CN218976842U - Electronic equipment - Google Patents

Abstract

The application discloses electronic equipment includes: the device comprises a frame body, a first circuit board, a second circuit board and a loudspeaker; the first circuit board is connected to the frame body, the second circuit board is connected to one side of the first circuit board, which is away from the frame body, and the first circuit board and the second circuit board are enclosed to form a cavity; the loudspeaker comprises a front end and a rear end which are oppositely arranged; the rear end is at least partially embedded in the cavity and is communicated with the cavity; the first circuit board is provided with a mounting hole at a position corresponding to the front end, and the front end passes through the mounting hole to be connected with the frame body.

Description

Electronic equipment

Technical Field

The application belongs to the technical field of electronic equipment, and particularly relates to electronic equipment.

Background

With the rapid development of electronic technology, electronic devices such as mobile phones and tablet computers are increasingly powerful. For example, the electronic device housing is provided with dual speakers to achieve a stereo effect. In a specific application, a stereo effect in a specific scene is achieved by configuring one speaker at the bottom and top of the electronic device.

At present, a speaker assembly at the top of an electronic device is fixed on a frame body by adopting a mounting bracket, and a sealed cavity is formed by the mounting bracket and the frame body or a circuit board and is used as a rear sound cavity of the speaker assembly. However, this solution requires a larger cavity to be reserved to play the speaker performance, and the larger cavity occupies the space inside the electronic device, which affects the device layout on the back of the electronic device. Moreover, the whole electronic equipment is thick and heavy, and the use experience of a user is affected.

Disclosure of Invention

The application aims at providing electronic equipment, and at least solves one of the problems that a loudspeaker assembly at the top of the electronic equipment needs to reserve a larger cavity volume to occupy the space inside the electronic equipment, influence the device layout at the back of the electronic equipment, and cause the whole weight of the electronic equipment to influence the use experience of a user in the related art.

In order to solve the technical problems, the application is realized as follows:

the embodiment of the application provides electronic equipment, which comprises: the device comprises a frame body, a first circuit board, a second circuit board and a loudspeaker;

the first circuit board is connected to the frame body, the second circuit board is connected to one side of the first circuit board, which is away from the frame body, and the first circuit board and the second circuit board are enclosed to form a cavity;

the loudspeaker comprises a front end and a rear end which are oppositely arranged;

the rear end is at least partially embedded in the cavity and is communicated with the cavity;

the front end penetrates through the mounting hole to be connected with the frame body.

In the embodiment of the application, through wearing to locate first circuit board with the speaker, the front end and the framework of speaker are connected to fix the speaker on the framework, first circuit board and second circuit board set up in the same side of framework, enclose by first circuit board and second circuit board and close and form the cavity, the rear end of speaker is located the cavity at least partially, the rear end and the cavity intercommunication of speaker to regard the cavity as the back sound chamber of speaker. Therefore, the gap space between the two circuit boards can be effectively utilized as a rear sound cavity of the loudspeaker, the problem that the large cavity is reserved to occupy the internal space of the electronic equipment is avoided, and the influence on the device layout on the back of the electronic equipment is reduced. Meanwhile, compared with the prior art, the electronic equipment has the advantages that the internal space of the electronic equipment occupied by the mounting bracket is saved, the light and thin electronic equipment is facilitated, and the use experience of a user is improved.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, wherein:

fig. 1 is a schematic structural view of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic structural view of an electronic device in the related art;

FIG. 3 is a schematic view of a partial structure of a main circuit board in the related art;

FIG. 4 is a schematic view of a partial structure of a back face of a frame according to an embodiment of the present application;

fig. 5 is a schematic view of a partial structure of a front face of a frame according to an embodiment of the present application.

Reference numerals:

10. a frame; 101. a second groove; 102. a sound outlet hole; 103. a mounting groove; 104. a sound outlet hole; 11. a first circuit board; 111. a mounting hole; 12. a second circuit board; 121. a circuit board body; 122 a connection portion; 13. a speaker; 131. a rear end; 132. a front end; 14. a cavity; 15. sealing the connection member; 16. a display module; 17. a gap; 18. a sealing layer; 20. a mounting bracket; 21. a main circuit board; 210. a through hole; 211. a sealing region; 22. sealing foam.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functionality throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The features of the terms "first", "second", and the like in the description and in the claims of this application may be used for descriptive or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

