CN219625748U - Small-size mechanical optical switch - Google Patents
Small-size mechanical optical switch Download PDFInfo
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- CN219625748U CN219625748U CN202321102559.6U CN202321102559U CN219625748U CN 219625748 U CN219625748 U CN 219625748U CN 202321102559 U CN202321102559 U CN 202321102559U CN 219625748 U CN219625748 U CN 219625748U
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- optical fiber
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- shaped silicon
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- 230000003287 optical effect Effects 0.000 title claims abstract description 48
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 48
- 239000010703 silicon Substances 0.000 claims abstract description 48
- 239000013307 optical fiber Substances 0.000 claims abstract description 45
- 235000012431 wafers Nutrition 0.000 claims description 22
- 239000000835 fiber Substances 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 12
- 235000014676 Phragmites communis Nutrition 0.000 claims description 10
- 229910003460 diamond Inorganic materials 0.000 abstract description 7
- 239000010432 diamond Substances 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
The utility model relates to a small-sized mechanical optical switch, comprising: two optical fiber collimators which are oppositely arranged are used for inputting and outputting optical signals; the diamond-shaped silicon wafer is arranged in a light path formed by the two optical fiber collimators and is used for switching the light path; and the electromagnetic relay is connected with the diamond-shaped silicon chip and is used for controlling the diamond-shaped silicon chip to translate up and down so as to realize the cross switching of optical signals. The utility model adopts the scheme that the side-perforated optical fiber collimator is matched with the diamond silicon chip to be connected with the electromagnetic relay, thereby greatly reducing the size of the traditional mechanical optical switch.
Description
Technical Field
The utility model relates to the field of optical communication devices, in particular to a small-size mechanical optical switch.
Background
In optical fiber network systems, the transmission of information is accomplished by the transmission of optical signals in optical fibers. In the process of information transmission, signals of different channels are usually required to be switched, so that the requirement of cross-switching optical switches is promoted. The mechanical optical switch is an electro-optical switch which adopts a mechanical moving element to realize the switching of different signals among channels. Optical moving elements commonly employed in mechanical optical switches include triangular prisms (CN 1427277 a), double parallelogram prisms (CN 202093205U), trapezoidal prisms (CN 103487893A), plane mirrors (CN 1215348C), and diamond prisms (CN 2507021Y). Among them, a diamond prism is commonly used in early stages to switch the collimated light paths of two parallel light beams (as shown in fig. 1). However, this solution has the drawback of being large in size.
Disclosure of Invention
In view of the above, the present utility model provides a compact mechanical optical switch with small size to solve the problem of larger size of the conventional design.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
a small-sized mechanical optical switch comprising:
two optical fiber collimators which are oppositely arranged are used for inputting and outputting optical signals;
the diamond-shaped silicon wafer is arranged in a light path formed by the two optical fiber collimators and is used for switching the light path;
and the electromagnetic relay is connected with the diamond-shaped silicon chip and is used for controlling the diamond-shaped silicon chip to translate up and down so as to realize the cross switching of optical signals.
Preferably, the two fiber collimators are connected through a glass ball joint.
Preferably, the diamond-shaped silicon chip is connected with the reed of the electromagnetic relay through a glass flat piece.
Further, the 2×2 optical switching scheme is as follows: the two optical fiber collimators are TEC double optical fiber collimators, a round hole is drilled in the side face of one of the TEC double optical fiber collimators, the diamond-shaped silicon chip is positioned in the TEC double optical fiber collimator drilled with the round hole, and the diamond-shaped silicon chip is controlled by the electromagnetic relay to translate up and down, so that 2X 2 cross switching of the optical path is realized.
Further, the 1×2 optical switching scheme is as follows: one of the optical fiber collimators is a TEC single optical fiber collimator, the other optical fiber collimator is a TEC double optical fiber collimator, a round hole is drilled in the side face of the TEC single optical fiber collimator, the diamond-shaped silicon chip is positioned in the TEC single optical fiber collimator drilled with the round hole, and the diamond-shaped silicon chip is controlled by the electromagnetic relay to translate up and down, so that 1X 2 cross switching of optical paths is realized.
