CN218647306U - Focusing and leveling device and photoetching equipment - Google Patents

Abstract

The utility model relates to the technical field of semiconductors, and provides a focusing and leveling device and photolithographic equipment. The focusing and leveling device includes: a base, an adjusting component and a locking piece; the adjusting component can be moved along a first direction It is movable and arranged on the base, the adjustment component includes a support plane, and the support plane can be rotated to adjust its orientation to conform to the main substrate; the locking member includes a locking curved surface, so that The locking curved surface is used for point contact with the main substrate, and presses the main substrate on the supporting plane along the first direction. With such a configuration, there will be no assembly stress on the main substrate during locking, which improves the stability of focusing and leveling. While meeting the increasingly higher adjustment accuracy requirements for focusing and leveling in integrated circuit technology, it also improves the adjustment During the process, there is a phenomenon of focal plane drift or repeated adjustment caused by assembly stress.

Description

Focusing and leveling device and photolithography equipment

technical field

The utility model relates to the technical field of semiconductors, in particular to a focusing and leveling device and photoetching equipment.

Background technique

Focusing and leveling sensors are widely used in semiconductor processing technology. For example, in the projection lithography technology of VLSI manufacturing, focusing and leveling sensors are usually used to reduce the influence of the surface topography of the silicon wafer on the focal plane of the projection objective lens to ensure Photolithography effect.

In the prior art, the focusing and leveling sensor is usually installed under the main substrate carrying the projection objective lens. In order to ensure the coincidence of the focal plane of the focusing and leveling sensor with the focal plane of the projection objective lens, it is necessary to adjust the main substrate through the focusing and leveling device. orientation.

The existing adjustment method is usually to adjust the orientation of the main substrate through a threaded auxiliary adjustment mechanism. There are two main methods, one is a differential adjustment mechanism, and the other is a single thread adjustment mechanism. Among them, after the adjustment is completed, the differential adjustment mechanism can only be naturally supported on the auxiliary connection mechanism by the gravity of the main substrate for focusing and leveling, which will cause the vertical lock to fail. It can be used, but cannot meet the increasingly higher adjustment accuracy requirements for focusing and leveling in integrated circuit technology; the single-thread adjustment mechanism adjusts the vertical position of the main substrate through threads, and realizes vertical locking of the main substrate through nuts, adjusting After the completion, the nut is pressed on the main base plate, and the plane of the main base plate and the frame surface of the whole machine cannot be absolutely parallel, so when the nut is used for locking, due to the existence of At a certain included angle, assembly stress exists at the connection between the adjustment mechanism and the main substrate, resulting in focal plane drift during use. Moreover, when the included angle is large enough, the focal plane changes during locking, resulting in repeated adjustment of the focal plane, which affects work efficiency.

Therefore, there is an urgent need for a focusing and leveling device and lithographic equipment to ensure that while meeting the requirements of focusing and leveling precision, it can improve the phenomenon of focal plane drift or repeated adjustment caused by assembly stress during the adjustment process.

Utility model content

The utility model provides a focusing and leveling device and a lithographic equipment. The focusing and leveling device realizes the alignment of the main substrate through the cooperation of a support plane conformable to the main substrate and a locking curved surface in point contact with the main substrate. The leveling and focusing of the substrate not only meets the increasingly higher adjustment accuracy requirements for focusing and leveling in the integrated circuit process, but also improves the phenomenon of focal plane drift or repeated adjustment caused by assembly stress during the adjustment process.

The focusing and leveling device includes: a base, an adjusting assembly and a locking member;

The adjustment assembly is arranged on the base movable along the first direction, the adjustment assembly includes a support plane, the support plane is used to be supported on the main substrate, and the support plane can be rotatably adjusted to suit The shape is attached to the main substrate;

The locking member is arranged on the base movable along the first direction, and the locking member includes a locking curved surface, the locking curved surface is used for point contact with the main substrate, and along the The first direction presses the main substrate on the support plane.

Optionally, the locking member further includes a locking shaft, the axis of the locking shaft extends along the first direction, and the locking curved surface is arranged at one end of the locking shaft.

Optionally, the locking shaft is threadedly engaged with the base.

Optionally, the adjustment assembly includes an adjustment main body and a support member, the support member is provided on the adjustment main body so as to be movable along a first direction, and the support plane is provided on the support member.

Optionally, the adjusting body is disposed on the base so as to move along the first direction.

