CN219740631U - Reduce special chamfer structure of pottery fracture - Google Patents
Reduce special chamfer structure of pottery fracture Download PDFInfo
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- CN219740631U CN219740631U CN202320705826.2U CN202320705826U CN219740631U CN 219740631 U CN219740631 U CN 219740631U CN 202320705826 U CN202320705826 U CN 202320705826U CN 219740631 U CN219740631 U CN 219740631U
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- ceramic block
- thermoelectric
- thermoelectric ceramic
- grooving
- cutting portion
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- 239000000919 ceramic Substances 0.000 claims abstract description 87
- 238000005336 cracking Methods 0.000 claims abstract description 12
- 238000002955 isolation Methods 0.000 claims abstract description 7
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
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Abstract
The utility model discloses a special chamfering structure for reducing ceramic cracking, which comprises a thermoelectric ceramic block, wherein electrode holes penetrating through the thermoelectric ceramic block are formed in corner positions of the surface of the thermoelectric ceramic block, front grooving parts are formed in the surface of the thermoelectric ceramic block where the electrode holes are formed, upper grooving parts and lower grooving parts are formed at two ends of the back surface of the thermoelectric ceramic block, a first wire-outlet grooving part is integrally formed between one group of electrode holes and the lower grooving parts, a first stress isolation cavity is formed in the back surface of the thermoelectric ceramic block where the first wire-outlet grooving part is formed, and a second wire-outlet grooving part is integrally formed between the other group of electrode holes and the upper grooving parts. The utility model adopts a grooving mode and then chamfering structural mode, and can reduce the internal stress of the ceramic and the corner cracking in the use process of the ceramic under the condition of not influencing the assembly interference during application, thereby effectively ensuring the structural strength and the service life of the thermoelectric ceramic block.
Description
Technical Field
The utility model relates to the technical field of ceramic chamfer structures, in particular to a special chamfer structure for reducing ceramic cracking.
Background
The thermoelectric ceramic component has the characteristics of high conductivity, insulation and high temperature resistance, is often applied to a cooling and heating thermoelectric system, such as a small household electrical appliance with a temperature control function, corners of the conventional small household electrical appliance ceramic component suitable for temperature control mostly adopt R angle and C angle structures, so that cracking caused by ceramic stress influence is solved, the ceramic component needs high temperature resistance, the ceramic is relatively easy to crack at the R angle and the C angle under the use environment of frequent cold and hot shock, and certain household electrical appliances are not allowed to be chamfered in design because of the assembly problem, so that the ceramic product is easier to crack when being applied.
Disclosure of Invention
The utility model aims to provide a special chamfering structure for reducing ceramic cracking, chamfering adopts a grooving mode, and chamfering treatment is carried out so as to reduce the internal stress of a ceramic block and solve the problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a reduce special chamfer structure of pottery fracture, includes the thermoelectric ceramic block, the corner department on thermoelectric ceramic block surface all is provided with the electrode hole that runs through, and the thermoelectric ceramic block surface at electrode hole place is provided with preceding grooveling portion, thermoelectric ceramic block's back both ends are provided with last grooveling portion and lower grooveling portion, wherein a set of between electrode hole and the lower grooveling portion an organic whole formation is gone out line grooveling portion one, and the thermoelectric ceramic block back at line grooveling portion one forms first stress and cuts off the cavity, another set of be gone out line grooveling portion two between electrode hole and the last grooveling portion an organic whole formation is gone out line grooveling portion two, the thermoelectric ceramic block back at line grooveling portion two place is through put the conduction groove each other, go out line grooveling portion two, down the grooveling portion and go out line grooveling portion two and all carry out chamfering.
Preferably, the electrode holes include an input side internal electrode hole I, an input side internal electrode hole II, an output side internal electrode hole I and an output side internal electrode hole II which are provided at corner positions of the surface of the thermoelectric ceramic block.
Preferably, U-shaped concave parts are arranged on the back surfaces of the thermoelectric ceramic blocks on two sides of the lower grooved part.
Preferably, a first secondary rectangular groove is formed in the back surface of the thermoelectric ceramic block of the first stress isolation cavity, and a second secondary rectangular groove is formed in the back surface of the thermoelectric ceramic block of the second stress isolation cavity.
Preferably, the corner positions of the thermoelectric ceramic blocks are provided with R angles or C angles.
