CN219218187U - Electroplating equipment - Google Patents

Abstract

The utility model relates to the technical field of electroplating, in particular to electroplating equipment. The electroplating equipment comprises a current equalizer, an anode group and a plating piece; the current equalizer, the anode group and the plating piece are sequentially arranged; the flow equalizer is provided with a liquid inlet and a plurality of flow equalizing ports, the liquid inlet and the plurality of flow equalizing ports are communicated with the inner cavity of the flow equalizer, and the plurality of flow equalizing ports are positioned on the side wall of the flow equalizer opposite to the anode group; the anode stack comprises an anode or a plurality of anodes arranged in an array, the anode being provided with a plurality of anode holes. The electroplating equipment can uniformly jet the plating solution so as to comprehensively and uniformly cover the plating piece; meanwhile, as the anode is arranged between the current equalizer and the workpiece, the distance between the anode group and the plating piece can be shortened, the symmetry of the anode group and the plating piece is improved, and the problem of power line dispersion is avoided.

Description

Plating equipment

technical field

The utility model relates to the technical field of electroplating, in particular to an electroplating equipment.

Background technique

With the development of integrated circuit packaging technology, the quality requirements of the packaging substrate (IC Substrate) are getting higher and higher, and the uniformity of the coating is one of the key links. The anode is usually installed behind the jet tube, and the anode is far away from the plated parts, so the power lines are easy to diverge, change, and become sparse and uneven, which will eventually affect the uniformity of the coating.

Utility model content

The purpose of the utility model is to provide a kind of electroplating equipment, which can evenly spray the plating solution, so that the plating solution covers the plated parts comprehensively and evenly; at the same time, since the anode group is placed between the current equalizer and the workpiece, it can Shorten the distance between the anode group and the plated piece, improve the symmetry of the anode group and the plated piece, and avoid the problem of discrete power lines.

Embodiments of the utility model are achieved in that:

The utility model provides an electroplating equipment. The electroplating equipment includes a current equalizer, an anode group and a plated piece; the current equalizer, the anode group and the plated piece are arranged in sequence;

The flow equalizer is provided with a liquid inlet and multiple flow equalization ports. The liquid inlet and multiple flow equalization ports are connected to the inner cavity of the flow equalizer, and the multiple flow equalization ports are located on the side of the flow equalizer facing the anode group. wall;

The anode group includes one anode or a plurality of anodes arranged in an array, and the anode is configured with a plurality of anode holes.

In an optional embodiment, the anode is provided with multiple anode holes, the multiple anode holes are arranged in an array, the multiple anode holes are in one-to-one correspondence with the multiple flow sharing ports, and each anode hole is connected to the corresponding current sharing port. The axes of the mouth coincide.

In an optional embodiment, a partition plate is arranged in the flow equalizer, and the partition plate divides the inner cavity of the flow equalizer into a diversion chamber and a flow equalization chamber, and the diversion chamber communicates with the flow equalization chamber ;

The liquid inlet is in communication with the diversion chamber, and the plurality of flow equalization ports are all in communication with the flow equalization chamber.

In an optional embodiment, a plurality of diversion openings are opened on the partition plate, and the plurality of diversion openings communicate the diversion chamber with the flow equalization chamber.

In an optional embodiment, a plurality of diversion openings are arranged in an array.

In an optional embodiment, the partition plate is parallel to the side wall where the flow equalization holes are arranged.

In an optional embodiment, each anode hole corresponds to one or more flow sharing ports, and the axis of each anode hole is parallel to the axis of the corresponding flow sharing port.

In an optional embodiment, the edge of the anode group is provided with an anode shade, and the anode shade is used to adjust the current density at the edge of the anode group.

The beneficial effects of the utility model embodiment include:

The electroplating equipment includes a current equalizer, an anode group and a plated piece; the current equalizer, the anode group and the plated piece are arranged in sequence; It communicates with the inner cavity of the flow equalizer, and the plurality of flow equalization ports are all located on the side wall of the flow equalizer facing the anode. The electroplating equipment can evenly spray the plating solution, so that the plating solution can cover the plated parts comprehensively and uniformly; at the same time, because the anode group is placed between the current equalizer and the workpiece, the distance between the anode group and the plated part can be shortened , improve the symmetry of the anode group and the plated parts, and avoid the problem of discrete power lines.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention. Therefore, it should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained according to these drawings without creative work.