Optionally, the adjusting assembly further includes a locating piece, the locating piece is arranged on the adjusting main body and/or the base for locking the adjusting main body relative to the base along the first direction. Location.

Optionally, the adjustment body is a shaft-shaped structure, the axis of the adjustment body extends along the first direction, and the adjustment body is screwed into the base.

Optionally, the adjustment assembly further includes an adjustment member, the support member is slidable along the axial direction of the adjustment main body and is overlaid on the adjustment main body, and the adjustment member is threadedly engaged with the adjustment main body for adjusting The position of the support along the first direction.

Optionally, the support includes a first support and a second support, the first support is movably arranged on the adjustment main body along the first direction, the second support and the first support A support member is universally rotatable, and the support plane is arranged on the second support member.

The utility model also provides a lithography equipment, which is equipped with the above-mentioned focusing and leveling device.

In summary, the focusing and leveling device includes: a base, an adjustment assembly and a locking member; the adjustment assembly is arranged on the base so that it can move along a first direction, and the adjustment assembly includes a support plane, the support plane is used to be supported on the main substrate, and the orientation of the support plane can be rotatable and adjusted so as to conform to the main substrate; On the seat, the locking member includes a locking curved surface, the locking curved surface is used for point contact with the main substrate, and presses the main substrate on the supporting plane along the first direction.

With such a configuration, the support plane can be rotatably adjusted to conform to the shape of the main substrate, and there will be no angle between the support plane and the main substrate; the rotation and adjustment of the support plane can realize the rotation of the main substrate around the X-axis and the Y-axis The adjustment of the degree of freedom of rotation, wherein the X-axis, Y-axis and the first direction are perpendicular to each other; in addition, the support plane can move along the first direction with the adjustment component, and then the degree of freedom of the main substrate along the first direction can be adjusted , and comprehensively realize the flexible adjustment of the main substrate. In addition, the support plane cooperates with the locking curved surface to lock the main substrate along the first direction. The locking curved surface is in point contact with the main substrate. When locking, there will be no assembly stress on the main substrate, which improves the stability of focusing and leveling. While meeting the higher and higher adjustment accuracy requirements for focusing and leveling in the integrated circuit process, it also improves the phenomenon of focal plane drift or repeated adjustment caused by assembly stress during the adjustment process, and shortens the detection time for focusing and leveling , improve the adjustment efficiency, and then increase the product yield.

Description of drawings

Fig. 1 is the structural representation 1 of existing focusing and leveling device;

Fig. 2 is the structural representation 2 of existing focusing and leveling device;

Fig. 3 is a schematic structural view of the focusing and leveling device of Embodiment 1 of the present invention;

Fig. 4 is a schematic diagram of the application structure of the focusing and leveling device of Embodiment 1 of the present utility model;

Fig. 5 is a schematic structural diagram of the focusing and leveling device of the second embodiment of the present invention;

Fig. 6 is a schematic diagram of the application structure of the focusing and leveling device of the second embodiment of the present invention;

Wherein, the reference signs are as follows:

10 - base;

20-adjustment assembly; 21-adjustment body; 22-support; 221-first support; 222-second support; 223-outer ring; 23-adjustment; 24-positioning; 25-support plane; 26 -bushing;

30-locking piece; 31-locking curved surface; 32-locking shaft;

40-main substrate; 41-assembly hole;

50-frame board; 51-installation hole;

100-auxiliary connection mechanism;

200-nut;

300-lower adjustment parts;

a - first direction.

Detailed ways

As used in the utility model, the singular forms "a", "an" and "the" include plural objects, the term "or" is usually used in the sense of including "and/or", and the term "several" Usually, the term "at least one" is used in the meaning of "at least one", and the term "at least two" is usually used in the meaning of "two or more". In addition, the terms "first", "second "Two" and "third" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, a feature defined as "first", "second" and "third" may explicitly or implicitly include one or at least two of these features. In addition, as used in the utility model, "mounting", "connecting", "connecting", and "setting" of one element on another element should be interpreted in a broad sense, usually only means that there is connection, coupling, Fitting or transmission relationship, and the connection, coupling, cooperation or transmission between two elements may be direct or indirect through intermediate elements, but shall not be understood as indicating or implying a spatial positional relationship between two elements, that is, one element may be in another Any orientation of the inside, outside, top, bottom, or side of an element, unless the content clearly indicates otherwise. Those of ordinary skill in the art can understand the specific meanings of the above terms in the utility model according to specific situations. Furthermore, directional terms such as above, below, up, down, up, down, left, right, etc. are used with respect to the exemplary embodiments as they are shown in the figures, with an upward or upward direction toward the top of the corresponding figure, The downward or downward direction is towards the bottom of the corresponding drawing.

