CN219778838U - Wafer post-processing device - Google Patents

Abstract

The utility model provides a wafer post-processing device, which comprises: a case; the clamping part is arranged in the box body and is used for vertically limiting the position of the wafer; the driving part is in transmission connection with the clamping part so as to drive the clamping part to rotate; a cleaning part which swings in a fan shape in a vertical plane at one side of the wafer and sprays a rinse liquid and/or a dry gas to the surface of the wafer; a rotating check ring arranged along the periphery of the wafer to surround the wafer, wherein the rotating check ring rotates synchronously with the wafer; and the fixed check ring is arranged along the periphery of the rotary check ring. In the utility model, the rotary check ring and the wafer rotate in the same direction, and after the liquid drops contact the inner wall of the rotary check ring, the liquid drops are more easily discharged backwards along the inner wall without sputtering; the fixed check ring is additionally arranged on the outer side of the rotary check ring, so that liquid thrown out from the liquid outlet of the rotary check ring can be effectively blocked, and the liquid falls along the inner wall of the fixed check ring and is discharged from the liquid outlet of the fixed check ring; the structure can effectively improve the secondary pollution of the wafer caused by liquid drop back splash.

Description

Wafer post-processing device

Technical Field

The utility model belongs to the technical field of wafer production, and particularly relates to a wafer post-processing device.

Background

The integrated circuit industry is the core of the information technology industry and plays a key role in the process of converting and upgrading the boosting manufacturing industry into digital and intelligent conversion. The chip is a carrier of an integrated circuit, and the chip manufacturing involves the process flows of integrated circuit design, wafer manufacturing, wafer processing, electrical measurement, dicing packaging, testing, and the like. Among them, chemical mechanical polishing belongs to one of five main core processes in the wafer manufacturing process.

Since a large amount of particles remain on the wafer surface after chemical mechanical polishing, the wafer needs to be post-processed such as cleaning and drying. Common cleaning modes include double-fluid jet cleaning, rolling brush cleaning, megasonic cleaning and the like, and common drying modes include rotary drying, marangoni drying and the like.

When the wafer is cleaned and dried by utilizing the marangoni effect, a semicircular fixed retainer ring is arranged above the wafer and is used for receiving and discharging rinsing liquid thrown out from the surface of the wafer; the fixed check ring is fixed when the wafer rotates to wash and spin-dry, the rinsing liquid can be sputtered when striking the inner surface of the fixed check ring, and some sputtered liquid drops can carry the cleaned pollutant to splash back to the wafer surface again, so that the secondary pollution of the wafer is caused.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems in the related art to some extent. To this end, the utility model proposes a chemical mechanical polishing method.

An embodiment of the present utility model provides a wafer post-processing apparatus, including:

a case;

the clamping part is arranged in the box body and is used for vertically limiting the position of the wafer;

the driving part is in transmission connection with the clamping part so as to drive the clamping part to rotate;

a cleaning part which swings in a fan shape in a vertical plane at one side of the wafer and sprays a rinse liquid and/or a dry gas to the surface of the wafer;

a rotating check ring arranged along the periphery of the wafer to surround the wafer, wherein the rotating check ring rotates synchronously with the wafer;

and the fixed check ring is arranged along the periphery of the rotary check ring.

In some embodiments, the cleaning portion, the rotating collar, and the stationary collar are all disposed within the housing.

In some embodiments, the case includes at least a bottom panel and side panels; the top of the box body is provided with a loading and unloading through groove, and the wafers are put in or taken out from the loading and unloading through groove; and a liquid outlet is formed in the bottom plate.

In some embodiments, the rotating collar includes a body plate maintained in a vertical state and a sidewall disposed along a circumference of an edge of the body plate, the sidewall enclosing with the body plate to form a receiving cavity to receive a wafer.

In some embodiments, a plurality of first liquid drain ports are formed at the edge of the main body plate along the circumferential direction.

In some embodiments, the retaining ring is fixed to an inner sidewall of the case, and the retaining ring is located at a periphery of the sidewall and surrounds at least a partial region of the sidewall with a gap therebetween.

In some embodiments, a second drain is provided at the bottom of the retaining ring.

In some embodiments, the clamping portion includes a vertically disposed chuck and a plurality of movable jaws located at an edge of the chuck.

