of the chip. When the heat dissipating unit 3 is removed from the chip 2, the heat dissipating unit 3 is moved in the opposite direction (for example, the heat dissipating unit 3 is moved upward during the process of removing the heat dissipating unit 3 from the view point shown in fig. 1), and each guide sleeve 43 slides along the corresponding guide post 42 until the guide sleeve 43 is separated from the corresponding guide post 42. Therefore, in the process of installing and detaching the heat dissipating unit 3, the guide posts 42 can act together with the corresponding guide sleeves 43 to guide the movement of the heat dissipating unit 3, so as to reduce the possibility of tilting the heat dissipating unit 3, and even avoid tilting the heat dissipating unit 3, so as to reduce the possibility of damaging the chip 2, and even avoid damaging the chip 2.
The above-mentioned circuit board 1 may be a printed circuit board PCB, for example; the chip 2 and the heat dissipation unit 3 are connected through a heat-conducting medium, specifically, the heat-conducting medium includes, but is not limited to, heat-conducting silicone grease, heat-conducting glue, carbon fiber, phase-change material capable of realizing a heat-conducting function, and the like.
In particular, when the guide posts 42 are provided, in an alternative implementation, each guide post 42 may be indirectly and fixedly connected to the circuit board 1 through a structure such as the backplate 200, for example: the guide posts are integrally formed on the backboard 200, the circuit board 1 is fixedly connected with the backboard 200, through holes corresponding to the guide posts 42 one by one are arranged, and the guide posts 42 respectively penetrate through the corresponding through holes on the circuit board 1. Illustratively, the backplate 200 may be a chassis base of an electronic device.
In a specific implementation manner, as shown in fig. 1 and fig. 2, the chip package heat dissipation structure provided in this embodiment includes two anti-tilting fixing assemblies 4, optionally, a cross section of the heat dissipation unit 3 parallel to the circuit board 1 is rectangular, the cross section of the heat dissipation unit 3 includes a first side and a second side that are adjacent, when the first side is greater than or equal to the second side, one of the two guide sleeves 43 is disposed in a middle portion of the second side, and the other is disposed in a middle portion of the second side opposite to the first side. The scheme reduces the possibility of tilting of the heat radiating unit 3 and simultaneously facilitates rapid assembly between the heat radiating unit 3 and the circuit board 1 and the chip 2.
In an alternative implementation, on the side of the circuit board 1 facing the heat dissipation unit 3, each guide post 42 extends beyond the corresponding guide sleeve 43, so that the section of the guide post 42 that plays a guiding role is longer, and a better guiding effect is achieved. Further, in a specific implementation manner, each anti-tilting fixing assembly further includes a first limiting member, each first limiting member is fixedly arranged at one end of the corresponding guide post, which exceeds the corresponding guide sleeve, and when the chip package heat dissipation structure is in a natural state, a gap exists between the guide sleeve 43 and the circuit board 1. Specifically, the gap may be determined according to a tolerance of the heat dissipation structure of the chip package.
In an alternative implementation, when the chip package heat dissipation structure is in a natural state, a gap is formed between the guide sleeve 43 and the circuit board 1 and the corresponding first limiting member 41.
When adopting arbitrary one of the two kinds of schemes, at the in-process of electronic equipment work, radiating element 3 can float a little to can absorb under the high low temperature circulation, radiating element 3 and chip 2 expend with heat and contract with cold stress influence the micro deformation that leads to, simultaneously, can also effectively prevent rocking of radiating element 3 under the scene such as vibrations, fall. The structure has fewer parts, is stable and reliable, and integrates three functions of installation guiding, assembly inclination prevention and deformation absorption.
When the heat dissipation unit 3 is specifically provided, in an alternative implementation manner, the heat dissipation unit 3 includes a heat dissipation fin 31 and a Vapor Chamber (VC) 32 fixedly arranged on one side of the heat dissipation fin 31 facing the chip 2, and meanwhile, the chip package heat dissipation structure further includes at least two floating connection assemblies 5, and the heat dissipation unit 3 is further connected with the circuit board 1 through each floating connection assembly 5. In this scheme, the above-mentioned at least two floating connection components 5 also can be compatible under the high low temperature circulation, the stress influence of the thermal expansion shrinkage of heat dissipation unit 3 and chip 2.
