CN219338373U - Glue overflow preventing structure for hardware injection molding test - Google Patents
Glue overflow preventing structure for hardware injection molding test Download PDFInfo
- Publication number
- CN219338373U CN219338373U CN202223378971.9U CN202223378971U CN219338373U CN 219338373 U CN219338373 U CN 219338373U CN 202223378971 U CN202223378971 U CN 202223378971U CN 219338373 U CN219338373 U CN 219338373U
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- Prior art keywords
- lower mold
- injection molding
- module
- trough
- glue overflow
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- 239000003292 glue Substances 0.000 title claims abstract description 42
- 238000001746 injection moulding Methods 0.000 title claims abstract description 27
- 238000012360 testing method Methods 0.000 title claims abstract description 25
- 230000000903 blocking effect Effects 0.000 claims abstract description 36
- 229920003023 plastic Polymers 0.000 claims abstract description 33
- 239000004033 plastic Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 29
- 238000000465 moulding Methods 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 2
- 238000002347 injection Methods 0.000 abstract description 5
- 239000007924 injection Substances 0.000 abstract description 5
- 238000004891 communication Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013502 plastic waste Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses an anti-glue overflow structure for hardware injection molding test, which comprises a lower module, an upper module and a blocking piece, wherein a first half groove and a material placing groove which are communicated with each other are formed in one side surface of the lower module, which is close to the upper module, a second half groove is formed in one side surface of the upper module, which is close to the lower module, the blocking piece is accommodated in the material placing groove, and when the upper module and the lower module are mutually buckled, the first half groove and the second half groove jointly form a forming cavity, and the end surface of the blocking piece is flush with the inner side wall of the forming cavity. So, through the jam piece, when the mould carries out the hardware injection test, can avoid plastic material overflow to put in the silo, jam piece can used repeatedly moreover, avoids extravagant hardware.
Description
Technical Field
The utility model relates to the technical field of injection molds, in particular to a glue overflow preventing structure for hardware injection test.
Background
The hardware injection molding refers to an injection molding mode in which hardware is built in a mold so that plastic and the hardware are integrally molded.
However, since the injection mold needs to be debugged repeatedly before stable production to verify the reliability of the mold, the production parameters of the injection molding machine, and the like, if the hardware injection molding is performed, i.e. hardware is not put in, molten plastic overflows from the placement position of the hardware, and the problem of glue overflow is caused. If the hardware is placed into the die for debugging, the hardware is wasted, and the difficulty in separating the hardware from plastic waste is increased. Therefore, in order to solve the technical problem, the anti-overflow glue structure for hardware injection molding test is provided.
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provides a glue overflow preventing structure for hardware injection molding test, which can avoid glue overflow and avoid hardware waste.
The aim of the utility model is realized by the following technical scheme:
a glue overflow prevention structure for five metals test of moulding plastics includes:
the lower module is provided with a first half groove and a material placing groove which are communicated with each other on one side surface of the lower module, which is close to the upper module;
the upper module is provided with a second half groove on one side surface close to the lower module; and
The blocking piece is accommodated in the material accommodating groove, and when the upper module and the lower module are mutually buckled, the first half groove and the second half groove jointly enclose a forming cavity, and the end face of the blocking piece is flush with the inner side wall of the forming cavity.
In one embodiment, the lower mold comprises a lower mold frame and a lower mold core, the lower mold core is arranged in the lower mold frame, and the first half groove and the material placing groove are both positioned on one side surface of the lower mold core away from the lower mold frame.
In one embodiment, the lower mold further comprises a top rod, the top rod penetrates through the lower mold core, and the top surface of the top rod is flush with the bottom wall of the first half groove.
In one embodiment, a first trough is further formed on the lower module, and the first trough is communicated with the first half trough.
In one embodiment, a second trough is further formed on the upper module, and when the upper module and the lower module are mutually buckled, the second trough and the first trough are enclosed together to form a feeding channel.
In one embodiment, the upper module is further provided with a glue inlet hole of a penetrating structure, and the glue inlet hole is communicated with the feeding channel.
In one embodiment, a cold material groove is arranged at the connection position of the glue inlet hole and the feeding channel.
In one embodiment, the diameter of the glue inlet hole gradually increases towards the direction approaching the feeding channel.
In one embodiment, the blocking tab is a metallic structure.
In one embodiment, the plug sheet is a copper structure.
Compared with the prior art, the utility model has at least the following advantages:
the utility model discloses an anti-glue overflow structure for hardware injection molding test, which comprises a lower module, an upper module and a blocking piece, wherein a first half groove and a material placing groove which are communicated with each other are formed in one side surface of the lower module, which is close to the upper module, a second half groove is formed in one side surface of the upper module, which is close to the lower module, the blocking piece is accommodated in the material placing groove, and when the upper module and the lower module are mutually buckled, the first half groove and the second half groove jointly form a forming cavity, and the end surface of the blocking piece is flush with the inner side wall of the forming cavity. So, through the jam piece, when the mould carries out the hardware injection test, can avoid plastic material overflow to put in the silo, jam piece can used repeatedly moreover, avoids extravagant hardware.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic cross-sectional view of an anti-overflow structure for hardware injection molding test according to an embodiment of the present utility model;
FIG. 2 is a schematic view of a partial cross-sectional structure of the glue overflow prevention structure for hardware injection molding test shown in FIG. 1;
FIG. 3 is a schematic view of the enlarged partial structure of FIG. 2A;
FIG. 4 is a schematic structural diagram of a hardware and a plastic part according to an embodiment of the present utility model;
fig. 5 is a schematic structural diagram of a plugging sheet and a plastic member according to an embodiment of the utility model.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model.
