CN218982148U - Adhesive removing device for patch diode - Google Patents
Adhesive removing device for patch diode Download PDFInfo
- Publication number
- CN218982148U CN218982148U CN202222724007.0U CN202222724007U CN218982148U CN 218982148 U CN218982148 U CN 218982148U CN 202222724007 U CN202222724007 U CN 202222724007U CN 218982148 U CN218982148 U CN 218982148U
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- Prior art keywords
- diode
- plate
- extension board
- rod
- rigid coupling
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- 239000000853 adhesive Substances 0.000 title claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 9
- 230000007246 mechanism Effects 0.000 claims abstract description 24
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 12
- 230000001105 regulatory effect Effects 0.000 claims description 16
- 230000008878 coupling Effects 0.000 claims description 15
- 238000010168 coupling process Methods 0.000 claims description 15
- 238000005859 coupling reaction Methods 0.000 claims description 15
- 238000003825 pressing Methods 0.000 claims description 13
- 230000000694 effects Effects 0.000 claims description 5
- 239000003292 glue Substances 0.000 abstract description 13
- 230000005540 biological transmission Effects 0.000 description 3
- 238000007790 scraping Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Coating Apparatus (AREA)
Abstract
The utility model relates to the technical field of adhesive removing of a patch diode, and discloses an adhesive removing device of a patch diode. The driving mechanism can drive the scraper to move downwards, when the scraper moves to the surface of the diode, the adjusting plate is held by hands to move back and forth, so that adhesive residual glue on the diode can be removed in a short time, the photoresist removing efficiency is greatly improved, the diode can be rapidly clamped by two symmetrically distributed clamping mechanisms in an elastic mode, the diode can be prevented from loosening, and the diode can be prevented from being damaged due to overlarge instant clamping force.
Description
Technical Field
The utility model relates to the technical field of adhesive removal of a patch diode, in particular to an adhesive removal device of a patch diode.
Background
The chip diode is also called a crystal diode, and is called a diode for short, and packaging is an important work in the production process of the diode, because packaging can play roles in fixing, sealing, protecting diode performance and the like, in the packaging process of a product, glue injection action is required to be carried out on the product, and residual glue is inevitably generated on the surface of the diode in the glue injection process, so that timely photoresist removal is required, thereby ensuring the cleanliness of the surface of the diode, and facilitating the next process.
When the existing photoresist removing device is used, residual photoresist attached to a diode is difficult to remove in a short time, the photoresist removing efficiency is not high enough, and the existing diode is clamped in a rigid clamping mode before photoresist removing, so that the diode is damaged when the instant clamping force is too large.
Disclosure of Invention
The utility model aims to provide a patch diode glue removing device for solving the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a paster diode gumming device, includes the workstation, the front surface rigid coupling of workstation has the controller, and the vertical rigid coupling in top both sides edge of workstation has first extension board and second extension board respectively, the spout has all been seted up to the inside of first extension board and second extension board, install drive mechanism between first extension board and the second extension board, drive mechanism includes the regulating plate, the slider, the threaded rod, the installing frame, fastening rod and scraper, the both ends of regulating plate all rigid coupling has the slider, and the inside activity of regulating plate runs through there is the threaded rod, the bottom rigid coupling of regulating plate has the installing frame, the bottom thread bush of threaded rod is equipped with the fastening rod, the bottom rigid coupling of fastening rod has the scraper, clamping mechanism is all installed on first extension board and the second extension board.
Optionally, the fastening rod movably penetrates through the mounting frame, the fastening rod is of a cuboid structure, and the threaded rod is rotatably connected with the adjusting plate through a bearing.
Optionally, regulating plate movable mounting is between first extension board and second extension board, and slider sliding connection is in the inside of spout.
Optionally, fixture includes electric putter, backing plate, spring, flexible post, clamp plate and antislip strip, and electric putter's one end rigid coupling has the backing plate, is connected with two springs on the backing plate, and still movable grafting has two flexible posts on the backing plate, and two spring's one end is connected with the clamp plate, and the equidistance rigid coupling has multiunit antislip strip on the inner wall of clamp plate.