In a specific implementation manner, the heat dissipation fin 31 comprises heat dissipation parts and avoidance parts corresponding to the floating connection assemblies 5 one by one, each floating connection assembly 5 comprises a bolt 51 and a floating connection unit, and through holes corresponding to the corresponding bolts 51 are formed in the positions, opposite to the avoidance parts, of the temperature equalization plate 32. The bolts 51 pass through the corresponding through holes and are connected to the temperature equalizing plate 32 by the corresponding floating connection units.
Illustratively, the floating connection unit includes a sealing cover 52 and a first elastic member 53, the sealing cover 52 is fixedly arranged on one side of the temperature equalization plate 32 away from the chip 2 and is in sealing fit with the temperature equalization plate 32, the head of the bolt 51 and the corresponding through hole are located in the corresponding area covered by the sealing cover 52, and the rod of the bolt 51 passes through the corresponding through hole on the temperature equalization plate and can slide relative to the through hole. The first elastic member 53 is sleeved on the rod portion of the bolt 51 and located between the head portion of the bolt 51 and the temperature equalizing plate 32, and specifically, the first elastic member 53 contacts both the head portion of the bolt 51 and the temperature equalizing plate 32. The first elastic member 53 may be in direct contact with the temperature equalizing plate 32, or may be in indirect contact with the heat dissipating substrate under the heat dissipating fins.
Meanwhile, the floating connection unit further comprises a second elastic piece 54, a sealing ring 55 and a second limiting piece 56, wherein the second elastic piece 54, the sealing ring 55 and the second limiting piece 56 are all located on one side of the temperature equalizing plate 32, which is away from the radiating fins 31, and the sealing ring 55 is sleeved on the rod part of the corresponding bolt 51 and is in sealing fit with the rod part of the corresponding bolt 51 and the temperature equalizing plate 32. The second limiting member 56 is fixedly sleeved on the rod portion, and the second elastic member 54 is located between the sealing ring 55 and the second limiting member 56 and is abutted against both the sealing ring 55 and the second limiting member 56. Further, the phase change material 7 is filled between the sealing cover 52 and the temperature equalizing plate 32, and after the electronic equipment is electrified, the phase change material 7 is in a liquid state, so that the expansion and contraction of the first elastic piece 53 are not influenced, and each floating connection assembly 5 can be compatible with the thermal expansion influences of the heat radiating unit 3 and the chip 2; after the electronic equipment is powered down, the phase change material 7 is in a solid state and the first elastic piece 53 is fixed in the solid state, and the form of the first elastic piece 53 is fixed accordingly, so that the chip 2 can be effectively prevented from being damaged due to the fact that the heat radiating unit 3 floats and the chip 2 is instantaneously flapped in the scenes of vibration, falling and the like, and the chip packaging heat radiating structure provided by the embodiment is more stable and reliable. Obviously, in this embodiment, the phase change material 7 and the sealing cap 52 are located above the temperature equalizing plate 32.
Illustratively, the second limiting member 56 may be a nut or an O-shaped buckle; the first stopper 41 may be a nut.
In an alternative implementation, the seal housing 52 may include a seal cartridge secured to the temperature equalization plate 32 and having an open top end, and a seal cap secured to the open end of the seal cartridge and fixedly connected to the seal cartridge. In this scheme, the seal housing 52 is of a split type construction, facilitating maintenance of the floating connection unit.
Alternatively, the heat dissipation fins 31 may be fixed to the side of the temperature equalization plate 32 facing the circuit board 1, and it is obvious that the heat dissipation fins 31 do not interfere with the chip 2. This scheme can further improve the radiating effect of the radiating unit 3. Illustratively, the heat dissipation fins 31 include a first fin on one side of the chip 2 and a second fin on the other side of the chip 2.
