CN219868251U - Heat abstractor and air conditioning system - Google Patents

Abstract

The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation device and an air conditioning system, and aims to solve the problem that heat dissipation of a compressor is affected due to the arrangement of a noise reduction structure when the existing compressor operates. For this purpose, the heat dissipating device of the present utility model comprises: a supercharging device; one end of the liquid passing pipeline is connected with the input end of the pressurizing device, the other end of the liquid passing pipeline is connected with the output end of the pressurizing device, and the liquid passing pipeline and the pressurizing device form a circulating liquid path system; and the semiconductor refrigeration module is provided with a cold end and a hot end which are opposite, the liquid passing pipeline is partially attached to the cold end of the semiconductor refrigeration module, and the liquid passing pipeline can be partially attached to a heat source to be cooled, so that the heat source exchanges heat with the semiconductor refrigeration module through the liquid passing pipeline. The utility model adopts a mode of combining liquid path circulation and a semiconductor refrigeration module to cool the compressor, and meets the heat dissipation requirement on the basis of realizing noise reduction.

Description

Radiation device and air conditioning system

Technical field

This application relates to the field of heat dissipation technology, and specifically provides a heat dissipation device and an air conditioning system.

Background technique

At present, in air conditioning systems, the compressor will generate a lot of noise when running. For household air conditioners, the compressor is generally placed outdoors to reduce the impact of noise. However, for applications such as computer rooms and data centers, the compressor is Need to be placed indoors.

For scenarios where the compressor is placed indoors, in order to reduce the noise of the compressor, it is usually chosen to add a physical noise reduction structure outside the compressor. However, in this way, since the noise reduction structure is wrapped around the outside of the compressor, it will cause compression The heat dissipation of the machine is affected.

Accordingly, a new technical solution is needed in this field to solve the above problems.

Utility model content

This application aims to solve the above technical problems, that is, to solve the problem that the heat dissipation of the compressor is affected due to the installation of the noise reduction structure when the existing compressor is running.

In a first aspect, this application provides a heat dissipation device, which includes:

supercharging device;

A liquid pipe, one end of which is connected to the input end of the supercharging device, and the other end is connected to the output end of the supercharging device, and the liquid pipe and the supercharging device form a circulating liquid system; and

Semiconductor refrigeration module, which has opposite cold ends and hot ends, the liquid pipe is partially attached to the cold end of the semiconductor refrigeration module, and the liquid pipe can be partially attached to the heat source to be cooled, so as to The heat source is allowed to exchange heat with the semiconductor refrigeration module through the liquid pipe.

Optionally, the heat dissipation device further includes:

A liquid storage tank is connected and arranged in the circulating liquid system, and the outer surface of the liquid storage tank is in contact with the cold end of the semiconductor refrigeration module.

Optionally, the liquid storage tank and the cold end of the semiconductor refrigeration module are pressed and fixed.

Optionally, a thermal conductive layer is coated between the outer surface of the liquid storage tank and the cold end of the semiconductor refrigeration module.

Optionally, the thermally conductive layer is thermally conductive silicone grease or thermally conductive silica gel or a thermally conductive gasket.

Optionally, a portion of the liquid pipe away from the semiconductor refrigeration module is formed with a spiral structure, and the spiral structure is used to coil around the outside of the heat source.

Optionally, a heat sink is provided at the hot end of the semiconductor refrigeration module.

Optionally, the radiator includes:

a heat pipe assembly that is attached to the hot end of the semiconductor refrigeration module; and

A heat dissipation fin is connected to an end of the heat pipe assembly away from the semiconductor refrigeration module.

Optionally, a fan is provided on one side of the heat dissipation fins.

In a second aspect, this application provides an air conditioning system, including a compressor, a condenser, a throttling component and an evaporator. The air conditioning system further includes:

The heat dissipation device according to any one of the first aspects, the liquid pipe part is attached to the outer surface of the compressor; and

A noise reduction device is installed outside the compressor and used to reduce the noise generated by the compressor.

