CN218831245U - Precise bonding device for piezoelectric ceramic pieces - Google Patents
Precise bonding device for piezoelectric ceramic pieces Download PDFInfo
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- CN218831245U CN218831245U CN202223315079.6U CN202223315079U CN218831245U CN 218831245 U CN218831245 U CN 218831245U CN 202223315079 U CN202223315079 U CN 202223315079U CN 218831245 U CN218831245 U CN 218831245U
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- 239000000919 ceramic Substances 0.000 title claims abstract description 127
- 239000003292 glue Substances 0.000 claims abstract description 177
- 230000007246 mechanism Effects 0.000 claims abstract description 46
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 238000001816 cooling Methods 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 13
- 235000012431 wafers Nutrition 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000004321 preservation Methods 0.000 description 6
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The application discloses accurate bonding device of piezoceramics piece, it includes: the glue coating mechanism comprises a glue mold and a limiting part, the glue mold is provided with a glue groove, the glue groove corresponds to the end face outline of the piezoelectric ceramic piece, the glue groove is used for containing glue, the limiting part is positioned at one side of the glue mold provided with the glue groove, and the length of the limiting part extending along the depth direction of the glue groove is smaller than the thickness of the piezoelectric ceramic piece; the moving mechanism is used for enabling one end face of the piezoelectric ceramic piece to move towards the glue groove in a reciprocating mode, the moving mechanism is provided with a butting face which is flush with the other end face of the piezoelectric ceramic piece, and the butting face can be butted with the limiting piece. Through setting up the locating part, can the thickness of the glue film on the accurate control piezoceramics piece terminal surface, form the high thin glue film of precision on piezoceramics piece surface.
Description
Technical Field
The utility model relates to a piezoceramics piece's bonding technical field, concretely relates to piezoceramics piece's accurate bonding device.
Background
The piezoelectric ceramic is an information functional ceramic material capable of converting mechanical energy and electric energy into each other. The piezoelectric ceramic dielectric material is placed between the two copper round electrodes to form the piezoelectric ceramic piece, when alternating-current audio signals are connected to the two electrodes of the piezoelectric ceramic piece, the piezoelectric piece can vibrate according to the magnitude frequency of the signals, and conversely, the two electrodes of the piezoelectric ceramic piece are vibrated to generate electric signals.
The fixing mode of the piezoelectric ceramic plate comprises bonding, for example, the piezoelectric ceramic plate is bonded on the packaging substrate for transportation, and for example, the piezoelectric ceramic plate is bonded on the metal sheet to form a circuit. However, the thickness of the piezoelectric ceramic plate is generally 2-3 mm, the shape is mainly circular or square, the upper and lower surfaces of the piezoelectric ceramic plate are normally polarized ceramic layers, and if an excessively hard and thick adhesive layer is used for bonding with other structures, the piezoelectric ceramic plate is affected by bonding to generate unexpected deformation under the action of driving voltage, thereby causing damage. Therefore, for the piezoelectric ceramic plate, the thinner the adhesive layer is, the least influences the performance of the piezoelectric ceramic plate.
How to form a high-precision thin adhesive layer on the surface of the piezoelectric ceramic piece needs to be solved urgently.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problems set forth in the background art, the present application aims to provide a precise bonding device for piezoelectric ceramic plates.
In order to achieve the purpose, the technical scheme is as follows:
a precise bonding device for piezoelectric ceramic plates comprises: cover gluey mechanism and moving mechanism, wherein:
the glue coating mechanism comprises a glue mold and a limiting part, the glue mold is provided with a glue groove, the glue groove corresponds to the end face outline of the piezoelectric ceramic piece, the glue groove is used for containing glue, the limiting part is positioned at one side of the glue mold provided with the glue groove, and the length of the limiting part extending along the depth direction of the glue groove is smaller than the thickness of the piezoelectric ceramic piece; the moving mechanism is used for enabling one end face of the piezoelectric ceramic piece to face the glue groove to perform reciprocating movement, the moving mechanism is provided with an abutting surface which is flush with the other end face of the piezoelectric ceramic piece, and the abutting surface can abut against the limiting piece.
