CN218849491U

CN218849491U - LED lamp bead and LED lamp strip

Info

Publication number: CN218849491U
Application number: CN202221607342.6U
Authority: CN
Inventors: 刘明剑; 朱更生; 吴振雷; 周凯
Original assignee: Dongguan Opcso Optoelectronics Technology Co ltd
Current assignee: Dongguan Opcso Optoelectronics Technology Co ltd
Priority date: 2022-06-23
Filing date: 2022-06-23
Publication date: 2023-04-11
Anticipated expiration: 2032-06-23

Abstract

The application provides an LED lamp bead and an LED lamp strip, wherein the lamp bead comprises an insulating base, a light-emitting component, packaging glue and at least four pairs of pins, the light-emitting component comprises a driving chip and a wafer, the driving chip is used for driving the wafer to emit light, and the packaging glue covers the light-emitting component; the pins are fixed on the insulating seat and comprise connecting parts and a die bonding part, the light emitting assembly is arranged on the die bonding part, the connecting parts are used for being electrically connected with the conducting wire, the third die bonding part of the third pin is connected with the signal input end of the driving chip, and the fourth die bonding part of the fourth pin is connected with the signal output end of the driving chip; the positive end of the driving chip is electrically connected with the fifth die bonding part of the fifth pin, the negative end of the driving chip is electrically connected with the sixth die bonding part of the sixth pin, and the wafer is electrically connected with the fifth die bonding part.

Description

LED lamp bead and LED lamp strip

Technical Field

The application relates to the technical field of light-emitting diodes, in particular to an LED lamp bead and an LED lamp strip.

Background

Light-Emitting diodes (LEDs) have the advantages of energy saving, power saving, high efficiency, fast response time, long life cycle, environmental protection, etc., are widely used in the lighting industry, and become one of the most spotlighted products in recent years. For example, a plurality of LED lamp beads are used to make an LED strip, which may also be referred to as an LED lamp string, for an atmosphere lamp, but in the existing LED strip, a single-color or multi-color LED strip is basically implemented by using plug-in LEDs in a series connection manner, but a single LED cannot be controlled, and the light emitting effect is single. Certainly, a power carrier scheme can be adopted at present, but the power carrier scheme is also limited by data loss and the number of cascading points caused by power supply voltage fluctuation, so that the LED lamp strip cannot be cascaded downwards by multiple points in a long distance. Therefore, the LED lamp bead is needed to be provided, and the LED lamp strip can be conveniently cascaded downwards in a long-distance multipoint manner.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an LED lamp pearl and LED lamp area, aims at providing an LED lamp pearl that is suitable for cascaded LED lamp area of long distance multiple points to use.

In a first aspect, an embodiment of the present application provides an LED lamp bead, the LED lamp bead includes:

an insulating base;

the light-emitting component comprises a driving chip and a wafer, wherein the driving chip is electrically connected with the wafer and is used for driving the wafer to emit light;

the packaging glue covers the light-emitting component;

the four pairs of pins are fixed on the insulating seat and comprise connecting parts, part or all of the pins comprise die bonding parts, the light emitting assemblies are arranged on the die bonding parts, and the connecting parts are used for being electrically connected with wires; the four pairs of pins are respectively a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin and an eighth pin; the first pin and the second pin form a first pin pair, the third pin and the fourth pin form a second pin pair, the fifth pin and the sixth pin form a third pin pair, and the seventh pin and the eighth pin form a fourth pin pair;

the third pin comprises a third die bonding part, the fourth pin comprises a fourth die bonding part, the third die bonding part is connected with the signal input end of the driving chip, and the fourth die bonding part is connected with the signal output end of the driving chip; the fifth pin comprises a fifth die bonding part, the sixth pin comprises a sixth die bonding part, the positive end of the driving chip is electrically connected with the fifth die bonding part, the negative end of the driving chip is electrically connected with the sixth die bonding part, and the wafer is electrically connected with the fifth die bonding part.

In a second aspect, an embodiment of the present application provides an LED lamp strip, where the LED lamp strip includes any one of the LED lamp beads provided in the present application.