Optionally, one ends of the two telescopic columns are fixedly connected to the pressing plate, and the base plate and the pressing plate are located above the workbench.
Optionally, the fixed end of the electric putter is fixedly connected to the first support plate, and the telescopic end of the electric putter is fixedly connected to the backing plate.
Compared with the prior art, the utility model has the beneficial effects that:
1. the transmission mechanism can drive the scraper to move downwards, when the scraper moves to the surface of the diode, the adjusting plate is held by hands to move back and forth, so that adhesive residual glue on the diode can be removed in a short time, the photoresist removing efficiency is greatly improved, and the downward movement amount of the scraper can be accurately controlled under the action of the threaded rod, so that the scraper can be flexibly adjusted according to the actual residual glue thickness, and the application range is improved.
2. The diode can be clamped fast by the two clamping mechanisms which are symmetrically distributed in an elastic mode, the diode can be prevented from loosening, the diode can be prevented from being damaged due to overlarge clamping force in the moment, and the diode clamping device is easy to use in practice.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a patch diode glue removing device according to the present utility model;
FIG. 2 is a schematic diagram of a driving mechanism of a paster diode photoresist remover according to the present utility model;
fig. 3 is a schematic structural view of a clamping mechanism in a patch diode glue removing device according to the present utility model.
In the figure: 1. a work table; 11. a controller; 2. a first support plate; 3. a second support plate; 4. a chute; 5. a transmission mechanism; 51. an adjusting plate; 52. a slide block; 53. a threaded rod; 54. a mounting frame; 55. a fastening rod; 56. a scraper; 6. a clamping mechanism; 61. an electric push rod; 62. a backing plate; 63. a spring; 64. a telescopic column; 65. a pressing plate; 66. an anti-slip strip.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 3, the utility model provides a patch diode photoresist remover, which comprises a workbench 1, wherein a controller 11 is fixedly connected to the front surface of the workbench 1, a first support plate 2 and a second support plate 3 are vertically and fixedly connected to the edges of two sides of the top of the workbench 1, and sliding grooves 4 are formed in the first support plate 2 and the second support plate 3.
The clamping mechanisms 6 are arranged on the first support plate 2 and the second support plate 3, the two clamping mechanisms 6 are symmetrically distributed, each clamping mechanism 6 comprises an electric push rod 61, a base plate 62, a spring 63, telescopic columns 64, a pressing plate 65 and anti-slip strips 66, one end of each electric push rod 61 is fixedly connected with the base plate 62, two springs 63 are connected to the base plate 62, two telescopic columns 64 are movably inserted into the base plate 62, one ends of the two springs 63 are connected with the pressing plate 65, a plurality of groups of anti-slip strips 66 are fixedly connected to the inner wall of the pressing plate 65 at equal intervals, one ends of the two telescopic columns 64 are fixedly connected to the pressing plate 65, the base plate 62 and the pressing plate 65 are located at the position above the workbench 1, the fixed end of each electric push rod 61 is fixedly connected to the first support plate 2, the telescopic ends of each electric push rod 61 are fixedly connected to the base plate 62, the two symmetrically distributed clamping mechanisms 6 can clamp a diode in an elastic mode rapidly, the diode can be prevented from loosening, the diode can be prevented from being damaged due to overlarge clamping force in the moment, and the diode is easy to be practically used.
