CN219068743U - Heat dissipation type metal base - Google Patents
Heat dissipation type metal base Download PDFInfo
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- CN219068743U CN219068743U CN202222939652.4U CN202222939652U CN219068743U CN 219068743 U CN219068743 U CN 219068743U CN 202222939652 U CN202222939652 U CN 202222939652U CN 219068743 U CN219068743 U CN 219068743U
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Abstract
The utility model discloses a heat dissipation type metal base which comprises a base, filling blocks and a substrate. The filling block is filled in the groove, the top end of the filling block is flush with the upper edge of the groove or is attached to the inner side surface of the groove, and the depth of the groove is smaller than the thickness of the base. The substrate is a rectangular plate with a plurality of filling blocks on the surface, and the filling blocks and the substrate are made of graphene. According to the heat dissipation type metal base, the graphene filling blocks are filled in the grooves of the heat dissipation type metal base, and the heat dissipation efficiency of the base is improved by utilizing the characteristics of good heat resistance and plasticity of graphene and using the combination of the metal base and the graphene to conduct passive heat dissipation. In addition, after the components are connected, damage caused by overheat of the components is avoided. And a reticular structure is formed in the groove by using the filling blocks, so that the contact area of the metal base is reinforced to perform passive heat dissipation. Increasing the heat conduction efficiency.
Description
Technical Field
The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation type metal base.
Background
Along with the acceleration of manufacturing, the heat dissipation technology is applied to a plurality of electronic components production lines, and operators pay attention to the heat dissipation efficiency in the electronic components production process gradually, and in the heat dissipation process of the traditional metal base, people design a heat dissipation type metal base, and the heat dissipation efficiency of the traditional metal base is lower, the heat dissipation capacity is weaker, and the operation is more complicated.
The existing metal base heat dissipation in the market is guided by adopting an air cooling mode, so that the heat dissipation efficiency in the prior art is lower.
Disclosure of Invention
The embodiment of the utility model provides a heat dissipation type metal base, which aims to solve the problem of low heat dissipation rate of the metal base.
The embodiment of the utility model provides a heat dissipation type metal base, which comprises a base, a filling block and a substrate.
The filling block is filled in the groove, the top end of the filling block is flush with the upper edge of the groove or is attached to the inner side surface of the groove, and the depth of the groove is smaller than the thickness of the base.
The substrate is a rectangular plate with a plurality of filling blocks on the surface, and the filling blocks and the substrate are made of graphene.
The heat dissipation type metal base is characterized in that the base is a copper alloy base.
And the height of the filling block is not greater than the depth of the groove.
The depth of the groove is 25-45 micrometers.
The heat dissipation type metal base is characterized in that the height of the base is larger than the thickness of the filling block, and the height of the base is not smaller than 60 micrometers.
The depth of the groove is the same as the width of the filling block, and the width of the filling block is 14-30 micrometers.
The heat dissipation type metal base is characterized in that the height of the substrate is not more than 10 microns, and the substrate is attached to the upper end of the heat dissipation type metal base.
The heat dissipation type metal base is characterized in that the width of the single filling block arranged on the bottom surface of the substrate is 25 micrometers, and the single filling block is attached to the groove.
Compared with the prior art, the utility model has the following advantages:
according to the heat dissipation type metal base, the good heat dissipation effect of graphene is utilized, the graphene filling blocks are filled in the grooves of the heat dissipation type metal base, and the characteristics of good heat resistance and plasticity of graphene are utilized, so that the metal base and the graphene are combined to conduct passive heat dissipation, and the heat dissipation efficiency of the base is improved.
In addition, the utility model discloses a heat dissipation type metal base is when being connected with other industry components and parts that generate heat, after connecting components and parts, avoids components and parts overheated and causes the harm. And a reticular structure is formed in the groove by using the filling blocks, so that the contact area between the filling blocks and the metal base is increased to carry out passive heat dissipation. The efficiency of heat conduction is increased.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a heat dissipation type metal base according to an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of an inner base of a heat dissipation type metal base according to an embodiment of the present utility model;
fig. 3 is another schematic structural diagram of a heat dissipation type metal base according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a heat dissipation type metal base according to an embodiment of the present utility model.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
In the embodiment of the present utility model, please refer to fig. 1 and 2, as shown in fig. 1 and 2, a heat dissipation type metal base includes a base 12, a filling block 11, and a substrate 14.