In some embodiments, the drive portion comprises a drive shaft and a drive device in driving connection;

the driving shaft penetrates through the side plate of the box body to be connected with the rotary check ring and the clamping part, and the driving device drives the rotary check ring and the clamping part to synchronously rotate through the driving shaft.

In some embodiments, the cleaning portion includes a swing arm assembly having a rotating end and a free end;

the swing arm assembly is configured to swing around a rotating end thereof in an arc track in a vertical plane at a certain distance from the surface of the wafer so as to form a sector-shaped swing area, and the swing area at least covers a partial area of the surface of the wafer;

the free end of the swing arm assembly is provided with a nozzle, and the nozzle sprays rinsing liquid and/or drying gas to the surface of the wafer in the swing process of the swing arm assembly.

Compared with the prior art, the utility model has the beneficial effects that:

the rotary check ring and the wafer rotate in the same direction, and liquid drops are thrown out from the edge of the wafer and hit the inner wall of the rotary check ring, and after the liquid drops contact the inner wall of the rotary check ring due to the fact that the rotary check ring has the same rotation speed as the wafer, the liquid drops are more easily discharged backwards along the inner wall without sputtering. In addition, this embodiment increases fixed retaining ring in the outside of rotatory retaining ring, can effectively block the liquid that rotatory retaining ring leakage fluid dram was thrown away, makes liquid follow the inner wall whereabouts of fixed retaining ring and follow the leakage fluid dram of fixed retaining ring and drain. The double-layer check ring structure formed by the rotary check ring and the fixed check ring can effectively improve secondary pollution caused by liquid drops splashing back to the surface of the wafer, and effectively improve the cleanliness of the wafer after being cleaned and dried by marangoni.

Drawings

The advantages of the present utility model will become more apparent and more readily appreciated from the detailed description given in conjunction with the following drawings, which are meant to be illustrative only and not limiting of the scope of the utility model, wherein:

FIG. 1 shows a schematic diagram of a prior art wafer post-processing apparatus;

FIG. 2 is a schematic view showing a retainer ring structure of a conventional wafer post-processing apparatus;

FIG. 3 is a schematic view of a wafer post-processing apparatus according to one embodiment of the present utility model;

FIG. 4 shows a schematic view of a top cover provided in one embodiment of the present utility model;

FIG. 5 illustrates a cross-sectional view of a wafer post-processing apparatus according to one embodiment of the present utility model;

FIG. 6 illustrates a schematic view of a circlip provided in accordance with one embodiment of the present utility model;

FIG. 7 shows a schematic view of a body panel provided in accordance with one embodiment of the present utility model;

FIG. 8 is a schematic view of a retaining ring according to one embodiment of the present utility model;

FIG. 9 is a schematic view of a clamping portion according to an embodiment of the present utility model;

FIG. 10 is a schematic diagram showing a chuck in a splayed state according to an embodiment of the present utility model;

FIG. 11 is a schematic view showing a chuck fixing state according to an embodiment of the present utility model;

FIG. 12 shows a schematic water droplet flow diagram provided by one embodiment of the present utility model.

Detailed Description

The following describes the technical scheme of the present utility model in detail with reference to specific embodiments and drawings thereof. The examples described herein are specific embodiments of the present utility model for illustrating the concept of the present utility model; the description is intended to be illustrative and exemplary in nature and should not be construed as limiting the scope of the utility model in its aspects. In addition to the embodiments described herein, those skilled in the art can adopt other obvious solutions based on the disclosure of the claims and the specification thereof, including those adopting any obvious substitutions and modifications to the embodiments described herein.

The drawings in the present specification are schematic views, which assist in explaining the concept of the present utility model, and schematically show the shapes of the respective parts and their interrelationships. It should be understood that for the purpose of clearly showing the structure of various parts of embodiments of the present utility model, the drawings are not drawn to the same scale and like reference numerals are used to designate like parts in the drawings. The technical scheme of the utility model is further described by the following specific embodiments.

It is to be understood that in the description of the present utility model, the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus are not to be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the present utility model, "chemical mechanical polishing (Chemical Mechanical Polishing, CMP)" is also referred to as "chemical mechanical planarization (Chemical Mechanical Planarization, CMP)". The Wafer W (Wafer, W) is also called a Substrate (Substrate), and its meaning is equivalent to the actual function.

