CN218824747U - Radar and microseism composite life detection circuit - Google Patents

Abstract

The utility model provides a radar and micro-seismic composite life detection circuit, which comprises a comprehensive processing module, a radar detection module, a micro-seismic detection module, a camera module and a display module; the radar detection module comprises a first power supply unit and a radar detection unit which are independently arranged; the first power supply unit and the radar detection unit are respectively electrically connected with the comprehensive processing module, and the first power supply unit is used for providing working voltage for the radar detection unit; the microseismic detection module comprises a second power supply unit and a first acceleration sensor which are independently arranged, and the second power supply unit is used as a current source of the first acceleration sensor; the camera module and the display module are both in communication connection with the comprehensive processing module; the comprehensive processing module sequentially enables the first power supply unit and the radar detection unit to be conducted, or sequentially enables the second power supply unit and the first acceleration sensor to enter a working state.

Description

Radar and microseism composite life detection circuit

Technical Field

The utility model relates to an emergency rescue equipment technical field especially relates to a radar and compound life detection circuit of microseism.

Background

After an earthquake or a collapse disaster occurs, people trapped in a collapsed building or structure need to be detected, searched and rescued in time. At present, in the field of emergency rescue, a radar life detection instrument is mainly used for detecting trapped people in combination with a microseismic life detection instrument, wherein the radar life detection instrument is high-tech life-saving equipment which is developed by integrating a micropower ultra-wideband radar technology and a biomedical engineering technology, can use electromagnetic waves as a carrier, penetrates through a non-metal medium to detect body surface micromotion caused by human respiration, heartbeat and the like, and is widely applied to the fields of emergency, fire fighting, municipal administration, mine rescue and the like; the microseismic life detector adopts a specific detection element to identify the micro-vibration transmitted in the solid, such as shouting, beating, scratching or knocking of survivors, and is suitable for searching and positioning the survivors trapped in the concrete rubble.

The radar life detection instrument and the micro-motion life detection instrument are two independent devices, the advantages of the radar life detection instrument and the micro-motion life detection instrument can be independently exerted, but the radar life detection instrument and the micro-motion life detection instrument need to be respectively carried in use, the size and the weight of the device are large, and the device is not convenient to switch. CN105974492B discloses a multifunctional life detector, which adopts a structure of a host and a terminal, combines three functions of a UWB electromagnetic detector, a microvibration detector and an audio-video detector, but does not provide a specific detection circuit composition, and the integration level of the host and slave structures is not high, and the internal devices of the host share one power supply, and when different devices operate simultaneously, the internal devices may disturb the output of the same power supply, thereby reducing the precision and reliability of detection. Therefore, there is a need to provide a composite life detection circuit that combines the functions of a radar life detector and a micro-motion life detector, and makes the radar life detector or the micro-motion life detector work in reliable working states respectively, and can switch the functions of the two smoothly.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a switch smoothly, reliably provide the radar and the compound life detection circuit of microseism for radar life detection or microseism life detection subassembly provides independent power respectively with radar life detection and the function of microseism life detection.

The technical scheme of the utility model is realized like this: the utility model provides a radar and micro-seismic composite life detection circuit, which comprises a comprehensive processing module (1), a radar detection module (2), a micro-seismic detection module (3), a camera module (4) and a display module (5);

the radar detection module (2) is in communication connection with the comprehensive processing module (1), and the radar detection module (2) comprises a first power supply unit and a radar detection unit which are independently arranged; the first power supply unit and the radar detection unit are respectively electrically connected with the comprehensive processing module (1), and the first power supply unit is used for providing working voltage for the radar detection unit;

the microseismic detection module (3) is in communication connection with the comprehensive processing module (1); the microseismic detection module (3) comprises a second power supply unit and a first acceleration sensor which are independently arranged, and the second power supply unit is used as a current source of the first acceleration sensor;

the camera module (4) and the display module are in communication connection with the comprehensive processing module (1), and the camera module (4) and the display module (5) are always in a running state after being electrified;

the comprehensive processing module (1) sequentially enables the first power supply unit and the radar detection unit to be conducted, or sequentially enables the second power supply unit and the first acceleration sensor to enter a working state.

On the basis of the above technical solution, preferably, the first power supply unit includes a radar power supply chip U17, a first voltage dividing resistor R181, a second voltage dividing resistor R182, and a third voltage dividing resistor R180; the comprehensive processing module (1) comprises a plurality of communication interfaces and a universal input/output interface; a pin 5 of the radar power supply chip U17 is electrically connected with a DC _ PWR power supply, one end of a resistor R178 and one end of an inductor L12, the other end of the resistor R178 is electrically connected with one end of a resistor R179 and a pin 8 of the radar power supply chip U17 respectively, the other end of the resistor R179 is grounded, and the other end of the inductor L12 is electrically connected with a pin 2 of the radar power supply chip U17; a pin 7 of the radar power supply chip U17 is electrically connected with one end of the resistor R184 and a general input/output interface of the comprehensive processing module (1) respectively, and the other end of the resistor R184 is grounded; a pin 9 of the radar power supply chip U17 is electrically connected with one end of a resistor R183, the other end of the resistor R183 is electrically connected with a pin 1 and a pin 6 of the radar power supply chip U17 and one end of a first voltage-dividing resistor R181, the other end of the first voltage-dividing resistor R181 is electrically connected with one end of a second voltage-dividing resistor R182 and a pin 10 of the radar power supply chip U17, the other end of the second voltage-dividing resistor R182 is electrically connected with one end of a third voltage-dividing resistor R180, and the other end of the third voltage-dividing resistor R180 is grounded; a pin 1 of the radar power supply chip U17 is used as a power supply output end and is electrically connected with a pin 1 of the radar detection unit; a pin 2 and a pin 3 of the radar detection unit are respectively in corresponding communication connection with one path of communication interface of the comprehensive processing module (1), a pin 4 of the radar detection unit is electrically connected with the other general input/output interface of the comprehensive processing module (1), and a pin 5 of the radar detection unit is grounded; the comprehensive processing module (1) enables a radar power supply chip U17 or a radar detection unit through different universal input and output interfaces; the radar power supply chip U17 is SY7065; the integrated processing module (1) adopts an NT98528 chip.