Before explaining the electronic device provided by the embodiment of the present utility model, an application scenario of the electronic device provided by the embodiment of the present utility model is specifically explained:

speakers in existing electronic devices are generally classified into closed speakers, semi-open speakers, and the like. In order to improve the internal space utilization rate of electronic devices, currently, semi-open speakers or open speakers are mostly used in electronic devices. However, with the semi-open speaker or the open speaker, since the rear sound cavity of the speaker extends to the rear cover of the electronic device, when the speaker is operated, air in the rear sound cavity pushes the rear cover, resulting in vibration of the rear cover, and thus a user experience is deteriorated. For this reason, in the related art, a mounting bracket is used to mount and fix a speaker, and a rear sound cavity of the speaker is formed by the mounting bracket and a frame body or a circuit board of the electronic device, so that the mounting bracket is used to isolate a rear cover from the speaker, thereby avoiding vibration of the rear cover caused by the operation of the speaker.

Referring to fig. 2 and 3, fig. 2 shows a schematic structural view of an electronic device in the related art, and fig. 3 shows a schematic partial structural view of a main circuit board in the related art.

As shown in fig. 2, the related art electronic device includes a frame 10, a mounting bracket 20, a main circuit board 21 (Printed Circuit Board, PCB) and a speaker 13, the main circuit board 21 is connected to the frame 10, and the mounting bracket 20 is disposed on a side of the main circuit board 21 facing away from the frame 10. The side of the mounting bracket 20 facing the main circuit board 21 is provided with a concave cavity, and the concave cavity and the circuit board are enclosed to form a closed cavity. The main circuit board 21 is provided with a through hole 210, and the speaker 13 is arranged in the through hole 210 in a penetrating way, wherein the speaker 13 comprises a front end and a rear end which are oppositely arranged, and the rear end of the speaker 13 is at least partially positioned in the cavity, so that a rear sound cavity of the speaker 13 is formed by the cavity.

The main circuit board 21 and the frame 10 are sealed by a sealing foam 22, and the mounting bracket 20 and the main circuit board 21 are also sealed by the sealing foam 22. As shown in fig. 3, in order to achieve a sealed connection between the mounting bracket 20 and the main circuit board 21, a sealing region 211 is provided around the through hole 210 at a side of the main circuit board 21 facing the mounting bracket 20, and the mounting bracket 20 is sealed and connected to the sealing region 211 of the main circuit board 21 by a sealing foam 22.

However, in the electronic device of the related art, the mounting bracket 20 and the main circuit board 21 are adopted to enclose the rear sound cavity of the speaker 13, so that a larger cavity volume is required to be set for playing the performance of the speaker 13, and therefore, a larger space is required to be reserved in the electronic device for setting the mounting bracket 20 and the speaker 13, which occupies the space inside the electronic device, and affects the layout of devices on the back of the electronic device. Meanwhile, since a special sealing area 211 is required to be arranged on the main circuit board 21 for sealing connection with the mounting bracket 20, the effective layout area on the main circuit board 21 is occupied, and the layout of devices on the main circuit board 21 is affected. In addition, the mounting bracket 20 with the concave cavity is required to be arranged in the electronic equipment, so that the thickness of the electronic equipment is large, and the use experience of a user is affected.

In order to solve the above-mentioned problems, an embodiment of the present application provides an electronic device, and in the following, the electronic device provided in the embodiment of the present application is described in detail by a specific embodiment and an application scenario thereof with reference to the accompanying drawings.

As shown in fig. 1, an electronic device according to some embodiments of the present application includes: a frame 10, a first circuit board 11, a second circuit board 12, and a speaker 13; the first circuit board 11 is connected to the frame 10, the second circuit board 12 is connected to one side of the first circuit board 11 away from the frame 10, and the first circuit board 11 and the second circuit board 12 enclose to form a cavity; the speaker 13 includes a rear end 131 and a front end 132 disposed opposite each other; the rear end 131 is at least partially embedded in the cavity 14, and the rear end 131 is communicated with the cavity 14; the first circuit board 11 is provided with a mounting hole 111 at a position corresponding to the front end 132, and the front end 132 is connected to the housing 10 through the mounting hole 111.

