CN219203154U - Lead frame - Google Patents
Lead frame Download PDFInfo
- Publication number
- CN219203154U CN219203154U CN202320227714.0U CN202320227714U CN219203154U CN 219203154 U CN219203154 U CN 219203154U CN 202320227714 U CN202320227714 U CN 202320227714U CN 219203154 U CN219203154 U CN 219203154U
- Authority
- CN
- China
- Prior art keywords
- base island
- pin
- lead frame
- pins
- island
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 claims abstract description 13
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005452 bending Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 101100520142 Caenorhabditis elegans pin-2 gene Proteins 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The application provides a lead frame, comprising: the device comprises a base island, a first pin and a second pin; the top surface of the base island is used for arranging a chip; the first pin is connected with the edge of the base island into a whole; the second pin is separated from the base island and the first pin, and is connected with the chip in a bonding mode; the bottom surface of the base island is not higher than the bottom surfaces of the first pin and the second pin, and when in packaging, the bottom surface of the base island protrudes out of the bottom surface of the packaging body. And the heat dissipation effect of the semiconductor device is improved.
Description
Technical Field
The utility model belongs to the technical field of lead frame structures, and particularly relates to a lead frame.
Background
The semiconductor device is mainly formed by mounting an integrated circuit chip on a lead frame made of metal, and along with development of a high-power semiconductor device, the heat dissipation requirement of the semiconductor device is also higher, because the semiconductor device packages the chip of the integrated circuit in an insulating plastic or ceramic package, and thus the heat dissipation efficiency is difficult to further improve.
Disclosure of Invention
In order to solve the defects in the prior art, the utility model provides the lead frame which is beneficial to improving the heat dissipation effect of a semiconductor device.
In order to achieve the object of the utility model, the following scheme is adopted:
a lead frame, comprising: the device comprises a base island, a first pin and a second pin;
the top surface of the base island is used for arranging a chip;
the first pin is connected with the edge of the base island into a whole;
the second pin is separated from the base island and the first pin, and is connected with the chip in a bonding mode;
the bottom surface of the base island is not higher than the bottom surfaces of the first pin and the second pin, and when in packaging, the bottom surface of the base island protrudes out of the bottom surface of the packaging body.
Further, the edge of the top surface of the base island is provided with a flange protruding outwards, the flange extends to two sides of the first pin, and the flange is located inside the package body.
Further, the second pin is towards one end of the base island, a bending part is formed towards the top surface, and the chip is connected with the top surface of the bending part in a bonding mode.
Further, the first pins and the second pins are respectively two, the base island is in a diamond structure, the first pins are respectively positioned at two opposite ends of the base island, and the second pins are respectively positioned at two opposite sides of the base island.
Further, at least one through hole is formed in the base island.
Further, a through hole is arranged at the joint of the corresponding first pin and the base island.
Further, the bottom surface of the connection part of the first pin and the base island is provided with a plurality of clamping grooves, and the clamping grooves are positioned in the package body.
The utility model has the beneficial effects that: based on the semiconductor device formed by the lead frame according to the scheme, the bottom surface of the base island can be protruded out of the bottom surface of the packaging body, and the base island can directly radiate outwards, so that the radiating efficiency of the semiconductor device can be effectively improved.
Drawings
The drawings described herein are for illustration of selected embodiments only and not all possible implementations, and are not intended to limit the scope of the utility model.
Fig. 1 shows a schematic view of a preferred structure of the lead frame of the present application.
Fig. 2 shows a side view of a preferred structure of the base island and the second lead.
Figure 3 shows a partial cross-sectional view at A-A in figure 1.
Fig. 4 shows a schematic structural diagram of the present application when molded on a substrate.
The marks in the figure: island-1, flange-11, through hole-12, first pin-2, clamping groove-21, second pin-3.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the following detailed description of the embodiments of the present utility model will be given with reference to the accompanying drawings, but the described embodiments of the present utility model are some, but not all embodiments of the present utility model.
As shown in fig. 1, a lead frame includes: island 1, first pin 2 and second pin 3. The top surface of the base island 1 is used for arranging a chip, and the first pins 2 are connected with the edges of the base island 1 into a whole. The second pin 3 is separated from the base island 1 and the first pin 2, and the second pin 3 is connected with the chip in a bonding mode.
Specifically, the bottom surface of the base island 1 is not higher than the bottom surfaces of the first pin 2 and the second pin 3, that is, the bottom surface of the base island 1 and the bottom surfaces of the first pin 2 and the second pin 3 are in the same plane, or the bottom surface of the base island 1 is lower than the bottom surfaces of the first pin 2 and the second pin 3, and when in packaging, the bottom surface of the base island 1 protrudes out of the bottom surface of the packaging body, so that the bottom surface of the base island 1 is exposed outside the packaging body, and the heat dissipation effect is increased.