Working principle: when the device is used, the diode is placed between the two clamping mechanisms 6, the part, needing to be removed, of the diode is located under the scraping knife 56, at the moment, the two electric push rods 61 are controlled to stretch through the controller 11, at the moment, the two base plates 62 can be driven to move relatively after moving relatively, after the anti-slip strips 66 are contacted with two sides of the diode, the springs 63 can deform along with continuous stretching of the two electric push rods 61, the diode is finally clamped, the two clamping mechanisms 6 in symmetrical distribution can clamp the diode rapidly in an elastic mode, the diode is prevented from being loose, the phenomenon that the diode is damaged due to excessive clamping force in the moment can be prevented, the device is easy to be used in practice, then the threaded rod 53 is held to rotate positively, at the moment, the fastening rod 55 and the scraping knife 56 can be driven to move continuously downwards, after the scraping knife 56 moves to an ideal position, the adjusting plate 51 can be driven to move forwards and backwards at the moment, the glue removing work is completed, the transmission mechanism 5 can be driven to move downwards, the scraper 56 can be held by hand to move to the ideal position, the thickness can be adjusted to the position of the scraper 56 in a short time, the device can be adjusted to remove the glue by the thickness of the device, and the diode can be adjusted flexibly and the thickness can be adjusted to be removed in a short time, the device can be adjusted to the position by the thickness of the device to be used for removing the diode by the diode.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a paster diode gumming device, includes workstation (1), its characterized in that, the front surface rigid coupling of workstation (1) has controller (11), and the vertical rigid coupling in top both sides edge of workstation (1) has first extension board (2) and second extension board (3) respectively, spout (4) have all been seted up to the inside of first extension board (2) and second extension board (3), install drive mechanism (5) between first extension board (2) and second extension board (3), drive mechanism (5) include regulating plate (51), slider (52), threaded rod (53), installing frame (54), fastening rod (55) and scraper (56), the both ends of regulating plate (51) all rigid coupling have slider (52), and the inside activity of regulating plate (51) runs through there is threaded rod (53), the bottom rigid coupling of regulating plate (51) has installing frame (54), the bottom thread bush of threaded rod (53) is equipped with fastening rod (55), the bottom rigid coupling of fastening rod (55) has scraper (56), all fixture (6) are installed on first extension board (2) and second extension board (3).
2. The adhesive removing device for the surface-mounted diode according to claim 1, wherein the fastening rod (55) movably penetrates through the mounting frame (54), the fastening rod (55) is of a cuboid structure, and the threaded rod (53) is rotatably connected with the adjusting plate (51) through a bearing.
3. A paster diode photoresist stripper according to claim 1, characterized in that the adjusting plate (51) is movably mounted between the first support plate (2) and the second support plate (3), and the sliding block (52) is slidingly connected inside the sliding groove (4).
4. The patch diode photoresist removing device according to claim 1, wherein the clamping mechanism (6) comprises an electric push rod (61), a base plate (62), springs (63), telescopic columns (64), a pressing plate (65) and a plurality of anti-slip strips (66), wherein one end of the electric push rod (61) is fixedly connected with the base plate (62), two springs (63) are connected to the base plate (62), two telescopic columns (64) are movably inserted on the base plate (62), one end of each of the two springs (63) is connected with the pressing plate (65), and a plurality of groups of anti-slip strips (66) are fixedly connected to the inner wall of the pressing plate (65) at equal intervals.
5. A paster diode photoresist stripper according to claim 4, wherein one end of two said telescopic columns (64) are fixedly connected to the pressing plate (65), and the backing plate (62) and the pressing plate (65) are located above the workbench (1).
6. The device according to claim 4, wherein the fixed end of the electric push rod (61) is fixedly connected to the first support plate (2), and the telescopic end of the electric push rod (61) is fixedly connected to the backing plate (62).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222724007.0U CN218982148U (en) | 2022-10-17 | 2022-10-17 | Adhesive removing device for patch diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222724007.0U CN218982148U (en) | 2022-10-17 | 2022-10-17 | Adhesive removing device for patch diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218982148U true CN218982148U (en) | 2023-05-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222724007.0U Active CN218982148U (en) | 2022-10-17 | 2022-10-17 | Adhesive removing device for patch diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218982148U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116511121A (en) * | 2023-06-30 | 2023-08-01 | 苏州双远电子科技有限公司 | Automatic photoresist remover for photovoltaic diode |
-
2022
- 2022-10-17 CN CN202222724007.0U patent/CN218982148U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116511121A (en) * | 2023-06-30 | 2023-08-01 | 苏州双远电子科技有限公司 | Automatic photoresist remover for photovoltaic diode |
| CN116511121B (en) * | 2023-06-30 | 2023-09-15 | 苏州双远电子科技有限公司 | Automatic photoresist remover for photovoltaic diode |
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