CN219085951U - Automatic semiconductor carrying device - Google Patents
Automatic semiconductor carrying device Download PDFInfo
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- CN219085951U CN219085951U CN202320114710.1U CN202320114710U CN219085951U CN 219085951 U CN219085951 U CN 219085951U CN 202320114710 U CN202320114710 U CN 202320114710U CN 219085951 U CN219085951 U CN 219085951U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides an automatic semiconductor carrying device, comprising: at least two guide rails forming a conveying channel; a plurality of energizing coils mounted on at least two guide rails; the magnetic element is arranged between the at least two guide rails and magnetically matched with the plurality of energized coils; the connecting seat is connected with the magnetic element; the wafer transfer box is arranged on the connecting seat and is used for loading wafers; wherein, on each guide rail, the magnetic field direction formed by a plurality of energizing coils is the same. The utility model has the advantages of high transmission speed and stable transmission.
Description
Technical Field
The utility model relates to the field of semiconductors, in particular to an automatic semiconductor conveying device.
Background
In an existing FAB (FOUP) FAB, FOUP (Front Opening Unified Pod ) is moved to different locations or stations of the FAB along installed rails by a handling system/overhead travelling crane system.
However, the existing system has the problems of relatively slow transmission speed, mechanism abrasion and the like in the transmission process. Therefore, there is a need for improvement.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present utility model is to provide an automatic semiconductor handling device for solving the problem of slow semiconductor transfer speed in the prior art.
To achieve the above and other related objects, the present utility model provides an automatic semiconductor handling device comprising:
at least two guide rails forming a conveying channel;
a plurality of energizing coils mounted on at least two of the guide rails;
a magnetic element arranged between at least two guide rails, the magnetic element magnetically cooperating with a plurality of energized coils;
the connecting seat is connected with the magnetic element;
the wafer conveying box is arranged on the connecting seat and is used for loading wafers;
and the magnetic fields formed by the energizing coils are in the same direction on each guide rail.
In one embodiment of the present utility model, on two guide rails of one of the conveying paths, a magnetic field formed on one of the guide rails is opposite to a magnetic field formed on the other guide rail.
In one embodiment of the present utility model, each end of the magnetic element includes a south pole and a north pole, the south pole and the north pole of each end of the magnetic element are symmetrical about the axis of the magnetic element, and the magnetic poles at both ends of the magnetic element are arranged in a central symmetry manner.
In an embodiment of the present utility model, on the conveying path formed by the two guide rails, when the magnetic element is in a stationary state, a magnetic field direction of each end of the magnetic element is the same as a magnetic field direction of the conveying path at the same end position of the magnetic element.
In an embodiment of the present utility model, on the conveying channel formed by the two guide rails, when the magnetic element is in a moving state, a magnetic field direction of a first end of the magnetic element is the same as a magnetic field direction of the conveying channel at a position of the first end of the magnetic element, and a magnetic field direction of a second end of the magnetic element is opposite to a magnetic field direction of the conveying channel at a position of the second end of the magnetic element.
In an embodiment of the present utility model, two of the guide rails are in a shape of a straight line segment, and the two guide rails are arranged in parallel to form a conveying channel of the straight line segment.
In an embodiment of the present utility model, two of the guide rails have an arc shape, and the concave portions of the two guide rails face to the same side, so as to form an arc-shaped conveying channel.
In one embodiment of the present utility model, the conveying passage is formed by connecting the guide rail in a straight line section shape and the guide rail in an arc shape.
In an embodiment of the utility model, the automatic semiconductor handling device further includes a plurality of position sensors, and the plurality of position sensors are mounted on the conveying channel to detect the positions of the magnetic elements.
In an embodiment of the utility model, the semiconductor automatic handling device further includes a static electricity dissipating plate disposed between the connection base and the wafer cassette.
As described above, the automatic semiconductor handling device of the present utility model has the following advantages: the current direction and the current magnitude in the electrified coil can be changed to change the moving speed and the moving direction of the magnetic element and the wafer conveying box, and the magnetic element and the wafer conveying box have the advantages of high transmission speed and stable transmission.
Drawings
Fig. 1 is a schematic view showing a structure of an automatic semiconductor handling device according to the present utility model.
Fig. 2 is a plan view showing a stationary state of a magnetic element in the automatic semiconductor handling device of the present utility model.
Fig. 3 is a top view showing a first moving state of a magnetic element in the automatic semiconductor handling device according to the present utility model.
