CN218957761U - Deep ultraviolet LED packaging structure - Google Patents
Deep ultraviolet LED packaging structure Download PDFInfo
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- CN218957761U CN218957761U CN202221720188.3U CN202221720188U CN218957761U CN 218957761 U CN218957761 U CN 218957761U CN 202221720188 U CN202221720188 U CN 202221720188U CN 218957761 U CN218957761 U CN 218957761U
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- Prior art keywords
- deep ultraviolet
- ultraviolet led
- substrate
- led package
- package structure
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 239000003292 glue Substances 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000010453 quartz Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 238000004659 sterilization and disinfection Methods 0.000 abstract description 10
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 238000002834 transmittance Methods 0.000 abstract description 7
- 230000001954 sterilising effect Effects 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005180 public health Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
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Abstract
The utility model belongs to the technical field of LED packaging, and relates to a deep ultraviolet LED packaging structure, which comprises a substrate (2), a deep ultraviolet chip (3) arranged on the substrate (2) and a cover plate (1) matched with the substrate (2), wherein the substrate (2) comprises a substrate body (2.1) and a surrounding dam (2.2) arranged on the front surface of the substrate body (2.1), a groove (2.2.1) is arranged on the upper end surface of the surrounding dam (2.2), and the periphery of the cover plate (1) is fixed in the groove (2.2.1) through adhesive. The ultraviolet light collecting and gathering device not only solves the problems of low light transmittance and short service life of glue caused by ultraviolet irradiation, but also can collect and gather ultraviolet light better, and achieves better sterilization and disinfection capability under the chips with the same power.
Description
Technical Field
The utility model belongs to the technical field of LED packaging, and relates to an LED packaging structure, in particular to a deep ultraviolet LED packaging structure.
Background
People pay more and more attention to public health, and deep ultraviolet LEDs are popular with people because of the functions of sterilization and disinfection.
However, the deep ultraviolet LEDs on the market at present are mostly packaged by using glue and a quartz cover plate, and the ultraviolet light in the cavity is not well utilized, so that the sterilization and disinfection efficiency of the ultraviolet light is seriously affected.
Therefore, the deep ultraviolet LEDs currently on the market generally have the following problems:
1. in the prior art, the deep ultraviolet LED is packaged by using glue, and the packaged glue can be directly irradiated by ultraviolet rays, and no matter what glue is aged or yellowing due to irradiation of the ultraviolet rays, so that the light transmittance and the service life of the deep ultraviolet LED are affected.
2. The deep ultraviolet LED in the prior art can extract ultraviolet light, but the ultraviolet light is not fully utilized, but partial ultraviolet light is absorbed by the cavity, so that the ultraviolet light is wasted, and the expected sterilization function cannot be achieved.
In view of the drawbacks of the prior art, it is necessary to develop a novel deep ultraviolet LED package structure to better solve the above technical problems of the existing deep ultraviolet LED.
Disclosure of Invention
In order to overcome the defects of the prior art, the utility model provides a deep ultraviolet LED packaging structure which not only solves the problems of low light transmittance and short service life of glue caused by ultraviolet irradiation, but also can collect and gather ultraviolet light better and achieve better sterilization and disinfection capability under the chips with the same power.
In order to achieve the above object, the present utility model provides the following technical solutions:
the deep ultraviolet LED packaging structure comprises a substrate, a deep ultraviolet chip arranged on the substrate and a cover plate matched with the substrate, wherein the substrate comprises a substrate body and a surrounding dam arranged on the front surface of the substrate body, and the deep ultraviolet LED packaging structure is characterized in that a groove is formed in the upper end surface of the surrounding dam, and the periphery of the cover plate is fixed in the groove through adhesive.
Preferably, an inclined plane is arranged on the inner side of the box dam, a cavity is formed by the inclined plane and the area, surrounded by the box dam, of the substrate body, and a reflective coating is arranged on the surface of the cavity.
Preferably, two substrate electrodes are provided on the back surface of the substrate body.
Preferably, the two substrate electrodes are respectively an anode and a cathode, and are used for being connected with the anode and the cathode of the deep ultraviolet chip.
Preferably, a heat dissipation structure is further arranged on the back surface of the substrate body.
Preferably, the heat dissipation structure and the deep ultraviolet chip are symmetrically arranged relative to the substrate body.
Preferably, the cover plate is made of quartz and is a convex lens.
Preferably, the cover plate has a thin middle periphery that is thick.
Preferably, the substrate body is a ceramic substrate body.
Preferably, the substrate body is made of aluminum nitride or aluminum oxide.
