CN219455428U - Semiconductor packaging air leakage detection device using positive pressure air intake - Google Patents

Abstract

The utility model discloses a semiconductor package air leakage detection device using positive pressure air intake, which is applied to detect the sealed bag covering the wafer box, and detects whether the sealed bag has the defect of a hole. The semiconductor packaging air leakage detection device includes a box body, a gas entry and exit control part and a detector, and has an accommodating space in the box body for placing the sealing bag covering the wafer box, and the gas entry and exit control part is set On the box and communicated with the accommodation space in the box, the detector is set on the inner wall of the box to detect whether the envelope is inflated; when the positive pressure passes through the When the gas entry and exit control member enters the box and the envelope has a hole, the envelope will expand outward. The utility model uses positive pressure air intake to detect whether the sealed bag is leaking, and achieves the purpose of effectively and quickly judging whether the sealed bag is sealed.

Description

Semiconductor packaging air leakage detection device using positive pressure air intake

technical field

The utility model relates to an air leakage detection device, in particular to a semiconductor packaging air leakage detection device using positive pressure air intake.

Background technique

Science and technology are changing with each passing day. In the current semiconductor industry, it is an existing technology to use a wafer box automatic packaging machine (FOUP/FOSB AutoPacking Machine). The wafer box automatic packaging machine mainly packs wafer boxes (FOUP, FOSB), desiccant ( Desiccant) and Humidity Card (Humidity Card) are placed together in a sealed bag (such as sealed in an aluminum bag), and the manual operation is replaced by the chip box automatic packaging machine, the product quality is maintained, and the risk of chip fragmentation is effectively reduced to meet the intelligent manufacturing needs. However, in the process of sealing the aluminum bag, if the sealing bag is not completely sealed, it will have a great impact on the overall work quality. Therefore, how to effectively judge that the sealing bag is really sealed has become an important issue. topic.

Pre-testing equipment is mostly used in canned food to detect whether the food has deteriorated. In a sterile environment, when the food is delivered from the pipeline to the food can, the joints between the interconnected pipelines must be kept sealed. state, to ensure that the food is in a sterile line until the food is delivered to the food can, but the canned food inspection technology cannot be transferred to the packaging bag. On the other hand, although there is another detection device that can detect whether there is a breach in the sealed rice bag, the rice bag is placed in a sealed container, and the gas is compressed downward by the piston until the piston touches the pressure switch and moves upward to the initial position, thereby Detect whether there is gas leakage from the rice bag.

However, the above two detection devices are not suitable for sealing bags covering wafer cassettes. First, canned food detection technology cannot be transferred to packaging bags, and food will deteriorate due to exposure to air, but wafer boxes will not; The rise in temperature has a sterilizing effect on the rice bag, but the rise in temperature may cause the wafers in the wafer box to fail due to heat.

Therefore, the existing technology still cannot solve the problem that the semiconductor industry can more efficiently judge whether the envelope is sealed after the wafer box is automatically packaged, so it is indeed necessary to further propose a better solution.

Utility model content

In view of the above-mentioned deficiencies in the prior art, the main purpose of this utility model is to provide a semiconductor packaging air leakage detection device using positive pressure air intake, which uses positive pressure air intake to detect whether the sealed bag is leaking, to achieve effective, The function of quickly judging whether the sealed bag is really sealed.

The main technical means adopted to achieve the above purpose is to make the aforementioned air leakage detection device for semiconductor packaging using positive pressure air intake include:

The box body has an accommodating space therein for placing envelopes covering the wafer cassettes;

The gas entry and exit control part is arranged on the box body and communicates with the accommodation space in the box body;

The detector is arranged on the inner wall of the box to detect whether the envelope is inflated.

According to the above-mentioned structure, the utility model is mainly applied to detect the sealing bag covering the wafer box, and detect whether the sealing bag has a defect of a hole, when the positive pressure enters the box through the gas inlet and outlet control member In vivo, and when the sealed bag has a hole, the sealed bag will expand outwards; thereby, the positive pressure air intake method is used to detect whether the sealed bag is leaking, so as to effectively and quickly judge the sealed bag Whether it is indeed the purpose of sealing.