As shown in fig. 1, a conventional wafer post-processing apparatus 100 includes: the wafer w is driven to rotate indirectly by the driving part 160, and the clamping part 130 is arranged in the box 110 and is used for limiting the position of the wafer w vertically. A cleaning portion 120 is disposed on a side of the wafer w away from the holding portion 130, and the cleaning portion 120 is configured to spray a rinse liquid onto a surface of the wafer w.

A semicircular check ring 170 is arranged above the edge of the wafer w and used for blocking rinsing liquid splashed by the rotation of the wafer w, the semicircular check ring 170 is fixed when the wafer w rotates to be washed and spin-dried, and the rinsing liquid can flow backwards along the inner surface of the semicircular check ring 170 to drop when contacting with the arc-shaped inner surface of the semicircular check ring 170, so that rinsing liquid drops with pollutants are prevented from dropping onto the surface of the wafer w again.

However, as shown in fig. 2, when the wafer w is cleaned and dried by using the marangoni effect, the wafer w and the clamping portion 130 for clamping the wafer w rotate together at a high speed, the rinsing liquid is thrown out from the edge of the surface of the wafer w, the droplets are sputtered when striking the inner surface of the semicircular ring 170, and some of the sputtered droplets will splash back onto the surface of the wafer w with the cleaned contaminants, thereby causing secondary pollution to the wafer w.

In order to solve at least the above-mentioned problems, an embodiment of the present utility model provides a wafer post-processing apparatus 100 to prevent back splash after the rinsing liquid is thrown out. Specifically, as shown in fig. 3, the wafer post-processing apparatus 100 provided in this embodiment includes:

the clamping portion 130 shown in fig. 1 is used to vertically define the position of the wafer w;

the driving part 160 shown in fig. 1 is in transmission connection with the clamping part 130 to drive the clamping part 130 to rotate;

a cleaning unit 120 that swings in a fan shape in a vertical plane on the wafer w side and sprays a rinse liquid and/or a dry gas onto the wafer w surface;

a rotation check ring 150 disposed along the outer circumference of the wafer w to surround the wafer w, the rotation check ring 150 rotating in synchronization with the wafer w;

a fixed retainer ring 140 is provided along the outer circumference of the rotating retainer ring 150.

In this embodiment, the rotation check ring 150 rotates in the same direction as the wafer w, and the liquid drops are thrown out from the edge of the wafer w to the inner wall of the rotation check ring 150, and because the rotation check ring 150 has the same rotation speed as the wafer w, the liquid drops are more easily discharged backwards along the inner wall after contacting the inner wall of the rotation check ring 150, and no sputtering is generated.

In addition, the fixed retainer ring 140 is added to the outer side of the rotating retainer ring 150 in this embodiment, so that the liquid thrown out from the liquid outlet of the rotating retainer ring 150 can be effectively blocked, and the liquid can fall along the inner wall of the fixed retainer ring 140 and be discharged from the liquid outlet of the fixed retainer ring 140 (as shown in fig. 12).

The double-layer check ring structure formed by the rotary check ring 150 and the fixed check ring 140 can effectively improve secondary pollution caused by liquid drops splashing back to the surface of the wafer w, and effectively improve the cleanliness of the wafer w after being cleaned and dried by marangoni.

In the same way as the conventional wafer post-processing apparatus 100, the wafer post-processing apparatus 100 provided in this embodiment includes a housing 110, and the clamping portion 130, the cleaning portion 120, the rotation check ring 150, and the fixing check ring 140 are disposed in the housing 110.

Further, the case 110 includes at least a bottom plate 111 and a side plate 112, and the top of the case 110 has a loading/unloading slot through which the wafer w is loaded or unloaded.

In some alternative embodiments, as shown in fig. 4, a top cover 114 capable of being opened and closed independently is disposed on the top of the case 110, and a loading and unloading slot is formed on the top cover 114 along the length direction, where the loading and unloading slot has a size enough to allow the wafer w to pass through, and the wafer w is sent into the case 110 or taken out from the case 110 through the loading and unloading slot. The loading and unloading trough is provided with a movable door plate 115, and when the door plate 115 moves, the loading and unloading trough is exposed, and the wafer w is vertically fed into the box 110 from the loading and unloading trough by an external manipulator and is fixed to the clamping part 130. When the door 115 is reset, the loading/unloading through groove is covered, and the top cover 114 is in a closed state at this time, so that the wafer w starts to be cleaned and dried.