Compared with the prior art, the deep ultraviolet LED packaging structure has one or more of the following beneficial technical effects:
1. according to the ultraviolet LED, the direct irradiation of ultraviolet rays to glue can be avoided by changing the connection mode of the base plate and the cover plate, so that the light transmittance and the service life of the ultraviolet LED can be improved.
2. The cavity structure is improved, so that ultraviolet light emitted by the chip is reflected into the cavity without being absorbed, and the ultraviolet light can be fully collected and utilized, and the waste of the ultraviolet light is reduced.
3. The cover plate capable of gathering the light rays in the cavity is designed according to the optical principle by changing the shape of the cover plate, so that ultraviolet light can be gathered, and the waste of the ultraviolet light is further reduced.
4. The device has longer service life and stronger sterilization capability, and can achieve better sterilization and disinfection capability under the chips with the same power.
Drawings
Fig. 1 is a cross-sectional view of a deep ultraviolet LED package structure of the present utility model.
Fig. 2 is a cross-sectional view of a substrate of the deep ultraviolet LED package structure of the present utility model.
Fig. 3 is a cross-sectional view of a cover plate of the deep ultraviolet LED package structure of the present utility model.
Detailed Description
The utility model is further illustrated by the following examples in conjunction with the accompanying drawings, which are not to be construed as limiting the scope of the utility model.
Aiming at the defects of the prior art, the utility model provides a deep ultraviolet LED structure which not only solves the problems of low light transmittance and short service life of glue caused by ultraviolet irradiation, but also can collect and gather ultraviolet light better and achieve better sterilization and disinfection capability under the chips with the same power.
Fig. 1 shows a cross-sectional view of a deep ultraviolet LED package structure of the present utility model. As shown in fig. 1, the deep ultraviolet LED package structure of the present utility model includes a substrate 2, a deep ultraviolet chip 3 disposed on the substrate 2, and a cover plate 1 mated with the substrate 2, similar to the prior art. Wherein the deep ultraviolet chip 3 is arranged at the center of the front surface of the substrate 2 and is encapsulated in the substrate 2 and the cover plate 1.
Fig. 2 shows a cross-sectional view of a substrate of the deep ultraviolet LED package structure of the present utility model. As shown in fig. 2, the base plate 2 includes a base plate body 2.1 and a dam 2.2 provided on the front surface of the base plate body 2.1. The surrounding dam 2.2 is a circle of surrounding shield which is arranged around the deep ultraviolet chip 3.
In the utility model, a groove 2.2.1 is arranged on the upper end face of the dam 2.2. The periphery of the cover plate 1 is fixed in the groove 2.2.1 through adhesive glue.
Because the adhesive is positioned in the groove 2.2.1, the adhesive is not directly irradiated by ultraviolet light emitted by the deep ultraviolet chip 3, and therefore, the direct irradiation of the ultraviolet light to the adhesive can be avoided by changing the connection mode of the base plate and the cover plate, the aging of the adhesive or the yellow flower can be prevented, and the light transmittance and the service life of the deep ultraviolet LED can be improved.
Meanwhile, an inclined plane 2.2.2 is arranged on the inner side of the surrounding dam 2.2. The inclined surface 2.2.2 and the area of the substrate body 2.1 surrounded by the dam 2.2 together form a cavity and the surface of the cavity is provided with a reflective coating.
Preferably, the material of the reflective coating includes aluminum, teflon, magnesium fluoride, and the like.
Due to the reflective coating, the cavity can not absorb ultraviolet light emitted by the deep ultraviolet chip 3, but reflect the ultraviolet light, so that the ultraviolet light emitted by the deep ultraviolet chip 3 is reflected into the cavity without being absorbed by the cavity structure is improved, and the ultraviolet light can be sufficiently collected and utilized, so that the waste of the ultraviolet light is reduced.
Fig. 3 shows a cross-sectional view of a cover plate of the deep ultraviolet LED package structure of the present utility model. As shown in fig. 3, the cover plate 1 is made of quartz and is a convex lens.
Preferably, the convex lens is a convex lens having a certain angle, for example, the convex lens is a convex lens having an angle of 30-100 °.
More preferably, the middle thin perimeter of the cover plate 1 is thick. In the present utility model, it is only necessary to ensure that the thickness of the intermediate portion of the cover plate 1 is smaller than that of the peripheral portion, and therefore, there is no need to make restrictions on the specific thicknesses of the intermediate portion and the peripheral portion.
Because the cover plate 1 is a convex lens, the convex lens is combined with the positions of the base plate 2 and the deep ultraviolet chip 3, and the middle is thin and the periphery is thick through optical design, so that ultraviolet light emitted by the deep ultraviolet chip 3 can be gathered. Through tests, the transmittance of the convex lens is up to more than 98%, and ultraviolet light can be effectively extracted, so that the ultraviolet light can be gathered, and the waste of the ultraviolet light is further reduced.