Description of drawings

FIG. 1 is a system architecture diagram of a semiconductor packaging air leakage detection device according to an embodiment of the present invention.

Fig. 2 is a usage situation diagram of the air-inflated state of the semiconductor packaging air leakage detection device according to an embodiment of the present invention.

FIG. 3 is a situational diagram of the exhaust state of the semiconductor packaging air leakage detection device according to an embodiment of the present invention.

FIG. 4 is a diagram of the use situation of the trigger detector of the semiconductor packaging air leakage detection device according to an embodiment of the present invention.

FIG. 5 is a system architecture diagram of a semiconductor packaging air leakage detection device according to another embodiment of the present invention.

FIG. 6 is a system architecture diagram of a semiconductor packaging air leakage detection device according to another embodiment of the present invention.

FIG. 7 is a system architecture diagram of a semiconductor packaging air leakage detection device according to another embodiment of the present invention.

FIG. 8 is a system architecture diagram of a semiconductor packaging air leakage detection device according to another embodiment of the present invention.

FIG. 9 is a system architecture diagram of a semiconductor packaging air leakage detection device according to another embodiment of the present invention.

Detailed ways

Regarding an embodiment of the present invention, please refer to Figs. 1 and 2, which includes a semiconductor packaging air leakage detection device 1 using positive pressure air intake, which is applied to detect an envelope 50, and the envelope 50 is a package Flip the wafer box 51, and detect whether the envelope 50 has a defect of a hole 53.

Please refer to Fig. 1, wherein said semiconductor packaging air leakage detection device 1 includes a box body 10, a gas entry and exit control member 20 and a detector 30; said box body 10 has an accommodating space 101 for placing said envelope bag 50, The envelope 50 is used to cover the wafer box 51, and the gas entry and exit control member 20 is arranged on the box body 10 and communicates with the accommodating space 101 in the box body 10; The detector 30 is arranged on the inner wall of the box 10 to detect whether the envelope 50 is inflated. When the positive pressure enters the box body 10 through the gas inlet and outlet control member 20, and the envelope 50 has the hole 53, the envelope 50 will expand outwards, thereby utilizing the positive pressure to enter the box body 10. The method of air detection is used to detect whether the enveloped bag 50 is leaking, so as to effectively and quickly determine whether the enveloped bag 50 is really sealed.

In this embodiment, as shown in FIG. 1, the gas inlet and outlet control member 20 has an air inlet 21 and an air outlet 22, and the air inlet 21 and the air outlet 22 are integrated into an integral component In this embodiment, the gas inlet and outlet control member 20 can be composed of a two-way valve, a dual-channel inlet and outlet valve, or a dual-channel switch valve; wherein, the air inlet 21 of the gas inlet and outlet controller 20 is connected to The accommodating space 101 in the box body 10 , and the exhaust port 22 of the gas entry and exit control member 20 communicates with the accommodating space 101 in the box body 10 . In addition, the gas inlet and outlet control member 20 can be connected to the outside with a pressure pump for positive pressure intake or negative pressure exhaust, which can input gas into the air intake port 21 in the form of positive pressure intake. The accommodating space 101 in the box body 10; and through the exhaust port 22, the gas in the accommodating space 101 in the box body 10 is exhausted from the exhaust port 22 in the manner of negative pressure exhaust.

The detector 30 includes more than one micro switch, more than one image sensor or more than one charge-coupled device, etc., for detecting whether the envelope 50 has the hole 53 or not.

To illustrate the specific application of this embodiment, please refer to Figures 2 and 3, since the pressure in the housing space 101 in the box body 10 is at least greater than one atmosphere, as shown in Figure 2, at this time the box body 10 The envelope 50 in the accommodating space 101 is in a non-expanded state. When the pressure of the accommodating space 101 in the box body 10 is at least greater than one atmospheric pressure, the gas inlet and outlet control member 20 cuts off the positive pressure air intake through the air inlet 21, and then makes the exhaust port 22 discharge air under negative pressure. The gas in the accommodating space 101 in the box body 10 is continuously discharged by means of air until the accommodating space 101 in the box body 10 returns to the state of atmospheric pressure. In the process of continuous negative pressure exhaust, if the envelope 50 covering the wafer cassette 51 has the hole 53, the pressure inside the envelope 50 will be greater than the pressure of the external environment. The entirety of the envelope 50 is continuously expanded toward the inner wall of the box body 10 .