Fig. 4 is a plan view showing a second moving state of the magnetic element in the semiconductor automatic transfer device according to the present utility model.
Fig. 5 is a plan view showing a guide rail in the automatic semiconductor conveying device of the present utility model.
Description of element reference numerals
10. A guide rail; 11. a first track; 12. a second track; 13. a third track; 14. a fourth track; 15. a fifth track; 20. a power-on coil; 21. a current control part; 30. a magnetic element; 40. a connecting seat; 50. a wafer transfer box; 60. an electrostatic dissipation plate; 70. a position sensor.
Detailed Description
Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. It is also to be understood that the terminology used in the examples of the utility model is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the utility model. The test methods in the following examples, in which specific conditions are not noted, are generally conducted under conventional conditions or under conditions recommended by the respective manufacturers.
Please refer to fig. 1 to 5. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the utility model, are not intended to be critical to the essential characteristics of the utility model, but are intended to fall within the spirit and scope of the utility model. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the utility model, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the utility model may be practiced.
Referring to fig. 1 to 5, the present utility model provides an automatic semiconductor handling device, which can be applied to a semiconductor manufacturing factory for handling, and can be widely used as a main force handling device of a FAB (wafer Foundry). The automatic conveying device can be used for conveying the wafer box (FOUP, front Opening Unified Pod, front opening wafer transfer box) in the process area and also can be used for conveying the wafer box in the process area or the factory to realize loading and conveying of the wafer box. The present utility model is improved for improving the transport efficiency of the wafer cassette, and is described in detail below by way of specific examples.
Referring to fig. 1, 2 and 3, the present utility model provides an automatic semiconductor handling device, which may include a guide rail 10, an energizing coil 20, a magnetic element 30, a connection base 40 and a wafer cassette 50. The number of the guide rails 10 may be at least two, wherein two guide rails 10 may form a conveying channel. The number of the energizing coils 20 may be plural, and the plural energizing coils 20 may be mounted on at least two guide rails 10. The energizing coil 20 is mounted on the guide rail 10 to form an energizing solenoid, the energizing solenoid corresponds to a bar magnet externally, and a magnetic field outside the energizing solenoid is similar to that of the bar magnet. The magnetic element 30 may be arranged between two rails 10 with a gap between the magnetic element 30 and the two rails 10. The magnetic element 30 and the plurality of energizing coils 20 are magnetically matched, that is, the magnetic element 30 can move on the conveying channel formed by the two guide rails 10 under the action of the magnetic field formed by the plurality of energizing coils 20. On each guide rail 10, the direction of the magnetic field formed by the plurality of energizing coils 20 may be the same as the arrangement direction of the guide rails 10, so that the magnetic element 30 may drive the connecting seat 40 and the wafer cassette 50 to continuously move on the conveying channel. The current direction in the energizing coil 20 is synchronously changed at the same end position of the magnetic element 30 on the two guide rails 10 of a conveying path. Specifically, at the leading end position in the advancing direction of the magnetic element 30, the current direction in the energizing coil 20 is synchronously changed to exert an attracting effect on the magnetic element 30. At the trailing end position of the advancing direction of the magnetic element 30, the current direction in the energizing coil 20 is synchronously changed to repel the magnetic element 30. The connection base 40 may be connected to the magnetic device 30, and the connection base 40 may be used as a mounting body of the wafer cassette 50. The wafer cassette 50 is connected to the connection base 40, and the wafer cassette 50 can be used as a mounting body for wafers. The cassette 50 is a container used in semiconductor processes for protecting, transporting, and storing wafers, and can accommodate 25 wafers of 300mm inside, and its main component is a front opening container capable of accommodating 25 wafers and an open front door frame dedicated container, which is an important transfer container dedicated to an automated transfer system in a 12 inch (300 mm) wafer factory.