From above, the working process does: the moving mechanism drives the piezoelectric ceramic piece to move, one end of the piezoelectric ceramic piece can move towards the glue groove, the glue groove corresponds to the end face outline of the piezoelectric ceramic piece, therefore, the glue groove can allow the piezoelectric ceramic piece to enter, in the process that the piezoelectric ceramic piece moves towards the glue groove, the abutting surface of the moving mechanism abuts against the limiting part, the length of the limiting part is smaller than the thickness of the piezoelectric ceramic piece, and the limiting part can limit the thickness of the piezoelectric ceramic piece entering the glue groove, so that glue is only thinly adhered to the end face of the piezoelectric ceramic piece, and the thickness of the glue layer is thinner in the final adhesion process.
In conclusion, by arranging the limiting piece, the thickness of the adhesive layer on the end face of the piezoelectric ceramic piece can be precisely controlled, and the thin adhesive layer with high precision is formed on the surface of the piezoelectric ceramic piece.
As an optional implementation manner of the precise bonding device for the piezoelectric ceramic plates, the limiting member is a limiting member with adjustable length. Therefore, by adjusting the length of the limiting piece, on one hand, the piezoelectric ceramic piece with different thicknesses can be adapted, the shorter the limiting piece is, the thinner the piezoelectric ceramic piece can be adapted, and the longer the limiting piece is, the thicker the piezoelectric ceramic piece can be adapted; on the other hand, the thickness that the piezoelectric ceramic piece is stained with glue can be adjusted, the shorter the limiting part is, the thicker the thickness of being stained with glue is, but the too short limiting part can lead to glue in the side of piezoelectric ceramic piece, influence the performance of piezoelectric ceramic piece, the longer the limiting part is, the thinner the thickness of being stained with glue is, but the too long limiting part can lead to glue too little or not be stained with piezoelectric ceramic piece, influence the bonding quality.
As an optional implementation manner of the precise bonding device for the piezoelectric ceramic plate, the glue mold is provided with a glue adding opening. Therefore, glue in the glue mould can be added through the glue adding opening, the glue mould is convenient and fast, and glue can be added through the glue adding opening when the glue sticking process is not influenced.
As an optional implementation mode of the precise bonding device for the piezoelectric ceramic plates, the glue coating mechanism further comprises a glue barrel, and a glue outlet of the glue barrel is communicated with the glue adding port. With this, glue bucket glue outlet department can set up gluey pump, glues the pump and is arranged in will gluing the glue in the bucket and passes through the mouth of gluing of pipeline conveying to gluey mould from glue outlet with this add gluey mouth to add gluey.
As an optional implementation manner of the precise bonding device for the piezoelectric ceramic wafer, the glue coating mechanism further comprises a cooling structure, and the cooling structure is used for cooling the glue mold and/or the glue in the glue barrel. The glue used for bonding the piezoelectric ceramic piece is preferably elastic epoxy resin glue, the preservation temperature of the epoxy resin glue is 20-30 degrees, and the preservation of the epoxy resin glue is facilitated in a cold environment, so that the cooling structure is arranged, the glue in the glue mold and/or the glue barrel is cooled, the preservation time of the glue is prolonged, and the glue is in contact with the piezoelectric ceramic piece in a better state.
As an optional implementation mode of the precise bonding device for the piezoelectric ceramic plates, the cooling structure comprises a water cooling pipeline, and the water cooling pipeline surrounds the glue mold and/or the glue barrel. Therefore, the cooling structure is simple and reliable in structure, good in cooling effect and low in cost.
As an optional implementation mode of the precise bonding device for the piezoelectric ceramic pieces, the moving mechanism comprises a guide rail, a sliding block, an extensible part and a negative pressure head, the sliding block is connected with the guide rail in a sliding manner, the extensible part is connected with the sliding block, the negative pressure head is connected with the extensible part, and the negative pressure head is used for adsorbing the piezoelectric ceramic pieces. Therefore, the guide rail is located above the glue mold, the sliding block can drive the telescopic piece to move to the position above the glue groove, the piezoelectric ceramic piece can be aligned with the glue groove, the telescopic piece can stretch along the height direction, the piezoelectric ceramic piece can enter the glue groove, the negative pressure head can adsorb and release the piezoelectric ceramic piece from the end face of the piezoelectric ceramic piece, the piezoelectric ceramic piece is prevented from being clamped from the side part of the piezoelectric ceramic piece, and the piezoelectric ceramic piece is not damaged.
As an alternative implementation manner of the precise bonding device for the piezoelectric ceramic plate, the expansion piece or the negative pressure head has the abutting surface.