Please refer to Figures 3 and 4, when the gas in and out control member 20 continues to carry out negative pressure exhaust to the accommodating space 101 in the box body 10, the entirety of the envelope 50 is continuously facing the box body 10 The direction of the inner wall expands until the envelope 50 touches the detector 30 . Once the envelope 50 touches the detector 30 and the detector 30 is triggered, the semiconductor package air leakage detection device 1 using positive pressure air can detect that the envelope 50 has the The hole 53, that is, the envelope 50 is not really sealed.

Further, in order to illustrate another specific application mode of this embodiment, please refer to FIG. The air valve and the exhaust valve can be separated into independent elements, and in this embodiment, the air inlet 21 of the gas inlet and outlet control member 20 constitutes the air inlet of the air inlet valve, and the air inlet of the air inlet valve is composed of The exhaust port 22 of the gas inlet and outlet control member 20 constitutes the exhaust port of the exhaust valve. Next, the inlet valve of the gas inlet and outlet control member 20 and the exhaust valve of the gas inlet and outlet controller 20 are respectively connected to the aforementioned external pressure pumps.

In this embodiment, the air intake valve with the air inlet 21 can be arranged on the top of the box body 10 and communicate with the accommodation space 101 in the box body 10; The exhaust valve at the port 22 may be disposed on the side of the box body 10 and communicate with the accommodating space 101 in the box body 10 . In addition, the actuation mode of the intake valve of the gas in-out control part 20 and the actuation mode of the exhaust valve of the gas in-out control part 20 have been seen in the aforementioned description of the air inlet 21 and the exhaust port 22. The actuation mode integrated into an integral component will not be described in detail.

Further, to illustrate another specific application manner of this embodiment, please refer to FIG. 6 , in this embodiment, the number of detectors 30 may be one or more. When there are two detectors in the present embodiment, as shown in FIG. Side portion; the second detector 32 is disposed on the right side of the inner wall of the box body 10 . When the envelope 50 with the hole 53 is located in the accommodating space 101 in the box body 10, the gas exhausted by the envelope 50 due to negative pressure is discharged from the hole 53, resulting in The envelope 50 continues to expand toward the inner wall of the box 10 until the expanded envelope 50 touches the first detector 31 or the second detector 32 . At the same time, the touched detectors 31, 32 are triggered.

Further, when there are multiple detectors in this embodiment, please refer to FIG. 7, which further includes a third detector 33 and a fourth detector 34, wherein the third detector 33 is located in the box The top of the inner wall of the box body 10; and the fourth detector 34 is arranged at the bottom of the inner wall of the box body 10. When the envelope 50 with the hole 53 is located in the accommodating space 101 in the box body 10, the gas exhausted by the envelope 50 due to negative pressure is discharged from the hole 53, resulting in The envelope 50 continues to expand toward the inner wall of the box 10 until the expanded envelope 50 touches any one of the first to fourth detectors 31 , 32 , 33 , 34 . At the same time, the touched detectors 31 , 32 , 33 , 34 are triggered.

To illustrate another specific application of this embodiment, please refer to Figures 8 and 9. In this embodiment, the semiconductor packaging air leakage detection device 1 may further include the aforementioned detector 30, The pressure detection element 40 or the pressure sensor 41, in this embodiment, the aforementioned detector 30 and the pressure sensing element 40 can be electrically connected to the processor 42, or the aforementioned detector 30 and the pressure sensor 41 It can be electrically connected to the processor 42 to detect the pressure of the accommodating space 101 in the box body 10 . When the pressure detection part 40 or the pressure sensor 41 detects that the pressure of the accommodating space 101 in the box body 10 is at least greater than a threshold value of atmospheric pressure, the gas entry and exit control part 20 will The air inlet 21 for continuous positive pressure intake cuts off the positive pressure intake, and the gas in the accommodation space 101 in the box 10 is continuously exhausted by the exhaust port 22 until the pressure detection The component 40 or the pressure sensor 41 detects that the pressure of the accommodating space 101 in the box body 10 returns to an atmospheric pressure state.