In the present utility model, the substrate body 2.1 is preferably a ceramic substrate body. For example, the substrate body 2.1 is made of aluminum nitride or aluminum oxide. Thereby, the substrate body 2.1 can better provide support for the deep ultraviolet chip 3 and the like.
Furthermore, as shown in fig. 1 and 2, two substrate electrodes 2.3 are provided on the rear side of the substrate body 2.1. The two substrate electrodes 2.3 are respectively a positive electrode and a negative electrode and are used for being connected with the positive electrode and the negative electrode of the deep ultraviolet chip 3. Thereby, the two substrate electrodes 2.3 can be connected to an external power supply, so that the deep ultraviolet chip 3 is supplied with power to enable it to emit ultraviolet light.
Preferably, a heat dissipation structure 2.4 is further disposed on the back surface of the substrate body 2.1. The heat dissipation structure 2.4 can dissipate heat generated in the working process of the deep ultraviolet chip 3, so that the deep ultraviolet chip can work normally and the service life of the deep ultraviolet chip is prolonged.
More preferably, the heat dissipation structure 2.4 and the deep ultraviolet chip 3 are symmetrically disposed with respect to the substrate body 2.1. In this way, the heat dissipation structure 2.4 is enabled to better dissipate the heat generated by the deep ultraviolet chip 3.
According to the deep ultraviolet LED packaging structure, the connection mode of the base plate and the cover plate is changed, the cavity structure is improved, the shape of the cover plate is changed, the service life of the deep ultraviolet LED packaging structure is longer, the sterilization capability is stronger, and the better sterilization capability is achieved under the chips with the same power.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present utility model, and are not intended to limit the scope of the present utility model. Modifications and equivalent substitutions can be made by those skilled in the art based on the present teachings without departing from the spirit and scope of the present teachings.
Claims (10)
1. The utility model provides a deep ultraviolet LED packaging structure, its includes base plate (2), sets up deep ultraviolet chip (3) on base plate (2) and with base plate (2) matched with apron (1), base plate (2) include base plate body (2.1) and set up surrounding dam (2.2) on the front of base plate body (2.1), a serial communication port, be equipped with recess (2.2.1) on the up end of surrounding dam (2.2), the periphery of apron (1) is fixed through the bonding glue in recess (2.2.1).
2. The deep ultraviolet LED package structure according to claim 1, characterized in that an inclined plane (2.2.2) is provided on the inner side of the dam (2.2), the inclined plane (2.2.2) and the area of the substrate body (2.1) surrounded by the dam (2.2) together form a cavity and the surface of the cavity is provided with a reflective coating.
3. Deep ultraviolet LED package structure according to claim 1, characterized in that two substrate electrodes (2.3) are provided on the back side of the substrate body (2.1).
4. A deep ultraviolet LED package structure according to claim 3, characterized in that the two substrate electrodes (2.3) are respectively a positive electrode and a negative electrode for connection with the positive electrode and the negative electrode of the deep ultraviolet chip (3).
5. The deep ultraviolet LED package structure according to claim 1, characterized in that a heat dissipation structure (2.4) is further provided on the back side of the substrate body (2.1).
6. The deep ultraviolet LED package structure according to claim 5, wherein the heat dissipation structure (2.4) and the deep ultraviolet chip (3) are symmetrically arranged with respect to the substrate body (2.1).
7. The deep ultraviolet LED package structure according to claim 1, wherein the cover plate (1) is made of quartz and is a convex lens.
8. Deep ultraviolet LED package structure according to claim 7, characterized in that the middle thin perimeter of the cover plate (1) is thick.
9. The deep ultraviolet LED package structure according to claim 1, characterized in that the substrate body (2.1) is a ceramic substrate body.
10. Deep ultraviolet LED package structure according to claim 9, characterized in that the substrate body (2.1) is made of aluminum nitride or aluminum oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221720188.3U CN218957761U (en) | 2022-07-04 | 2022-07-04 | Deep ultraviolet LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221720188.3U CN218957761U (en) | 2022-07-04 | 2022-07-04 | Deep ultraviolet LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218957761U true CN218957761U (en) | 2023-05-02 |
Family
ID=86136764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221720188.3U Active CN218957761U (en) | 2022-07-04 | 2022-07-04 | Deep ultraviolet LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218957761U (en) |
-
2022
- 2022-07-04 CN CN202221720188.3U patent/CN218957761U/en active Active
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