Referring to fig. 2, 3, 4 and 5, in some embodiments, the number of the guide rails 10 may be two, and the two guide rails 10 may have a straight line shape. The two guide rails 10 may be arranged in parallel to form a straight-line section of the transfer path so that the connection base 40 and the wafer cassette 50 are transported in a straight line. For another example, the number of the guide rails 10 may be two, and the two guide rails 10 may have arc shapes with different radii. The concave openings of the two guide rails 10 may be disposed toward the same side, that is, the centers of the two guide rails 10 are located at the same point at this time, so as to form a conveying channel of an arc section, so that the connection seat 40 and the wafer cassette 50 perform curved transportation. The number of the guide rails 10 may be more than three, wherein a section of conveying passage is formed between every two guide rails 10, and a plurality of guide rails 10 may form a conveying passage composed of a straight line section and an arc section. For example, in fig. 3, the guide rail 10 may include a first rail 11, a second rail 12, a third rail 13, a fourth rail 14, and a fifth rail 15. The first rail 11 and the second rail 12 form a conveying channel of a first straight line segment, and the first rail 11 and the third rail 13 form a conveying channel of a second straight line segment. The fourth rail 14 and the fifth rail 15 are each arc-shaped, and when the recess openings of the fourth rail 14 and the recess openings of the fifth rail 15 face the same side, the fourth rail 14 and the fifth rail 15 form a conveying path of an arc-shaped section. And because the fourth track 14 is connected with the third track 13, the fifth track 15 is connected with the second track 12, so that the conveying channel of the arc section is connected between the conveying channel of the first straight line section and the conveying channel of the second straight line section, and the conveying channel can be in a Y-shaped structure as a whole.
Referring to fig. 1, 2 and 3, in some embodiments, the direction of the magnetic field formed by the plurality of energizing coils 20 on each guide rail 10 may be the same as the arrangement direction of the guide rails 10. For example, when the two guide rails 10 are in the shape of a straight line segment, the two guide rails 10 form a straight line segment conveying path. At this time, the directions of the magnetic fields formed by the plurality of energizing coils 20 may be the same on each guide rail 10, that is, the plurality of energizing coils 20 may be equivalent to a plurality of bar magnets arranged along a straight line segment at this time, and the directions of the magnetic fields formed by the plurality of bar magnets equivalent to the plurality of energizing coils 20 may be the same. When the two guide rails 10 are in the shape of an arc segment, the two guide rails 10 form an arc segment conveying path. At this time, on each guide rail 10, the direction of the magnetic field formed by the plurality of energizing coils 20 is the same as the arrangement direction of the guide rail 10, that is, the plurality of energizing coils 20 may be equivalently arranged as a plurality of bar magnets along the arc section at this time, and the direction of the magnetic field formed by the plurality of bar magnets equivalent to the plurality of energizing coils 20 is the same as the arrangement direction of the guide rail 10. Under the action of the magnetic fields formed by the plurality of energizing coils 20, the magnetic element 30 can move on the conveying channel formed by the two guide rails 10, so that the magnetic element 30 can drive the connecting seat 40 and the wafer transfer box 50 to continuously move on the conveying channel.
Referring to fig. 1, 2 and 3, in some embodiments, since the magnitude of the current in the energizing coil 20 and the direction of the current can be changed in real time, the magnetic element 30 can have different structures, and the magnetic element 30 can be a permanent magnet. The arrangement of the poles of the magnetic element 30 can have a variety of configurations. For example, when the two guide rails 10 are in the shape of straight line segments, the energizing coils 20 on the two guide rails 10 are symmetrically arranged with each other, and the directions in which the plurality of energizing coils 20 on the two guide rails 10 form the magnetic field are the same. In this case, the magnetic element 30 may be a bar magnet, one end of the magnetic element 30 is an S pole (south pole), and the other end of the magnetic element 30 is an N pole (north pole). In fig. 2 and 3, the energizing coils 20 on the two guide rails 10 are arranged symmetrically to each other in a section of the conveying path. However, the direction of the current in the energizing coils 20 on the two rails 10 is opposite, i.e. the direction in which the energizing coils 20 on the first rail 11 form a magnetic field is opposite to the direction in which the energizing coils 20 on the second rail 12 form a magnetic field. At this time, the magnetic element 30 may be a bar magnet, one end of the magnetic element 30 includes an S pole and an N pole, the S pole and the N pole at one end of the magnetic element 30 are symmetrical with respect to the axis of the magnetic element 30, the S pole and the N pole at the other end of the same magnetic element 30 are symmetrical with respect to the axis of the magnetic element 30, and the magnetic poles (S pole and N pole) at both ends of the magnetic element 30 are integrally formed in a central symmetrical shape.