Preferably, the second power supply unit includes a current source U23; pin 3 of the current source U23 is electrically connected to VCC _21V, pin 2 of the current source U23 is electrically connected to one end of the resistor R481 and one end of the resistor R482, the other end of the resistor R481 is electrically connected to the cathode of the diode D7, one end of the capacitor C527, one end of the capacitor C528 and the first current input end of the first acceleration sensor, the other end of the capacitor C527 and the other end of the capacitor C528 are electrically connected to the second current input end of the first acceleration sensor, and the second current input end of the first acceleration sensor is also grounded; the current source U23 is LM334SM;

the microseismic detection module (3) further comprises an operational amplifier U21 and an analog-to-digital conversion chip U22; the output end of the first acceleration sensor is electrically connected with one end of a capacitor C523, the other end of the capacitor C523 is electrically connected with one end of a resistor R473 and one end of a resistor R476 respectively, the other end of the resistor R473 is electrically connected with one end of a capacitor C524 and the non-inverting input end of the operational amplifier U21 respectively, and the other end of the resistor R476 is electrically connected with the other end of the capacitor C524 and the ground wire respectively; the operational amplifier U21 is powered by a single power supply adc _ power, an inverting input end of the operational amplifier U21 is electrically connected with one end of the resistor R469, one end of the resistor R470 and one end of the resistor R471 respectively, the other end of the resistor R469 is electrically connected with a +3.3V power supply, the other end of the resistor R470 is grounded, and the other end of the resistor R471 is electrically connected with an output end of the operational amplifier U21; the output end of the operational amplifier U21 is also electrically connected with a pin 3 of an analog-to-digital conversion chip U22, the pin of the operational amplifier U21 is electrically connected with an adc _ power supply, a pin 6 of the operational amplifier U21 is electrically connected with a general input/output interface K16 of the comprehensive processing module (1), a pin 4 of the operational amplifier U21 is electrically connected with a pin K13 of the comprehensive processing module (1), and a pin K17 and a pin K18 of the comprehensive processing module (1) are electrically connected; the chip model of the operational amplifier U21 is ADA4897-1ARJZ-R.

Further preferably, the camera module (4) comprises a camera module, an MOS transistor V10, a triode V11 and a dc motor; the serial communication interface of the camera module is correspondingly in communication connection with the communication interface of the comprehensive processing module (1); the starting end, the frame synchronization input end, the external clock input end and the reset end of the camera module are respectively and electrically connected with different general input and output interfaces of the comprehensive processing module (1) correspondingly; a universal input/output interface of the comprehensive processing module (1) is also electrically connected with a base electrode of the triode V11, an emitting electrode of the triode V11 is grounded, a collecting electrode of the triode V11 is electrically connected with one end of a resistor R103, the other end of the resistor R103 is electrically connected with one end of a capacitor C130, one end of a resistor R101 and a grid electrode of the MOS tube V10 respectively, a drain electrode of the MOS tube V10 is electrically connected with the other end of the capacitor C130, the other end of the capacitor R101 and a DC _3.3V power supply respectively, and a source electrode of the MOS tube V10 is electrically connected with the direct current motor; the camera module is arranged on a rotating shaft of the direct current motor, and the direct current motor drives the camera module to rotate.

Further preferably, the camera module (4) further comprises a supplementary lighting driving unit U18, an ambient light sensor, a plurality of LED lamp beads and a socket J16, wherein a communication port of the ambient light sensor is in corresponding communication connection with a group of communication interfaces of the comprehensive processing module (1); the enabling end of the light supplementing driving unit U18 is electrically connected with one end of the resistor R453, one end of the resistor R457 and one universal input/output interface of the comprehensive processing module (1) respectively, and the other end of the resistor R457 is grounded; the other end of the resistor R453 is electrically connected with the DC _5V power supply and the input end of the supplementary lighting driving unit U18 respectively; the output end of the supplementary lighting driving unit U18 is electrically connected to one end of an inductor L13, the other end of the inductor L13 is electrically connected to one end of a resistor R455 and a pin 1 of the socket J16, the other end of the resistor R455 is electrically connected to one end of a resistor R456 and a feedback input end of the supplementary lighting driving unit U18, the other end of the resistor R456 is electrically connected to one end of a resistor R454, and the other end of the resistor R454 is grounded and a pin 2 of the socket J16 are both grounded; the anode of each LED lamp bead is electrically connected with the pin 1 of the socket J16, and the cathode of each LED lamp bead is electrically connected with the pin 2 of the socket J16.

Further preferably, the display module (5) comprises an LCD screen and a screen backlight driving unit U11; the serial communication interface of the LCD screen is correspondingly connected with a group of communication interfaces of the comprehensive processing module (1) in a communication way; a pin 5 of the screen backlight driving unit U11 is electrically connected with a general input/output interface of the comprehensive processing module (1); a pin 6 of a screen backlight driving unit U11 is electrically connected with a DC _3.3V power supply and one end of an inductor L8 respectively, a pin 4 of the screen backlight driving unit U11 is electrically connected with the other end of the inductor L8 and an anode of a diode V12, a cathode of the diode V12 is electrically connected with an anode of a backlight LED of an LCD screen, a pin 1 of the screen backlight driving unit U11 is electrically connected with the cathode of the backlight LED of the LCD screen and one end of a resistor R106 respectively, and the other end of the resistor R106 is electrically connected with a pin 7, a pin 3 and a ground wire of the screen backlight driving unit U11 respectively; the screen backlight driving unit U11 adopts a TPS61161A chip.

Preferably, the wireless communication device further comprises a communication module (6), wherein the communication module (6) comprises a wireless transmission chip U8, an MOS tube V9 and a socket J3; a general input/output interface of the comprehensive processing module (1) is electrically connected with one end of a resistor R70, and the other end of the resistor R70 is respectively electrically connected with one end of a capacitor C111, one end of a resistor R68 and the grid electrode of the MOS transistor V9; the other end of the capacitor C111, the other end of the resistor R68, the drain of the MOS transistor V9 and one end of the resistor R64 are all electrically connected with DC _3.3V, the other end of the resistor R64 is electrically connected with the source of the MOS transistor V9, and the source of the MOS transistor V9 outputs a DC _ WIFI power supply; the pin 2 of the wireless transmission chip U8 is electrically connected with the socket J3, and the socket is electrically connected with the antenna; the pin 9 and the pin 22 of the wireless transmission chip U8 are electrically connected with the DC _ WIFI power supply; the pins 12, 13 and 16 of the wireless transmission chip U8 are respectively electrically connected with different general input and output interfaces of the comprehensive processing module (1) in a one-to-one correspondence manner; the pin 14, the pin 15, the pin 17, the pin 18 and the pin 19 of the wireless transmission chip U8 are electrically connected with a group of communication interfaces of the comprehensive processing module (1) in a one-to-one correspondence manner; the wireless transmission chip U8 is AW-NM372SM.

Preferably, the integrated processing module further comprises a first storage module J4 and a second storage module U9, wherein the pin 1, the pin 2, the pin 3, the pin 5, the pin 7, the pin 8 and the pin 9 of the first storage module J4 are respectively electrically connected with different general input/output interfaces of the integrated processing module (1) in a one-to-one correspondence manner; a pin 4 of the first memory module J4 is electrically connected with the DC _3.3V power supply; pins 2, 5 and 6 of the second storage module U9 are electrically connected with a group of communication interfaces of the comprehensive processing module (1) in a one-to-one correspondence manner, pins 1, 3 and 7 of the second storage module U9 are respectively electrically connected with different general input and output interfaces of the comprehensive processing module (1) in a one-to-one correspondence manner, and pins 4 and 9 of the second storage module U9 are both grounded; the first memory module J4 is MicroSDCard and the second memory module U9 is nadadflash.