As above, when the above technical solution is adopted, this application attaches a part of the liquid pipeline to the outer surface of the compressor, and places the semiconductor refrigeration module and boosting device on one side of the compressor. During the operation of the compressor, ensure The semiconductor refrigeration module is powered on and the booster device is turned on to circulate the liquid in the liquid pipe. When the liquid flows through the compressor surface, the temperature rises and takes away the heat from the compressor surface. The liquid flows through the semiconductor refrigeration module. At the cold end, the temperature decreases and the heat is dissipated to the surrounding environment through the semiconductor refrigeration module. This circular flow realizes heat exchange and cools the compressor.

This application uses a combination of liquid circulation and semiconductor refrigeration modules to cool down the compressor. The noise it generates is very small. Therefore, for scenarios where the compressor is placed indoors, a noise reduction device is installed outside the compressor. Finally, the liquid pipe of the present application can be extended into the noise reduction device and fitted with the surface of the compressor, thereby achieving noise reduction and meeting the heat dissipation requirements at the same time.

Description of the drawings

The preferred embodiments of the present application are described below in conjunction with the accompanying drawings, in which:

Figure 1 is a schematic diagram of a heat dissipation device according to an embodiment of the present application.

In the figures, the reference numbers refer to the following:

1. Pressurizing device; 2. Liquid pipe; 3. Semiconductor refrigeration module; 4. Liquid storage tank; 5. Radiator; 51. Heat pipe assembly; 52. Cooling fins; 53. Fan.

Detailed ways

Preferred embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not used to limit the protection scope of the present application. Those skilled in the art can make adjustments as needed to adapt to specific application situations.

It should be noted that in the description of this application, the terms "upper", "lower", "inner", "outer" and other terms indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only It is for the convenience of description, but does not indicate or imply that the relevant device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. In addition, ordinal words "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance.

In addition, it should be noted that in the description of this application, unless otherwise clearly stated and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. Or integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

Referring to Figure 1 , a heat dissipation device disclosed in the present application is shown, which includes a supercharging device 1, a liquid pipe 2 and a semiconductor refrigeration module 3.

One end of the liquid pipe 2 is connected to the input end of the supercharging device 1, and the other end is connected to the output end of the supercharging device 1, so that the liquid pipe 2 and the supercharging device 1 form a complete closed circuit. The boosting device 1 is mainly used to form a pressure difference between its two ends. For example, the boosting device 1 can be a pump device. When the pump device is working, the liquid in the liquid pipe 2 circulates to form a circulating liquid system.

The semiconductor refrigeration module 3 has opposite cold ends and hot ends, which adopts the Peltier effect. Specifically, in the energized state, the electrons inside the semiconductor refrigeration module 3 undergo directional movement, bringing part of the internal energy to the other end of the electric field, thereby produce a temperature difference. Optionally, the semiconductor refrigeration module 3 in this application has a plate-like structure, so its cold end and hot end are both planar structures.

As a possible implementation method of this application, a liquid storage tank 4 is also connected to the circulating liquid circuit system. The liquid storage tank 4 is used to store liquid. When the boosting device 1 is running, the liquid in the circulating liquid circuit system circulates through Liquid storage tank 4. The liquid storage tank 4 has a rectangular parallelepiped structure, and its side surface is in contact with the cold end of the semiconductor refrigeration module 3, thereby increasing the contact area between the circulating liquid system and the semiconductor refrigeration module 3.

When the heat dissipation device of the present application is used, a part of the liquid pipe 2 is attached to the outer surface of the compressor, and the semiconductor refrigeration module 3 and the boosting device 1 are placed on one side of the compressor. During the operation of the compressor, ensure that the semiconductor The refrigeration module 3 is in the power-on state, and the booster device 1 is turned on to circulate the liquid in the liquid pipe 2. When the liquid flows through the compressor surface, the temperature rises, taking away the heat from the compressor surface, and the liquid flows through the semiconductor refrigeration At the cold end of the module 3, the temperature decreases, and the heat is dissipated to the surrounding environment through the semiconductor refrigeration module 3. This circular flow realizes heat exchange and cools the compressor.