The existing adjustment method is usually to adjust the orientation of the main substrate through the thread pair adjustment mechanism. There are two main methods, one is a differential adjustment mechanism, and the other is a single thread adjustment mechanism;

Please refer to FIG. 1, which is a structural diagram of the differential adjustment mechanism. After the structural adjustment is completed, the main substrate 40 can only be naturally supported on the auxiliary connection mechanism 100 by the gravity of the focusing and leveling main substrate 40. At this time, the main substrate 40 is vertically The position is in a natural state, and the vertical direction cannot be locked. This solution can be used when the stability of focusing and leveling is not high, and cannot meet the increasingly higher adjustment accuracy requirements for focusing and leveling in integrated circuit technology.

Please refer to FIG. 2, which is a structural diagram of a single-thread adjustment mechanism. This structure realizes vertical locking of the main base plate 40 through the nut 200 and the lower adjustment member 300. After the adjustment is completed, the nut 200 is pressed against the main base plate 40, and It is impossible to achieve absolute parallelism between the plane of the main substrate 40 and the frame surface of the whole machine, so when using the nut 200 to lock, because there is a certain angle between the locking surface of the nut 200 and the plane of the main substrate 40, the nut 200 While locking the main substrate 40 , it will cause deformation of the main substrate 40 , so assembly stress exists at the connection between the adjustment mechanism and the main substrate 40 , resulting in focal plane drift during use. When the included angle is large enough, the focal plane changes during locking, resulting in repeated adjustment of the focal plane, which affects work efficiency.

This embodiment provides a focusing and leveling device. The focusing and leveling device achieves alignment through the cooperation of the support plane 25 that is conformable to the main substrate 40 and the locking curved surface 31 that is in point contact with the main substrate 40. The leveling and focusing of the main substrate 40 satisfies the higher and higher adjustment accuracy requirements for focusing and leveling in the integrated circuit process, and at the same time improves the focal plane drift or repeated adjustment caused by assembly stress during the adjustment process.

Embodiment one:

The focusing and leveling device includes: a base 10, an adjusting assembly 20 and a locking member 30;

The adjustment assembly 20 is arranged on the base 10 to be movable along the first direction a, the adjustment assembly 20 includes a support plane 25, the support plane 25 is used to be supported on the main substrate 40, the support The plane 25 can be rotated to adjust its orientation to conform to the main substrate;

The locking member 30 is disposed on the base 10 so as to be movable along the first direction a, and the locking member 30 includes a locking curved surface 31 for connecting with the main substrate 40 point contact, and press the main substrate 40 on the supporting plane 25 along the first direction a.

3 and 4, the base 10 is installed on the frame plate 50, so that the entire focusing and leveling device is installed on the frame plate 50, wherein a plurality of focusing and leveling devices are installed on the frame plate 50. A focusing and leveling device is used to adjust the orientation of the main substrate 40.

The specific structure of the base 10 is not limited here. For example, the base 10 in FIG. Block structure, frame structure or other known structures, the specific structure of the base can be adjusted adaptively based on actual usage requirements, and will not be repeated here.

The adjustment assembly 20 is movable along the first direction a and is arranged on the base 10. When the focusing and leveling device is installed on the frame plate 50 and cooperates with the main substrate 40, the first direction a corresponds to the vertical direction, and the adjustment The component 20 can move relative to the base 10 along the vertical direction to adjust the position of the support plane 25 , and then adjust the local position of the main substrate 40 .

Here, there is no limitation on the movement of the adjustment assembly 20 along the base 10 , for example, the movement along the set direction can be realized through screw fit, sliding fit between the slide rail and the slide block.

The support plane 25 can be rotated to adjust the direction and position. During the movement of the adjustment assembly 20 along the first direction a, the support plane 25 is always kept in contact with the bottom of the main substrate 40 to ensure that the support plane 25 is in contact with the main substrate 40. There is no included angle at the location of the joint. Here, there is no limitation on the rotation adjustment method of the support plane 25 , for example, the rotation adjustment of the support plane 25 at any angle can be realized through structures such as universal bearings and cross universal joints. Please refer to FIG. 4, the three support planes in the three focusing and leveling devices can be adapted to the orientation of the main substrate 40 and rotate, so that the three support planes are always in surface contact with the main substrate 40 without making the An angle is formed between one or more supporting planes and the main substrate 40 .