Preferably, the device further comprises a second acceleration sensor U10, wherein a pin 2 and a pin 12 of the second acceleration sensor U10 are electrically connected with a group of communication interfaces of the comprehensive processing module (1) in a one-to-one correspondence manner, the pin 10 of the second acceleration sensor U10 is electrically connected with a general input/output interface of the comprehensive processing module (1), and a pin 3 and a pin 7 of the second acceleration sensor U10 are electrically connected with a DC — 3.3V power supply; the second acceleration sensor U10 is QMA7981.

Preferably, the system further comprises a power conversion module, wherein the power conversion module is electrically connected with the comprehensive processing module (1), the radar detection module (2), the microseismic detection module (3), the camera module (4) or the display module (5) and used for outputting electric energy.

The utility model provides a pair of radar and compound life detection circuit of slight shock for prior art, has following beneficial effect:

(1) According to the scheme, the radar detection module and the circuit part of the micro-seismic detection module are organically integrated, the radar detection module adopts an independent power supply to supply power independently, the micro-seismic detection module adopts an independent current source to supply power independently, and the current source can provide a differential current signal, so that the first acceleration sensor is in a reliable working state, and detection interference brought by an external severe environment is reduced;

(2) The radar power supply chip and the radar detection unit can be independently switched and powered on by the comprehensive processing module, and energy expenditure is saved when the radar power supply chip and the radar detection unit are not used;

(3) The microseism detection module is stably supplied with energy by a constant current source, the output of the microseism detection module is filtered, amplified and negatively fed back by an operational amplifier, and then the output signal is subjected to analog-to-digital conversion and output to a comprehensive processing module;

(4) The camera module can shoot an environment image of a rescue site, and a light supplement driving unit is started according to the intensity of environment light to drive an LED lamp bead for lighting to supplement light;

(5) The communication module and each storage module further provide a wireless data transmission function and a data and image storage function.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a structural block diagram of the composite life detection circuit of radar and microseismic of the present invention;

FIG. 2 is a partial pin wiring diagram of the integrated processing module of the composite life detection circuit for radar and microseismic of the present invention;

FIG. 3 is a wiring diagram of a radar detection module of the composite life detection circuit of the present invention;

FIG. 4 is a wiring diagram of the microseismic detection module of the radar and microseismic combined life detection circuit of the present invention;

fig. 5 is a wiring diagram of a part of a camera module of a radar and micro-seismic composite life detection circuit according to the present invention;

fig. 6 is a wiring diagram of a driving circuit of a dc motor of a camera module of the composite life detection circuit for radar and microseisms of the present invention;

fig. 7 is a wiring diagram of an ambient light sensor of a camera module of a radar and microseismic composite life detection circuit according to the present invention;

fig. 8 is a wiring diagram of the light-compensating driving unit of the camera module of the composite life detection circuit for radar and microseismic of the present invention;

fig. 9 is a wiring diagram of the display module of the composite life detection circuit for radar and microseismic of the present invention;

fig. 10 is a wiring diagram of the communication module of the composite life detection circuit for radar and microseisms according to the present invention;

fig. 11 is a wiring diagram of the communication module and the comprehensive processing module of the composite life detection circuit of radar and microseismic of the present invention;

fig. 12 is a wiring diagram of another communication module of the composite life detection circuit of radar and microseismic of the present invention;

fig. 13 is a wiring diagram of the first storage module of the composite life detection circuit for radar and microseismic of the present invention;

fig. 14 is a wiring diagram of a second storage module of the composite life detection circuit for radar and microseismic of the present invention;

fig. 15 is a wiring diagram of a second acceleration sensor of the composite life detection circuit for radar and microseisms of the present invention;

fig. 16 is a partial wiring diagram of the power conversion module of the composite life detection circuit for radar and microseismic of the present invention;

fig. 17 is a partial wiring diagram of a power conversion module of a radar and microseismic composite life detection circuit of the present invention;

fig. 18 is a wiring diagram of the power conversion module of the composite life detection circuit for radar and microseismic of the present invention outputting DC _5v _power;

fig. 19 is a wiring diagram of the output dc0.9v of the power conversion module of the radar and microseismic composite life detection circuit of the present invention;

fig. 20 is a wiring diagram of the power conversion module output DC _5V of the composite life detection circuit for radar and microseismic of the present invention;

fig. 21 is a wiring diagram of the multi-output step-down chip of the power conversion module of the composite life detection circuit for radar and microseisms of the present invention;

fig. 22 is a wiring diagram of the power conversion module outputting 1.2VD of the composite life detection circuit for radar and microseismic of the present invention;

fig. 23 is a wiring diagram of the power conversion module outputting dc3.3v of the composite life detection circuit for radar and microseismic of the present invention;

fig. 24 is a wiring diagram of the power conversion module output VCC _21V of the radar and microseismic composite life detection circuit of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

As shown in fig. 1, the utility model provides a radar and microseismic composite life detection circuit, which comprises a comprehensive processing module 1, a radar detection module 2, a microseismic detection module 3, a camera module 4, a display module 5 and the like;

the radar detection module 2 is in communication connection with the comprehensive processing module 1, and the radar detection module 2 comprises a first power supply unit and a radar detection unit which are independently arranged; the first power supply unit and the radar detection unit are respectively electrically connected with the comprehensive processing module 1, and the first power supply unit is used for providing working voltage for the radar detection unit; the radar detection module 2 sends the pulse echo signal to the comprehensive processing module 1; the radar detection module 2 is used for realizing the function of radar life detection.

The microseismic detection module 3 is in communication connection with the comprehensive processing module 1; the microseismic detection module 3 comprises a second power supply unit and a first acceleration sensor which are independently arranged, and the second power supply unit is used as a current source of the first acceleration sensor; the microseismic detection module 3 is used for realizing the function of microseismic life detection.

The camera module 4 and the display module 5 are both in communication connection with the comprehensive processing module 1, and the camera module 4 and the display module 5 are always kept in a running state after being electrified;

the comprehensive processing module 1 sequentially turns on the first power supply unit and the radar detection unit, or sequentially turns on the second power supply unit and the first acceleration sensor to enter a working state.

