CN219088796U - Heat dissipation mechanism for semiconductor cooling and heating mattress - Google Patents

Abstract

The utility model relates to the technical field of cold and warm mattresses, in particular to a heat dissipation mechanism for a semiconductor cold and warm mattress, which comprises a support ring and a mattress, wherein the support ring is arranged at the bottom of the mattress, a plurality of heat dissipation fins are arranged around the bottom of the mattress in the support ring, one side of each heat dissipation fin is provided with a plurality of pipelines, each pipeline penetrates through the heat dissipation fins, a fixing device is arranged between the pipelines at one side of each heat dissipation fin, and one end of each pipeline is connected to the bottom of the mattress. The device has high practical value and is worth popularizing.

Description

Heat dissipation mechanism for semiconductor cooling and heating mattress

Technical Field

The utility model relates to the technical field of cold and warm mattresses, in particular to a heat dissipation mechanism for a semiconductor cold and warm mattress.

Background

Mattresses are an article of daily use between the human body and a bed used by people to obtain healthy and comfortable sleep, and are widely used. Traditional mattresses have a single function, typically employing a soft-textured foam or palm cushion to enhance sleep quality. In winter, in order to resist cold, people can use the electric blanket, the electric blanket heats through the electric heating element in the blanket mat, as long as the power supply is not cut off, the electric heating element can be always in a heating state, so that potential safety hazards exist, if a user forgets to turn off the power supply, accidents such as fire disaster and the like are easy to cause, and the electric blanket can generate certain radiation, so that the electric blanket is unfavorable for the use of crowds such as pregnant women and children. In addition, the electric blanket can only be used in cold weather to achieve the heating effect, and cannot be used for cooling in hot weather. Because the semiconductor refrigerating sheets are generated, the temperature of the mattress can be reduced without an air conditioner in summer, but the refrigerating speed of the semiconductor refrigerating sheets is very slow, so that the mattress can feel insufficient cold air in the mattress after being used for a long time.

Disclosure of Invention

The utility model aims to solve the defect that a semiconductor refrigerating sheet is slow in refrigerating speed in the prior art, so that the mattress can feel insufficient cold air in the mattress after being used for a long time, and provides a radiating mechanism for a semiconductor cold-warm mattress.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a cooling mechanism for semiconductor changes in temperature mattress, includes holding ring, mattress, the holding ring is installed mattress bottom, in the holding ring a plurality of fin are all installed all around the mattress bottom, a plurality of fin one side is provided with a plurality of pipelines, a plurality of the pipeline all runs through a plurality of the fin, a plurality of fin one side a plurality of be provided with fixing device between the pipeline, a plurality of pipeline one end all is connected to mattress bottom.

Preferably, the fixing device comprises a first clamping ring arranged at one side of the plurality of pipelines, a second clamping ring is arranged on the first clamping ring, and one section of the plurality of pipelines is positioned in the first clamping ring and the second clamping ring.

Preferably, the upper surfaces of the plurality of radiating fins are all provided with corrosion-resistant coatings.

Preferably, the surfaces and the inner walls of the pipelines are all provided with antioxidation treatment.

Preferably, the plurality of pipes between the plurality of heat radiating fins are welded to the plurality of heat radiating fins.

Preferably, the plurality of radiating fins are arranged at intervals, and the interval distance is not less than 0.5mm.

The heat dissipation mechanism for the semiconductor cooling and heating mattress has the beneficial effects that: the heat dissipation mechanism for the semiconductor cooling and heating mattress can rapidly adjust the temperature of the semiconductor refrigerating sheet at the bottom of the mattress by utilizing the heat dissipation mechanism to enable the interior of the mattress to dissipate heat or heat, so that the temperature of the mattress relative to the indoor temperature is in a low-temperature or high-temperature state, and people lying on the mattress are more comfortable.

Drawings

Fig. 1 is a front view of the whole heat dissipation mechanism for a semiconductor cooling and heating mattress according to the present utility model.

Fig. 2 is a front view, in cross section, of an overall heat dissipation mechanism for a semiconductor cool-warm mattress in accordance with the present utility model.

Fig. 3 is a schematic structural diagram of a heat dissipation mechanism in a heat dissipation mechanism for a semiconductor cooling and heating mattress according to the present utility model.

Fig. 4 is a schematic diagram of a heat dissipation mechanism for a semiconductor cooling and heating mattress according to the second embodiment of the present utility model.