The embodiment of the application discloses LED lamp pearl and LED lamp area, to LED lamp pearl, four to the pin and with light-emitting component's relation of connection, can make this LED lamp pearl be connected with other LED lamp pearls through four wires, arrange on four wires with other lamp pearls in order promptly, it forms a LED lamp cluster to see a plurality of LED lamp pearl welding on four wires in appearance, can make the processing in LED lamp area easier from this, can realize the high voltage power supply in LED lamp area simultaneously, long distance cascades and luminous diversity, for example can realize the luminous pattern such as running water lamp and horse lamp, the use experience of product has been improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an LED lamp bead provided in an embodiment of the present application;

fig. 2 is a schematic view of another view structure of an LED lamp bead provided in the embodiment of the present application;

fig. 3 is a schematic diagram of an explosion structure of an LED lamp bead provided in the embodiment of the present application;

fig. 4 is a schematic structural diagram of a pin of an LED lamp bead provided in the embodiment of the present application;

fig. 5a and 5b are schematic diagrams illustrating a filling effect of a pin of an LED lamp bead provided in an embodiment of the present application;

fig. 6 is a schematic diagram of a circuit connection relationship of an LED lamp bead provided in the embodiment of the present application;

fig. 7 is an enlarged schematic structural diagram of a driving chip provided in an embodiment of the present application;

fig. 8 and 9 are schematic structural diagrams of different viewing angles of the connection relationship between the LED lamp bead and the wire provided by the embodiment of the present application;

fig. 10 is a schematic structural diagram of an LED strip provided in an embodiment of the present application.

Description of the main elements and symbols:

100. an LED light strip; 10. LED lamp beads; 101. a bonding wire; 11. an insulating base; 110. filling resin; 111. a concave cavity; 112. an identification member; 12. a light emitting assembly; 121. a driving chip; 122. a wafer; 1221. a green chip; 1222. a red light chip; 1223. a blue light chip; 13. packaging glue; 14. a pin; 1401. a connecting portion; 1402. a die bonding part; 14021. a wafer placing section; 14022. a bonding wire connection point placing part; 1404. a conductive electrode; 141. a first pin; 1411. a first connection portion; 1412. a first die bonding section; 142. a second pin; 1421. a second connecting portion; 1422. a second die bonding section; 14221. a first setting part; 14222. a second setting part; 143. a third pin; 1431. a third connecting portion; 1432. a third die bonding section; 144. a fourth pin; 1441. a fourth connecting portion; 1442. a fourth die bonding section; 145. a fifth pin; 1451. a fifth connecting part; 1452. a fifth die bonding section; 146. a sixth pin; 1461. a sixth connecting portion; 1462. a sixth die bonding section; 14621. a first placing section; 14622. a second placing section; 147. a seventh pin; 1471. a seventh connecting portion; 1472. a seventh die bonding section; 148. an eighth pin; 1481. an eighth connecting portion; 1482. an eighth die bonding section; 14a, a first transition pin; 14a1, a die bonding part of the first transition pin; 14a11, fixed end; 14a12, a connection end; 14b, a second transition pin; 15. a separator plate;

20. a wire; 201. a conductive wire core; 202. an insulating layer; 21. a first conductive line; 22. a second conductive line; 23. a third conductive line; 24. and a fourth conductive line.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It is also to be understood that the terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

Referring to fig. 1 to 3, fig. 1 to 3 respectively show a schematic structural diagram of another LED lamp bead provided in the embodiment of the present application. As shown in fig. 1 to 3, the LED lamp bead 10 includes an insulating base 11, a light emitting component 12, an encapsulation adhesive 13, and at least four pairs of pins 14.

The insulating base 11 may be made of plastic material. The light emitting assembly 12 includes a driving chip 121 and a wafer 122, the driving chip 121 is connected to the wafer 122 through a bonding wire 101, and the driving chip 121 is used for driving the wafer 122 to emit light. In this embodiment, the wafer 122 may be a multi-color light emitting chip, and specifically may include a green chip 1221, a red chip 1222 and a blue chip 1223, and a full-color light lamp is formed by the green chip 1221, the red chip 1222 and the blue chip 1223.