Please continue to refer to FIG. 3 and FIG. 4 , the locking member 30 is arranged opposite to the adjustment assembly 20 in the first direction a, the locking member 30 is used to press on the main substrate 40 , and through the locking curved surface 31 and The main substrate 40 forms a point contact, so that during the adjustment process, both support and locking can conform to the main substrate without generating assembly stress.

Here, the specific structure of the locking member 30 and the mode of cooperation with the base 10 are not limited. For example, the locking member 30 can be set as a slider structure, and the locking member 30 can be connected with the slide rail on the base 10 along the first The direction a is slidingly fitted, and the locking member 30 can also adopt other known structures, which will not be repeated here.

In addition, the specific shape of the locking curved surface 31 is not limited here. For example, the locking curved surface 31 may be a spherical surface, an ellipsoid, or a curved surface structure of other shapes, and the locking member 30 moves along the first direction a and presses against the main substrate 40. When putting on, it is only necessary to ensure point contact between the locking curved surface 31 and the main substrate 40 . The point contact here should be understood in a broad sense. In reality, there is almost no point contact phenomenon in an absolute microscopic state, so the point contact here should be in a macroscopic contact state to ensure that there is no large gap between the locking curved surface 31 and the main substrate 40. The case of area contact is sufficient.

In the present utility model, the supporting plane 25 can be rotatably adjusted to fit closely with the main substrate, and there will be no angle between the supporting plane 25 and the main substrate; the rotation adjustment of the supporting plane can achieve the main substrate 40 to The adjustment of the rotational freedom of the X-axis and the Y-axis, wherein the X-axis, the Y-axis and the first direction a are perpendicular to each other, and the first direction a is consistent with the direction of the Z-axis; The degree of freedom of the main substrate 40 along the first direction a can be adjusted by moving along the first direction a, and the flexible adjustment of the main substrate 40 can be realized comprehensively. In addition, the support plane 25 cooperates with the locking curved surface 31 to lock the main substrate 40 along the first direction a. The locking curved surface 31 is in point contact with the main substrate 40, and there will be no assembly stress on the main substrate 40 during locking, which improves focusing. The stability of leveling, while meeting the increasingly higher adjustment accuracy requirements for focusing and leveling in the integrated circuit process, also improves the focus plane drift or repeated adjustments caused by assembly stress during the adjustment process, shortening the adjustment time. The detection time of focus leveling is shortened, the adjustment efficiency is improved, and the production rate of the product is improved.

Please refer to FIG. 3 , in this embodiment, the locking member 30 further includes a locking shaft 32, the axis of the locking shaft 31 extends along the first direction a, and the locking curved surface 31 is arranged on One end of the locking shaft 32 . The locking shaft 32 is threadedly engaged with the base 10 .

The locking shaft 32 is arranged as a ball stud structure, and one end of the locking shaft is threadedly fitted with the bottom of the base 10, and the position of the locking shaft 32 along the first direction a can be precisely adjusted by rotating the locking shaft 32, and the locking shaft 32 The other end of the ball head is a ball head structure, and the spherical surface of the ball head is used as a locking curved surface 31 . The ball head structure faces the upper surface of the main substrate 40 along the first direction a. By rotating the locking shaft 32 so that the locking curved surface 31 is pressed against the upper surface of the main substrate 40 and makes point contact with the main substrate 40, the locking The tight curved surface 31 cooperates with the support plane 25 to achieve vertical locking of the main substrate 40 .

Further, the adjustment assembly 20 includes an adjustment main body 21 and a support member 22, the adjustment main body 21 is a shaft-shaped structure, the axis of the adjustment main body 21 extends along the first direction a, and the support member 22 can move along the first direction a. The movement in the direction a is set on the adjustment main body 21 , and the support plane 25 is set on the support member 22 .

Please refer to FIG. 3 , the adjustment main body 21 is arranged as a shaft structure, which is beneficial to cooperate with the main substrate 40 and the adjustment assembly 20, wherein the main substrate 40 is provided with an assembly hole 41, and the adjustment main body 21 passes through the assembly hole 41, The adjustment assembly 20 is overlaid on the adjustment main body 21 to adjust and support the main substrate 40 .