In the figure: support ring 1, mattress 2, fin 3, pipeline 4, first rand 5, second rand 6.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Example 1

Referring to fig. 1-4, a heat dissipation mechanism for a semiconductor cooling and heating mattress comprises a support ring 1 and a mattress 2, wherein the support ring 1 is installed at the bottom of the mattress 2, a plurality of semiconductor refrigerating sheets are arranged in the mattress 2 and are all connected with a pipeline 4, a plurality of cooling fins 3 are all installed around the bottom of the mattress 2 in the support ring 1, a plurality of pipelines 4 are arranged on one side of the cooling fins 3, the pipelines 4 penetrate through the cooling fins 3, a fixing device is arranged between the pipelines 4 on one side of the cooling fins 3, and one ends of the pipelines 4 are all connected to the bottom of the mattress 2. The upper surfaces of the cooling fins 3 are provided with corrosion-resistant coatings, the surfaces and the inner walls of the pipelines 4 are provided with antioxidation treatment, the pipelines 4 between the cooling fins 3 are welded on the cooling fins 3, the cooling fins 3 are arranged at intervals, and the interval distance is not less than 0.5mm.

Through all being the interval setting between a plurality of fin 3, and interval distance is not less than 0.5mm, is even interval setting between a plurality of fin 3, lets the work efficiency of a plurality of fin 3 all can improve to let a plurality of fin 3 carry out radiating effect better to a plurality of 4.

Because fin 3 dispels the heat back to mattress 2 transfer, and be rich in steam in the air in addition, mattress 2 and cooling mechanism are connected the position and can condense and have the drop of water, these drops of water can attach on the pipeline 4 of mattress 2 bottom and cooling mechanism, and cooling mechanism is when not operating in addition, these drops of water can flow to fin 3 through the pipeline, let a plurality of pipelines 4 and a plurality of fin 3 receive the corruption, all be provided with corrosion-resistant coating through setting up a plurality of fin 3 upper surfaces, corrosion-resistant coating on a plurality of fin 3 is through chemical method with fin 3 surface formation of turning into nickel, a plurality of pipeline 4 surfaces and inner wall all are provided with oxidation resistance treatment, a plurality of pipeline surfaces and inner wall all form oxidation resistance film through the heat treatment nitriding treatment, thereby let the drop of water condensed in the air can not cause the influence to a plurality of fin 3 and a plurality of pipeline 4.

The temperature of the semiconductor refrigerating sheets at the bottom of the mattress 2 is quickly adjusted by the heat dissipation mechanism, so that the interior of the mattress dissipates heat or heats up, and the temperature of the mattress relative to the indoor temperature is in a low-temperature or high-temperature state, so that people lying on the mattress are more comfortable.

Example 2

Optimizing on the basis of the embodiment 1, referring to fig. 1-4, the fixing device comprises a first clamping ring 5 arranged on one side of a plurality of pipelines 4, a second clamping ring 6 is arranged on the first clamping ring 5, and a section of the pipelines 4 is positioned in the first clamping ring 5 and the second clamping ring 6; the first collar 5 is detachably connected with the second collar 6 via bolts.

Through setting up first rand 5 and second rand 6 and fixing a plurality of pipelines 4, let the range between a plurality of pipelines 4 more neat, make heat dissipation mechanism wholly install behind mattress 2 bottom, heat dissipation mechanism occupy the volume and reduce to can reduce the volume of holding circle 1, thereby reduce the holistic weight of heat dissipation mechanism and mattress 2.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims (6)

1. The utility model provides a cooling mechanism for semiconductor changes in temperature mattress, includes holding ring (1), mattress (2), its characterized in that, holding ring (1) is installed mattress (2) bottom, in holding ring (1) a plurality of fin (3) are all installed all around mattress (2) bottom, a plurality of fin (3) one side is provided with a plurality of pipeline (4), a plurality of pipeline (4) all run through a plurality of fin (3), a plurality of fin (3) one side a plurality of be provided with fixing device between pipeline (4), a plurality of pipeline (4) one end all be connected to mattress (2) bottom.

2. The heat dissipation mechanism for a semiconductor cooling and warming mattress according to claim 1, wherein the fixing device comprises a first clamping ring (5) arranged on one side of a plurality of the pipelines (4), a second clamping ring (6) is arranged on the first clamping ring (5), and a section of the pipelines (4) is located in the first clamping ring (5) and the second clamping ring (6).

3. The heat dissipation mechanism for a semiconductor cooling and heating mattress according to claim 1, wherein the upper surfaces of a plurality of the heat dissipation fins (3) are provided with corrosion-resistant coatings.

4. The heat dissipation mechanism for a semiconductor cooling and warming mattress according to claim 1, wherein the surfaces and the inner walls of the plurality of pipes (4) are provided with antioxidation treatment.

5. A heat dissipation mechanism for a semiconductor cooling and warming mattress according to claim 1, characterized in that a number of the pipes (4) between a number of the heat dissipation fins (3) are welded to a number of the heat dissipation fins (3).

6. The heat dissipation mechanism for the semiconductor cooling and heating mattress according to claim 1, wherein a plurality of heat dissipation fins (3) are arranged at intervals, and the interval distance is not less than 0.5mm.

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