In some embodiments, the wafer 122 may further include a single color light emitting chip or a combination of multiple single color light emitting chips, such as a blue light emitting chip, a red light emitting chip, or a green light emitting chip, or a full color light lamp formed by combining the blue light emitting chip, the red light emitting chip, and the green light emitting chip, or may further be combined with a white light emitting chip, which may cooperate with one or more of the blue light emitting chip, the red light emitting chip, and the green light emitting chip to form a multi-color light.

The package adhesive 13 covers the light emitting component 12, specifically covers the driving chip 121 and the wafer 122, where the package adhesive 13 is specifically a transparent adhesive, specifically, for example, a transparent adhesive or a semi-transparent adhesive, so that light emitted from the wafer can be transmitted to other directions except the bottom through the package adhesive 13, and meanwhile, the package adhesive 13 can also protect the light emitting component 12 and a connection line between the light emitting components 12, and the connection line may be a bonding line.

It should be noted that the bonding wire provided in the embodiments of the present application includes one of a gold wire, a silver wire, a copper wire, an aluminum wire, and an alloy wire.

As shown in fig. 3, at least four pairs of pins 14 are fixed on the insulating base 11, specifically, for example, a large copper foil may be pressed on the insulating base 11, and then circuits corresponding to the pins 14 are etched on the copper foil, specifically, the circuits include a connection portion 1401 and a die attach portion 1402 of the pin 14, where the connection portion 1401 and the die attach portion 1402 are electrically connected by using a via 1403. The four pairs of pins 14 may be fixed to the insulating base 11 by adhesion, but may be fixed in other manners, such as by molding.

In the embodiment of the present application, pins 14 all include connecting portions 1401, but not all pins 14 all need to include die bonding portions 1402, that is, a portion of pins 14 include die bonding portions 1402, or all pins 14 include die bonding portions 1402, light emitting element 12 is disposed on die bonding portions 1402, connecting portions 1401 are used for electrically connecting with a wire, the wire is an external wire, and specifically may include a conductive wire core and an insulating layer wrapped on the conductive wire core, and the wire may be divided into a power supply wire and a communication wire from the function of the wire.

Specifically, exemplarily, as shown in fig. 2, the connection portions 1401 of four pairs of pins 14 are all located at the bottom of the insulating base 11 and are arranged at intervals, and the connection portions 1401 of each pair of pins 14 are respectively located at two sides of the bottom of the insulating base 11 and are opposite to each other; accordingly, die attach portions 1402 of leads 14 are spaced apart on top of housing 11.

It should be noted that the LED lamp beads provided in the present application all include at least four pairs of pins 14, but it is understood that more pins 14 may also be included, for example, five pairs of pins 14 or more pairs of pins 14 may be included, and the present application is not limited herein.

Referring to fig. 2 and fig. 4, the at least four pairs of leads 14 are a first lead 141, a second lead 142, a third lead 143, a fourth lead 144, a fifth lead 145, a sixth lead 146, a seventh lead 147 and an eighth lead 148, respectively. The first pin 141 and the second pin 142 form a first pin pair, the third pin 143 and the fourth pin 144 form a second pin pair, the fifth pin 145 and the sixth pin 146 form a third pin pair, and the seventh pin 147 and the eighth pin 148 form a fourth pin pair.

The connection parts of the first pin 141 and the second pin 142 are electrically connected to the first conductive wire; the connecting parts of the third pin 143 and the fourth pin 144 are used for electrically connecting with a third wire; the connection parts of the fifth pin 145 and the sixth pin 146 are used for electrically connecting with a second wire; the connection portions of the seventh pin 147 and the eighth pin 148 are used for electrically connecting with the fourth conductive wire. The first lead is a positive pole lead, the second lead is a positive pole lead, the third lead is a communication lead, and the fourth lead is a negative pole lead; the conductive core of the third wire is cut off at a portion between the connection portions of the third and

fourth pins

143 and 144, and the conductive core of the second wire is cut off at a portion between the connection portions of the fifth and

sixth pins

145 and 146.