In this embodiment, through wearing the speaker 13 through the first circuit board 11, the front end 132 of the speaker 13 is connected with the frame 10 to fix the speaker 13 on the frame 10, the first circuit board 11 and the second circuit board 12 are disposed on the same side of the frame 10, the first circuit board 11 and the second circuit board 12 enclose to form the cavity 14, the rear end 131 of the speaker 13 is at least partially located in the cavity 14, and the rear end 131 of the speaker 13 is communicated with the cavity 14 to use the cavity 14 as a rear sound cavity of the speaker 13. Therefore, the gap space between the two circuit boards can be effectively utilized as the back sound cavity of the loudspeaker 13, the problem that the large cavity is reserved to occupy the internal space of the electronic equipment is avoided, and the influence on the device layout on the back of the electronic equipment is reduced. Meanwhile, compared with the prior art, the electronic equipment has the advantages that the internal space of the electronic equipment occupied by the mounting bracket is saved, the light and thin electronic equipment is facilitated, and the use experience of a user is improved.

Specifically, the circuit board includes a frame 10, one side of the frame 10 is connected with a first circuit board 11, the first circuit board 11 is connected with the frame 10 in a sealing manner, a second circuit board 12 is disposed on one side of the first circuit board 11 facing away from the frame 10, and at least a part of the first circuit board 11 and the second circuit board 12 are in a gap, so that a hollow cavity 14 can be formed by enclosing the first circuit board 11 and the second circuit board 12.

It may be appreciated that the electronic device in the embodiment of the present utility model may include: electronic devices provided with speakers 13, such as cell phones, computers, game consoles, smart watches, etc.

The first circuit board 11 is provided with a mounting hole 111, and a speaker 13 is inserted into the mounting hole 111. The speaker 13 may include a rear end 131 and a front end 132 disposed opposite to each other, where the front end 132 of the speaker 13 is connected to the frame 10 to mount and fix the speaker 13 on the frame 10, and the rear end 131 of the speaker 13 is at least partially located in the cavity 14, so that the rear end 131 communicates with the cavity 14, and thus the cavity 14 formed by the enclosed first circuit board 11 and the enclosed second circuit board 12 may be used as a rear sound cavity of the speaker 13.

In this embodiment, the first circuit board 11 and the second circuit board 12 are connected in a sealing manner, the first circuit board 11 is connected with the frame 10 in a sealing manner, and the front end 132 of the speaker 13 is connected with the frame 10 in a sealing manner, so that a sealed back sound cavity of the speaker 13 can be formed through the frame 10, the first circuit board 11 and the second circuit board 12. Wherein the gap between the first circuit board 11 and the second circuit board 12 is utilized as a part of the rear sound cavity of the speaker 13.

In the electronic device, a screen and a rear cover are generally included, and the speaker 13 is disposed between the screen and the rear cover, wherein an end of the speaker 13 facing the screen is a front end 132 of the speaker 13, and an end of the speaker 13 facing the rear cover is a rear end 131 of the speaker 13. The sound cavity in the electronic device that communicates with the rear end 131 of the speaker 13 is a rear sound cavity, and the sound cavity that communicates with the front end 132 of the speaker 13 is a front sound cavity.

In a specific application, the peripheral edge of the second circuit board 12 can be connected with the first circuit board 11, so that a cavity 14 is formed between the second circuit board 12 and the first circuit board 11, and therefore, positions corresponding to the cavity 14 on the first circuit board 11 and the second circuit board 12 can be used for laying out other electronic devices, so that a piece-layout gap space between the two circuit boards can be effectively utilized, the occupied space of the loudspeaker 13 is reduced, and the influence of a rear sound cavity provided with the loudspeaker 13 on the device layout on the back of the electronic device is reduced.

In addition, compared with the mode of forming the rear sound cavity by adopting the mounting bracket in the related art, in the embodiment of the utility model, because the mounting bracket is not required to be used, a larger space is reserved in the back space of the electronic equipment for arranging the second circuit board 12, so that the layout space of the second circuit board 12 can be increased, the volume of the cavity 14 formed between the first circuit board 11 and the second circuit board 12 can be enlarged, the volume of the rear sound cavity of the loudspeaker 13 can be enlarged, the performance of the loudspeaker 13 can be effectively improved, and the sound effect of the loudspeaker 13 can be improved.

In some embodiments, in the embodiments of the present application, the cavity 14 formed by enclosing the first circuit board 11 and the second circuit board 12 is used to form a back sound cavity of the speaker 13, the volume of the back sound cavity may reach 2 cubic centimeters, and the volume of the back sound cavity formed by the mounting bracket and the main circuit board in the related technology is only 0.5 cubic centimeter, so that by adopting the technical scheme in the embodiments of the present application, the volume of the back sound cavity may be greatly increased, and the performance of the speaker 13 is improved. Meanwhile, the occupation of the mounting bracket on the effective cloth area of the circuit board is reduced, so that the cloth area of the circuit board with the thickness of 300mm2 can be increased at least.