In this embodiment, when the exhaust port 22 continuously discharges the gas in the accommodating space 101 in the box body 10, the entirety of the envelope 50 is continuously directed towards the inner wall of the box body 10 swell. Once the envelope 50 touches the detector 30 so that the detector 30 is triggered, the processor 42 determines that the envelope 50 has the hole 53 .

To sum up, the utility model is mainly applied to detect the envelope 50 covering the wafer box 51, and detect whether the envelope 50 has the defect of the hole 53, when the positive pressure passes through the When the gas entry and exit control member 20 enters the box 10 and the envelope 50 has the hole 53, the envelope 50 will expand outward; Whether the sealing bag 50 leaks air can achieve the purpose of effectively and quickly judging whether the sealing bag 50 is really sealed.

Claims (10)

1. A semiconductor packaging air leakage detection device utilizing positive pressure air intake, characterized in that: The box body has an accommodating space therein for placing envelopes covering the wafer cassettes; The gas entry and exit control part is arranged on the box body and communicates with the accommodation space in the box body; The detector is arranged on the inner wall of the box to detect whether the envelope is inflated. 2. The semiconductor packaging air leakage detection device utilizing positive pressure air intake according to claim 1, wherein the gas entry and exit control member has: The air inlet communicates with the accommodating space in the box, and enters the accommodating space in the box with positive pressure; The exhaust port communicates with the accommodating space in the box, and exhausts the gas in the accommodating space in the box with negative pressure. 3. The semiconductor packaging air leakage detection device utilizing positive pressure air intake according to claim 1, wherein the gas entry and exit control member comprises: The air intake valve is arranged on the top of the box and communicates with the accommodation space in the box; The exhaust valve is arranged on the side of the box and communicates with the accommodating space in the box. 4. The semiconductor packaging air leakage detection device utilizing positive pressure air intake according to claim 1, wherein the detector includes a micro switch, which is arranged on the inner wall of the box body, and when the micro switch When the switch is activated, the envelope has a hole. 5. The semiconductor packaging air leakage detection device utilizing positive pressure air intake according to claim 1, wherein the detector has two or more, and each detector is arranged on the inner wall of the box body Above, when the envelope contacts one of the detectors such that the detector is triggered, the envelope has a hole. 6. The semiconductor packaging air leakage detection device utilizing positive pressure air intake according to claim 1, further comprising a pressure detection member or a pressure sensor, which is arranged on the inner wall of the box to detect The pressure of the accommodating space in the box. 7. The semiconductor packaging air leakage detection device utilizing positive pressure air intake according to claim 6, further comprising a processor electrically connected to the detector and the pressure detection element or the a pressure sensor, when the pressure sensor detects that the pressure of the accommodating space in the box is greater than the external pressure and the envelope touches the detector to trigger the detector, the processor determines that the The envelope has holes. 8. The semiconductor packaging air leakage detection device utilizing positive pressure air intake according to any one of claims 1 to 6, further comprising a processor electrically connected to the detector, when the package The processor determines that the envelope has a hole when the detector is triggered by contact with the bag. 9. The semiconductor packaging air leakage detection device utilizing positive pressure air intake according to claim 8, characterized in that, when the gas in and out control member is exhausted under negative pressure, the envelope contacts the detector and When the detector is triggered, the processor determines that the envelope has a hole. 10. The semiconductor packaging air leakage detection device utilizing positive pressure air intake according to claim 1, characterized in that, the gas in and out of the housing space in the box is positively pressured into the air in and out of the gas in and out control member, and the gas in and out The negative pressure exhaust of the control member causes the envelope to contact the detector to trigger the detector.