In order to avoid the interference or the shifting of equipment operation to the power production simultaneously, this scheme has adopted independent power supply's mode, and first power supply unit only cooperates the radar detection unit and work promptly. The second power supply unit works only in cooperation with the first acceleration sensor. The circuit parts of the two detection modules are integrated, so that the volume of the equipment is reduced, and the number of rescue equipment carried by rescue workers is reduced. Fig. 2 provides a wiring diagram of the integrated processing module 1, and the integrated processing module 1 of the present solution may be NT98528, which is a chip with image processing capability that integrates an ARM Cortex A9 CPU core, a latest ISP generation, an h.265/h.264 video compression codec, a high performance hardware DLA module, a graphics engine, an ethernet PHY, a USB 2.0, an audio codec, an RTC, and an SD/SDIO 3.0.

As shown in fig. 2 and 3, the first power supply unit includes a radar power supply chip U17, a first voltage dividing resistor R181, a second voltage dividing resistor R182, and a third voltage dividing resistor R180; the comprehensive processing module 1 comprises a plurality of communication interfaces and a universal input/output interface; a pin 5 of the radar power supply chip U17 is electrically connected with a DC _ PWR power supply, one end of a resistor R178 and one end of an inductor L12, the other end of the resistor R178 is electrically connected with one end of a resistor R179 and a pin 8 of the radar power supply chip U17 respectively, the other end of the resistor R179 is grounded, and the other end of the inductor L12 is electrically connected with a pin 2 of the radar power supply chip U17; a pin 7 of the radar power supply chip U17 is electrically connected with one end of the resistor R184 and a general input/output interface of the comprehensive processing module 1 respectively, and the other end of the resistor R184 is grounded; a pin 9 of the radar power supply chip U17 is electrically connected with one end of a resistor R183, the other end of the resistor R183 is electrically connected with a pin 1 and a pin 6 of the radar power supply chip U17 and one end of a first voltage-dividing resistor R181, the other end of the first voltage-dividing resistor R181 is electrically connected with one end of a second voltage-dividing resistor R182 and a pin 10 of the radar power supply chip U17, the other end of the second voltage-dividing resistor R182 is electrically connected with one end of a third voltage-dividing resistor R180, and the other end of the third voltage-dividing resistor R180 is grounded; a pin 1 of the radar power supply chip U17 is used as a power supply output end and is electrically connected with a pin 1 of the radar detection unit; a pin 2 and a pin 3 of the radar detection unit are respectively in corresponding communication connection with one path of communication interface of the comprehensive processing module 1, a pin 4 of the radar detection unit is electrically connected with the other general input/output interface of the comprehensive processing module 1, and a pin 5 of the radar detection unit is grounded; the comprehensive processing module 1 enables the radar power supply chip U17 or the radar detection unit through different universal input and output interfaces.

The radar power supply chip U17 is powered by a DC _ PWR power supply, and decoupling capacitors C262 and C261 are connected in parallel to an input terminal, i.e., pin 5, of the radar power supply chip U17. The DC _ PWR power supply is also sent to a pin 2 of a radar power supply chip U17 through an inductor L12, and is sent to a pin 8 of the radar power supply chip U17 after being divided by series-connected resistors R178 and R179; pin 7 of the radar power supply chip U17 is an enable terminal, and is controlled by a pin T11 of the integrated processing module 1, and when the pin outputs a high level, the radar power supply chip U17 is enabled. Pin 1 of the radar power supply chip U17 is an output terminal, on one hand, a signal output by the output terminal is filtered by decoupling capacitors C263, C264, and C265 to output a rad _ power, which is supplied to a radar detection unit for use, and the signal output by the output terminal is also divided by a voltage dividing circuit composed of resistors R181, R182, and R180 and then sent back to a feedback terminal, that is, pin 10, of the radar power supply chip U17. In the radar detection unit, a commercially available microwave radar product can be adopted, the working voltage is 5.6V, the interface type is a UART interface, and the UART interface is in corresponding communication connection with the pins R13 and P12 of the comprehensive processing module 1. The port of awaking of radar detection unit and the pin T10 electric connection of integrated processing module 1, when integrated processing module 1's pin T10 output high level, radar detection unit will be awaken up and get into operating condition, otherwise radar detection unit will get into dormant state. The DC PWR power supply may be directly connected to a built-in battery.

As shown in fig. 2 and 4, the second power supply unit includes a current source U23; pin 3 of the current source U23 is electrically connected to VCC _21V, pin 2 of the current source U23 is electrically connected to one end of the resistor R481 and one end of the resistor R482, the other end of the resistor R481 is electrically connected to the cathode of the diode D7, one end of the capacitor C527, one end of the capacitor C528, and the first current input end of the first acceleration sensor, the other end of the capacitor C527 and the other end of the capacitor C528 are both electrically connected to the second current input end of the first acceleration sensor, and the second current input end of the first acceleration sensor is also grounded.

The microseismic detection module 3 also comprises an operational amplifier U21 and an analog-to-digital conversion chip U22; the output end of the first acceleration sensor is electrically connected with one end of a capacitor C523, the other end of the capacitor C523 is electrically connected with one end of a resistor R473 and one end of a resistor R476 respectively, the other end of the resistor R473 is electrically connected with one end of a capacitor C524 and the non-inverting input end of an operational amplifier U21 respectively, and the other end of the resistor R476 is electrically connected with the other end of the capacitor C524 and a ground wire respectively; the operational amplifier U21 is powered by a single power supply adc _ power, the inverting input end of the operational amplifier U21 is electrically connected with one end of the resistor R469, one end of the resistor R470 and one end of the resistor R471 respectively, the other end of the resistor R469 is electrically connected with a +3.3V power supply, the other end of the resistor R470 is grounded, and the other end of the resistor R471 is electrically connected with the output end of the operational amplifier U21; the output end of the operational amplifier U21 is also electrically connected to the pin 3 of the analog-to-digital conversion chip U22, the pin of the operational amplifier U21 is electrically connected to the adc _ power supply, the pin 6 of the operational amplifier U21 is electrically connected to the general input/output interface K16 of the integrated processing module 1, the pin 4 of the operational amplifier U21 is electrically connected to the pin K13 of the integrated processing module 1, and the pin K17 and the pin K18 of the integrated processing module 1 are electrically connected.

In the scheme, a first acceleration sensor selects CAYD149V-500J, the detection range is +/-10 g, a constant current signal needs to be input into the sensor, the constant current signal is provided by a current source U23, the current source U23 is a three-pin output adjustable current source, a peripheral circuit of the current source U23 shown in the figure is a typical current source with zero temperature coefficient, and the output current of the current source U23 is about 0.134V/R482=4.06mA; the capacitors C527 and C528 function as a filter. The output of the first acceleration sensor is a 10-14V pulse voltage signal singleA, the signal singleA is sent to the non-inverting input end of an operational amplifier U21 after passing through a filter circuit consisting of a capacitor C523 and a capacitor C524 and resistors R476 and R473, the operational amplifier U21 and peripheral devices thereof form a low-pass filter amplifying circuit, the output SIN1 of the operational amplifier U21 is sent to the input end of an analog-to-digital conversion chip U22, namely AD7680, on the one hand, the negative feedback resistor R471 is sent to the inverting input end of the operational amplifier U21, and the input signal of the inverting input end is raised by +3.3V level. The single-ended power supply used by the analog-to-digital conversion chip U22 is also adc _ power, and the output of the analog-to-digital conversion chip U22 adopts an SPI four-wire interface and is electrically connected to one of the communication ports of the integrated processing module 1, i.e., the pins K17, K18, K13, and K16.