Moreover, this application uses a combination of liquid circulation and semiconductor refrigeration module 3 to cool down the compressor, which itself generates very little noise. Therefore, for scenarios where the compressor is placed indoors, it is best to install it outside the compressor. After the noise reduction device is installed, the liquid pipe 2 of the present application can be extended into the noise reduction device and fit with the surface of the compressor, thereby achieving noise reduction and meeting the heat dissipation requirements at the same time.

It should be noted that the heat dissipation device of the present application is not limited to application in air conditioning systems. It can be used in any noise-sensitive situation. Just attach the liquid pipe 2 to the corresponding heat source. For example, when some indoor power-generating heating equipment needs noise reduction processing, the heat dissipation device of the present application can be applied therein, thereby achieving the noise reduction effect and meeting the heat dissipation needs.

Optionally, the cold end of the liquid storage tank 4 and the semiconductor refrigeration module 3 is pressed and fixed, thereby ensuring that the side surface of the liquid storage tank 4 is always in contact with the semiconductor refrigeration module 3 and preventing the liquid storage tank 4 from being affected by external environmental factors. Separate from the semiconductor refrigeration module 3.

Furthermore, a thermal conductive layer is coated between the outer surface of the liquid storage tank 4 and the cold end of the semiconductor refrigeration module 3 . In some possible implementations, the thermally conductive layer may take the form of, for example, thermally conductive silicone grease, thermally conductive silicone gel, or thermally conductive pads.

In practical applications, even if the cold ends of the liquid storage tank 4 and the semiconductor refrigeration module 3 are smooth enough, there will still be gaps when the two components come into contact. The air in these gaps is a poor conductor of heat and will hinder the connection between the liquid storage tank 4 and the semiconductor refrigeration module 3. The heat transfer of the semiconductor refrigeration module 3, and the thermal conductive layer fills these gaps, making the heat transfer smoother and faster, enhancing the heat exchange efficiency between the liquid in the liquid storage tank 4 and the cold end of the semiconductor refrigeration module 3, thereby enhancing the heat dissipation efficiency .

Referring to Figure 1, as a possible implementation of the present application, one section of the liquid pipe 2 is processed to form a spiral structure. This spiral structure is located away from the semiconductor refrigeration module 3 and is used to coil around the heat source such as the compressor. On the outside, the spiral coiling method can increase the fitting area between the liquid pipe 2 and the heat source such as the compressor, thereby enhancing the heat exchange efficiency.

Referring to Figure 1, the hot end of the semiconductor refrigeration module 3 is also provided with a radiator 5. The radiator 5 can also be pressed and fixed to the hot end of the semiconductor refrigeration module 3. Similarly, the radiator 5 can also be attached to the hot end of the semiconductor refrigeration module 3. Thermal conductive materials such as thermal conductive silica gel or thermal conductive silicone grease are arranged between the cold ends of the semiconductor refrigeration module 3 to enhance the heat transfer efficiency.

By providing the radiator 5, the heat at the hot end of the semiconductor refrigeration module 3 can be quickly dissipated to the surrounding environment, thereby enhancing the heat dissipation efficiency of the entire heat dissipation device.

Optionally, the heat sink 5 is a heat pipe heat sink, which includes a heat pipe assembly 51 and heat dissipation fins 52 . The heat pipe assembly 51 is filled with liquid. The lower end of the heat pipe assembly 51 is attached to the hot end of the semiconductor refrigeration module 3. The heat dissipation fins 52 are connected to the upper end of the heat pipe assembly 51. A capillary network is fixedly arranged in the heat pipe assembly 51. The lower end of the heat pipe assembly 51 is the evaporation end, and the upper end is the condensation end. When the heat from the hot end of the semiconductor refrigeration module 3 is transferred to the lower end of the heat pipe assembly 51, the liquid in the capillary tube evaporates, and the vapor flows to the upper end of the heat pipe assembly 51 under a slight pressure difference. It releases heat and condenses back into liquid. The liquid then flows back to the evaporation end along the porous material due to capillary force. This cycle continues to achieve heat dissipation. The function of the heat dissipation fins 52 is to increase the contact area between the upper end of the heat pipe assembly 51 and the surrounding air, thereby accelerating the release of heat and promoting the condensation process of steam.