As an optional implementation mode of the precise bonding device for the piezoelectric ceramic pieces, the precise bonding device further comprises a curing mechanism, wherein the curing mechanism comprises a curing platform, the curing platform is used for bearing an object to be bonded with the piezoelectric ceramic pieces, and the moving mechanism can move the piezoelectric ceramic pieces to the curing platform. Therefore, the moving mechanism can move the piezoelectric ceramic piece with the lower end surface being stained with the glue to the curing platform to be accurately bonded with the object to be bonded.
As an optional implementation manner of the precise bonding device for the piezoelectric ceramic plate, the curing mechanism comprises a heating device, the heating device is connected with the curing platform, and the heating device is used for heating an object to be bonded with the piezoelectric ceramic plate. Therefore, the solidification of the glue can be accelerated, and the bonding quality of the piezoelectric ceramic piece is improved.
Drawings
The accompanying drawings, which are described herein, serve to provide a further understanding of the invention and constitute a part of this specification, and the exemplary embodiments and descriptions thereof are provided for explaining the invention without unduly limiting it. In the drawings:
FIG. 1 is a schematic structural diagram of an exemplary embodiment of the present application;
fig. 2 is a schematic structural diagram of a position limiting element according to an exemplary embodiment of the present application.
The reference numbers in the figures illustrate:
1. a glue coating mechanism; 11. gluing a mold; 111. a glue groove; 12. a limiting member; 13. a glue barrel; 14. a cooling structure; 141. a water-cooled pipeline;
2. a moving mechanism; 21. a butting surface; 22. a guide rail; 23. a slider; 24. a telescoping member; 25. a negative pressure head;
3. piezoelectric ceramic plates;
4. a curing mechanism; 41. and (6) curing the platform.
Detailed Description
In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described with reference to the accompanying drawings, wherein the same reference numerals in the drawings denote the same components or similar components.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
Referring to fig. 1-2, the present application provides a precise bonding apparatus for piezoelectric ceramic plates, which includes: cover gluey mechanism 1 and moving mechanism 2, wherein:
the glue coating mechanism 1 comprises a glue mold 11 and a limiting piece 12, wherein the glue mold 11 is provided with a glue groove 111, the glue groove 111 corresponds to the end surface profile of the piezoelectric ceramic piece 3, the glue groove 111 is used for containing glue, the limiting piece 12 is positioned at one side of the glue mold 11 provided with the glue groove 111, and the length of the limiting piece 12 extending along the depth direction of the glue groove 111 is smaller than the thickness of the piezoelectric ceramic piece 3; the moving mechanism 2 is for reciprocating one end face of the piezoelectric ceramic plate 3 toward the glue groove 111, and the moving mechanism 2 has a contact surface 21 flush with the other end face of the piezoelectric ceramic plate 3, and the contact surface 21 can contact the stopper 12.
From above, the working process does: the moving mechanism 2 drives the piezoelectric ceramic piece 3 to move, so that one end of the piezoelectric ceramic piece 3 can move towards the glue groove 111, the glue groove 111 corresponds to the end face profile of the piezoelectric ceramic piece 3, the glue groove 111 can allow the piezoelectric ceramic piece 3 to enter, in the process that the piezoelectric ceramic piece 3 moves towards the glue groove 111, the abutting surface 21 of the moving mechanism 2 abuts against the limiting part 12, the length of the limiting part 12 is smaller than the thickness of the piezoelectric ceramic piece 3, and the limiting part 12 can limit the thickness of the piezoelectric ceramic piece 3 entering the glue groove 111, so that the glue is only thinly adhered to the end face of the piezoelectric ceramic piece 3, and the thickness of the glue layer is thinner in the final adhesion process.
In conclusion, by arranging the limiting member 12, the thickness of the adhesive layer on the end surface of the piezoelectric ceramic plate 3 can be precisely controlled, and a high-precision thin adhesive layer is formed on the surface of the piezoelectric ceramic plate 3.
It should be understood by those skilled in the art that, as long as the thickness of the piezoelectric ceramic plate 3 entering the glue groove 111 is controlled, so that only the end surface of the piezoelectric ceramic plate 3 is adhered with glue, the glue adhered on the end surface of the piezoelectric ceramic plate 3 will not flow downward due to surface tension.