Further, the 1×4 optical switching scheme is as follows: one of the optical fiber collimators is a TEC single optical fiber collimator, the other optical fiber collimator is a TEC four optical fiber collimator, one side of the TEC single optical fiber collimator is drilled with a circular hole, and two sides of the TEC four optical fiber collimators are respectively drilled with a circular hole; the number of the diamond-shaped silicon wafers is three, one diamond-shaped silicon wafer is positioned in the TEC single-fiber collimator, and the other two diamond-shaped silicon wafers are respectively positioned in the TEC double-fiber collimator; the three diamond-shaped silicon chips are respectively controlled by the corresponding electromagnetic relays to translate up and down, so that the 1X 4 cross switching of the optical paths is realized.
The utility model adopts the scheme that the side-perforated optical fiber collimator is matched with the diamond silicon chip to be connected with the electromagnetic relay, thereby greatly reducing the size of the traditional mechanical optical switch.
Drawings
The utility model is described in further detail below with reference to the attached drawings and detailed description:
FIG. 1 is a schematic diagram of a conventional diamond-silicon-wafer-based mechanical optical switch;
FIG. 2 is a schematic structural diagram of embodiment 1 of the present utility model;
FIG. 3 is a schematic diagram illustrating the switching of the optical path according to embodiment 1 of the present utility model;
FIG. 4 is a schematic structural diagram of embodiment 2 of the present utility model;
FIG. 5 is a schematic diagram illustrating the switching of the optical path according to embodiment 2 of the present utility model;
FIG. 6 is a schematic structural diagram of embodiment 3 of the present utility model;
fig. 7 is a schematic diagram illustrating optical path switching according to embodiment 3 of the present utility model.
Description of the embodiments
Embodiment 1 as shown in fig. 2, the present utility model comprises a pair of TEC dual optical fiber collimators 105 and 106 for optical signal input and output, a diamond-shaped silicon wafer 101 for optical path switching, and an electromagnetic relay 104 connected thereto, which are disposed opposite to each other and connected by a glass ball joint 100. The light path diagrams of the two switching states are shown in fig. 3.
The diamond-shaped silicon wafer 101 is positioned inside the TEC dual-optical-fiber collimator 105 and is connected with the reed 103 of the electromagnetic relay 104 through the glass flat piece 102. One side of the TEC dual fiber collimator 105 is drilled with a circular hole 107 (for diamond shaped silicon wafer 101 access). The diamond-shaped silicon chip 101 is controlled by an electromagnetic relay and is driven by the reed 103 to translate up and down, so that 2X 2 cross switching of the light path is realized.
Embodiment 2 as shown in fig. 4, the present utility model includes a pair of TEC single fiber collimator 205 and TEC double fiber collimator 206 which are disposed opposite to each other and connected through glass ball joint 200 for optical signal input and output, a diamond-shaped silicon wafer 201 for optical path switching, and electromagnetic relay 204 connected thereto. The light path diagrams of the two switching states are shown in fig. 5.
The diamond-shaped silicon chip 201 is positioned inside the TEC single-fiber collimator 205 and is connected with the reed 203 of the electromagnetic relay 204 through the glass flat piece 202. One side of the TEC single fiber collimator 205 is drilled with a circular hole 207 (for diamond shaped silicon wafer 201 access). The diamond-shaped silicon chip 201 is controlled by an electromagnetic relay, and is driven by the reed 203 to translate up and down, so that the 1X 2 cross switching of the optical path is realized.
Embodiment 3 as shown in fig. 6, the present utility model includes a pair of TEC single fiber collimator 305 and TEC four fiber collimator 306 for optical signal input and output, three diamond-shaped silicon wafers 301, 307, 311 for optical path switching, and electromagnetic relays 304, 310, and 314 correspondingly connected to the two silicon wafers, which are disposed opposite to each other and connected through a glass ball joint 300. The optical path diagrams of the four switching states are shown in fig. 7.