As shown in fig. 15, in order to detect whether the current circuit is in the moving process, the present solution is further equipped with a second acceleration sensor U10, pins 2 and 12 of the second acceleration sensor U10 are electrically connected to a group of communication interfaces of the integrated processing module 1 in a one-to-one correspondence manner, pin 10 of the second acceleration sensor U10 is electrically connected to a general-purpose input/output interface of the integrated processing module 1, and pin 3 and pin 7 of the second acceleration sensor U10 are electrically connected to the DC — 3.3V power supply. The pin 10 of the second acceleration sensor U10 is an enable terminal, and the pin 2 and the pin 12 of the second acceleration sensor U10 are correspondingly connected to the corresponding serial communication interface of the integrated processing module 1 as an I2C interface.

As shown in fig. 2 in combination with fig. 5 and 6, the camera module 4 includes a camera module, a MOS transistor V10, a triode V11, and a dc motor; the serial communication interface of the camera module is correspondingly in communication connection with the communication interface of the comprehensive processing module 1; the starting end, the frame synchronization input end, the external clock input end and the reset end of the camera module are respectively and electrically connected with different universal input and output interfaces of the comprehensive processing module 1 correspondingly; a universal input/output interface of the comprehensive processing module 1 is also electrically connected with a base electrode of the triode V11, an emitting electrode of the triode V11 is grounded, a collector electrode of the triode V11 is electrically connected with one end of the resistor R103, the other end of the resistor R103 is electrically connected with one end of the capacitor C130, one end of the resistor R101 and a gate electrode of the MOS transistor V10 respectively, a drain electrode of the MOS transistor V10 is electrically connected with the other end of the capacitor C130, the other end of the capacitor R101 and the DC _3.3V power supply respectively, and a source electrode of the MOS transistor V10 is electrically connected with the direct current motor; the camera module is arranged on a rotating shaft of the direct current motor, and the direct current motor drives the camera module to rotate.

The camera module adopts an SC200AI series with 200 ten thousand pixels, and the camera is provided with an MIPI data interface which is correspondingly in communication connection with pins D19, D18, E19, E18, F19 and F18 of the integrated processing module 1; the MIPI data interface adopts differential signal transmission, and the anti-interference capability is strong. The PWDNB port of the camera module is used for a power supply shutoff function, and the SCL port and the SDA port of the camera module are used for outputting image cache; the EFSYNC port of the camera module is used for inputting an external frame synchronization signal; the EXTCLK port of the camera module is used for clock input; the XSHUNDN port of the camera module is used for a reset function. Similarly, as shown in fig. 6, in order to enable the rotation function of the dc motor, the triode V11 may be turned on through the pin V13 of the comprehensive processing module 1, and the MOS transistor V10 is further turned on, so that the 3.3V/motor is output to the dc motor, and the dc motor drives the camera module to rotate by a certain angle, thereby obtaining a required image.

The solutions shown in fig. 7 and 8 are further improved to supplement the shortage of ambient light and improve the imaging quality. The camera module 4 of the present solution further includes a light supplement driving unit U18, an ambient light sensor, a plurality of LED lamp beads, and a socket J16, and in fig. 7, a communication port of the ambient light sensor is correspondingly connected to a group of communication interfaces of the comprehensive processing module 1 in a communication manner; in fig. 8, the enable terminal of the fill light driving unit U18 is electrically connected to one terminal of the resistor R453, one terminal of the resistor R457, and a general purpose input/output interface of the comprehensive processing module 1, respectively, and the other terminal of the resistor R457 is grounded; the other end of the resistor R453 is electrically connected with the DC _5V power supply and the input end of the light supplementing driving unit U18 respectively; the output end of the light supplement driving unit U18 is electrically connected to one end of an inductor L13, the other end of the inductor L13 is electrically connected to one end of a resistor R455 and a pin 1 of the socket J16, the other end of the resistor R455 is electrically connected to one end of a resistor R456 and a feedback input end of the light supplement driving unit U18, the other end of the resistor R456 is electrically connected to one end of a resistor R454, and the other end of the resistor R454 is grounded and a pin 2 of the socket J16 are grounded; the anode of each LED lamp bead is electrically connected with the pin 1 of the socket J16, and the cathode of each LED lamp bead is electrically connected with the pin 2 of the socket J16. The ambient light sensor acquires a sensing signal and sends the output signal to pins P11 and N11 of the comprehensive processing module 1 through a communication port, if light supplement is needed, a pin V10 of the comprehensive processing module 1 outputs a high level, so that the light supplement driving unit U18 is started, the light supplement driving unit U18 is a synchronous step-down power supply chip, the output voltage is determined by resistances of resistors R455, R456 and R454, the output voltage of the illustrated light supplement driving unit U18 is about 3.3V, a plurality of LED lamp beads are connected in parallel to pins of a socket J16, in order to avoid overcurrent of the LED lamp beads, a plurality of LED lamp beads can be adopted, if 6 or more LED lamp beads are connected in series and then connected in parallel to pins of the J16, a field lighting function is provided, and the imaging quality of the camera module is improved. The ambient light sensor may select LRT-F216A to support I2C output.

As also shown in fig. 1 and 2 in conjunction with fig. 9, the display module 5 includes an LCD panel and a screen backlight driving unit U11; the serial communication interface of the LCD screen is correspondingly communicated and connected with a group of communication interfaces of the comprehensive processing module 1; a pin 5 of the screen backlight driving unit U11 is electrically connected with a general input/output interface of the comprehensive processing module 1; pin 6 of screen backlight driving unit U11 is electrically connected to DC _3.3V power supply and one end of inductor L8, pin 4 of screen backlight driving unit U11 is electrically connected to the other end of inductor L8 and anode of diode V12, cathode of diode V12 is electrically connected to anode of backlight LED of LCD screen, pin 1 of screen backlight driving unit U11 is electrically connected to cathode of backlight LED of LCD screen and one end of resistor R106, and the other end of resistor R106 is electrically connected to pin 7, pin 3 and ground wire of screen backlight driving unit U11. In the drawing, the LCD panel is not shown, and only the pins thereof connected to the socket J6, i.e., the DSI interfaces of the integrated processing module 1, i.e., the pins M18, M19, N18, N19, P18 and P19, corresponding to the pins DSI _ DON, DSI _ DOP, DSI _ CKN, DSI _ CKP, DSI _ D1N and DSI _ D1P in fig. 2 and 7, are shown. The LCD _ RESET pin is an LCD screen RESET pin and is electrically connected to a pin T8 of the comprehensive processing module 1. The LCD screen is provided with backlight LEDs, a screen backlight driving unit U11 can be enabled through a pin E6 of the comprehensive processing module 1, and a loop is formed by a pin 4 and a pin 1 of the screen backlight driving unit U11, an anode LEDA _ m of the backlight LEDs and a cathode LEDA _ k of the backlight LEDs. The screen backlight driving unit U11 may employ a TPS61161A chip.