The surface of the base is provided with a netlike groove 13, the tail end of the groove 13 penetrates through the side wall of the base, and the base 12 is a metal base.
The filling block 11 is filled in the groove 13, the top end of the filling block 11 is flush with the upper edge of the groove 13 or is attached to the inner side surface of the groove 13, and the depth of the groove 13 is smaller than the thickness of the base 12.
Specifically, the end of the groove 13 penetrates through the side wall of the base 12 to form a crossed netlike heat dissipation structure.
Further, the base 12 forms a cross-web heat dissipation structure of the grooves 13 after laser engraving or chemical etching.
The substrate 14 is a rectangular plate with a plurality of filling blocks 11 on the surface, and the filling blocks 11 and the substrate 14 are made of graphene.
Specifically, the filling block 11 is a graphene filling block, the graphene material is a two-dimensional carbon nanomaterial, the heat resistance is good, and the upper limit of the heat resistance is 300 ℃. After the grooves 13 are filled, the heat resistance is reduced, the heat exchange efficiency of the base 12 is improved, and the base is free from falling off, yellowing and cracking after long-term use.
Furthermore, compared with other heat dissipation materials and other heat conduction coatings, the graphene heat dissipation material also has good mechanical properties, excellent corrosion resistance, environmental protection and no toxicity, and ensures efficient heat dissipation.
Further, the bottom surface of the base 12 may be adhered to the surface of a chip base (not shown), so that the heat dissipation metal base can rapidly dissipate heat of the chip disposed on the chip base, and heat dissipation performance is improved; or the chip is adhered to the bottom surface of the base 12, so that the heat dissipation performance is improved by directly and rapidly dissipating the heat of the chip through the heat dissipation type metal base.
In an embodiment of the present utility model, please refer to fig. 1 and 2, as shown in fig. 1 and 2, the heat dissipation type metal base is shown, wherein the base 12 is a copper alloy base.
Specifically, the base 12 is a copper alloy base, and the copper alloy has good high strength and thermal conductivity, also has a certain corrosion resistance, can rapidly remove heat and exchange heat in the process of heat dissipation, and is efficient and safe in the industrial processing and installation processes.
In the embodiment of the present utility model, referring to fig. 1 and 2, as shown in fig. 1 and 2, the height of the filling block 11 is not greater than the depth of the groove 13.
In the embodiment of the present utility model, referring to fig. 1 and 2, as shown in fig. 1 and 2, the depth of the groove 13 is 25-45 micrometers.
Specifically, the height of the filling block 11 is greater than the width of the filling block 11, and by increasing the depth of the filling block 11, the overall sectional area of the filling block 11 is increased, so that the heat dissipation performance is improved.
Further, the height of the filling block 11 is not greater than the depth of the groove. When the height of the filling block 11 is set to be not more than the depth of the groove 13, the height of the filling block 11 is 10-45 μm.
Further, the vertical cross-sectional area of the contact between the two is determined by setting the depth of the groove 13 and the height of the filling block 11, so as to improve the heat dissipation efficiency of the vertical cross-section.
In an embodiment of the present utility model, referring to fig. 1 and 2, as shown in fig. 1 and 2, the height of the base 12 is greater than the thickness of the filling block 11, and the height of the base 12 is not less than 60 micrometers.
Specifically, after the filling blocks 11 are filled in the base 12, a cuboid structure is formed, and the height of the base 12 is higher than that of the filling blocks 11, so that a plurality of filling blocks 11 can be placed, the contact area between the base 12 and the filling blocks 11 is increased, and the heat dissipation performance is further improved.
In the embodiment of the present utility model, referring to fig. 1 and 2, as shown in fig. 1 and 2, the depth of the groove 13 is the same as the width of the filling block 11, and the width of the filling block 11 is 14-30 micrometers. The grooves 13 are arranged in a manner as shown in fig. 2, and the grooves 13 shown in fig. 2 are not filled with the filling blocks 11.
In an embodiment of the present utility model, please refer to fig. 1 and 2, as shown in fig. 1 and 2, the height of the substrate is not greater than 10 μm.