Referring to fig. 4 to 7, the first lead 141 includes a first connection portion 1411 and a first die bonding portion 1412, the second lead 142 includes a second connection portion 1421 and a second die bonding portion 1422, the first connection portion 1411 and the second connection portion 1421 are used for electrically connecting to the first conductive wire, the first connection portion 1411 and the second connection portion 1421 may be disposed at an interval, or may be integrally designed, which may increase the reliability of electrical connection to the first conductive wire. The third lead 143 includes a third connection portion 1431 and a third die bonding portion 1432, the fourth lead 144 includes a fourth connection portion 1441 and a fourth die bonding portion 1442, the third die bonding portion 1432 is connected to the signal input Din of the driver chip 121 through a bonding wire 101, the fourth die bonding portion 1442 is connected to the signal output of the driver chip 121 through the bonding wire 101, the third connection portion 1431 and the fourth connection portion 1441 are used for electrically connecting to a third conductive wire, and a portion of the conductive wire core of the third conductive wire between the third connection portion 1431 and the fourth connection portion 1441 is cut. The fifth pin 145 includes a fifth connection portion 1451 and a fifth die bonding portion 1452, the sixth pin 146 includes a sixth connection portion 1461 and a sixth die bonding portion 1462, the positive terminal VDD of the driver chip 121 is electrically connected to the fifth die bonding portion 1452 through the bonding wire 101, the negative terminal GND of the driver chip 121 is electrically connected to the sixth die bonding portion 1462 through the bonding wire 101, the die 122 is electrically connected to the fifth die bonding portion 1452 through the bonding wire 101, the fifth connection portion 1451 and the sixth connection portion 1461 are used for electrically connecting to a second conductive wire, and the conductive wire core of the second conductive wire is partially switched between the fifth connection portion 1451 and the sixth connection portion 1461. The seventh lead pins 147 include seventh connection portions 1471 and seventh die bonding portions 1472, the eighth lead pins 148 include eighth connection portions 1481 and eighth die bonding portions 1482, and the seventh connection portions 1471 and the eighth connection portions 1481 are for electrical connection with fourth conductive wires.

The embodiment provides an LED lamp pearl 10, because the design of four pairs of pins 14 and the relation of connection of four pairs of pins 14 and light-emitting component 12, can make this LED lamp pearl 10 be connected with other LED lamp pearls through four wires, arrange on four wires in order with other lamp pearls promptly, it is a LED lamp cluster to see that a plurality of LED lamp pearls welding constitutes on four wires in appearance, but there are series connection and parallelly connected at the circuit connection, each LED lamp pearl all is the series connection and is convenient for control on communication connection relation, can make the processing in LED lamp area easier from this, realize the high voltage power supply in LED lamp area simultaneously, long distance cascades and luminous diversity, for example can realize the luminous patterns such as running water lamp and horse race lamp.

In some embodiments, the fifth die bond 1452 may be provided with one or more wafers 122; the wafer 122 is electrically connected to the driving chip 121 through bonding wires 101; the die 122 is further electrically connected to the fifth die attach portion 1452 via bonding wires 101, or the die 122 is further electrically connected to the fifth die attach portion 1452 via adhesive contacts, such as conductive silver paste. It is understood that the wafer 122 may be disposed on the die attach portion of other leads.

For example, as shown in fig. 6, the fifth die bond 1452 may be provided with a green chip 1221 and a red chip 1222; the green chip 1221 is electrically connected to the fifth die attach part 1452 and the driving chip 121 through the bonding wire 101, specifically, connected to the G control terminal of the driving chip 121; the red chip 1222 is connected to the driving chip 121, specifically to the R control terminal of the driving chip 121, through the bonding wire 101, and is electrically connected to the fifth die attach portion 1452 through an adhesive contact.