As shown in fig. 1, fig. 2, fig. 10, fig. 11 and fig. 12, in order to improve the wireless communication capability of the circuit, the present solution further includes a communication module 6, where the communication module 6 includes a wireless transmission chip U8, a MOS transistor V9 and a socket J3; a general input/output interface of the comprehensive processing module 1 is electrically connected with one end of a resistor R70, and the other end of the resistor R70 is electrically connected with one end of a capacitor C111, one end of a resistor R68 and the grid of the MOS transistor V9 respectively; the other end of the capacitor C111, the other end of the resistor R68, the drain of the MOS transistor V9 and one end of the resistor R64 are all electrically connected with DC _3.3V, the other end of the resistor R64 is electrically connected with the source of the MOS transistor V9, and the source of the MOS transistor V9 outputs a DC _ WIFI power supply; the pin 2 of the wireless transmission chip U8 is electrically connected with the socket J3, and the socket is electrically connected with the antenna; the pin 9 and the pin 22 of the wireless transmission chip U8 are electrically connected with the DC _ WIFI power supply; the pins 12, 13 and 16 of the wireless transmission chip U8 are electrically connected with different general input/output interfaces of the integrated processing module 1 in a one-to-one correspondence manner; the pins 14, 15, 17, 18 and 19 of the wireless transmission chip U8 are electrically connected to a group of communication interfaces of the integrated processing module 1 in a one-to-one correspondence manner.

As shown in fig. 10 and 11, the wireless transmission chip U8 is AW-NM372SM, and the pin 2 is an antenna interface. When data are required to be received/transmitted, the pin U11 of the comprehensive processing module 1, namely WIFI _ power, outputs high level, the MOS tube V9 is enabled, and at the moment, DC _ WIFI has voltage output, namely DC _3.3V, so that the wireless transmission chip U8 is electrified and initialized. Subsequently, SDIO ports of the wireless transmission chip U8, i.e., the pins 14, 15, 16, 17, 18, and 19, are communicatively connected to the pins G7, E7, F9, H5, F10, and F8 of the integrated processing module 1. The pin 12 and the pin 13 of the wireless transmission chip U8 are electrically connected to the pin T9 and the pin R8 of the integrated processing module 1, respectively, the pin 12 of the wireless transmission chip U8 is a reset port, and the pin 13 of the wireless transmission chip U8 is an interrupt output pin, i.e., when external data is input, the wireless transmission chip U8 sends an interrupt signal to the integrated processing module 1. In order to increase the application range of the device, as shown in fig. 12, a socket J7 may be further provided, and the socket J7 is electrically connected to the ethernet interface of the integrated processing module 1, that is, the pins W15, V15, W14 and V14, so as to be further connected to an ethernet controller of a peripheral device, thereby providing an ethernet extension function.

As shown in fig. 1, fig. 2, fig. 13 and fig. 14, in order to facilitate data storage, the present solution further includes a first storage module J4 and a second storage module U9, where a pin 1, a pin 2, a pin 3, a pin 5, a pin 7, a pin 8 and a pin 9 of the first storage module J4 are respectively electrically connected to different general input/output interfaces of the comprehensive processing module 1 in a one-to-one correspondence manner; a pin 4 of the first memory module J4 is electrically connected with the DC _3.3V power supply; the pin 2, the pin 5 and the pin 6 of the second storage module U9 are electrically connected with a group of communication interfaces of the integrated processing module 1 in a one-to-one correspondence manner, the pin 1, the pin 3 and the pin 7 of the second storage module U9 are respectively electrically connected with different general input/output interfaces of the integrated processing module 1 in a one-to-one correspondence manner, and the pin 4 and the pin 9 of the second storage module U9 are both grounded. The top view of fig. 9 is a standard wiring diagram of a MicroSDCard. The lower diagram of fig. 9 shows that the second storage module U9, i.e., the NADA FLASH, is electrically connected to the SPI _ D0, SPI _ DI, SPI _ CLK, and SPI _ CS of the integrated processing module 1 through the SPI interface, and the pin/WP and pin/HOLD of the second storage module U9 are write-protection and input-HOLD functions, and are electrically connected to different general-purpose input/output interfaces of the integrated processing module 1, respectively.

As shown in fig. 1 and fig. 2 in combination with fig. 16, fig. 17, fig. 18, fig. 19, fig. 20, fig. 21, fig. 22, fig. 23 and fig. 24, the present solution includes a power conversion module. The power conversion module is electrically connected with the comprehensive processing module 1, the radar detection module 2, the microseismic detection module 3, the camera module 4 or the display module 5 and is used for outputting electric energy to other modules respectively.

The circuits of fig. 16 and 17 respectively show schematic diagrams of the output voltages VCC _ BAT, VCC _ RTC, DC _3.3 _rtcand DC _ PWR of the battery V8, wherein the battery V8 is formed by connecting two rechargeable batteries of 3.7V and 21700mAh capacity in series. The DC _ PWR signal is divided by resistors R1 and R7 to obtain PWR _ AD, i.e. a voltage sampling signal of the battery V8, and sent back to the ADC port of the integrated processing module 1. VCC _ RTC and DC _3.3 \/u RTC are power supplies of the RTC real-time clock built in the integrated processing module 1. The input of the first power supply unit is directly connected to DC _ PWR, i.e. the direct source is the battery V8. The working voltage 21V required by the second power supply unit is further processed by the DC _ PWR signal to obtain DC _5V, and then VCC _21V is further obtained. And the first power supply unit and the second power supply unit do not work simultaneously, so that mutual interference between the first power supply unit and the second power supply unit during working can be avoided.

As shown in fig. 18, DC _ PWR is further outputted through the chip U1, i.e., the DCDC voltage regulation chip, the output voltage is determined by the resistances of the resistors R6, R11, and R14, B1 in the circuit in the middle of fig. 10 is a magnetic bead, which can reduce electromagnetic interference, and the chip U1 outputs 5V DC voltage DC _5v _power.

As shown in fig. 19, the 5V DC voltage DC _5v _poweris sent to the voltage regulation chip U2, and outputs DC _0.9V after being limited by the peripheral circuit of the voltage regulation chip U2, and as shown in fig. 20, the 5V DC voltage DC _5v _poweris also loaded on the drain of the MOS transistor V1, and when the pin U18 of the integrated processing module 1 outputs a high level, the transistor V4 is turned on, and the MOS transistor V1 is also turned on, and at this time, the MOS transistor V1 functions as a switch, and outputs a DC _5V voltage, similar to a switching power supply function.