It should be noted that the moving manner of the door panel 115 is not particularly limited and the door panel 115 may be disposed along the length direction of the top cover 114, that is, the length direction of the door panel 115 is parallel to the length direction of the top cover 114. When the top cover 114 needs to be opened, the door panel 115 translates along the length direction of the top cover 114, can translate along the width direction of the top cover 114, and can also rotate along one end of the door panel 115. It should be understood that, in any moving manner, the door plate 115 is moved to expose or cover the loading and unloading slot, so that other moving schemes of the door plate 115, which are not listed above, can realize the opening and closing functions of the top cover 114 required by the present embodiment, fall within the protection scope and the disclosure scope of the present embodiment.

It will be understood that, in order to realize the movement of the door panel 115, it is also necessary to provide a driving component necessary for moving the door panel 115, as shown in fig. 4, where the driving component includes a plurality of side-by-side guide rails 116 mounted on the surface of the top cover 114, the length of the guide rails 116 is parallel to one side of the width of the top cover 114, a sliding block is slidably disposed on the guide rails 116, the door panel 115 is fixed on the sliding block, and the length direction of the door panel 115 is parallel to the length direction of the top cover 114, the sliding block is in driving connection with an air cylinder, and the sliding block is configured to move along the guide rails 116 under the driving of the air cylinder, so as to drive the door panel 115 to translate along the width direction of the top cover 114.

It is easy to think that the driving component described above can drive the door panel 115 to translate along the width direction of the top cover 114, and if the moving mode of the door panel 115 is changed, such as translating along the length direction of the top cover 114 or rotating around one end of the door panel 115 as an axis, those skilled in the art need to adaptively adjust the installation position and specific structure of the driving component, and the new technical solution obtained after adjustment also falls within the protection scope and the disclosure scope of the present utility model.

The structure of the clamping portion 130 defined in this embodiment is described in detail below with reference to fig. 9, 10 and 11:

the clamping part 130 includes a chuck 131 disposed vertically and a plurality of movable claws 132 at edges of the chuck 131. Specifically, as shown in fig. 9, five movable claws 132 with L-shaped structures are equidistantly arranged at the outer edge of the surface of the chuck 131 along the circumferential direction, and the movable claws 132 define a carrying plane on which the wafer w is located, and the carrying plane is parallel to the chuck 131. The movable claws 132 are hinged to the edge of the back surface (the other side surface opposite to the cleaning surface of the wafer w) of the chuck 131 through claw rotation shafts, so that the movable claws 132 can turn over from the back surface of the chuck 131 to the front surface of the chuck 131, that is, to the direction close to the wiping surface of the wafer w with the claw rotation shafts as the center, to clamp the edge of the wafer w.

As shown in fig. 10 and 11, a plurality of elastic members 133 are provided at the edge of the chuck 131, and the elastic members 133 correspond to the positions of the movable claws 132 and bear against the movable claws 132, and in a natural state, the elastic members 133 bear against the movable claws 132 to cause the movable claws 132 to be outwardly stretched (as shown in fig. 10). The driving part 160 drives the chuck 131 to horizontally move in a direction away from the rotating retainer ring 150 until the chuck 131 completely extends out of the rotating retainer ring 150, at this time, the elastic member 133 is in a free state, and the movable claw 132 rotates in a direction away from the cleaning surface of the wafer w under the action of the elastic member 133, so that the wafer w is conveniently placed into the chuck 131.

A plurality of jaw top blocks 154 are provided on the body plate 151 (shown in fig. 7) of the rotation check ring 150, and positions of the jaw top blocks 154 correspond to positions of corners of the movable jaw 132. After the wafer w is placed, the transmission assembly drives the chuck 131 to horizontally move in a direction close to the rotating retainer ring 150, in the process of horizontally moving the chuck 131, the movable claw 132 rotates in a direction close to the wiping surface of the wafer w under the stirring of the claw top block 154 so as to clamp the edge of the wafer w (as shown in fig. 11), at this time, the elastic piece 133 is in a compressed state, and the claw top block 154 is abutted against the corner of the movable claw 132.