Fig. 1 is the structural representation of electroplating equipment in the utility model embodiment;

Fig. 2 is a schematic view of the structure of the current equalizer and the anode in the first viewing angle of the embodiment of the utility model;

Fig. 3 is a schematic structural diagram of a current equalizer and an anode group in a second viewing angle in an embodiment of the present invention.

Icons: 100-electroplating equipment; 110-flow equalizer; 120-anode group; 130-plated parts; 111-liquid inlet; Flow equalization chamber; 116-drain port; 121-anode hole.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the utility model more clear, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the utility model. Obviously, the described The embodiments are some embodiments of the present utility model, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship that is usually placed when the product of the utility model is used. It is only for the convenience of describing the utility model and simplifying the description, rather than Any indication or implication that a referenced device or element must have a particular orientation, be constructed, and operate in a particular orientation should not be construed as limiting the invention. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions, and should not be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that a component is absolutely level or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal than "vertical", and it does not mean that the structure must be completely horizontal, but can be slightly inclined.

In the description of the present utility model, it should also be noted that, unless otherwise specified and limited, the terms "setting", "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection , can also be detachably connected, or integrally connected; can be mechanically connected, can also be electrically connected; can be directly connected, can also be indirectly connected through an intermediary, and can be internal communication between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model in specific situations.

Please refer to FIGS. 1-3 , the present embodiment provides an electroplating equipment 100. The electroplating equipment 100 includes a current equalizer 110, an anode group 120, and a plating piece 130; the current equalizer 110, the anode set 120, and the plating piece 130 are arranged in sequence;

The flow equalizer 110 is provided with a liquid inlet 111 and a plurality of flow equalization ports 112, the liquid inlet 111 and the plurality of flow equalization ports 112 are all connected to the inner cavity of the flow equalizer 110, and the plurality of flow equalization ports 112 are located at the The device 110 is facing the side wall of the anode group 120;

The anode group 120 includes one anode or a plurality of anodes arranged in an array, and the anode is configured with a plurality of anode holes 121 .

Please refer to Fig. 1-Fig. 3, the working principle of this electroplating equipment 100 is:

The electroplating equipment 100 is used to perform electroplating treatment on workpieces, and the equipment is in an electroplating pool or other types of electroplating environments during the processing;

During the electroplating process, since the current equalizer 110, the anode group 120 and the plated piece 130 are arranged in sequence, the anode group 120 is relatively located between the current equalizer 110 and the plated piece 130, and the anode can be shortened in this way. The distance between the group 120 and the plated part 130 improves the symmetry of the anode group 120 and the plated part 130, and avoids the problem of discrete power lines;

Moreover, during the electroplating process, since the flow equalizer 110 is facing the side wall of the anode group 120, a plurality of flow equalization openings 112 are opened, and the plurality of flow equalization openings 112 communicate with the inner cavity of the flow equalizer 110, thereby making The electroplating solution in the flow equalizer 110 can evenly flow to the surface of the plated piece 130 through a plurality of flow equalizing ports 112, thus, the electroplating equipment 100 can evenly spray the plating solution, so that the plating solution is comprehensive and uniform cover plated part 130;

To sum up, during the use of the electroplating equipment 100, the plating solution can be evenly sprayed, so that the plating solution fully and uniformly covers the plated piece 130; , thereby shortening the distance between the anode group 120 and the plated piece 130, improving the symmetry of the anode group 120 and the plated piece 130, and avoiding the problem of discrete power lines.