As shown in fig. 21, after the DC _5V voltage is obtained, the voltage can further pass through a multi-output buck chip U3, which integrates a synchronous buck regulator and two linear regulators LDO, and can respectively output DC _1.8v _ldo, B _ VDD _ a2.8, and DC _3.3v _rtc, which are respectively used by the camera module or the integrated processing module 1. In addition, the circuit diagrams of fig. 22 and 23 respectively show the wiring diagrams of +1.2VD and dc3.3v obtained by the DCDC voltage reduction chip for the DC — 5V voltage. Fig. 24 shows a wiring diagram of the boost chip U20, and the chip U20 boosts the input DC _5V to VCC _21V for the current source U23. The battery V8 of the present embodiment may be further configured with a charging circuit, which is not described herein again.

The utility model discloses an application method does, with circuit integration in one or more circuit board to encapsulate the circuit board in the box of easily carrying. When the portable micro-seismic detector is used, rescue workers carry the portable micro-seismic detector to enter a search and rescue site, the buttons of the radar detection module 2, the micro-seismic detection module 3, the camera module 4 and the display module 5 are correspondingly arranged on the box body, and the radar detection module 2, the micro-seismic detection module 3, the camera module 4 or the display module 5 are started as required.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A radar and microseismic composite life detection circuit is characterized by comprising a comprehensive processing module (1), a radar detection module (2), a microseismic detection module (3), a camera module (4) and a display module (5);

the radar detection module (2) is in communication connection with the comprehensive processing module (1), and the radar detection module (2) comprises a first power supply unit and a radar detection unit which are independently arranged; the first power supply unit and the radar detection unit are respectively electrically connected with the comprehensive processing module (1), and the first power supply unit is used for providing working voltage for the radar detection unit;

the microseismic detection module (3) is in communication connection with the comprehensive processing module (1); the microseismic detection module (3) comprises a second power supply unit and a first acceleration sensor which are independently arranged, and the second power supply unit is used as a current source of the first acceleration sensor;

the camera module (4) and the display module are in communication connection with the comprehensive processing module (1), and the camera module (4) and the display module (5) are always in a running state after being electrified;

the comprehensive processing module (1) sequentially enables the first power supply unit and the radar detection unit to be conducted, or sequentially enables the second power supply unit and the first acceleration sensor to enter a working state.

2. The radar and microseismic composite life detection circuit of claim 1 wherein the first power supply unit comprises a radar power supply chip U17, a first voltage dividing resistor R181, a second voltage dividing resistor R182 and a third voltage dividing resistor R180; the comprehensive processing module (1) comprises a plurality of communication interfaces and a universal input/output interface; a pin 5 of the radar power supply chip U17 is electrically connected with a DC _ PWR power supply, one end of a resistor R178 and one end of an inductor L12, the other end of the resistor R178 is electrically connected with one end of a resistor R179 and a pin 8 of the radar power supply chip U17 respectively, the other end of the resistor R179 is grounded, and the other end of the inductor L12 is electrically connected with a pin 2 of the radar power supply chip U17; a pin 7 of the radar power supply chip U17 is electrically connected with one end of the resistor R184 and a general input/output interface of the comprehensive processing module (1) respectively, and the other end of the resistor R184 is grounded; a pin 9 of the radar power supply chip U17 is electrically connected with one end of a resistor R183, the other end of the resistor R183 is electrically connected with a pin 1 and a pin 6 of the radar power supply chip U17 and one end of a first voltage-dividing resistor R181, the other end of the first voltage-dividing resistor R181 is electrically connected with one end of a second voltage-dividing resistor R182 and a pin 10 of the radar power supply chip U17, the other end of the second voltage-dividing resistor R182 is electrically connected with one end of a third voltage-dividing resistor R180, and the other end of the third voltage-dividing resistor R180 is grounded; a pin 1 of the radar power supply chip U17 is used as a power supply output end and is electrically connected with a pin 1 of the radar detection unit; a pin 2 and a pin 3 of the radar detection unit are respectively in corresponding communication connection with one communication interface of the comprehensive processing module (1), a pin 4 of the radar detection unit is electrically connected with the other universal input/output interface of the comprehensive processing module (1), and a pin 5 of the radar detection unit is grounded; the comprehensive processing module (1) enables a radar power supply chip U17 or a radar detection unit through different universal input/output interfaces; the radar power supply chip U17 is SY7065; the comprehensive processing module (1) adopts an NT98528 chip.

3. The radar and microseismic composite life detection circuit of claim 2 wherein the second power unit includes a current source U23; pin 3 of the current source U23 is electrically connected to VCC _21V, pin 2 of the current source U23 is electrically connected to one end of the resistor R481 and one end of the resistor R482, the other end of the resistor R481 is electrically connected to the cathode of the diode D7, one end of the capacitor C527, one end of the capacitor C528 and the first current input end of the first acceleration sensor, the other end of the capacitor C527 and the other end of the capacitor C528 are electrically connected to the second current input end of the first acceleration sensor, and the second current input end of the first acceleration sensor is also grounded; the current source U23 is LM334SM;

the microseismic detection module (3) further comprises an operational amplifier U21 and an analog-to-digital conversion chip U22; the output end of the first acceleration sensor is electrically connected with one end of a capacitor C523, the other end of the capacitor C523 is electrically connected with one end of a resistor R473 and one end of a resistor R476 respectively, the other end of the resistor R473 is electrically connected with one end of a capacitor C524 and the non-inverting input end of the operational amplifier U21 respectively, and the other end of the resistor R476 is electrically connected with the other end of the capacitor C524 and the ground wire respectively; the operational amplifier U21 is powered by a single power supply adc _ power, the inverting input end of the operational amplifier U21 is electrically connected with one end of the resistor R469, one end of the resistor R470 and one end of the resistor R471 respectively, the other end of the resistor R469 is electrically connected with a +3.3V power supply, the other end of the resistor R470 is grounded, and the other end of the resistor R471 is electrically connected with the output end of the operational amplifier U21; the output end of the operational amplifier U21 is also electrically connected with a pin 3 of an analog-to-digital conversion chip U22, the pin of the operational amplifier U21 is electrically connected with an adc _ power supply, a pin 6 of the operational amplifier U21 is electrically connected with a general input/output interface K16 of the comprehensive processing module (1), a pin 4 of the operational amplifier U21 is electrically connected with a pin K13 of the comprehensive processing module (1), and a pin K17 and a pin K18 of the comprehensive processing module (1) are electrically connected; the chip model of the operational amplifier U21 is ADA4897-1ARJZ-R.