In some embodiments, as shown in fig. 5a, referring to fig. 6, the fifth die bonding portion 1452 includes at least a third disposing portion 14521 and a fourth disposing portion 14522 disposed at intervals, the third disposing portion 14521 is used for disposing the green chip 1221 and the red chip 1222, and the fourth disposing portion 14522 is used for disposing the bond wire connection point. Because the bottoms of the blue light chip and the green light chip are connected with the die bonding part through the glue, the glue is organic, internal stress is released differently when the chips expand due to heating, delamination (also called peeling) of two bonding welding points (bonding wire connection points) on the periphery is easily caused, and further electric connection failure is caused. Therefore, the third setting part 14521 and the fourth setting part 14522 are arranged at intervals, so that the extension of layered peeling can be effectively prevented, the firmness of welding spots can be effectively protected, and the reliability of products can be improved.

In some embodiments, as shown in fig. 6, the fourth die bonding portion 1442 may also be provided with the wafer 122; the wafer 122 is electrically connected to the fifth die attach portion 1452 through bonding wires 101, and the wafer 122 is further electrically connected to the driving chip 121 through bonding wires 101. Specifically, for example, the wafer 122 disposed in the fourth die bonding section 1442 is a blue chip 1223, and the blue chip 1223 is disposed in the fourth die bonding section 1442 at a position close to the fifth die bonding section 1452 so that the blue chip 1223 is close to the wafer 122 disposed on the fifth die bonding section 1452. Therefore, various different colors can be combined by different wafers 122, so that the product cost can be reduced, the product reliability is improved, and the composite light-emitting color mixing effect of the LED lamp bead is also improved.

In some embodiments, the sixth die attach portion 1462 is provided with the driver chip 121, and the region of the sixth die attach portion 1462 where the driver chip 121 is provided is located between the fourth die attach portion and the fifth die attach portion.

In some embodiments, as shown in fig. 6, the driver chip 121 may be disposed on the sixth die attach portion 1462, and the region of the sixth die attach portion 1462 where the driver chip 121 is disposed is located between the fourth die attach portion 1442 and the fifth die attach portion 1452. Specifically, it can be understood that at least a portion of the sixth die attach portion 1462 extends between the fourth die attach portion 1442 and the fifth die attach portion 1452, thereby driving the distance between the chip 121 and other die attach portions or dies on other die attach portions, which in turn facilitates connection through bonding wires and also provides reliability and lifetime of the product.

In some embodiments, in order to further improve the reliability and the service life of the product, as shown in fig. 5a and fig. 6, when the sixth die bonding part 1462 is designed, the sixth die bonding part 1462 may include a first placing part 14621 and a second placing part 14622 which are arranged at intervals, and the first placing part 14621 is connected with the second placing part 14622, which may be specifically understood as that the first placing part 14621 and the second placing part 14622 are integrally designed. The first mounting portion 14621 is used for mounting the driving chip 121, the second mounting portion 14622 is used for mounting a bonding wire connection point, and a gap region is formed between the first mounting portion 14621 and the second mounting portion 14622, so that the bonding wire connection point of the second mounting portion 14622 can be prevented from being peeled off due to heat generation of the driving chip 121, and reliability and service life of a product can be improved. Accordingly, the fourth die bonding section 1442 includes a wafer placing section 14021 and a bonding wire connecting point placing section 14022 extending from the wafer placing section 14021, the bonding wire connecting point placing section 14022 extending to the spacing region. Therefore, the distance of the bonding wire for connecting the driving chip and the die bonding part can be further shortened, the cost can be saved, and the reliability of the product can be improved.

In some embodiments, since the connection portion and the die attach portion of the lead 14 further require electroplating process for electroplating, or the copper deposition process also requires electroplating when the electrical connection is implemented by using a via, in order to facilitate the electroplating process, a conductive electrode 1404 is further disposed on the die attach portion of one or more of the leads 14, and the conductive electrode 1404 extends from the die attach portion of each lead to an edge of the insulating base 11, for example, as shown in fig. 5a, the third die attach portion 1432 and the sixth die attach portion 1462 both include the conductive electrode 1404.