Referring to fig. 1 and 2, an anti-overflow structure 10 for hardware injection molding test includes a lower module 100, an upper module 200 and a blocking piece 300, wherein a side surface of the lower module 100, which is close to the upper module 200, is provided with a first half groove 121 and a material placing groove 122 which are mutually communicated, a side surface of the upper module 200, which is close to the lower module 100, is provided with a second half groove 210, the blocking piece 300 is accommodated in the material placing groove 122, and when the upper module 200 and the lower module 100 are mutually fastened, the first half groove 121 and the second half groove 210 jointly enclose a molding cavity, and an end surface of the blocking piece 300 is flush with an inner side wall of the molding cavity.
When the upper mold 200 and the lower mold 100 are fastened to each other, the first half groove 121 and the second half groove 210 together enclose a molding cavity, which is a cavity for molding a plastic part. A material placing groove 122 is also formed on the lower module 100, and the material placing groove 122 is communicated with the first half groove 121. When the upper mold 200 is snapped with the lower mold 100, the upper mold 100 shields the placement slot 122 such that the placement slot 122 is in communication with the molding cavity. The blocking piece 300 is placed in the receiving groove 122 before the upper mold 200 and the lower mold 100 are engaged with each other. In this way, the trough 122 is occupied by the blocking piece 300, when the upper module 200 is buckled with the lower module 100, the end surface of the blocking piece 300 is aligned with the inner side wall of the molding cavity, so that when the mold is tested, the plastic is injected into the molding cavity, the blocking piece 300 can block the plastic, and the plastic is prevented from being injected into the trough 122. Moreover, since the blocking piece 300 does not extend into the forming cavity, only the end face of the blocking piece 300 is aligned with the inner side wall of the forming cavity, so that the surface of the formed plastic piece is connected with the end face of the blocking piece 300, the connection strength between the plastic piece and the blocking piece 300 is greatly reduced, and therefore, when a certain transverse external force is applied to the blocking piece 300, the blocking piece 300 can be peeled off from the plastic piece, and the blocking piece 300 can be repeatedly utilized. Thus, through the jam sheet 300, when the mould carries out the hardware injection molding test, can avoid plastic material to overflow to put in the silo 122, jam sheet 300 can used repeatedly moreover, avoids extravagant hardware. In one embodiment, the plugging sheet 300 need not be completely identical to the shape of the chute 122, and only the connection aperture between the molding cavity and the chute 122 is ensured by the plugging sheet 300.
Referring to fig. 1 and 2, in an embodiment, the lower mold 100 includes a lower mold frame 110 and a lower mold core 120, the lower mold core 120 is disposed in the lower mold frame 110, and the first half groove 121 and the material placing groove 122 are both disposed on a side surface of the lower mold core 120 away from the lower mold frame 110.
It should be noted that, the lower mold core 120 is installed on the lower mold frame 110, and the lower mold core 120 is located at the top of the lower mold frame 110. The first half groove 121 and the material placing groove 122 are both positioned on the lower die core 120. The lower mold 100 is configured as a combined structure of the lower mold frame 110 and the lower mold core 120, thereby facilitating mold processing.
Referring to fig. 1 and 2, in an embodiment, the lower mold 100 further includes a mandrel 130, the mandrel 130 is disposed through the lower mold core 120, and a top surface of the mandrel 130 is flush with a bottom wall of the first half groove 121.
It should be noted that, the ejector pin 130 passes through the lower mold core 120, so that the top surface of the ejector pin 130 is flush with the bottom wall of the first half groove 121. For example, the ejector pin 130 is connected with a stripper plate, and the stripper plate is slidably mounted in the lower die frame 110, so that after injection molding is completed, the ejector pin 130 ejects the plastic part in the molding cavity, and the plastic part and the blocking piece 300 can be pushed out together.
Referring to fig. 3, in an embodiment, a first trough 123 is further formed on the lower module 100, and the first trough 123 is in communication with the first half trough 121.
For example, the first trough 123 is located on the lower mold core 120, and the first trough 123 is in communication with the first half trough 121. Thus, when the upper mold 200 is fastened to the lower mold 100, the first trough 123 is shielded by the upper mold 200, so that the plastic material can flow into the molding cavity through the first trough 123.
Referring to fig. 3, in an embodiment, a second trough 220 is further formed on the upper module 200, so that the second trough 220 and the first trough 123 form a feeding channel together when the upper module 200 and the lower module 100 are fastened together.