When the sealing cover 52 is specifically provided, a friction layer can be arranged on the inner wall of the sealing cover 52, so that the phase change material 7 can be adsorbed on the inner wall of the sealing cover 52 without affecting the installation and the disassembly of the chip packaging heat dissipation structure. The friction layer may be, for example, a threaded structure formed on the inner wall of the seal housing 52 or other structure that increases the roughness of the inner wall of the seal housing 52.
In a specific implementation manner, as shown in fig. 2, the chip package heat dissipation structure includes four floating connection assemblies 5, and the four floating connection assemblies 5 are distributed in a rectangular shape around the chip 2, so as to better protect the chip 2 and make the chip package heat dissipation structure provided in this embodiment better in stability.
In an alternative implementation manner, the heat dissipation unit 3 further includes a heat pipe fixed to the heat dissipation fin 31, so as to improve the heat dissipation effect of the heat dissipation unit 3.
The electronic device provided by the embodiment comprises a case and the chip packaging heat dissipation structure, wherein the chip packaging heat dissipation structure is arranged in the case.
In this solution, the chip package heat dissipation structure of the electronic device includes at least two anti-tilting fixing assemblies 4, when the chip package heat dissipation structure is assembled, each guide sleeve 43 is made to be opposite to the corresponding guide post 42, and then the heat dissipation unit 3 is moved (taking the view angle shown in fig. 1 as an example, the heat dissipation unit is moved downwards in the assembly process), so that each guide sleeve 43 respectively sleeves the corresponding guide post 42 therein and slides along the corresponding guide post 42 until the surface of the heat dissipation unit 3 contacts with the surface of the chip. When the heat dissipating unit 3 is removed from the chip 2, the heat dissipating unit 3 is moved in the opposite direction (for example, the heat dissipating unit 3 is moved upward during the process of removing the heat dissipating unit 3 from the view point shown in fig. 1), and each guide sleeve 43 slides along the corresponding guide post 42 until the guide sleeve 43 is separated from the corresponding guide post 42. Therefore, in the process of installing and detaching the heat dissipating unit 3, the guide posts 42 can act together with the corresponding guide sleeves 43 to guide the movement of the heat dissipating unit 3, so as to reduce the possibility of tilting the heat dissipating unit 3, and even avoid tilting the heat dissipating unit 3, so as to reduce the possibility of damaging the chip 2, and even avoid damaging the chip 2.
Further, in an optional implementation manner, the electronic device further includes a cushion pad 6, the chassis includes a case body and a case cover 100 covering the case body, and the cushion pad 6 is clamped between the case cover 100 and the heat dissipation unit 3, so as to effectively fix the heat dissipation device, prevent the heat dissipation unit 3 from shaking under the scenes of vibration, falling and the like, and thus better protect the chip 2. The cushion pad 6 may be a rubber pad, for example.
The electronic device provided in this embodiment includes, but is not limited to, a communication device, a switch, a computer, a server, and the like.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. The chip packaging heat dissipation structure is characterized by comprising a circuit board, a chip, a heat dissipation unit and at least two anti-tilting fixing assemblies, wherein the heat dissipation unit is positioned on one side of the circuit board, and the chip is positioned between the heat dissipation unit and the circuit board and fixedly connected with the heat dissipation unit and the circuit board;
each anti-tilting fixing assembly comprises a guide post and a guide sleeve, wherein the guide post is fixedly arranged on the circuit board and extends to one side of the circuit board facing the heat radiating unit, the guide sleeve is fixedly arranged on the heat radiating unit, and the guide post exceeds the surface of the chip on one side of the circuit board facing the heat radiating unit; the guide posts are inserted into the corresponding guide sleeves;
the heat dissipation unit comprises a heat dissipation fin and a temperature equalization plate fixedly arranged on one side, facing the chip, of the heat dissipation fin, the chip packaging heat dissipation structure further comprises at least two floating connection assemblies, and the heat dissipation unit is connected with the circuit board through the floating connection assemblies.