Referring to fig. 2, in some embodiments, when the magnetic poles (S-pole and N-pole) at both ends of the magnetic element 30 are in a central symmetrical shape, the N-pole at the first end on the left side of the magnetic element 30 corresponds to the N-pole of one energizing coil 20 on the first track 11, and like magnetic poles repel each other. The first end S pole on the left side of the magnetic element 30 corresponds to the S pole of one energized coil 20 on the second track 12, with like poles repelling each other. The second pole S on the right side of the magnetic element 30 corresponds to the pole S of an energized coil 20 on the first track 11, with like poles repelling each other. The second end N pole on the right side of the magnetic element 30 corresponds to the N pole of one of the energized coils 20 on the second rail 12, with like poles repelling each other. When the force applied to the first end on the left side of the magnetic element 30 is balanced with the force applied to the second end on the right side of the magnetic element 30, the magnetic element 30 is in a stationary state, and the corresponding magnetic element 30 drives the connecting seat 40 and the conveying and conveying device 50 to be located at an initial position, an end position or reach a destination.
Referring to fig. 1 and 2, in some embodiments, since the number of wafers in the pod 50 is variable, the weight of the connecting base 40 is fixed, and the weight of the connecting base 40 and the pod 50 as a whole is variable. Therefore, the current value range in the power coil 20 should be changed correspondingly by combining the gravity of the whole connecting seat 40 and the wafer cassette 50. For example, the distance between the two guide rails 10 may be 0.4m to 0.6m, the length of the magnetic element 30 may be selected to be 0.2m to 0.3m, the width of the magnetic element 30 may be selected to be 0.2m to 0.3m, and the interval of the energizing coils 20 may be 0.2mm to 0.3mm. The speed of the magnetic element 30 between the two guide rails 10 can be controlled between 0m/s and 5m/s, the magnitude of the current in the energizing coil 20 is related to the magnetic field strength of the magnetic element 30, and the switching frequency of the current in the energizing coil 20 can be between 0Hz and 20Hz. It is possible to realize the connection base 40 and the wafer cassette 50 to be transferred at a speed of 0km/h to 18km/h (5 m/s).
Referring to fig. 2 and 3, in some embodiments, when the poles (S-pole and N-pole) at both ends of the magnetic element 30 are integrally formed in a central symmetrical shape. When the force applied to the first end of the magnetic element 30 is smaller than the force applied to the second end of the magnetic element 30, the energizing coils 20 on the first rail 11 and the second rail 12 on the right side of the magnetic element 30 attract the magnetic element 30, so that the magnetic element 30 moves in the direction of the second end on the right side. When the force applied to the first end of the left side of the magnetic element 30 is greater than the force applied to the second end of the right side of the magnetic element 30, the energizing coils 20 on the first rail 11 and the second rail 12 on the left side of the magnetic element 30 attract the magnetic element 30, so that the magnetic element 30 moves leftwards. By changing the direction and magnitude of the current in the energizing coils 20 on the first rail 11 and the second rail 12, it is possible to drive the magnetic element 30 in different directions and at different speeds, and to stay the magnetic element 30 at a certain position of the conveying path.
Referring to fig. 2 and 3, in some embodiments, when the force applied to the first end of the magnetic element 30 is smaller than the force applied to the second end of the magnetic element 30, the energizing coils 20 on the first rail 11 and the second rail 12 on the right side of the magnetic element 30 attract the magnetic element 30, so that the magnetic element 30 moves in the direction of the second end on the right side. For example, in fig. 3, the first end N pole on the left side of the magnetic element 30 corresponds to the N pole of one of the energizing coils 20 on the first track 11, with like poles repelling each other. The first end S pole on the left side of the magnetic element 30 corresponds to the S pole of one energized coil 20 on the second track 12, with like poles repelling each other. The second end S pole on the right side of the magnetic element 30 corresponds to the N pole of one of the energizing coils 20 on the first track 11, and the opposite poles attract each other. The second end N pole on the right side of the magnetic element 30 corresponds to the S pole of one energized coil 20 on the second track 12, with opposite poles attracting each other. The energizing coils 20 on the first rail 11 and the second rail 12 on the left side of the magnetic element 30 repel the magnetic element 30, and the energizing coils 20 on the first rail 11 and the second rail 12 on the right side of the magnetic element 30 attract the magnetic element 30, so that the magnetic element 30 moves in the direction of the second ends of the first rail 11 and the second rail 12 along the right side of the magnetic element 30.