Compared with the prior art, the utility model has the beneficial effects that: the special chamfering structure for reducing ceramic cracking utilizes four groups of front chamfering parts to reduce stress changes caused by frequent cold and hot impact at the front corners of the thermoelectric ceramic blocks through the structure of the front chamfering parts and the wire outlet chamfering parts which are mutually matched, the lower chamfering parts, the wire outlet chamfering parts I and the wire outlet chamfering parts II which are mutually communicated are arranged at the back of the thermoelectric ceramic blocks, the area range of stress transmission at the back of the thermoelectric ceramic blocks is improved, and the continuity of stress transmission inside the thermoelectric ceramic blocks is reduced through the arrangement of a plurality of groups of spaces, so that the stress changes caused by frequent cold and hot impact at the back corners of the thermoelectric ceramic blocks are reduced.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic perspective view of the present utility model;
FIG. 3 is a schematic rear view of the present utility model;
FIG. 4 is a schematic view of a rear cross-sectional structure of the present utility model;
FIG. 5 is a schematic side sectional view of the present utility model;
in the figure: 1. a thermoelectric ceramic block; 101. an input side internal electrode hole I; 102. an input side internal electrode hole II; 103. an output side internal electrode hole I; 104. an output side internal electrode hole II; 2. a front grooved portion; 3. an upper grooved portion; 4. a lower grooved portion; 401. u-shaped concave part; 5. a second rectangular grooved part I; 6. a second rectangular grooved part II; 7. the outlet line is provided with a first grooved part; 8. a second outlet line groove digging part; 9. and a middle conducting groove.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, an embodiment of the present utility model is provided: a special chamfer structure for reducing ceramic cracking comprises a thermoelectric ceramic block 1, wherein an R angle or a C angle is arranged at the corner position of the thermoelectric ceramic block 1;
the corner positions of the surface of the thermoelectric ceramic block 1 are provided with penetrating electrode holes, and the electrode holes comprise an input side inner electrode hole I101, an input side inner electrode hole II 102, an output side inner electrode hole I103 and an output side inner electrode hole II 104 which are arranged at the corner positions of the surface of the thermoelectric ceramic block 1;
the surface of the thermoelectric ceramic block 1 where the electrode holes are arranged is provided with front grooved parts 2, and stress changes caused by frequent cold and hot impact at the front corners of the thermoelectric ceramic block 1 are reduced by utilizing four groups of front grooved parts 2;
the four groups of front grooved parts 2 are matched with the first input side internal electrode hole 101, the second input side internal electrode hole 102 and other hole sites, so as to provide a reserved space for mounting external pins, wires and other wiring devices;
an upper grooving part 3 and a lower grooving part 4 are arranged at two ends of the back surface of the thermoelectric ceramic block 1, wherein a first wire grooving part 7 is integrally formed between one group of electrode holes and the lower grooving part 4, a first stress isolating cavity is formed at the back surface of the thermoelectric ceramic block 1 where the first wire grooving part 7 is positioned, a second wire grooving part 8 is integrally formed between the other group of electrode holes and the upper grooving part 3, a second stress isolating cavity is formed at the back surface of the thermoelectric ceramic block 1 where the second wire grooving part 8 is positioned, the back surfaces of the thermoelectric ceramic blocks 1 between the first wire grooving part 7 and the second wire grooving part 8 are mutually communicated through a middle conducting groove 9, and chamfering treatment is carried out on the upper grooving part 3, the second wire grooving part 8, the lower grooving part 4 and the second wire grooving part 8;
the structure form of chamfering is adopted, and the internal stress of the ceramic and the corner cracking in the use process of the ceramic can be reduced under the condition of not influencing the assembly interference during application, so that the structural strength and the service life of the thermoelectric ceramic block 1 are effectively ensured;
the back of the thermoelectric ceramic block 1 of the first stress isolation cavity is provided with a first secondary rectangular groove part 5, the back of the thermoelectric ceramic block 1 of the second stress isolation cavity is provided with a second secondary rectangular groove part 6, the two groups of concave cavities are respectively provided with the first secondary rectangular groove part 5 and the second secondary rectangular groove part 6, the structural volume of the thermoelectric ceramic block 1 is further reduced, and the area range of the back stress transmission of the thermoelectric ceramic block 1 is improved;
the U-shaped concave parts 401 are arranged on the back surfaces of the thermoelectric ceramic blocks 1 on two sides of the lower grooved part 4, and the transmission continuity of internal stress of the thermoelectric ceramic blocks 1 is reduced through the arrangement of a plurality of groups of spaces, so that the stress change caused by frequent cold and hot impact at the corners of the back surfaces of the thermoelectric ceramic blocks 1 is reduced;
when the ceramic block is used for wiring, the pin wires of the first input side inner electrode hole 101 and the second input side inner electrode hole 102 can be wound out of the ceramic from the first wire-outlet grooved part 7, the middle-arranged conducting groove 9 and the upper grooved part 3, and the pin wires of the second output side inner electrode hole 104 and the first output side inner electrode hole 103 can be wound out of the ceramic from the second wire-outlet grooved part 8, the middle-arranged conducting groove 9 and the lower grooved part 4, so that wiring is built-in, and wiring treatment of products is facilitated.