The structure of the driving section 160 defined in this embodiment is described in detail below with reference to fig. 5:

the driving part 160 includes a driving shaft 163 connected in a driving manner, the driving shaft 163 penetrates through the side plate 112 of the case 110 to connect the rotation check ring 150 and the clamping part 130, and the driving device drives the rotation check ring 150 and the clamping part 130 to synchronously rotate through the driving shaft 163. A bearing 164 is disposed between the drive shaft 163 and the housing 110, and the drive shaft 163 rotates in the bearing 164 under the drive of the drive device.

In the embodiment shown in fig. 5, the driving device comprises a rotating motor 161 and a telescopic motor 162 which are in driving connection with the chuck 131, wherein the rotating motor 161 is used for driving the chuck 131 and the rotary check ring 150 to rotate, and the telescopic motor 162 is used for driving the chuck 131 to axially move so as to enable the chuck 131 to extend or retract into the rotary check ring 150.

The chuck 131 provided in this embodiment has two degrees of freedom of movement, that is, the chuck 131 moves horizontally along the axial direction of the chuck 131, so that the chuck 131 extends out of the coverage area of the rotating collar 150, and the wafer w is placed in the chuck 131 from the vertical direction; meanwhile, the chuck 131 also rotates with a center line penetrating through the center of the center line as a reference to drive the wafer w to rotate, and the cleaning part 120 is matched to clean the surface of the wafer w.

The structure of the cleaning section 120 defined in this embodiment is described in detail below with reference to fig. 3:

the cleaning part 120 includes a swing arm assembly having a rotating end and a free end, and the swing arm assembly is configured to swing around the rotating end thereof in an arc-shaped trajectory in a vertical plane at a distance from the surface of the wafer w to form a fan-shaped swing region, the swing region covering at least a partial region of the surface of the wafer w. The free end of the swing arm assembly is provided with a nozzle, and the nozzle sprays rinsing liquid and/or drying gas to the surface of the wafer w in the swing process of the swing arm assembly.

In the embodiment shown in fig. 3, the swing arm assembly includes a swing base 125 and a spraying mechanism, wherein the bottom of the swing base 125 is connected with a rotating shaft, and the rotating shaft is perpendicular to the plane of the wafer w and located at one side of the wafer w; the top of the swing base 125 is connected with the spraying mechanism, and the swing base 125 can rotate around the rotating shaft to drive the spraying mechanism at the top of the swing base to swing. The swing base 125 is further connected to the motor assembly such that the swing base 125 can rotate around the rotation shaft under the driving of the motor assembly, thereby realizing the swing of the swing base 125 in a vertical plane parallel to the plane of the wafer w.

The injection mechanism comprises a first injection assembly and a second injection assembly, and the first injection assembly is positioned on one side of the second injection assembly and is arranged in parallel with the second injection assembly. The first spraying assembly comprises a first swing arm 121 and an air nozzle 123 arranged at the free end of the first swing arm 121; the second spray assembly includes a second swing arm 122 and a spray nozzle 124 disposed at a free end of the second swing arm 122. The first swing arm 121 and the second swing arm 122 are fixedly disposed at the top end of the swing base 125, and the first swing arm 121 and the second swing arm 122 are driven to swing around the shaft under the rotation of the swing base 125.

It will be appreciated that the first spray assembly and the second spray assembly may each be controlled separately to perform different operations in different process steps. And the first swing arm 121 and the second swing arm 122 are rotatable, respectively, that is, are rotatable about axes respectively about connection points of each with the swing base 125 as base points. Thereby, the spraying angles of the first swing arm 121 and the second swing arm 122 can be respectively adjusted, the spraying range and the spraying angle can be changed according to different process requirements, the self-adaptive capacity of cleaning and drying the wafer w is improved, and the on-site operation is facilitated.

The first spray assembly further includes a gas line in communication with the gas nozzle 123, the gas line being connected to a gas supply source through the first swing arm 121 and the swing base 125. The second spray assembly also includes a liquid line in communication with the liquid spray nozzle 124, the liquid line being connected to a liquid supply through the second swing arm 122 and the swing base 125.