Further, please refer to FIGS. 1-3 , based on the above-mentioned structural settings, in this embodiment, when setting the anode group 120, the anode group 120 includes one anode or multiple anodes arranged in an array, and the anode configuration has multiple Anode holes 121, and the anode can be an anode mesh or an anode plate; wherein, when the anode is an anode mesh, a plurality of anode holes 121 are opened for the anode, and the plurality of anode holes 121 are arranged in an array. Moreover, an anode shield is provided at the edge of the anode group 120 , and the anode shield is used to adjust the current density at the edge of the anode group 120 .

In addition, each anode hole 121 corresponds to one or more flow sharing ports 112, and the axis of each anode hole 121 is parallel to the axis of the corresponding flow sharing port 112, thereby avoiding that the holes of the anode plate or the anode mesh will not Disturbance of the flow out of the jet box.

It should be noted that, in the embodiment of the present utility model, firstly, the anode group 120 can include at least one anode, and when there are multiple anodes, each anode can input current independently, and the magnitude of the input current can be adjusted; Secondly, in the process of work, the current equalizer 110, the anode group 120 and the plated piece 130 are all installed in the electroplating tank, and if the plated piece is single-sided electroplating, then the method of installing an anode group 120 is adopted. If the plated piece For double-sided electroplating, two current equalizers 110 and anode groups 120 need to be installed.

Further, please refer to Fig. 1-Fig. 3, in this embodiment, when setting the flow equalizing port 112, in order to make the electroplating solution in the flow equalizing device 110 evenly flow to the plated piece through a plurality of flow equalizing ports 112 130, thus, a plurality of flow sharing ports 112 are arranged in an array. It should be noted that when opening the flow equalizing port 112, the area where the flow equalizing port 112 is opened in the current equalizer 110 is facing the plated part 130, and along the direction from the plated part 130 to the anode group 120, the plated part 130 is in the direction of the current equalizer 110. The projections above are all located in the area where the flow equalizer 110 is provided with the flow equalization opening 112, so that the flow equalizer 110 can fully cover the plating piece 130 during the spray flow process, thereby improving the electroplating quality.

Please refer to Fig. 1-Fig. 3, in the present embodiment, what adopted is to add the plating solution in the flow equalizer 110 by the liquid inlet 111, and in the process of adding plating solution in the flow equalizer 110, for So that the plating solution can be evenly exported from the even flow port 112, thus, the divider plate 113 is arranged in the flow balancer 110, and the divider plate 113 divides the inner cavity of the flow balancer 110 into a flow guide chamber 114 and a flow equalization chamber. The chamber 115 and the flow diversion chamber 114 are in communication with the flow equalization chamber 115 ; the liquid inlet 111 is in communication with the flow diversion chamber 114 , and the plurality of flow equalization ports 112 are all in communication with the flow equalization chamber 115 .

Through such an arrangement, the plating solution can be buffered and collected in the diversion chamber 114 when the plating solution is introduced into the flow equalizer 110 from the liquid inlet 111, so that the impact of the plating solution can be reduced, and thus the plating solution can be reduced. After the plating solution enters the flow equalization chamber 115 , it can be uniformly exported from the flow equalization port 112 .

Further, please refer to Fig. 1-Fig. 3, based on the arrangement of the above-mentioned dividing plate 113, in order to improve the uniformity of the spray flow of the plating solution, therefore, the dividing plate 113 is provided with a plurality of guide ports 116, and the plurality of guides The flow port 116 communicates the flow guide chamber 114 with the flow equalization chamber 115 . Moreover, a plurality of guide ports 116 are arranged in an array.

Through such an arrangement, the plating solution can be evenly introduced into the flow equalization chamber 115 from the flow guide chamber 114 and evenly exported from the flow equalization port 112 when the plating solution is introduced into the flow equalizer 110 from the liquid inlet 111; Here, such an arrangement can form multiple channels of equalizing flow guides, thereby improving the uniformity of the flow equalizer 110 in the process of spraying flow, thus enabling the flow equalizer 110 to be able to control the plating temperature during the process of spraying flow. The member 130 is fully covered, thereby improving the quality of electroplating.

Further, please refer to Fig. 1-Fig. 3, in this embodiment, when installing the partition plate 113, in order to make the plating solution in the flow guide chamber 114 be evenly introduced into the flow uniform chamber 115, so the partition The plate 113 is parallel to the side wall where the flow sharing opening 112 is disposed.