Preferably, as shown in fig. 1 and fig. 2, the edge of the top surface of the base island 1 is provided with a flange 11 protruding outwards, and the flange 11 extends to two sides of the first pin 2, and when in packaging, the flange 11 is positioned inside the packaging body so as to ensure the connection stability of the base island 1 on the packaging body.
More specifically, as shown in fig. 2, the second lead 3 faces one end of the base island 1, a bending portion 31 is formed toward the top surface, and the chip is connected to the top surface of the bending portion by bonding.
Preferably, as shown in fig. 1, the first pins 2 and the second pins 3 are two, and the base island 1 has a diamond structure, so that the base island 1 has a larger area, the heat dissipation efficiency is further increased, the first pins 2 are respectively located at two opposite ends of the base island 1, and the second pins 3 are respectively located at two opposite sides of the base island 1.
Preferably, as shown in fig. 1, at least one through hole 12 is formed on the base island 1, so that a connector is formed in the through hole 12, so as to further improve the connection stability of the base island 1 on the package.
Further preferably, as shown in fig. 1, a through hole 12 is provided at the connection position corresponding to the first lead 2 and the base island 1, so as to achieve the effect of fixing the base island 1 and the first lead 2 at the same time.
Preferably, as shown in fig. 3, the bottom surface of the connection part between the first pin 2 and the base island 1 has a plurality of clamping grooves 21, and the clamping grooves 21 are located inside the package body, so as to ensure the stability of the first pin 2 on the package body.
As shown in FIG. 4, a plurality of lead frames can be formed on the same substrate in a rectangular array manner during production, so as to improve the production efficiency, and the substrate is a copper sheet or an aluminum sheet.
The foregoing description of the preferred embodiments of the utility model is merely exemplary and is not intended to be exhaustive or limiting of the utility model. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model.
Claims (7)
1. A lead frame, comprising: the circuit comprises a base island (1), a first pin (2) and a second pin (3);
the top surface of the base island (1) is used for arranging a chip;
the first pins (2) are connected with the edges of the base island (1) into a whole;
the second pins (3) are arranged separately from the base island (1) and the first pins (2), and the second pins (3) are connected with the chip in a bonding mode;
the bottom surface of the base island (1) is not higher than the bottom surfaces of the first pin (2) and the second pin (3), and when in packaging, the bottom surface of the base island (1) protrudes out of the bottom surface of the packaging body.
2. A lead frame according to claim 1, characterized in that the edge of the top surface of the island (1) has outwardly protruding flanges (11), and that the flanges (11) extend to both sides of the first leads (2), the flanges (11) being located inside the package.
3. A lead frame according to claim 1, wherein the second leads (3) are formed with bent portions (31) toward the top surface toward one end of the base island (1), and the chip is connected to the top surface of the bent portions by bonding.
4. The lead frame according to claim 1, wherein the first pins (2) and the second pins (3) are two, the base island (1) is in a diamond structure, the first pins (2) are respectively located at two opposite ends of the base island (1), and the second pins (3) are respectively located at two opposite sides of the base island (1).
5. A lead frame according to claim 1, characterized in that the base island (1) is provided with at least one through hole (12).
6. A lead frame according to claim 5, characterized in that a through hole (12) is provided at the connection of the corresponding first pin (2) and the island (1).
7. A lead frame according to claim 1, wherein the bottom surface of the connection part of the first pin (2) and the base island (1) is provided with a plurality of clamping grooves (21), and the clamping grooves (21) are positioned inside the package body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320227714.0U CN219203154U (en) | 2023-02-16 | 2023-02-16 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320227714.0U CN219203154U (en) | 2023-02-16 | 2023-02-16 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219203154U true CN219203154U (en) | 2023-06-16 |
Family
ID=86720333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320227714.0U Active CN219203154U (en) | 2023-02-16 | 2023-02-16 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219203154U (en) |
-
2023
- 2023-02-16 CN CN202320227714.0U patent/CN219203154U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 629000 No. 88 Hedong Avenue, Shehong Economic Development Zone, Suining City, Sichuan Province Patentee after: Sichuan Fumeda Microelectronics Co.,Ltd. Country or region after: China Address before: 629000 No. 88 Hedong Avenue, Shehong Economic Development Zone, Suining City, Sichuan Province Patentee before: SICHUAN FUMEIDA MICROELECTRONIC CO.,LTD. Country or region before: China |
|
| CP03 | Change of name, title or address |