CN218755530U - Antistatic cutting protection sticky tape - Google Patents

Abstract

The utility model provides an antistatic cutting protective adhesive tape, which comprises a substrate film layer, an adhesive layer and a substrate film layer from top to bottom; the adhesive layer is positioned between the substrate film layer and the substrate film layer; the base material film layer and the base material film layer are bonded through the adhesive layer. The utility model discloses a sticky tape uses specific thickness's substrate rete and substrate rete to the coating has antistatic coating, when having mechanical properties such as excellent stability, durability and stretch-proofing, has excellent anti stability. And the antistatic adhesive layer is used, the specific thickness of the antistatic adhesive layer is limited, the antistatic adhesive layer has the effects of strong adhesive force and no adhesive residue, and simultaneously has a comprehensive effect with the first antistatic coating and the second antistatic coating, so that the antistatic effect is further enhanced, and the antistatic adhesive layer has considerable market application prospect.

Description

An antistatic cutting protection tape

technical field

The utility model relates to the technical field of protective tapes, in particular to an antistatic cutting protective tape.

Background technique

With the development of science and technology, tapes are widely used in various fields, such as chip industry, electronic products, home appliances, building materials, decorative materials, etc. Especially in the chip industry, there are processes such as wafer expansion and cutting in the chip manufacturing process. In this process, a kind of eye-catching and effective identification is required, and it has good flexibility, no silicon transfer, and can protect the wafer from physical damage. adhesive tape. However, due to the characteristics of the tape itself, there will be a certain amount of static electricity, which will cause dust or other particles to be adsorbed on the surface of the substrate, which will affect its subsequent processing and use, and may even break down the wafer during processing, causing damage to the wafer. affect the service life of related devices.

Existing antistatic tapes usually adopt a single-layer antistatic structure, and the antistatic value can only meet the requirements of the general electronics industry. Patent CN210765104U discloses a semiconductor wafer packaging film, which can avoid the problems of easy chipping and flying chips during cutting by combining a TPU adhesive layer and an antistatic UV adhesive layer. Although it contains an antistatic UV adhesive layer, the adhesive force of the adhesive layer is limited.

Therefore, it is a current market demand to develop a protective tape with excellent antistatic properties, expansibility, stretch resistance, aging resistance, safety and environmental protection.

Utility model content

In order to solve the above problems, the first aspect of the utility model provides an antistatic cutting protective tape, which is characterized in that the protective tape includes a base film layer, an adhesive layer, and a base film layer from top to bottom. The adhesive layer is located between the substrate film layer and the substrate film layer; the substrate film layer and the substrate film layer are bonded by the adhesive layer.

As a preferred technical solution of the present invention, the thickness of the substrate film layer is 25-200 microns.

Further preferably, the thickness of the substrate film layer is 50-100 microns.

Further preferably, the thickness of the substrate film layer is 70-80 microns

Further preferably, the thickness of the substrate film layer is 75 microns.

In order to improve the stability, mechanical strength and other properties of the tape, the thickness and material of the substrate film layer used are limited, so that the tape maintains excellent stability and mechanical properties, which is convenient for subsequent processing and use. If the substrate film layer is too thick, it is not easy for subsequent processing and use, but if the substrate film layer is too thin, problems such as damage are prone to occur.

As a preferred technical solution of the present invention, the upper surface of the substrate film layer is coated with a functional coating, and the functional coating is a first antistatic coating.

The substrate film layer is coated with a specific antistatic coating, which can absorb moisture on the surface of products and materials, and neutralize static electricity, thereby producing an antistatic effect. And it will not affect the stability of the substrate film itself and mechanical properties such as tensile resistance.

As a preferred technical solution of the present invention, the thickness of the substrate film layer is 25-75 microns.

Further preferably, the thickness of the substrate film layer is 40-60 microns.

Further preferably, the thickness of the substrate film layer is 50 microns.

The utility model uses a specific substrate film thickness and film material, so that it can be better preserved and prolongs the service life of the adhesive tape.

As a preferred technical solution of the present invention, the lower surface of the substrate film layer is coated with a functional coating, and the functional coating is a second antistatic coating.

As a preferred technical solution of the present invention, the thickness of the adhesive is 5-150 microns.

Further preferably, the adhesive layer has a thickness of 20-100 microns.

Further preferably, the adhesive layer has a thickness of 30-70 microns.

Further preferably, the thickness of the adhesive layer is 40 microns.

By limiting the thickness and material of the adhesive layer, the amount of adhesive is controlled, thereby improving the bonding performance of the material, and avoiding the overflow of the adhesive during use and reducing the residual glue. In addition, the adhesive is an antistatic adhesive, which not only has excellent bonding performance when used, but also has an excellent antistatic effect when combined with the first antistatic coating and the second antistatic coating.

As a preferred technical solution of the present invention, the adhesive layer is an antistatic adhesive.

As a preferred technical solution of the present invention, the substrate film layer is a PET film.

As a preferred technical solution of the present invention, the base film layer is any one of PVC base film, PO base film, PET base film and PEN base film.