In an embodiment of a precise bonding device for piezoelectric ceramic plates, the limiting member 12 is a limiting member 12 with adjustable length. Therefore, by adjusting the length of the limiting piece 12, on one hand, the piezoelectric ceramic piece 3 with different thicknesses can be adapted, the shorter the limiting piece 12 is, the thinner the piezoelectric ceramic piece 3 can be adapted, and the longer the limiting piece 12 is, the thicker the piezoelectric ceramic piece 3 can be adapted; on the other hand, the glue dipping thickness of the piezoelectric ceramic piece 3 can be adjusted, the shorter the limiting part 12 is, the thicker the glue dipping thickness is, but the too short limiting part 12 can cause glue to stick to the side surface of the piezoelectric ceramic piece 3, which affects the performance of the piezoelectric ceramic piece 3, the longer the limiting part 12 is, the thinner the glue dipping thickness is, but the too long limiting part 12 can cause the glue to be too little or not stick to the piezoelectric ceramic piece 3, which affects the bonding quality. Referring to fig. 2, the limiting member 12 may include a limiting sleeve and a limiting shaft, the limiting sleeve and the limiting shaft are rotatably connected, the limiting shaft can rotate in the forward direction and the reverse direction to rotate in the forward direction and rotate in the reverse direction, and scales are engraved on the limiting shaft, so that the length of the limiting member 12 can be precisely controlled.
In a specific embodiment of a precise bonding device for piezoelectric ceramic plates, the glue mold 11 is provided with a glue adding opening. Therefore, glue in the glue mould 11 can be added through the glue adding opening, convenience and rapidness are achieved, and glue can be added through the glue adding opening when the glue sticking process is not influenced.
In a specific embodiment, a liquid level sensor may be disposed at the edge of the glue groove 111 to remind the user to add glue when the glue level decreases.
In a specific embodiment of a precise bonding device for piezoelectric ceramic plates, the glue coating mechanism 1 further comprises a glue barrel 13, and a glue outlet of the glue barrel 13 is communicated with a glue adding port. Therefore, a glue pump can be arranged at the glue outlet of the glue barrel 13, and the glue pump is used for conveying the glue in the glue barrel 13 from the glue outlet to the glue adding opening of the glue die 11 through a pipeline, so as to add the glue.
In a specific embodiment of the precise bonding device for the piezoelectric ceramic plates, the glue coating mechanism 1 further comprises a cooling structure 14, and the cooling structure 14 is used for cooling the glue in the glue mold 11 and/or the glue barrel 13. The glue used for bonding the piezoelectric ceramic piece 3 is preferably elastic epoxy resin glue, the preservation temperature of the epoxy resin glue is 20-30 degrees, and the preservation of the epoxy resin glue is facilitated in a cold environment, so that the arrangement of the cooling structure 14 for cooling the glue in the glue mold 11 and/or the glue barrel 13 is beneficial to prolonging the preservation time of the glue, and the glue is enabled to be in contact with the piezoelectric ceramic piece 3 in a better state.
In a specific embodiment of the precise bonding device for the piezoelectric ceramic plates, the cooling structure 14 includes a water cooling pipe 141, and the water cooling pipe 141 is disposed around the glue mold 11 and/or the glue bucket 13. Therefore, the cooling structure 14 is simple and reliable in structure, good in cooling effect and low in cost.
In a specific embodiment of the precise bonding device for the piezoelectric ceramic plates, the moving mechanism 2 comprises a guide rail 22, a slide block 23, an expansion piece 24 and a negative pressure head 25, wherein the slide block 23 is connected with the guide rail 22 in a sliding manner, the expansion piece 24 is connected with the slide block 23, the negative pressure head 25 is connected with the expansion piece 24, and the negative pressure head 25 is used for adsorbing the piezoelectric ceramic plates 3. Therefore, the guide rail 22 is located above the glue mold 11, the slider 23 can drive the extensible member 24 to move above the glue groove 111, so that the piezoelectric ceramic piece 3 can be aligned with the glue groove 111, the extensible member 24 can extend along the height direction, the piezoelectric ceramic piece 3 can enter the glue groove 111, the negative pressure head 25 can absorb and release the piezoelectric ceramic piece 3 from the end face of the piezoelectric ceramic piece 3, clamping from the side portion of the piezoelectric ceramic piece 3 is avoided, and the piezoelectric ceramic piece 3 cannot be damaged.
In a specific embodiment of the precise bonding device for the piezoceramic wafers, the expansion element 24 or the vacuum head 25 has an abutment surface 21.
In a specific embodiment of the precise bonding device for the piezoelectric ceramic pieces, the abutting surface 21 of the negative pressure head 25 is provided with a positioning piece, the positioning piece can position the position of the piezoelectric ceramic piece 3 on the negative pressure head 25, and the piezoelectric ceramic piece 3 can be manually positioned on the negative pressure head 25 by a person.