The gas line is used to deliver a surface active material-containing dry gas, which is a mixture containing at least a surface active material such as isopropyl alcohol (IPA), to the gas nozzles 123, which reduces the surface tension of the rinse solution.

The liquid line is used to deliver a rinse liquid such as deionized water (DIW) or a rinse liquid containing deionized water to the liquid spray nozzles 124, the surface tension of the rinse liquid being higher than the surface tension of the surfactant in the dry gas.

In order to dry the wafer w by centrifugal force and Marangoni Effect, the rinse liquid sprayed onto the surface of the wafer w is thoroughly peeled off to thoroughly dry the wafer w, axes of the first swing arm 121 and the second swing arm 122 are parallel to each other and are perpendicular to the axis of the rotation shaft, the free end of the first swing arm 121 is provided with two air nozzles 123 for spraying dry gas toward the plane where the wafer w is located, and the free end of the second swing arm 122 is provided with one liquid spray nozzle 124 for spraying rinse liquid toward the plane where the wafer w is located. The second swing arm 122 is disposed below the first swing arm 121 such that the liquid spray nozzle 124 is disposed below the air spray nozzle 123 when the swing base 125 is in a non-vertical state. However, it should be understood that the utility model is not limited in this respect.

In some embodiments, the wafer post-processing apparatus 100 may further include a pumping device (not shown) in communication with the housing 110, for exhausting rinsing liquid remaining in the housing 110 and/or pumping contaminants erased from the surface of the wafer w.

In this embodiment, a ventilation grille (not shown) is provided at the side wall 152 of the case 110, and a suction device is located at the bottom of the case 110 and communicates with the liquid outlet 113 at the bottom of the case 110 through a suction line. After the suction device is started, external air enters the box body 110 through the ventilation grille at the side wall 152 of the box body 110, residual rinsing liquid and pollutants accumulated in the box body 110 are wrapped and clamped, and then are discharged through the suction pipeline, so that the box body 110 is kept clean before the next wafer w is cleaned, and secondary pollution to the next wafer w is avoided.

The wafer post-processing apparatus 100 provided in this embodiment is significantly different from the existing wafer post-processing apparatus 100 in that: the present utility model replaces the semicircular retainer ring 170 in the existing wafer post-processing apparatus 100 with the rotating retainer ring 150 and the fixed retainer ring 140.

As shown in fig. 6, the rotation collar 150 includes a body plate 151 maintained in a vertical state and a sidewall 152 disposed along a circumference of an edge of the body plate 151, the sidewall 152 and the body plate 151 enclosing a receiving chamber to receive a wafer w. The wafer w is driven by the driving part 160 to rotate and move in parallel along the axial direction thereof, and along with the parallel movement of the wafer w, the wafer w can completely extend out of the rotating collar 150, and also can completely retract into the rotating collar 150.

When a wafer needs to be placed, the chuck 131 is driven to move axially by the telescopic motor 162, so that the chuck 131 extends out of the rotary check ring 150, a wafer w is vertically placed in the chuck 131 by an external manipulator, and the edge of the wafer w is contacted with the movable clamping jaw 132 at the edge of the chuck 131; then, the telescopic motor 162 drives the chuck 131 to reset until the chuck 131 is completely retracted into the rotary retainer ring 150, and the movable claw 132 rotates in a direction approaching to the wiping surface of the wafer w under the stirring of the claw top block 154 in the moving process, so that the edge of the wafer w is clamped, and the fixing of the wafer w is completed.

As shown in fig. 7, a plurality of first liquid drain ports 153 are formed at the edge of the main body plate 151 along the circumferential direction, the rotary check ring 150 and the chuck 131 rotate in the same direction, and liquid drops on the surface of the wafer w are thrown out from the edge of the wafer w to splash onto the inner wall of the rotary check ring 150 under the action of centrifugal force, and as the rotary check ring 150 has the rotation speed in the same direction as the wafer w, the liquid drops contact with the inner wall of the rotary check ring 150 and then flow along the inner wall and are thrown out by the first liquid drain ports 153, so that the secondary pollution caused by the back splash of rinsing liquid onto the surface of the wafer w is reduced.