Referring to fig. 2 and 4, in some embodiments, when the force applied to the first end of the magnetic element 30 is greater than the force applied to the second end of the magnetic element 30, the energizing coils 20 on the first rail 11 and the second rail 12 on the left side of the magnetic element 30 attract the magnetic element 30, so that the magnetic element 30 moves in the direction of the first end on the left side. For example, in fig. 4, the first end N pole on the left side of the magnetic element 30 corresponds to the S pole of one energizing coil 20 on the first track 11, and the opposite poles attract each other. The first end S pole on the left side of the magnetic element 30 corresponds to the N pole of one of the energizing coils 20 on the second track 12, and the opposite poles attract each other. The second pole S on the right side of the magnetic element 30 corresponds to the pole S of an energized coil 20 on the first track 11, with like poles repelling each other. The second end N pole on the right side of the magnetic element 30 corresponds to the N pole of one of the energized coils 20 on the second rail 12, with like poles repelling each other. The energizing coils 20 on the first rail 11 and the second rail 12 on the left side of the magnetic element 30 attract the magnetic element 30, and the energizing coils 20 on the first rail 11 and the second rail 12 on the right side of the magnetic element 30 repel the magnetic element 30, so that the magnetic element 30 moves in the direction of the first ends of the first rail 11 and the second rail 12 on the left side of the magnetic element 30.
Referring to fig. 2, 3 and 4, in some embodiments, the magnetic element 30 in fig. 2 is in a stationary state, i.e. the magnetic element 30 drives the connecting base 40 and the wafer cassette 50 to be in a stationary state. The movement of the magnetic element 30 toward the second right end of the magnetic element 30 in fig. 3 indicates that the magnetic element 30 moves the connecting base 40 and the wafer cassette 50 toward the second right end of the magnetic element 30. The movement of the magnetic element 30 toward the left first end in fig. 4 shows that the magnetic element 30 moves the connecting base 40 and the wafer cassette 50 toward the left first end of the magnetic element 30. A plurality of energizing coils 20 are connected to a current control member 21 in a conveyance path formed by the first rail 11 and the second rail 12. By changing the magnitude and direction of the current in the energized coils 20 in the first rail 11 and the second rail 12, it is achieved that the magnetic element 30 is in a forward, reverse or stationary state. On the conveying channel, the connecting seat 40 and the wafer conveying box 50 are moved in an electromagnetic driving mode, so that the problem of contact abrasion among components in a transmission system can be solved. When the magnetic element 30 is moving, the energizing coil 20 at the position of the magnetic element 30 is energized, and the energizing coil 20 in the advancing direction of the moving path of the magnetic element 30 is energized, so that the automatic semiconductor conveying device has the function of saving energy. On the conveying channel formed by the first track 11 and the second track 12, the moving speed and the moving direction of the magnetic element 30 can be changed by changing the current direction and the current magnitude in the energizing coil 20, and the conveying device has the advantages of high conveying speed and stable conveying.
Referring to fig. 5, in some embodiments, the fourth track 14 and the fifth track 15 have an arc-shaped section structure, and the fourth track 14 and the fifth track 15 form a conveying channel with an arc-shaped section. On the conveying path in which the fourth rail 14 and the fifth rail 15 form an arc segment, the energizing coils 20 are arranged along the paths of the fourth rail 14 and the fifth rail 15. At the position of one energizing coil 20 on the fourth track 14 or the fifth track 15, the direction in which the energizing coil 20 forms a magnetic field is the same as the tangential direction of the fourth track 14 or the fifth track 15 at this point. The movement of the magnetic element 30 still satisfies the driving conditions in fig. 2, 3 and 4 by selecting a section on the fourth track 14 or the fifth track 15. In addition, a position sensor 70 may be mounted on the guide rail 10, for example, a position sensor 70 may be mounted on the third rail 13, and the position sensor 70 may be used to detect position information of the connection base 40 and the pod 50. The position sensor 70 may be an infrared distance measuring sensor, which is a sensor for measuring the distance of an obstacle using the principle of infrared reflection. The infrared distance measuring sensor detects the distance of the obstacle by utilizing the principle that the infrared signals meet the difference of the distance of the obstacle and the reflected infrared signals have different intensities. The position sensor 70 confirms the position information of the connection base 40 and the pod 50, and then transmits the position information to the current control unit 21. The current control part 21 can control the motion state of the magnetic element 30 by changing the current magnitude and current direction in the energized coils 20 at different positions on the conveying channel according to the position information of the connecting seat 40. The magnetic element 30 may drive the connecting base 40 and the wafer cassette 50 to move forward, backward or still in a forward, backward or still state on the conveying path.