When the LED lamp bead 10 is used for manufacturing an LED lamp strip, four wires are needed, wherein the four wires are respectively a first wire, a second wire, a third wire and a fourth wire, the first wire is a positive wire, the second wire is a positive wire, the third wire is a communication wire, and the fourth wire is a negative wire. The first pin pair is connected to the first wire, that is, the connection portions of the first pin 141 and the second pin 142 are electrically connected to the first wire; the second pin pair is electrically connected to the third conductive wire, that is, the connection portions of the third pin 143 and the fourth pin 144 are electrically connected to the third conductive wire; the third pin pair is electrically connected to the second conductive line, that is, the connection portions of the fifth pin 145 and the sixth pin 146 are electrically connected to the second conductive line; the fourth pin pair is connected to the fourth conductive line, that is, the connection portions of the seventh pin 147 and the eighth pin 148 are electrically connected to the fourth conductive line. Wherein, the part of the conductive wire core of the third wire between the connection parts of the third pin 143 and the fourth pin 144 is cut off; a portion of the conductive core of the second wire between the connection portions of the fifth pin 145 and the sixth pin 146 is cut off.

In the embodiment of the present application, the first connection portion 1411 and the second connection portion 1421 are integrally formed, so as to be electrically connected to the first conductive wire, and the reliability of the electrical connection to the first conductive wire can be increased. Of course, in some embodiments, the first connection portion 1411 and the second connection portion 1421 may also be cut off, that is, the first connection portion 1411 and the second connection portion 1421 are disposed at an interval, and the interval can effectively prevent the connection portion of the first connection portion 1411 and the second connection portion 1421 from arching from the insulating base 11, so that reliability and service life of the LED lamp bead can be improved. The seventh connecting portion 1471 and the eighth connecting portion 1481 are also integrally formed, and the same effect can be achieved.

It should be noted that, as shown in fig. 4 and 5a, for the first pin 141, the second pin 142, the seventh pin 147, and the eighth pin 148, since the die attach portions of the first pin 141, the second pin 142, the seventh pin 147, and the eighth pin 148 mainly function to electrically connect with the connecting portion at the bottom of the insulating base 11 by using a via hole, and the area of the die attach portions at the top of the insulating base 11 is relatively small, the die attach portions may also be referred to as the first pin 141, the second pin 142, the seventh pin 147, and the eighth pin 148 not including the die attach portions.

In some embodiments, since the connection portion and the die attach portion of each lead 14 further require an electroplating process for electroplating, or a copper deposition process is also required for electrical connection by using a via, in order to facilitate the electroplating process, a conductive electrode 1404 is further disposed on the die attach portion of each lead 14, and the conductive electrode 1404 extends from the die attach portion of each lead to an edge of the insulating base 11, for example, as shown in fig. 5a, each of the third die attach portion 1432 and the sixth die attach portion 1462 includes the conductive electrode 1404.

In some embodiments, as shown in fig. 5b, the LED lamp bead 10 may further include a separating plate 15, where the separating plate 15 may specifically be a BT (binary iodide Triazine) plate, which may also be referred to as a resin substrate, and the separating plate 15 is specifically disposed at the bottom of the insulating base 11, and is used to separate the connection portions of the pins 14, so as to avoid short circuit caused by the tin beads when the LED lamp bead is subsequently connected to the conducting wire by soldering. Since the surface of the insulating base 11 is rough, if the isolation plate 15 is not used, short circuit is easily generated when the connection portion of the pin 14 is soldered to a wire.

In some embodiments, as shown in fig. 3, the connection portion and the die bonding portion of each pin 14 in the LED lamp bead 10 are electrically connected by a via hole, the via hole is filled with resin, which is beneficial to a Molding process, organic glue is not easy to permeate to a bottom pad pin, and a single product is obtained by connecting a via hole annular pin of the product with the periphery, and is required to be cut, so that the filling resin 110 of the single product is in a semi-cylindrical shape.