Please refer to FIG. 3 , the adjusting body 21 is fixedly connected to the base 10 , and the two can be connected by bolts, welding, etc., or can also be integrally formed. At this time, the adjustment body 21 is fixed relative to the base 10 and the frame plate 50 , and the adjustment of the main substrate 40 along the first direction is realized by moving the support member 22 relative to the adjustment body 21 along the first direction a.

Since the adjustment main body 21 is a shaft-shaped structure, the support member 22 is overlaid on the adjustment main body 21 and moves relatively along the first direction a, so as to adjust the main substrate 40 along the first direction a.

Further, the support 22 includes a first support 221 and a second support 222, the first support 221 is movably arranged on the adjustment main body 21 along the first direction a, and the second support The member 222 is universally rotatable with the first support member 221 , and the support plane 25 is disposed on the second support member 222 .

Please refer to Fig. 3, in this embodiment, the existing universal joint bearing is directly used to realize the universal rotation adjustment of the support plane 25, wherein the inner ring of the universal joint bearing is used as the first support member 221, and the universal joint bearing The outer ring 223 and its inner ring are universally rotatable, and the second support member 222 is overlaid on the outer ring 223 and has an interference fit with the outer ring 223, so the second support member 222 is universally connected with the first support member 221 through the outer ring 223 Turn to fit. The upper end surface of the second support 222 serves as a support plane 25. When the second support 222 rotates with the outer ring 223 relative to the first support 221, the direction and position of the support plane 25 are adaptively rotated to align with the main substrate. 40 Conformal fit.

In this embodiment, there is no limitation on the cooperation mode between the first support member 221 and the adjustment main body 21. As shown in FIG. A bushing 26 is also provided, and the bushing 26 is in interference fit with the first support member 221. The bushing 26 can be threadedly fitted with the adjustment main body 21, and then the rotation of the first support member 221 along the first direction a can be adjusted by rotating the bushing 26. position, and then adjust the positions of the outer ring 223 and the second support member 222. At this time, the support member 22 itself is threaded to lock its own position.

Further, the adjustment assembly 20 also includes an adjustment member 23, the support member 22 is slidable along the axial direction of the adjustment main body 21 and is overlaid on the adjustment main body 21, the adjustment member 23 and the adjustment main body 21 is screwed to adjust the position of the support member 22 along the first direction a.

Please refer to FIG. 3 , the adjusting part 23 is a lock nut, which is supported on the bottom of the bushing 26 to lock the position of the supporting part 22, prevent the threading of the bushing 26 from loosening with the adjusting body 21, and improve the support plane 25 stability.

In other alternative embodiments, the bushing 26 can slide axially with the adjustment body 21. At this time, the position locking of the support member 22 itself cannot be realized, so at this time, it is necessary to cooperate with the adjustment member 23 to realize the position adjustment of the support member 22 and Position locked.

Embodiment two

The difference between this embodiment and the first embodiment lies in the installation manner of the base 10 and the frame plate 50 , and the installation manner of the base 10 and the adjustment main body 21 .

Please refer to FIG. 5, wherein the frame plate 50 is provided with a stepped mounting hole 51, the base 10 is in a stepped structure adapted to the mounting hole 51, and the base 10 is fixed by bolts after passing through the mounting hole 51. At this time, the base 10 is not suspended on the bottom of the frame plate 50, and its stability is better.

The adjusting body 21 is disposed on the base 10 to move along the first direction a. , the adjusting body 21 is threadedly engaged with the base 10 .

Please refer to FIG. 5 and FIG. 6 , the position of the adjustment body 21 can be adjusted by screwing with the base 10 to realize the rough adjustment of the position of the support plane 25, and then the adjustment of the support plane 25 can be realized through the cooperation of the adjustment member 23. Fine position adjustment helps to shorten the detection time of focusing and leveling, improve adjustment efficiency, and increase product yield.

Further, the adjustment assembly 20 also includes a positioning piece 24, the positioning piece 24 is arranged on the adjustment main body 21 and/or the base 10 for locking the adjustment main body 21 relative to the base 10 along the The position in the first direction a.

The specific structure of the positioning member 24 is not limited here, for example, the positioning member 24 may be configured as a pin or other known positioning structures. Based on the adjustment main body 21 having a shaft-like structure, the positioning member 24 in this embodiment is adaptively set as a nut structure, and the positioning member 24 is screwed to the adjustment main body 21, and when the positioning member 24 is screwed tightly on the base 10, The rotation of the adjusting body 21 relative to the base 10 can be locked, thereby locking the position of the adjusting body 21 .