As shown in fig. 8, the retaining ring 140 has an annular wall structure fixed to the inner wall of the case 110, the retaining ring 140 is disposed around the outer periphery of the side wall 152, a gap is left between the inner side surface of the retaining ring 140 and the outer side surface of the side wall 152, and a gap is left between the main body plate 151 and the inner wall region of the case 110 surrounded by the retaining ring 140 (as shown in fig. 5). A part of the area of the side wall 152 is located within the coverage area of the fixed retainer 140, the rest part extends out of the fixed retainer 140, and a second liquid drain port 141 is formed at the bottom of the fixed retainer 140.

During the rotation of the chuck 131 and the rotating collar 150, the rinsing liquid is thrown out from the first liquid outlet 153 on the side wall 152, enters the annular cavity between the fixed collar 140 and the side wall 152, flows down to the bottom of the fixed collar 140 along the inner wall of the case 110 under the action of gravity, and is discharged from the second liquid outlet 141.

The rinse liquid that can prevent to throw away by rotatory retaining ring 150 through setting up fixed retaining ring 140 of this embodiment splashes to box 110 inner wall, improves the clearance degree of difficulty, also plays the effect of converging to the rinse liquid simultaneously, restricts the rinse liquid that splashes in the region that fixed retaining ring 140 surrounds to drain through the second leakage fluid dram 141 of bottom.

The working process of the vertical rotation processing device for the wafer w provided by the embodiment of the utility model comprises the following steps:

step S1, placing a wafer w: the cleaning part 120 moves to one side of the wafer w, and when the wafer w is cleaned, the air cylinder drives the door plate 115 on the top cover 114 to move until the loading and unloading through groove is exposed; the telescopic motor 162 drives the chuck 131 to horizontally move in a direction away from the rotary retainer ring 150, so that the chuck 131 completely extends out of the rotary retainer ring 150, and the movable claws 132 are outwards stretched under the action of the elastic members 133;

a robot arm outside the apparatus vertically feeds the wafer w into the case 110 through the loading/unloading through-slot and aligns the movable claws 132 at the outer periphery of the chuck 131; the telescopic motor 162 drives the chuck 131 to reset until the chuck 131 is completely retracted into the rotary retainer ring 150, and in the moving process, the claw jack 154 abuts against the corner of the movable claw 132 and pulls the movable claw 132 to rotate inwards until abutting against the edge of the wafer w, at this time, the wafer w is fixed on the chuck 131; the cylinder drives the door plate 115 on the top cover 114 to move until the door plate covers the loading and unloading through groove;

step S2, cleaning the wafer w: the swinging base 125 drives the second swinging arm 122 to rotate around the shaft, so that the spraying drop point of the spraying nozzle 124 at the free end of the second swinging arm 122 is opposite to the cleaning position of the circle center of the wafer w and keeps fixed, the rotating motor 161 drives the chuck 131 to rotate through the driving shaft 163, so that the wafer w keeps rotating at a certain rotating speed, the spraying nozzle 124 sprays rinsing liquid with higher flow rate to the surface of the wafer w, the rinsing liquid is sprayed on the radius of the wafer w, and the surface of the whole wafer w is washed along with the rotation of the wafer w, so that the chemical liquid left on the surface of the wafer w and pollutant particles suspended in the residual liquid are quickly washed clean;

during the rotation of the chuck 131 and the rotating retainer ring 150, the rinsing liquid is thrown out from the first liquid outlet 153 on the side wall 152, enters the annular cavity between the fixed retainer ring 140 and the side wall 152, flows down to the bottom of the fixed retainer ring 140 along the inner wall of the box 110 under the action of gravity, and is discharged from the second liquid outlet 141;

step S3, drying the wafer w: the swing base 125 drives the first swing arm 121 to rotate around the shaft, the wafer w still maintains the original rotation speed to rotate, dry gas is sprayed to the surface of the wafer w through the air nozzle 123 at the free end of the swing base during the swing process of the first swing arm 121, and meanwhile, the liquid spraying nozzle 124 still keeps spraying rinsing liquid with a certain flow;

the rinse solution sprayed to the surface of the wafer w forms a liquid flow which expands from a spiral direction to the edge of the wafer w from the vicinity of a drop point of the rinse solution on the wafer w under the action of the rotation of the wafer w, and as the surface active substances in the drying gas are dissolved in the rinse solution, marangoni stress facing the edge of the wafer w is generated, the rinse solution moves to the edge of the wafer w simultaneously with the sweeping of the second swing arm 122 towards the edge of the wafer w under the action of the marangoni stress and the centrifugal force, and the inner area of the wafer w swept by the rinse solution is dried;