As shown in fig. 8 and 9, the first lead 141 and the second lead 142 form a first lead pair, and are electrically connected to the first conductive line 21; the third pin 143 and the fourth pin 144 form a second pin pair, and are electrically connected to the third wire 23; the fifth pin 145 and the sixth pin 146 form a third pin pair, and are connected to the second wire 22; the seventh lead 147 and the eighth lead 148 constitute a fourth lead pair connected to the fourth wire 24. The four wires 20 are respectively a first wire 21, a second wire 22, a third wire 23 and a fourth wire 24, wherein the first wire 21 is a positive wire, the second wire 22 is a positive wire, the third wire 23 is a communication wire, and the fourth wire 24 is a negative wire. Specifically, the first connection portion 1411 of the first lead 141 and the second connection portion 1421 of the second lead 142 are electrically connected to the first conductive line 21; the third connection part 1431 of the third pin 143 and the fourth connection part 1441 of the fourth pin 144 are both electrically connected to the third wire 23; the fifth connection portion 1451 of the fifth pin 145 and the sixth connection portion 1461 of the sixth pin 146 are electrically connected to the second conductive line 22; the seventh connection portion 1471 of the seventh lead 147 and the eighth connection portion 1481 of the eighth lead 148 are electrically connected to the fourth wire 24. Wherein the conductive core 201 of the third wire 23 between the third connection part 1431 and the fourth connection part 1441 is cut off; the conductive core 201 of the second wire 22 between the fifth and sixth connecting

portions

1451 and 1461 is cut.

In the embodiment of the application, because the LED lamp beads produced by the same process have substantially the same shape, the LED lamp strip is inconvenient to process, and therefore the LED lamp bead 10 may further include a marking member for indicating different LED lamp beads. For example, as shown in fig. 1, a marker 112 may be disposed on the insulating base 11 to indicate different LED beads, so as to facilitate subsequent manufacturing of a LED strip by using different LED beads. The indicator 112 may be shaped differently to represent different LED beads, such as rectangular, square, and triangular, but may also be shaped differently to represent different colors and characters.

Referring to fig. 10, fig. 10 is a schematic structural diagram of a LED strip provided in an embodiment of the present application, where the LED strip 100 includes any one of the LED beads 10 provided in the above embodiments, and specifically may include one or more LED beads 10.

The method for manufacturing the LED lamp strip specifically comprises the following steps: at least four wires 20 are extended along a straight track; arranging corresponding LED lamp beads on at least four wires at intervals along a straight track; welding the LED lamp beads 10 and at least four wires 20; and performing punching processing on the cut part of the partial lead.

As shown in fig. 8 and 9, the conductive wire 20 includes a conductive wire core 201 and an insulating layer 202 wrapping the conductive wire core, where the conductive wire includes an enameled wire, and the insulating layer may also be referred to as an enameled wire layer. Before at least four wires are extended and arranged along a straight track, the insulating layers of the wires are required to be stripped, so that each wire is exposed to a conductive wire core matched with the pins of the LED lamp beads. It will of course be appreciated that the insulation stripping of the wires is also performed after at least four wires have been arranged to extend along a straight track.

In some embodiments, for the aesthetic appearance, the insulating layer of the wires may be stripped at equal intervals, so that the LED beads of the LED modules in the LED strip may be arranged at equal intervals on the four wires. Of course, the wires may be arranged at unequal intervals on the four wires.

The LED lamp beads and at least four wires are welded by coating the tin paste on the conductive wire cores of the wires, so that the welding reliability of the conductive wire cores of the LED lamp beads and the wires can be improved. In some embodiments, of course, solder paste may be coated on the connection portion of the LED lamp bead. The connecting portion of LED lamp pearl and the conductor core of wire can be welded and fixed specifically to use hot-blast mechanism, and at the welding end, still need cut off the conductor core of part wire, specifically need cut off the conductor core of second wire and third wire and handle. When punching, the wire welded with the LED lamp beads is overturned, so that the wire faces upwards and the LED lamp beads face downwards, and the LED lamp strips are manufactured by punching from top to bottom by utilizing the cutter.

In some embodiments, can also dial the insulating layer of wire earlier and expose the conductive core, then die-cut second wire and third wire, coat the tin cream on the wire core, put LED lamp pearl on the conductive core who is stained with the tin cream again, weld again, then go up to drip UV and glue the back solidification. And reversing the LED strip in the next process, and dripping UV glue on the other surface of the LED strip for curing to complete the manufacturing of the LED strip.