Such arrangement makes the distances from all the diversion openings 116 on the dividing plate 113 to the side wall where the flow equalization opening 112 is set consistent, thereby helping to improve the uniformity of the flow equalizer 110 in the spray flow process, thus This enables the flow equalizer 110 to completely cover the plating piece 130 during the spraying process, thereby improving the quality of electroplating.

To sum up, please refer to FIG. 1-FIG. 3. During the use of the electroplating equipment 100, the plating solution is added to the flow equalizer 110 through the liquid inlet 111, and the plating solution flows through the flow equalizer 110 after entering the flow equalizer 110. The flow guide chamber 114 and the flow equalization chamber 115, and when the flow guide chamber 114 flows into the flow equalization chamber 115 and is exported from the flow equalization chamber 115, the flow guide ports 116 arranged in an array and the even flow ports 116 arranged in an array Under the action of the orifice 112, two uniform jets can be formed, so that the electroplating equipment 100 can evenly spray the plating solution, so that the plating solution can cover the plating piece 130 comprehensively and uniformly;

And in the process of carrying out the electroplating process, the plating solution of the current equalizer 110 jet flow can pass through the anode net or the anode plate to reach the surface of the plated part 130, and because the current equalizer 110, the anode group 120 and the plated part 130 are arranged in sequence, thereby The anode group 120 is relatively located between the current equalizer 110 and the plated part 130, and the distance between the anode group 120 and the plated part 130 can be shortened in this way, the symmetry between the anode group 120 and the plated part 130 can be improved, and the occurrence of The problem of discrete power lines;

Therefore, the electroplating equipment 100 has the following advantages during use:

The plating solution can be sprayed evenly, so that the plating solution covers the plated piece 130 comprehensively and evenly; at the same time, since the anode set 120 is placed between the current equalizer 110 and the workpiece, the distance between the anode set 120 and the plated piece 130 can be shortened. The distance between them can improve the symmetry of the anode group 120 and the plating piece 130, and avoid the problem of discrete power lines.

The above are only preferred embodiments of the utility model, and are not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims (8)

1. An electroplating apparatus, characterized in that:

the electroplating equipment comprises a current equalizer, an anode group and a plating piece; the current equalizer, the anode group and the plating piece are sequentially arranged;

the flow equalizer is provided with a liquid inlet and a plurality of flow equalizing ports, the liquid inlet and the flow equalizing ports are communicated with the inner cavity of the flow equalizer, and the flow equalizing ports are positioned on the side wall of the flow equalizer, which is opposite to the anode group;

the anode group comprises one anode or a plurality of the anodes arranged in an array, the anodes being configured with a plurality of anode holes.

2. Electroplating apparatus according to claim 1, wherein:

the flow equalizing ports are arranged in an array mode.

3. Electroplating apparatus according to claim 1, wherein:

a separation plate is arranged in the flow equalizer, the separation plate separates the inner cavity of the flow equalizer into a flow guiding cavity and a flow equalizing cavity, and the flow guiding cavity is communicated with the flow equalizing cavity;

the liquid inlet is communicated with the flow guide cavity, and the flow equalizing ports are communicated with the flow equalizing cavity.

4. A plating apparatus according to claim 3, wherein:

the division plate is provided with a plurality of diversion ports, and the diversion ports are communicated with the diversion cavity and the flow equalizing cavity.

5. The plating apparatus as recited in claim 4, wherein:

the plurality of diversion openings are arranged in an array.

6. A plating apparatus according to claim 3, wherein:

the partition plate is parallel to the side wall provided with the flow equalizing port.

7. Electroplating apparatus according to any one of claims 1 to 6, wherein:

each anode hole corresponds to one or more of the flow equalizing ports, and the axis of each anode hole is parallel to the axis of the corresponding flow equalizing port.

8. Electroplating apparatus according to any one of claims 1 to 6, wherein:

the edge of the anode group is provided with an anode shielding, and the anode shielding is used for adjusting the edge current density of the anode group.

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