4. The radar and microseismic composite life detection circuit of claim 3 wherein the camera module (4) comprises a camera module, a MOS transistor V10, a triode V11 and a DC motor; the serial communication interface of the camera module is correspondingly in communication connection with the communication interface of the comprehensive processing module (1); the starting end, the frame synchronization input end, the external clock input end and the reset end of the camera module are respectively and electrically connected with different general input and output interfaces of the comprehensive processing module (1) correspondingly; a universal input/output interface of the comprehensive processing module (1) is also electrically connected with a base electrode of the triode V11, an emitting electrode of the triode V11 is grounded, a collecting electrode of the triode V11 is electrically connected with one end of a resistor R103, the other end of the resistor R103 is electrically connected with one end of a capacitor C130, one end of a resistor R101 and a grid electrode of the MOS tube V10 respectively, a drain electrode of the MOS tube V10 is electrically connected with the other end of the capacitor C130, the other end of the capacitor R101 and a DC _3.3V power supply respectively, and a source electrode of the MOS tube V10 is electrically connected with the direct current motor; the camera module is arranged on a rotating shaft of the direct current motor, and the direct current motor drives the camera module to rotate.

5. The radar and microseismic composite life detection circuit according to claim 4, wherein the camera module (4) further comprises a supplementary lighting driving unit U18, an ambient light sensor, a plurality of LED lamp beads and a socket J16, and a communication port of the ambient light sensor is correspondingly connected with a group of communication interfaces of the integrated processing module (1) in a communication manner; an enabling end of the light supplementing driving unit U18 is electrically connected with one end of the resistor R453, one end of the resistor R457 and one universal input/output interface of the comprehensive processing module (1) respectively, and the other end of the resistor R457 is grounded; the other end of the resistor R453 is electrically connected with the DC _5V power supply and the input end of the supplementary lighting driving unit U18 respectively; the output end of the supplementary lighting driving unit U18 is electrically connected to one end of an inductor L13, the other end of the inductor L13 is electrically connected to one end of a resistor R455 and a pin 1 of the socket J16, the other end of the resistor R455 is electrically connected to one end of a resistor R456 and a feedback input end of the supplementary lighting driving unit U18, the other end of the resistor R456 is electrically connected to one end of a resistor R454, and the other end of the resistor R454 is grounded and a pin 2 of the socket J16 are both grounded; the anode of each LED lamp bead is electrically connected with the pin 1 of the socket J16, and the cathode of each LED lamp bead is electrically connected with the pin 2 of the socket J16.

6. The radar and microseismic composite life detection circuit of claim 4 wherein the display module (5) comprises an LCD screen and a screen backlight driving unit U11; the serial communication interface of the LCD screen is correspondingly communicated and connected with a group of communication interfaces of the comprehensive processing module (1); a pin 5 of the screen backlight driving unit U11 is electrically connected with a general input/output interface of the comprehensive processing module (1); a pin 6 of a screen backlight driving unit U11 is electrically connected with a DC _3.3V power supply and one end of an inductor L8 respectively, a pin 4 of the screen backlight driving unit U11 is electrically connected with the other end of the inductor L8 and an anode of a diode V12, a cathode of the diode V12 is electrically connected with an anode of a backlight LED of an LCD screen, a pin 1 of the screen backlight driving unit U11 is electrically connected with a cathode of the backlight LED of the LCD screen and one end of a resistor R106 respectively, and the other end of the resistor R106 is electrically connected with a pin 7, a pin 3 and a ground wire of the screen backlight driving unit U11 respectively; the screen backlight driving unit U11 adopts a TPS61161A chip.

7. The radar and microseismic composite life detection circuit of claim 2 further comprising a communication module (6), wherein the communication module (6) comprises a wireless transmission chip U8, a MOS tube V9 and a socket J3; a general input/output interface of the comprehensive processing module (1) is electrically connected with one end of a resistor R70, and the other end of the resistor R70 is electrically connected with one end of a capacitor C111, one end of a resistor R68 and the grid electrode of the MOS transistor V9 respectively; the other end of the capacitor C111, the other end of the resistor R68, the drain of the MOS transistor V9 and one end of the resistor R64 are all electrically connected with DC _3.3V, the other end of the resistor R64 is electrically connected with the source of the MOS transistor V9, and the source of the MOS transistor V9 outputs a DC _ WIFI power supply; the pin 2 of the wireless transmission chip U8 is electrically connected with the socket J3, and the socket is electrically connected with the antenna; pin 9 and pin 22 of the wireless transmission chip U8 are electrically connected to the DC _ WIFI power supply; the pin 12, the pin 13 and the pin 16 of the wireless transmission chip U8 are respectively electrically connected with different general input and output interfaces of the comprehensive processing module (1) in a one-to-one correspondence manner; the pin 14, the pin 15, the pin 17, the pin 18 and the pin 19 of the wireless transmission chip U8 are electrically connected with a group of communication interfaces of the comprehensive processing module (1) in a one-to-one correspondence manner; the wireless transmission chip U8 is AW-NM372SM.

8. The radar and microseismic composite life detection circuit according to claim 2, further comprising a first memory module J4 and a second memory module U9, wherein the pin 1, the pin 2, the pin 3, the pin 5, the pin 7, the pin 8 and the pin 9 of the first memory module J4 are respectively electrically connected with different general input and output interfaces of the comprehensive processing module (1) in a one-to-one correspondence manner; a pin 4 of the first memory module J4 is electrically connected with the DC _3.3V power supply; the pin 2, the pin 5 and the pin 6 of the second storage module U9 are electrically connected with a group of communication interfaces of the comprehensive processing module (1) in a one-to-one correspondence manner, the pin 1, the pin 3 and the pin 7 of the second storage module U9 are respectively electrically connected with different general input and output interfaces of the comprehensive processing module (1) in a one-to-one correspondence manner, and the pin 4 and the pin 9 of the second storage module U9 are both grounded; the first memory module J4 is MicroSDCard and the second memory module U9 is NADA FLASH.

9. The radar and microseismic composite life detection circuit of claim 2 further comprising a second acceleration sensor U10, wherein the pins 2 and 12 of the second acceleration sensor U10 are electrically connected to a group of communication interfaces of the integrated processing module (1) in a one-to-one correspondence manner, the pin 10 of the second acceleration sensor U10 is electrically connected to a general input/output interface of the integrated processing module (1), and the pin 3 and the pin 7 of the second acceleration sensor U10 are electrically connected to a DC — 3.3V power supply; the second acceleration sensor U10 is QMA7981.

10. The radar and microseismic composite life detection circuit of claim 2 wherein,

the device is characterized by further comprising a power supply conversion module, wherein the power supply conversion module is electrically connected with the comprehensive processing module (1), the radar detection module (2), the microseismic detection module (3), the camera module (4) or the display module (5) and used for outputting electric energy.

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