This LED lamp area 100, because four pairs of pins of LED lamp pearl 10 and the relation of being connected with light-emitting component, can make this LED lamp pearl be connected with other LED lamp pearls through four wires, arrange in order on four wires with other lamp pearls promptly, see that a plurality of LED lamp pearl welding constitutes a LED lamp cluster on four wires from the outward appearance, but can have in series connection and parallelly connected at circuit connection, each LED lamp pearl all is the series connection and is convenient for control on communication connection relation, can make the processing in LED lamp area easier from this, can realize the high voltage power supply in LED lamp area simultaneously, long distance cascades and luminous diversity, for example can realize the luminous pattern such as running water lamp and horse race lamp, the use experience of product has been improved.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or substitutions within the technical scope of the present application, and these modifications or substitutions should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a LED lamp pearl which characterized in that, the lamp pearl includes:

an insulating base;

the packaging glue covers the light-emitting component;

2. The LED lamp bead according to claim 1, wherein the fifth die attach portion is provided with one or more of the wafers; the wafer is electrically connected with the driving chip through a bonding wire; the wafer is electrically connected with the fifth die bonding part through a bonding wire, or the wafer is electrically connected with the fifth die bonding part through bonding contact.

3. The LED lamp bead according to claim 2, wherein the fifth die bonding portion is provided with a green chip and a red chip; the green chip is electrically connected with the fifth die bonding part and the driving chip through bonding wires respectively; the red light chip is connected with the driving chip through a bonding wire and is electrically connected with the fifth die bonding part through bonding contact.

4. The LED lamp bead according to claim 3, wherein the fifth die attach portion includes at least a third disposing portion and a fourth disposing portion, the third disposing portion being disposed at an interval, the third disposing portion being configured to dispose the green chip and the red chip, and the fourth disposing portion being configured to dispose a bonding wire connection point.

5. The LED lamp bead according to claim 1, wherein the fourth die attach portion is provided with the wafer; the wafer is electrically connected with the fifth die bonding part through a bonding wire, and the wafer is also electrically connected with the driving chip through the bonding wire.

6. The LED lamp bead according to claim 5, wherein the wafer disposed in the fourth die bonding portion is a blue chip, and the blue chip is disposed in the fourth die bonding portion at a position close to the fifth die bonding portion, so that the blue chip is close to the wafer disposed on the fifth die bonding portion.

7. The LED lamp bead according to claim 1, wherein the driving chip is disposed on the sixth die bonding portion, and a region of the sixth die bonding portion where the driving chip is disposed is located between the fourth die bonding portion and the fifth die bonding portion.

8. The LED lamp bead according to claim 7, wherein the sixth die bonding portion includes a first placing portion and a second placing portion that are disposed at an interval, the first placing portion is connected to the second placing portion, the first placing portion is used for disposing the driving chip, the second placing portion is used for disposing a bonding wire connection point, and a space between the first placing portion and the second placing portion is a spacing region;

the fourth die bonding part comprises a wafer placing part and a bonding wire connection point placing part extending out of the wafer placing part, and the bonding wire connection point placing part extends to the spacing area.

9. The LED lamp bead according to claim 1, wherein the connecting portions of the first pin and the second pin are both used for electrically connecting with a first wire; the connecting parts of the third pin and the fourth pin are electrically connected with a third wire; the connecting parts of the fifth pin and the sixth pin are both used for being electrically connected with a second lead; the connecting parts of the seventh pin and the eighth pin are both used for being electrically connected with a fourth wire;

the first lead is a positive pole wire, the second lead is a positive pole wire, the third lead is a communication lead, and the fourth lead is a negative pole wire; the part of the conductive wire core of the third wire between the connecting parts of the third pin and the fourth pin is cut off; and the part of the conductive wire core of the second wire between the connecting parts of the fifth pin and the sixth pin is cut off.

10. A LED strip, characterized in that it comprises the LED bead of any one of claims 1-9.