step S4, high-speed spin-drying: the cleaning part 120 moves to one side of the wafer w, the air nozzle 123 and the liquid spray nozzle 124 stop spraying the drying gas and the rinsing liquid, the rotating motor 161 drives the wafer w to rotate at a high speed through the driving shaft 163, and the residual liquid on the surface of the wafer w is spin-dried by centrifugal force;

step S5, taking out the wafer w: the driving part drives the door plate 115 to move to expose the loading and unloading through groove, and the telescopic motor 162 drives the chuck 131 to horizontally move away from the rotary retainer ring 150 through the driving shaft 163, so that the chuck 131 is completely moved out of the rotary retainer ring 150; during the process of removing the chuck 131, the jaw top block 154 is separated from the movable jaw 132, the movable jaw 132 is restored to the outwardly-stretched state under the elastic force of the elastic member 133, the wafer w is released from fixation, and the wafer w is vertically inserted into the case 110 through the loading and unloading through slot by an external robot arm to be taken out.

The applicant declares that the above is only a specific embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and it should be apparent to those skilled in the art that any changes or substitutions that are easily conceivable within the technical scope of the present utility model disclosed by the present utility model fall within the scope of the present utility model and the disclosure.

Claims (10)

1. A wafer post-processing apparatus, comprising:

a case;

the clamping part is arranged in the box body and is used for vertically limiting the position of the wafer;

the driving part is in transmission connection with the clamping part so as to drive the clamping part to rotate;

a cleaning part which swings in a fan shape in a vertical plane at one side of the wafer and sprays a rinse liquid and/or a dry gas to the surface of the wafer;

a rotating check ring arranged along the periphery of the wafer to surround the wafer, wherein the rotating check ring rotates synchronously with the wafer;

and the fixed check ring is arranged along the periphery of the rotary check ring.

2. The wafer post-processing apparatus according to claim 1, wherein the cleaning portion, the rotating collar and the stationary collar are all disposed within the housing.

3. The wafer post-processing apparatus of claim 1 wherein the housing comprises at least a bottom plate and side plates; the top of the box body is provided with a loading and unloading through groove, and the wafers are put in or taken out from the loading and unloading through groove; and a liquid outlet is formed in the bottom plate.

4. The wafer post-processing apparatus according to claim 1, wherein the rotation collar comprises a body plate maintained in a vertical state and a sidewall disposed along a circumference of an edge of the body plate, the sidewall and the body plate enclosing a receiving chamber to receive a wafer.

5. The apparatus according to claim 4, wherein a plurality of first liquid discharge ports are circumferentially provided at an edge of the main body plate.

6. The wafer post-processing apparatus according to any one of claims 4 to 5, wherein the retaining ring is fixed to an inner side wall of the housing, the retaining ring being located at a periphery of the side wall and surrounding at least a partial region of the side wall with a gap therebetween.

7. The apparatus according to any one of claims 1 to 5, wherein a second drain is provided at the bottom of the retainer ring.

8. The wafer post-processing apparatus according to any one of claims 1 to 5, wherein the clamping portion includes a chuck disposed vertically and a plurality of movable claws located at an edge of the chuck.

9. The wafer post-processing apparatus according to any one of claims 1 to 5, wherein the drive section comprises a drive shaft and a drive device in driving connection;

the driving shaft penetrates through the side plate of the box body to be connected with the rotary check ring and the clamping part, and the driving device drives the rotary check ring and the clamping part to synchronously rotate through the driving shaft.

10. The wafer post-processing apparatus according to any one of claims 1 to 5, wherein the cleaning portion includes a swing arm assembly having a rotating end and a free end;

the swing arm assembly is configured to swing around a rotating end thereof in an arc track in a vertical plane at a certain distance from the surface of the wafer so as to form a sector-shaped swing area, and the swing area at least covers a partial area of the surface of the wafer;

the free end of the swing arm assembly is provided with a nozzle, and the nozzle sprays rinsing liquid and/or drying gas to the surface of the wafer in the swing process of the swing arm assembly.