Further, in order to promote the condensation of steam, a fan 53 is fixedly installed on one side surface of the heat dissipation fin 52. By turning on the fan 53, the heat dissipation fin 52 is cooled down and the condensation process is accelerated.

This application also discloses an air conditioning system, which includes a compressor, a condenser, a throttling component, an evaporator, the heat dissipation device in any of the above embodiments, and a noise reduction device.

Among them, the noise reduction device is fixedly installed on the outside of the compressor. The noise reduction device includes but is not limited to taking the form of a soundproof cover equipped with sound-absorbing cotton, a cover equipped with a shock-absorbing spring, or a vacuum cover. The liquid pipe 2 of the heat dissipation device extends into the noise reduction device and is in contact with the surface of the compressor.

It should be understood that no matter which form the noise reduction device adopts, it is only necessary to ensure that the noise reduction device has a process structure for the liquid passage pipe 2 to pass through. For example, a process hole is reserved on the noise reduction device. After the liquid pipe 2 extends into the noise reduction device through the process hole, the connection between the liquid pipe 2 and the process hole is sealed.

So far, the technical solution of the present application has been described in conjunction with the preferred embodiments shown in the drawings. However, those skilled in the art can easily understand that the protection scope of the present application is obviously not limited to these specific embodiments. Without departing from the principles of this application, those skilled in the art can make equivalent changes or substitutions to relevant technical features, and the technical solutions after these modifications or substitutions will fall within the protection scope of this application.

Claims (10)

1. A heat dissipation device, characterized in that it includes: supercharging device; A liquid pipe, one end of which is connected to the input end of the supercharging device, and the other end is connected to the output end of the supercharging device, and the liquid pipe and the supercharging device form a circulating liquid system; and Semiconductor refrigeration module, which has opposite cold ends and hot ends, the liquid pipe is partially attached to the cold end of the semiconductor refrigeration module, and the liquid pipe can be partially attached to the heat source to be cooled, so as to The heat source is allowed to exchange heat with the semiconductor refrigeration module through the liquid pipe. 2. The heat dissipation device according to claim 1, characterized in that the heat dissipation device further includes: A liquid storage tank is connected and arranged in the circulating liquid system, and the outer surface of the liquid storage tank is in contact with the cold end of the semiconductor refrigeration module. 3. The heat dissipation device according to claim 2, characterized in that the liquid storage tank and the cold end of the semiconductor refrigeration module are pressed and fixed. 4. The heat dissipation device according to claim 2, characterized in that a thermal conductive layer is coated between the outer surface of the liquid storage tank and the cold end of the semiconductor refrigeration module. 5. The heat dissipation device according to claim 4, wherein the thermal conductive layer is thermally conductive silicone grease, thermally conductive silica gel or thermally conductive gasket. 6. The heat dissipation device according to any one of claims 1 to 5, characterized in that the part of the liquid pipe away from the semiconductor refrigeration module is formed with a spiral structure, and the spiral structure is used to coil around the said semiconductor refrigeration module. outside of the heat source. 7. The heat dissipation device according to any one of claims 1 to 5, characterized in that a heat sink is provided at the hot end of the semiconductor refrigeration module. 8. The heat dissipation device according to claim 7, characterized in that the heat sink includes: a heat pipe assembly that is attached to the hot end of the semiconductor refrigeration module; and A heat dissipation fin is connected to an end of the heat pipe assembly away from the semiconductor refrigeration module. 9. The heat dissipation device according to claim 8, wherein a fan is provided on one side of the heat dissipation fin. 10. An air conditioning system, including a compressor, a condenser, a throttling component and an evaporator, characterized in that the air conditioning system further includes: The heat dissipation device according to any one of claims 1 to 9, the liquid pipe portion is attached to the outer surface of the compressor; and A noise reduction device is installed outside the compressor and used to reduce the noise generated by the compressor.