When the embodiment of the utility model is used, four groups of front grooved parts 2 with the same structure are firstly cut at the corners of the surface of the thermoelectric ceramic block 1, the four groups of front grooved parts 2 are utilized to reduce the stress change caused by frequent cold and hot impact at the corners of the front surface of the thermoelectric ceramic block 1, the lower grooved parts 4, the first wire-outlet grooved parts 7, the second wire-outlet grooved parts 8 and the upper grooved parts 3 which are mutually communicated are cut at the back surface of the thermoelectric ceramic block 1, the upper cavity and the lower cavity formed by the two parts are conducted again through the middle-arranged conducting groove 9, and meanwhile, the two groups of inner cavity bodies are respectively provided with the first secondary rectangular grooved parts 5 and the second secondary rectangular grooved parts 6, so that the structural volume of the thermoelectric ceramic block 1 is further reduced, the area range of the back surface stress transmission of the thermoelectric ceramic block 1 is improved, and the stress transmission continuity inside the thermoelectric ceramic block 1 is reduced through the arrangement of a plurality of groups of spaces, the stress change caused by frequent cold and hot impact at the corners of the back surface of the thermoelectric ceramic block 1 is further reduced.
Claims (5)
1. Reduce special chamfer structure of ceramic fracture, its characterized in that: the thermoelectric ceramic block comprises a thermoelectric ceramic block (1), electrode holes penetrating through the thermoelectric ceramic block are formed in corner positions of the surface of the thermoelectric ceramic block (1), front groove cutting portions (2) are formed in the surface of the thermoelectric ceramic block (1), upper groove cutting portions (3) and lower groove cutting portions (4) are formed in two ends of the back surface of the thermoelectric ceramic block (1), a first wire cutting portion (7) is integrally formed between the electrode holes and the lower groove cutting portions (4), a first stress cutting cavity is formed in the back surface of the thermoelectric ceramic block (1) where the first wire cutting portion (7) is located, a second wire cutting portion (8) is integrally formed between the electrode holes and the upper groove cutting portion (3), a second stress cutting cavity is formed in the back surface of the thermoelectric ceramic block (1) where the second wire cutting portion (8) is located, the back surfaces of the thermoelectric block (1) between the first wire cutting portion (7) and the second wire cutting portion (8) are conducted with each other through a conducting groove (9), and the first wire cutting portion (3), the second wire cutting portion (8) and the second wire cutting portion (4) are chamfered.
2. A special chamfer structure for reducing ceramic cracking as defined in claim 1, wherein: the electrode holes comprise an input side internal electrode hole I (101), an input side internal electrode hole II (102), an output side internal electrode hole I (103) and an output side internal electrode hole II (104) which are arranged at corner positions of the surface of the thermoelectric ceramic block (1).
3. A special chamfer structure for reducing ceramic cracking as defined in claim 1, wherein: the back of the thermoelectric ceramic block (1) at two sides of the lower grooved part (4) is provided with a U-shaped concave part (401).
4. A special chamfer structure for reducing ceramic cracking as defined in claim 1, wherein: the back of the thermoelectric ceramic block (1) of the first stress isolation cavity is provided with a first secondary rectangular groove digging part (5), and the back of the thermoelectric ceramic block (1) of the second stress isolation cavity is provided with a second secondary rectangular groove digging part (6).
5. A special chamfer structure for reducing ceramic cracking as defined in claim 1, wherein: and R angles or C angles are arranged at the corner positions of the thermoelectric ceramic blocks (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320705826.2U CN219740631U (en) | 2023-04-03 | 2023-04-03 | Reduce special chamfer structure of pottery fracture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320705826.2U CN219740631U (en) | 2023-04-03 | 2023-04-03 | Reduce special chamfer structure of pottery fracture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219740631U true CN219740631U (en) | 2023-09-22 |
Family
ID=88052770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320705826.2U Active CN219740631U (en) | 2023-04-03 | 2023-04-03 | Reduce special chamfer structure of pottery fracture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219740631U (en) |
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2023
- 2023-04-03 CN CN202320705826.2U patent/CN219740631U/en active Active
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