2. The chip package heat dissipation structure of claim 1, comprising two of said anti-tilt securing assemblies;
the cross section of the heat radiating unit parallel to the circuit board is rectangular, and the cross section comprises a first side and a second side which are adjacent; when the first edge is larger than or equal to the second edge, one of the two guide sleeves is arranged in the middle of the second edge, and the other guide sleeve is arranged in the middle of the second edge opposite to the first edge.
3. The chip package heat dissipation structure of claim 1, wherein each of the anti-tilt fixing assemblies further comprises a first stop member;
each guide post extends out of the corresponding guide sleeve on one side of the circuit board facing the heat radiating unit, and each first limiting piece is fixedly arranged at one end of the corresponding guide post, which extends out of the corresponding guide sleeve;
when the chip packaging heat dissipation structure is in a natural state, gaps are reserved among the guide sleeve, the circuit board and the corresponding first limiting piece.
4. The chip package heat dissipation structure according to claim 1, wherein the heat dissipation fins include heat dissipation portions and avoiding portions in one-to-one correspondence with the floating connection assemblies;
the floating connecting assembly comprises bolts and floating connecting units, through holes corresponding to the corresponding bolts are formed in the positions, opposite to the avoiding portions, of the temperature equalizing plate, and the bolts penetrate through the corresponding through holes and are connected with the temperature equalizing plate through the corresponding floating connecting units.
5. The chip package heat dissipation structure according to claim 4, wherein the floating connection unit comprises a sealing cover fixedly arranged on one side of the temperature equalization plate, which is away from the chip, and in sealing fit with the temperature equalization plate, the head of the bolt and the corresponding through hole are both located in a corresponding area covered by the sealing cover, and the rod of the bolt passes through the corresponding through hole and can slide relative to the through hole; the floating connection unit further comprises a first elastic piece which is sleeved on the rod part of the bolt and is positioned between the head part of the bolt and the temperature equalizing plate, and the first elastic piece is contacted with the head part of the bolt and the temperature equalizing plate;
the floating connection unit further comprises a second elastic piece, a sealing ring and a second limiting piece, wherein the second elastic piece, the sealing ring and the second limiting piece are positioned on one side, away from the radiating fins, of the temperature equalization plate, the sealing ring is sleeved on the corresponding rod portion and is in sealing fit with the corresponding rod portion and the temperature equalization plate, the second limiting piece is fixedly sleeved on the rod portion, and the second elastic piece is positioned between the sealing ring and the second limiting piece and is in butt joint with the sealing ring and the second limiting piece; a phase change material is filled between the sealing cover and the temperature equalization plate, and is in a liquid state after the electronic equipment is electrified; after the electronic equipment is powered down, the phase change material is in a solid state and the first elastic piece is fixed in the phase change material.
6. The heat dissipation structure of claim 5, wherein the inner wall of the sealing cap is provided with a friction layer.
7. The chip package heat dissipation structure of claim 1, comprising four of said floating connection assemblies, said four floating connection assemblies being rectangular in distribution around said chip.
8. The chip package heat dissipation structure of claim 1, wherein the heat dissipation unit further comprises a heat pipe fixedly arranged on the heat dissipation fin.
9. An electronic device, comprising a chassis and the chip package heat dissipation structure according to any one of claims 1-8, wherein the chip package heat dissipation structure is disposed in the chassis.
10. The electronic device of claim 9, further comprising a cushion pad, wherein the case comprises a case body and a case cover covering the case body, and wherein the cushion pad is clamped between the case cover and the heat dissipating unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320564075.7U CN219873496U (en) | 2023-03-21 | 2023-03-21 | Chip packaging heat radiation structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320564075.7U CN219873496U (en) | 2023-03-21 | 2023-03-21 | Chip packaging heat radiation structure and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219873496U true CN219873496U (en) | 2023-10-20 |
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ID=88319234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320564075.7U Active CN219873496U (en) | 2023-03-21 | 2023-03-21 | Chip packaging heat radiation structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219873496U (en) |
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2023
- 2023-03-21 CN CN202320564075.7U patent/CN219873496U/en active Active
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