The diamond-shaped silicon wafer 301 is positioned inside the TEC single-fiber collimator 305 and is connected with the reed 303 of the electromagnetic relay 304 through the glass flat piece 302. One side of the TEC single fiber collimator 305 is drilled with a circular hole 315 (for diamond shaped silicon wafer 301 entry). The diamond-shaped silicon chip 301 is controlled by an electromagnetic relay and is driven by the reed 303 to translate up and down; diamond-shaped silicon wafer 307 is located inside diamond-shaped silicon wafer 301 four-fiber collimator 306 and is connected to electromagnetic relay 310 via glass plate 308. Round holes 316 and 317 (for entrance of the diamond-shaped silicon wafers 307, 311, respectively) are drilled on both sides of the diamond-shaped silicon wafer 301 and the four fiber collimators 306. The diamond-shaped silicon chip 307 is controlled by an electromagnetic relay and is driven by the reed 309 to translate up and down; the diamond-shaped silicon chip 311 is positioned inside the TEC four-fiber collimator 306 and is connected to the electromagnetic relay 314 through a glass plate 312. The diamond-shaped silicon chip 311 is controlled by an electromagnetic relay and is driven by the reed 313 to translate up and down. The diamond-shaped silicon wafers 301, 307 and 311 translate up and down under the control of the corresponding electromagnetic relays, thereby realizing 1×4 cross switching of optical signals.
While particular embodiments of the present utility model have been described above, it will be understood by those skilled in the art that this is by way of example only, and that various changes and modifications may be made to this embodiment without departing from the spirit and scope of the utility model, but these changes and modifications are within the scope of the utility model.
Claims (6)
1. A small-sized mechanical optical switch, characterized in that: comprising the following steps:
two optical fiber collimators which are oppositely arranged are used for inputting and outputting optical signals;
the diamond-shaped silicon wafer is arranged in a light path formed by the two optical fiber collimators and is used for switching the light path;
and the electromagnetic relay is connected with the diamond-shaped silicon chip and is used for controlling the diamond-shaped silicon chip to translate up and down so as to realize the cross switching of optical signals.
2. A small-sized mechanical optical switch according to claim 1, characterized in that: the two optical fiber collimators are connected through a glass ball joint.
3. A small-sized mechanical optical switch according to claim 1, characterized in that: the diamond-shaped silicon chip is connected with the reed of the electromagnetic relay through the glass flat piece.
4. A small-sized mechanical optical switch according to claim 1, characterized in that: the two optical fiber collimators are TEC double optical fiber collimators, a round hole is drilled in the side face of one of the TEC double optical fiber collimators, the diamond-shaped silicon chip is positioned in the TEC double optical fiber collimator drilled with the round hole, and the diamond-shaped silicon chip is controlled by the electromagnetic relay to translate up and down, so that 2X 2 cross switching of the optical path is realized.
5. A small-sized mechanical optical switch according to claim 1, characterized in that: one of the optical fiber collimators is a TEC single optical fiber collimator, the other optical fiber collimator is a TEC double optical fiber collimator, a round hole is drilled in the side face of the TEC single optical fiber collimator, the diamond-shaped silicon chip is positioned in the TEC single optical fiber collimator drilled with the round hole, and the diamond-shaped silicon chip is controlled by the electromagnetic relay to translate up and down, so that 1X 2 cross switching of optical paths is realized.
6. A small-sized mechanical optical switch according to claim 1, characterized in that: one of the optical fiber collimators is a TEC single optical fiber collimator, the other optical fiber collimator is a TEC four optical fiber collimator, one side of the TEC single optical fiber collimator is drilled with a circular hole, and two sides of the TEC four optical fiber collimators are respectively drilled with a circular hole; the number of the diamond-shaped silicon wafers is three, one diamond-shaped silicon wafer is positioned in the TEC single-fiber collimator, and the other two diamond-shaped silicon wafers are respectively positioned in the TEC double-fiber collimator; the three diamond-shaped silicon chips are respectively controlled by the corresponding electromagnetic relays to translate up and down, so that the 1X 4 cross switching of the optical paths is realized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202321102559.6U CN219625748U (en) | 2023-05-10 | 2023-05-10 | Small-size mechanical optical switch |
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CN202321102559.6U CN219625748U (en) | 2023-05-10 | 2023-05-10 | Small-size mechanical optical switch |
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CN219625748U true CN219625748U (en) | 2023-09-01 |
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CN202321102559.6U Active CN219625748U (en) | 2023-05-10 | 2023-05-10 | Small-size mechanical optical switch |
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2023
- 2023-05-10 CN CN202321102559.6U patent/CN219625748U/en active Active
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