Alternatively, the first circuit board 11 and the second circuit board 12 are fixed by soldering. In the embodiment of the application, the first circuit board 11 and the second circuit board 12 can be welded and fixed by using a patch, so that the connection firmness of the first circuit board 11 and the second circuit board 12 is improved. Meanwhile, the sealing connection between the first circuit board 11 and the second circuit board 12 can be realized by using a patch welding mode, so that the sealing effect of the rear sound cavity of the formed loudspeaker 13 is improved, and the noise problem caused by poor sealing of the rear sound cavity is reduced.

It can be appreciated that in the embodiment of the present application, the first circuit board 11 and the second circuit board 12 are fixed by soldering via a patch, so that the sealing connection between the first circuit board 11 and the second circuit board 12 can be realized, and the sealing performance of the cavity 14 formed between the first circuit board 11 and the second circuit board 12 can be improved.

Compared with the sealing connection between the mounting bracket and the main circuit board realized by the sealing foam 22 in the related art, the patch welding is adopted in the application, so that the sealing reliability of the rear sound cavity can be improved, the performance of the loudspeaker 13 is improved, the use of the sealing foam 22 can be reduced, and the production material cost can be saved.

The surface assembly technology (Surface Mounted Technology, SMT) may be used to implement the patch welding between the first circuit board 11 and the second circuit board 12, and the patch welding process between the first circuit board 11 and the second circuit board 12 may be referred to the patch welding process in the related art, which is not described herein in detail.

In some embodiments, as shown in fig. 1, the second circuit board 12 may include a circuit board body 121 and a connection portion 122, where the connection portion 122 is disposed at a peripheral edge of the circuit board body 121, and a first groove is formed by enclosing the connection portion 122 and the circuit board body 121, and a side of the connection portion 122 away from the circuit board body 121 is connected to the first circuit board 11. So that the cavity 14 is defined by the circuit board body 121, the connection portion 122 and the first circuit board 11.

In some embodiments, the circuit board body 121 and the connecting portion 122 may be in a split structure, the circuit board body 121 may be a circuit board, and the connecting portion 122 may be made of a polymer material.

The structure of the connecting portion 122 may be matched with the structure of the rear sound cavity of the speaker 13, and the connecting portion 122 is formed by injection molding. The connection portion 122 and the circuit board body 121 may be fixed by adhesion, thereby obtaining the second circuit board 12.

Alternatively, the second circuit board 12 may be provided as a unitary structure, where a side of the second circuit board 12 facing the first circuit board 11 has a first groove, and the first groove and the first circuit board 11 enclose a cavity 14.

In this embodiment of the present application, the second circuit board 12 is of an integral structure, the second circuit board 12 is provided with a first groove, and the first groove and the first circuit board 11 directly enclose to form the cavity 14, so that the cavity 14 can be directly formed by connecting two circuit boards, and no additional connection component is required between the two circuit boards, which is helpful for improving the sealing performance of the cavity 14, and thus improving the sound effect of the speaker 13.

In some embodiments, the circuit board with the groove may be directly processed as the second circuit board 12 during the circuit board processing process, so that the connection portion 122 does not need to be separately processed, thereby reducing the processing flow and improving the production efficiency.

In some embodiments, the first groove may be machined in the circuit board by computer numerical control (Computerized Numerical Control, CNC) or by laser engraving, and the connection portion 122 is formed around the first groove, thereby obtaining the integrated second circuit board 12.

Of course, the second circuit board 12 may be machined in other manners to form an integral structure, and those skilled in the art may choose to choose according to actual needs, which is not limited in this embodiment of the present application.

Optionally, as shown in fig. 1, a side of the frame body 10 facing the first circuit board 11 is provided with a second groove 101, and the second groove 101 is in communication with the cavity 14. In this embodiment, the second groove 101 is disposed on the side of the frame body 10 facing the first circuit board 11, so that the second groove 101 is conducted with the cavity 14, thereby increasing the volume of the rear sound cavity of the formed speaker 13 and helping to improve the sound effect of the speaker 13.