In a specific embodiment of the precise bonding device for the piezoelectric ceramic plates, the precise bonding device further comprises a curing mechanism 4, the curing mechanism 4 comprises a curing platform 41, the curing platform 41 is used for bearing an object to be bonded with the piezoelectric ceramic plates 3, and the moving mechanism 2 can move the piezoelectric ceramic plates 3 to the curing platform 41. Therefore, the moving mechanism 2 can move the piezoelectric ceramic plate 3 with the lower end surface being stained with the glue to the curing platform 41 to be accurately bonded with the object to be bonded.
In a specific embodiment of the precise bonding device for the piezoelectric ceramic plate, the curing mechanism 4 comprises a heating device connected with the curing platform 41, and the heating device is used for heating an object to be bonded with the piezoelectric ceramic plate 3. Therefore, the solidification of the glue can be accelerated, and the bonding quality of the piezoelectric ceramic piece 3 is improved.
Heating device can lay on the solidification platform for the heating panel, perhaps for being located the solidification platform, is located piezoceramics piece side, makes the glue film of temperature transmission to piezoceramics piece through heated air.
All the embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
The above are merely examples of the present invention, and are not intended to limit the present invention. Various modifications and variations of the present invention will be apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A precise bonding device of piezoelectric ceramic pieces is characterized by comprising:
the glue coating mechanism comprises a glue mold and a limiting part, the glue mold is provided with a glue groove, the glue groove corresponds to the end surface profile of the piezoelectric ceramic piece, the glue groove is used for accommodating glue, the limiting part is positioned on one side of the glue mold, where the glue groove is formed, and the length of the limiting part extending along the depth direction of the glue groove is smaller than the thickness of the piezoelectric ceramic piece;
the moving mechanism is used for enabling one end face of the piezoelectric ceramic piece to face the glue groove to perform reciprocating movement, the moving mechanism is provided with an abutting surface which is flush with the other end face of the piezoelectric ceramic piece, and the abutting surface can abut against the limiting piece.
2. The apparatus of claim 1, wherein the position limiter is a length-adjustable position limiter.
3. The device for precisely bonding the piezoelectric ceramic plates according to claim 1, wherein the glue mold is provided with a glue adding opening.
4. The precise bonding device for the piezoelectric ceramic plates according to claim 3, wherein the glue coating mechanism further comprises a glue barrel, and a glue outlet of the glue barrel is communicated with the glue adding port.
5. The precise bonding device for the piezoceramic wafers according to claim 4, wherein the glue coating mechanism further comprises a cooling structure for cooling the glue in the glue mold and/or the glue barrel.
6. The precise bonding device for the piezoceramic wafers according to claim 5, wherein the cooling structure comprises a water cooling pipeline, and the water cooling pipeline is arranged around the glue mold and/or the glue barrel.
7. The precise bonding device for the piezoceramic wafers according to claim 1, wherein the moving mechanism comprises a guide rail, a slider, an expansion member and a negative pressure head, the slider is connected with the guide rail in a sliding manner, the expansion member is connected with the slider, the negative pressure head is connected with the expansion member, and the negative pressure head is used for adsorbing the piezoceramic wafers.
8. The device for precisely bonding the piezoelectric ceramic plate as claimed in claim 7, wherein the expansion member or the negative pressure head has the abutting surface.
9. The device of claim 1, further comprising a curing mechanism, wherein the curing mechanism comprises a curing platform for carrying an object to be bonded to the piezoceramic wafer, and the moving mechanism is capable of moving the piezoceramic wafer to the curing platform.
10. The device of claim 9, wherein the curing mechanism comprises a heating device, the heating device is connected to the curing platform, and the heating device is used for heating an object to be bonded to the piezoceramic wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223315079.6U CN218831245U (en) | 2022-12-08 | 2022-12-08 | Precise bonding device for piezoelectric ceramic pieces |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223315079.6U CN218831245U (en) | 2022-12-08 | 2022-12-08 | Precise bonding device for piezoelectric ceramic pieces |
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| Publication Number | Publication Date |
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| CN218831245U true CN218831245U (en) | 2023-04-07 |
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| CN202223315079.6U Active CN218831245U (en) | 2022-12-08 | 2022-12-08 | Precise bonding device for piezoelectric ceramic pieces |
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| CN (1) | CN218831245U (en) |
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- 2022-12-08 CN CN202223315079.6U patent/CN218831245U/en active Active
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