Specifically, the height of the substrate is not greater than 10 micrometers, so that the contact area with the groove 13 in the vertical direction can be further increased, and the heat dissipation performance of the vertical section of the base 12 can be improved.
In the embodiment of the present utility model, please refer to fig. 1 and 2, as shown in fig. 1 and 2, the heat dissipation type metal base is shown, wherein the width of the filling block 11 is 25 μm.
In a specific embodiment, referring to fig. 3 and fig. 4, as shown in fig. 3 and fig. 4, the thickness of the substrate 14 is 1/3-1/2 of the height of the filling block 11, the substrate 14 covers the upper end of the base 12, and the contact area between the substrate 14 and the base 12 and the filling block 11 is increased. The height of the substrate 14 is not more than 10 micrometers, and the height of the substrate 14 can be 0.1-0.5 micrometers.
Specifically, the substrate 14 is covered on the surface of the base 12 by pressing or plating, so as to increase the contact area between the base 12 and the substrate 14, and further improve the overall heat dissipation performance.
Further, after the substrate 14 is covered, the overall thickness of the heat dissipation type metal base is increased, and the heat dissipation efficiency is also increased.
Further, the substrate may be a graphene layer 15, forming a film-like structure or a sandwich structure. The sandwich structure is that a graphene layer 15 is covered on the surface of the heat dissipation type metal base by pressing (a machine pressing mode), and the membranous structure is that the graphene layer 15 or a coating mode is covered on the surface of the heat dissipation type metal base, and the scheme sets the two structures to be 0.1-0.5 microns.
According to the heat dissipation type metal base, the good heat dissipation effect of graphene is utilized, the graphene filling blocks are filled in the grooves of the heat dissipation type metal base, and the characteristics of good heat resistance and plasticity of graphene are utilized, so that the metal base and the graphene are combined to conduct passive heat dissipation, and the heat dissipation efficiency of the base is improved.
In addition, the utility model discloses a heat dissipation type metal base is when being connected with other industry components and parts that generate heat, after connecting components and parts, avoids components and parts overheated and causes the harm. And a reticular structure is formed in the groove by using the filling blocks, so that the contact area between the filling blocks and the metal base is increased to carry out passive heat dissipation. The efficiency of heat conduction is increased.
While the utility model has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.
Claims (8)
1. The heat dissipation type metal base is characterized by comprising a base, a filling block and a substrate;
the surface of the base is provided with a netlike groove, and the tail end of the groove penetrates through the side wall of the base; the base is a metal base;
the filling block is filled in the groove, the top end of the filling block is flush with the upper edge of the groove or is attached to the inner side surface of the groove, and the depth of the groove is smaller than the thickness of the base;
the substrate is a rectangular plate with a plurality of filling blocks on the surface, and the filling blocks and the substrate are made of graphene.
2. The heat sink type metal base of claim 1, wherein the base is a copper alloy base.
3. The heat dissipating metal base of claim 1, wherein the height of the filler block is no greater than the depth of the groove.
4. The heat sink type metal base of claim 1, wherein the depth of the groove is 25-45 microns.
5. The heat dissipating metal base of claim 1, wherein the height of the base is greater than the thickness of the filler block and the height of the base is no less than 60 microns.
6. The heat dissipating metal base of claim 5, wherein the depth of the groove is the same as the width of the filler block and the filler block has a width of 14-30 microns.
7. The heat sink type metal base according to claim 5, wherein the height of the substrate is not more than 10 μm, and the substrate is attached to an upper end of the heat sink type metal base.
8. The heat dissipation type metal base as set forth in claim 7, wherein the width of the single filling block on the bottom surface of the substrate is 25 microns, and the single filling block is attached to the inside of the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222939652.4U CN219068743U (en) | 2022-11-04 | 2022-11-04 | Heat dissipation type metal base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222939652.4U CN219068743U (en) | 2022-11-04 | 2022-11-04 | Heat dissipation type metal base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219068743U true CN219068743U (en) | 2023-05-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222939652.4U Active CN219068743U (en) | 2022-11-04 | 2022-11-04 | Heat dissipation type metal base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219068743U (en) |
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2022
- 2022-11-04 CN CN202222939652.4U patent/CN219068743U/en active Active
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