Specifically, the speaker 13 is mounted on the housing 10, and the side of the housing 10 facing the first circuit board 11 is the back side of the housing 10, and the side of the housing 10 facing away from the first circuit board 11 is the front side of the housing 10. The interface of being connected with speaker 13 on the framework 10 is located the back of framework 10, can set up second recess 101 in the back of framework and be close to the position of speaker 13, and second recess 101 can lead to with cavity 14 through mounting hole 111 on the first circuit board 11, and then can form the back sound chamber of speaker 13 by second recess 101 and cavity 14, can increase the volume in back sound chamber of speaker 13. Therefore, the space on the back of the frame 10 can be effectively utilized, the volume of the rear sound cavity of the loudspeaker 13 can be increased, and the layout of devices in the electronic equipment is not affected.

It should be noted that, the second groove 101 on the frame 10 may be determined according to the connection structure between the actual frame 10 and the speaker 13, and the first circuit board 11, so that the space outside the connection portion between the frame 10 and the speaker 13, and the first circuit board 11 may be fully utilized, and the effective utilization rate of the internal space of the electronic device may be improved. The arrangement position and the structural size of the second groove 101 may be designed according to practical situations, and the embodiment of the present application is not limited herein.

Optionally, as shown in fig. 4 and 5, a sound outlet 102 is provided on the frame 10 at a position corresponding to the front end 132 of the speaker 13, and the front end 132 is at least partially embedded in the sound outlet 102. In the embodiment of the present application, the front end 132 of the speaker 13 is at least partially located in the sound outlet 102 by providing the sound outlet 102 at a position corresponding to the front end 132 of the speaker 13 on the frame 10, so that the sound of the speaker 13 can be guided out of the front sound cavity.

In a specific application, the frame body is provided with a sound outlet hole 102 penetrating through, the front end 132 of the speaker 13 is connected with the frame body 10, and the front end 13 is at least partially positioned in the sound outlet hole 102, so that front and rear sound cavities of the speaker 13 can be formed on two sides of the frame body 10. The front end 132 of the acoustic device 13 can be connected to a front sound cavity located on the front surface of the housing 10 by the sound outlet 102.

It can be understood that, in the electronic device, the side of the housing 10 facing the first circuit board 11 is the back surface of the housing 10, the side of the housing 10 facing away from the first circuit board 11 is the front surface of the housing 10, the rear sound cavity of the speaker 13 is located at the back surface of the housing 10, and the front sound cavity of the speaker 13 is located at the front surface of the housing 10.

Alternatively, as shown in fig. 4, a mounting groove 103 is provided on the side of the frame 10 facing the first circuit board 11, the mounting groove 103 being provided around the sound outlet 102, and the front end 132 of the speaker 13 being connected to the mounting groove 103.

In this embodiment, the mounting groove 103 is provided on the side of the frame 10 facing the first circuit board 11, so that the mounting groove 103 is provided around the sound outlet 102, the front end 132 of the speaker 13 is mounted in the mounting groove 103, and the front end 132 is at least partially embedded in the sound outlet 102, thereby fixing the speaker 13 to the frame 10, and separating the front and rear sound chambers of the speaker 13 by the frame 10.

The specific structure of the mounting groove 103 on the frame body 10 may be adapted to the structure of the mounting portion of the speaker 13, so that the speaker 13 is mounted and fixed in the mounting groove 103, and the movement of the speaker 13 may be limited by using the mounting groove 103, so as to improve the mounting reliability.

Optionally, as shown in fig. 1, the electronic device further includes: and the sealing connecting piece 15, wherein the sealing connecting piece 15 is arranged between the front end 132 of the loudspeaker 13 and the bottom of the mounting groove 103, and the front end 132 is fixedly connected with the mounting groove 103 through the sealing connecting piece 15.

In this embodiment of the application, through setting up sealing connection 15, utilize sealing connection 15 to realize that speaker 13 passes through sealing connection 15 and is connected with mounting groove 103, can realize the fixed connection of speaker 13 and framework 10, can realize again that the seal between speaker 13 and the framework 10 to install speaker 13 on framework 10, can utilize framework 10 to separate the front and back sound chamber of speaker 13.

In some embodiments, the sealing connection 15 may be a sealant layer, for example, a silicone sealant, or the like may be selected to form the sealant layer; pressure-sensitive adhesives may also be used, for example, elastomer-type pressure-sensitive adhesives, resin-type pressure-sensitive adhesives, and the like, to form the sealant layer. Of course, the sealing connection member 15 may be made of other sealing connection materials, and those skilled in the art may choose to use according to actual needs, which is not limited in this embodiment.