Referring to fig. 1, in some embodiments, the automatic semiconductor handling device further includes a static electricity eliminating plate 60, wherein the static electricity eliminating plate 60 is installed between the connection base 40 and the wafer cassette 50. The longitudinal section of the connecting seat 40 may be concave, the whole wafer transfer box 50 may be rectangular, and an electrostatic dissipation plate 60 may be disposed between the outer wall of the wafer transfer box 50 and the inner wall of the connecting seat 40. The guide rail 10 and the energizing coil 20 may be disposed at a top position of the magnetic element 30, the current control part 21 may be disposed at a top position of the guide rail 10 and the energizing coil 20, and the magnetic element 30 may be disposed at a top position of the connection seat 40. When the connecting seat 40 is in a concave shape, the opening of the concave portion of the connecting seat 40 can face to the right lower side. The electrostatic dissipative material has a surface resistivity of less than 1 x 10 4 Ω/m 2 Or volume resistivity of not more than 1X 10 3 Omega cm, the use of this material prevents electrostatic effects on wafers in FOUPs (Front Opening Unified Pod, front opening pods).
In summary, the present utility model provides an automatic semiconductor transporting device, which can change the moving speed and moving direction of a magnetic element by changing the current direction and the current magnitude in an energizing coil on a transporting channel formed by a first track and a second track, and has the advantages of fast transporting speed and stable transporting. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. An automatic semiconductor handling device, comprising:
at least two guide rails forming a conveying channel;
a plurality of energizing coils mounted on at least two of the guide rails;
a magnetic element arranged between at least two guide rails, the magnetic element magnetically cooperating with a plurality of energized coils;
the connecting seat is connected with the magnetic element;
the wafer conveying box is arranged on the connecting seat and is used for loading wafers;
and the magnetic fields formed by the energizing coils are in the same direction on each guide rail.
2. The automated semiconductor handling device of claim 1, wherein the direction of the magnetic field formed on one of the rails is opposite to the direction of the magnetic field formed on the other rail on both of the rails of one of the conveyor lanes.
3. The automated semiconductor handling device of claim 2, wherein each end of the magnetic element comprises a south pole and a north pole, the south pole and the north pole of each end of the magnetic element being symmetrical about an axis of the magnetic element, the poles of the two ends of the magnetic element being arranged in a central symmetry.
4. The automated semiconductor handling device according to claim 3, wherein a direction of a magnetic field at each end of the magnetic element is the same as a direction of a magnetic field of the transport path at the same end position of the magnetic element when the magnetic element is in a stationary state on the transport path formed by the two guide rails.
5. The automated semiconductor handling device of claim 3, wherein the direction of the magnetic field at the first end of the magnetic element is the same as the direction of the magnetic field at the first end of the magnetic element in the transport path formed by the two guide rails when the magnetic element is in the moving state, and the direction of the magnetic field at the second end of the magnetic element is opposite to the direction of the magnetic field at the second end of the magnetic element in the transport path.
6. The automated semiconductor handling device of claim 1, wherein two of the rails are in the shape of straight sections, the two rails being arranged in parallel to form a straight section conveyor path.
7. The automated semiconductor handling device of claim 1, wherein the two rails are arcuate in shape with the recesses of the two rails opening to the same side to form an arcuate shaped transport path.
8. The automated semiconductor handling device of claim 1, wherein the transport path is formed by connecting the guide rail having a straight line segment shape and the guide rail having an arc shape.
9. The automated semiconductor handling device of claim 1, further comprising a plurality of position sensors mounted on the transport path to detect the position of the magnetic element.
10. The automated semiconductor handling device of claim 1, further comprising a static dissipative plate disposed between the connection base and the wafer cassette.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320114710.1U CN219085951U (en) | 2023-01-13 | 2023-01-13 | Automatic semiconductor carrying device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320114710.1U CN219085951U (en) | 2023-01-13 | 2023-01-13 | Automatic semiconductor carrying device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219085951U true CN219085951U (en) | 2023-05-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320114710.1U Active CN219085951U (en) | 2023-01-13 | 2023-01-13 | Automatic semiconductor carrying device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219085951U (en) |
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2023
- 2023-01-13 CN CN202320114710.1U patent/CN219085951U/en active Active
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