It should be noted that, in order to increase the plastic inflow rate and avoid that the plastic gate material formed in the first trough 123 is too large to be taken out, the feeding channel is formed by surrounding the first trough 123 and the second trough 220 together, so that the formed plastic gate material is convenient to fall off from the first trough 123 and the second trough 220 when the upper module 200 is separated from the lower module 100.
Referring to fig. 1 to 3, in an embodiment, the upper module 200 is further provided with a glue inlet 230 with a penetrating structure, and the glue inlet 230 is in communication with the feeding channel.
It should be noted that, the glue inlet 230 penetrates through the bottom surface of the upper module 200 from the top surface of the upper module 200, so that the glue inlet 230 communicates with the feeding channel, and the injection molding machine injects the plastic material into the feeding channel through the glue inlet 230.
Further, referring to fig. 3, in an embodiment, a cold material tank 240 is disposed at a connection position between the glue inlet 230 and the feeding channel. It should be noted that, after the plastic enters the glue inlet 230 from the injection molding machine, the temperature of the plastic at the front end is reduced, so as to avoid blocking the channel between the feeding channel and the molding cavity by the plastic at the front end, and therefore, a cold material tank 240 is disposed at the end of the glue inlet 230, so that the plastic at the front end is remained in the cold material tank 240.
Referring to fig. 3, in an embodiment, the diameter of the glue inlet 230 gradually increases toward the feeding channel.
In this way, the glue inlet 230 is configured to have a narrow top and wide bottom, so that the plastic gate material formed in the glue inlet 230 can be rapidly withdrawn from the glue inlet 230 when the upper mold 200 is separated from the lower mold 100.
In one embodiment, the blocking piece 300 is of a metal structure, so that the blocking piece 300 has sufficient structural strength, and when the blocking piece 300 is peeled off from the plastic part, the blocking piece 300 can be prevented from being cracked, so as to be stably separated from the plastic part. For example, the plug 300 may be a steel structure or a copper structure.
Referring to fig. 4 and 5, in normal production, a part of the structure of the hardware 30 is located in the plastic part 20 to realize integral injection molding, and in the anti-overflow glue structure for testing of the present application, the end surface of the blocking piece 300 contacts with the outer side wall of the plastic part 20, so that the blocking piece 300 is convenient to be detached from the plastic part 20, so that the blocking piece 300 can be reused.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. A prevent glue overflow structure for five metals test of moulding plastics, its characterized in that includes:
the lower module is provided with a first half groove and a material placing groove which are communicated with each other on one side surface of the lower module, which is close to the upper module;
the upper module is provided with a second half groove on one side surface close to the lower module; and
The blocking piece is accommodated in the material accommodating groove, and when the upper module and the lower module are mutually buckled, the first half groove and the second half groove jointly enclose a forming cavity, and the end face of the blocking piece is flush with the inner side wall of the forming cavity.
2. The glue overflow preventing structure for hardware injection molding test of claim 1, wherein the lower mold comprises a lower mold frame and a lower mold core, the lower mold core is arranged in the lower mold frame, and the first half groove and the material placing groove are both positioned on one side surface of the lower mold core away from the lower mold frame.
3. The glue overflow preventing structure for hardware injection molding test of claim 2, wherein the lower mold further comprises a push rod, the push rod is arranged through the lower mold core in a penetrating manner, and the top surface of the push rod is flush with the bottom wall of the first half groove.
4. The glue overflow preventing structure for hardware injection molding test of claim 1, wherein the lower mold is further provided with a first trough, and the first trough is communicated with the first half trough.
5. The glue overflow preventing structure for hardware injection molding test of claim 4, wherein the upper mold is further provided with a second trough, and the second trough and the first trough are enclosed together to form a feeding channel when the upper mold and the lower mold are mutually buckled.
6. The glue overflow preventing structure for hardware injection molding test of claim 5, wherein the upper module is further provided with a glue inlet hole of a penetrating structure, and the glue inlet hole is communicated with the feeding channel.
7. The glue overflow preventing structure for hardware injection molding test of claim 6, wherein a cold material groove is arranged at the connection position of the glue inlet hole and the feeding channel.
8. The glue overflow preventing structure for hardware injection molding test of claim 6, wherein the diameter of the glue inlet hole gradually increases towards the direction approaching the feeding channel.
9. The glue overflow preventing structure for hardware injection molding test of claim 1, wherein the blocking piece is a metal structure.
10. The glue overflow preventing structure for hardware injection molding test of claim 9, wherein the blocking piece is a copper structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223378971.9U CN219338373U (en) | 2022-12-15 | 2022-12-15 | Glue overflow preventing structure for hardware injection molding test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223378971.9U CN219338373U (en) | 2022-12-15 | 2022-12-15 | Glue overflow preventing structure for hardware injection molding test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219338373U true CN219338373U (en) | 2023-07-14 |
Family
ID=87095364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223378971.9U Active CN219338373U (en) | 2022-12-15 | 2022-12-15 | Glue overflow preventing structure for hardware injection molding test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219338373U (en) |
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2022
- 2022-12-15 CN CN202223378971.9U patent/CN219338373U/en active Active
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