Optionally, as shown in fig. 1, the electronic device further includes: the display module 16 is arranged on one side of the frame body 10 away from the first circuit board 11; a gap 17 is provided between the display module 16 and the frame 10, and the gap 17 is communicated with the sound outlet 102.

In this embodiment, a display module 16 is further disposed on a side of the frame body 10 facing away from the first circuit board 11, the display module 16 is in sealing connection with the first circuit board 11, a gap 17 is locally disposed between the display module 16 and the first circuit board 11, the position of the gap 17 corresponds to the position of the front end 132 of the speaker 13, and the gap 17 is communicated with the sound outlet 102, so that a front sound cavity of the speaker 13 can be formed by the gap 17 and the sound outlet 102.

In some embodiments, as shown in fig. 1, a sound outlet 104 is disposed on the electronic device near the edge of the display module 16, so that the sound outlet 104 is communicated with the gap 17, and thus, the sound of the speaker 13 can be conducted to the outside of the electronic device through the sound outlet 104, so as to realize the external playing of the sound.

Optionally, as shown in fig. 1, the electronic device further includes: and a sealing layer 18, wherein the sealing layer 18 is arranged between the first circuit board 11 and the frame 10, one side of the sealing layer 18 is connected with the first circuit board 11 in a sealing way, and the other side of the sealing layer 18 is connected with the frame 10 in a sealing way.

In this embodiment of the present application, the first circuit board 11 is connected with the frame 10, and the sealing layer 18 is disposed between the first circuit board 11 and the frame 10, so as to increase the sealing performance between the first circuit board 11 and the frame 10, thereby helping to improve the sealing effect of the rear sound cavity of the speaker 13, and reduce the noise problem caused by poor sealing of the rear sound cavity.

In some embodiments, the sealing layer 18 may be a sealing foam layer. Specifically, can adopt and seal and form the cotton layer of sealed bubble between cotton first circuit board 11 and the framework 10, can realize the sealed between first circuit board 11 and the framework 10 through setting up the cotton 22 layer of sealed bubble, convenient processing operation, and the cost of the cotton 22 material of sealed bubble is lower, can reduce manufacturing cost.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. An electronic device, comprising: the device comprises a frame body, a first circuit board, a second circuit board and a loudspeaker;

the first circuit board is connected to the frame body, the second circuit board is connected to one side of the first circuit board, which is away from the frame body, and the first circuit board and the second circuit board are enclosed to form a cavity;

the loudspeaker comprises a front end and a rear end which are oppositely arranged;

the rear end is at least partially embedded in the cavity and is communicated with the cavity;

the first circuit board is provided with a mounting hole at a position corresponding to the front end, and the front end penetrates through the mounting hole to be connected with the frame body.

2. The electronic device of claim 1, wherein a side of the second circuit board facing the first circuit board has a first groove, and the cavity is defined by the first groove and the first circuit board.

3. The electronic device of claim 2, wherein a side of the frame facing the first circuit board is provided with a second groove, and the second groove is in communication with the cavity.

4. The electronic device of claim 1, wherein the frame has a sound outlet at a position corresponding to the front end, and the front end is at least partially embedded in the sound outlet.

5. The electronic device according to claim 4, wherein a mounting groove is provided on a side of the frame body facing the first circuit board, the mounting groove is provided around the sound outlet hole, and the front end is connected to the mounting groove.

6. The electronic device of claim 5, wherein the electronic device further comprises: the sealing connecting piece is arranged between the front end and the bottom of the mounting groove, and the front end is fixedly connected with the mounting groove through the sealing connecting piece.

7. The electronic device of claim 4, wherein the electronic device further comprises: a display module, a display module and a display device,

the display module is arranged on one side of the frame body, which is away from the first circuit board; and a gap is formed between the display module and the frame body, and the gap is communicated with the sound outlet hole.

8. The electronic device of claim 1, wherein the first circuit board and the second circuit board are secured by a patch weld.

9. The electronic device of claim 1, wherein the electronic device further comprises: the sealing layer is arranged between the first circuit board and the frame body, one side of the sealing layer is in sealing connection with the first circuit board, and the other side of the sealing layer is in sealing connection with the frame body.

10. The electronic device of claim 9, wherein the sealing layer is a sealing foam layer.

Images