Compared with the prior art, the utility model has the following beneficial effects: the adhesive tape of the utility model uses a substrate film layer and a substrate film layer of a specific thickness, and is coated with an antistatic coating, which has excellent stability, It has excellent anti-stability while having mechanical properties such as durability and tensile resistance. Moreover, using the antistatic adhesive layer and limiting its specific thickness not only has the effect of strong adhesion and no glue residue, but also works together with the first antistatic coating and the second antistatic coating to achieve antistatic The effect is further enhanced, and has considerable market application prospects.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings based on these drawings without creative work.

Figure 1 is a schematic diagram of an antistatic cutting protection tape

Reference signs: 1-first antistatic coating, 2-substrate film layer, 3-adhesive layer, 4-substrate film layer, 5-second antistatic coating

Detailed ways

The utility model is illustrated below through specific embodiments, but not limited to the specific examples given below.

Example

Example 1

This embodiment provides an antistatic cutting protective tape, which includes a first antistatic coating 1, a substrate film layer 2, an adhesive layer 3, a substrate film layer 4, a first antistatic coating layer from top to bottom. Second antistatic coating5.

The thickness of the substrate film layer is 75 microns; the thickness of the substrate film layer is 50 microns; the thickness of the adhesive layer is 40 microns; the adhesive layer is an antistatic adhesive.

The substrate film layer is a PET film.

The base film layer is a PVC base film.

Example 2

This embodiment provides an antistatic cutting protective tape, which includes a first antistatic coating 1, a substrate film layer 2, an adhesive layer 3, a substrate film layer 4, a first antistatic coating layer from top to bottom. Second antistatic coating5.

The thickness of the substrate film layer is 70 microns; the thickness of the substrate film layer is 40 microns; the thickness of the adhesive layer is 30 microns; the adhesive layer is an antistatic adhesive.

The substrate film layer is a PET film.

The substrate film layer is a PO substrate film.

Example 3

This embodiment provides an antistatic cutting protective tape, which includes a first antistatic coating 1, a substrate film layer 2, an adhesive layer 3, a substrate film layer 4, a first antistatic coating layer from top to bottom. Second antistatic coating5.

The thickness of the substrate film layer is 80 microns; the thickness of the substrate film layer is 60 microns; the thickness of the adhesive layer is 60 microns; the adhesive layer is an antistatic adhesive.

The substrate film layer is a PET film.

The base film layer is a PET base film.

Comparative example 1

Comparative Example 1 provides an antistatic cutting protection tape, the difference between Comparative Example 1 and Example 1 is that the thickness of the substrate film layer is 30 microns.

Comparative example 2

Comparative Example 2 provides an antistatic cutting protection tape. The difference between Comparative Example 1 and Example 1 is that the film thickness of the substrate is 150 microns.

Comparative example 3

Comparative Example 3 provides an antistatic cutting protection tape. The difference between Comparative Example 1 and Example 1 is that the thickness of the adhesive layer is 120 microns.

Comparative example 4

Comparative Example 4 provides an antistatic cutting protection tape. The difference between Comparative Example 1 and Example 1 lies in that the adhesive layer is non-antistatic adhesive.

performance evaluation

The antistatic dicing protection tape provided by Examples 1-3 and Comparative Examples 1-3 is attached to the wafer, and the wafer is sent to the cutting device for cutting, and the tape is removed after the cutting is completed. Record whether the wafer is cracked or broken, whether there is displacement or drop during the transfer process, and whether there is residual glue. The recording results are shown in Table 1.

Table 1

The foregoing examples are illustrative only, and are used to explain some features of the method described in the present invention. The appended claims are intended to claim the broadest scope conceivable and the embodiments presented herein are merely illustrations of selected implementations according to all possible combinations of embodiments. Accordingly, it is the Applicant's intent that the appended claims not be limited by the selection of examples illustrating the features of the invention. Certain numerical ranges used in the claims also include sub-ranges therein, and changes within these ranges should also be construed as being covered by the appended claims where possible.

Claims (10)

1. an antistatic cutting protective tape, it is characterized in that, described protective tape comprises substrate film layer, adhesive agent layer, substrate film layer from top to bottom; Described adhesive agent layer is positioned at substrate film layer and between the substrate film layer; the substrate film layer and the substrate film layer are bonded by an adhesive layer. 2. A kind of antistatic cutting protective tape according to claim 1, characterized in that, the thickness of the substrate film layer is 25-200 microns. 3. A kind of antistatic cutting protective tape according to claim 2, characterized in that, the thickness of the substrate film layer is 50-100 microns. 4. A kind of antistatic cutting protective tape according to claim 2, characterized in that, the upper surface of the substrate film layer is coated with a functional coating, and the functional coating is a first antistatic coating. 5. A kind of antistatic cutting protective tape according to claim 1, characterized in that, the thickness of the substrate film layer is 25-75 microns. 6. A kind of antistatic cutting protective tape according to claim 5, characterized in that, the thickness of the substrate film layer is 40-60 microns. 7. A kind of antistatic cutting protective tape according to claim 5, characterized in that, the lower surface of the substrate film layer is coated with a functional coating, and the functional coating is a second antistatic coating. 8. The antistatic cutting protection tape according to claim 1, wherein the thickness of the adhesive is 5-150 microns. 9. The antistatic cutting protection tape according to claim 6, wherein the adhesive layer is an antistatic adhesive. 10. A kind of antistatic cutting protective tape according to any one of claims 1-9, characterized in that, the base film layer is PVC base film, PO base film, PET base film, PEN base film Any of the substrate films.

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