In other alternative embodiments, the installation position of the positioning member 24 can be selected based on the assembly relationship between the adjustment body 21 and the base 10. For example, when the positioning member 24 is a pin structure, it can be installed on the adjustment body 21 or the base. On the seat 10, the position locking of the adjustment main body 21 is realized through the cooperation of the pin and the pin hole, which will not be repeated here.

The above-mentioned focusing and leveling device can realize the flexible adjustment of three degrees of freedom. Please combine the three groups of focusing and leveling devices as shown in Fig. 6 to coordinate and adjust to ensure the focal plane position of the focusing and leveling sensor. Since the mounting surfaces of the main substrate 40 and the frame plate 50 generally have an included angle and are not parallel, and due to machining accuracy, the included angles of the mounting surfaces of the main substrate 40 and the frame plate 50 are different between different stations, therefore, by Three sets of focusing and leveling devices can realize the linear adjustment of the main substrate 40 along the first direction a and the adjustment of the degree of freedom of rotation along the X axis and the Y axis, and realize the adjustment of the main substrate 40 through the cooperation of the support plane 25 and the locking curved surface 31. The flexible adjustment of the substrate 40 eliminates assembly stress and realizes locking of the main substrate 40 along the first direction a.

Taking Figure 6 as an example, the installation and adjustment process of the focusing and leveling device is as follows:

Install the base 10 of each group of focusing and leveling devices on the frame 50 of the whole machine, and make each group of focusing and leveling devices cooperate with the main substrate 40;

The requirement after installation is to ensure the degree of coincidence between the adjustment focal plane of the focusing and leveling sensor installed on the main substrate 40 and the focal plane of the projection objective lens;

Before adjusting the focusing and leveling device, the position of the locking shaft 32 needs to be adjusted so that the locking curved surface 31 and the main substrate 40 maintain a certain distance;

Rotate the adjustment main body 21 in each group of focusing and leveling devices to achieve rough position adjustment;

Adjust the adjustment member 23 in each group of focusing and leveling devices to realize fine position adjustment, so that the focal plane of the focusing and leveling sensor coincides with the focal plane of the projection objective lens;

At this time, each supporting plane 25 is in stable surface-to-surface contact with the main substrate 40;

Adjust the position of the locking shaft 32 so that the tight curved surface 31 is in point contact with the upper surface of the main substrate 40. Three sets of focusing and leveling devices ensure that the three tight curved surfaces 31 are in contact with the upper surface of the main substrate 40 and form a three-point support plane stably. In order to eliminate the deviation between the actual focal plane and the theoretical focal plane, and there will be no assembly stress on the main substrate 40, so that the optical machine can obtain better focusing and leveling effects.

In addition, the support plane 25 on the second support member 222 in the plurality of focusing and leveling devices is in surface contact with the main substrate 40, which can realize the adjustment of the angle of the main substrate 40, and in order to ensure the stability of the main substrate 40 during use sex. In addition, the second supporting member 222 can be fixedly connected to the main substrate 40 through bolts, so as to limit the degree of freedom of the main substrate 40 and ensure the stability of the main substrate.

This embodiment also provides a lithography equipment, the lithography equipment is equipped with the above-mentioned focusing and leveling device. The photolithography equipment may be a photolithography machine, an optical measurement system and other devices.

In summary, the focusing and leveling device includes: a base 10, an adjustment assembly 20 and a locking member 30; The adjustment assembly 20 includes a support plane 25, the support plane 25 is used to be supported on the main substrate 40, and the support plane 25 can be rotated to adjust the orientation so as to conform to the main substrate; the locking member 30 It is arranged on the base 10 to be movable along the first direction a, and the locking member 30 includes a locking curved surface 31, the locking curved surface 31 is used for point contact with the main substrate 40, and along the The first direction a presses the main substrate 40 on the supporting plane 25 .

With such a configuration, the support plane 25 can be rotatably adjusted to conform to the shape of the main substrate, and there will be no angle between the support plane 25 and the main substrate; and the adjustment of the rotational freedom of the Y axis, wherein the X axis, the Y axis, and the first direction a are perpendicular to each other, and the first direction a is consistent with the direction of the Z axis; in addition, the support plane can follow the adjustment assembly 20 along the The movement in the first direction a can further adjust the degree of freedom of the main substrate 40 along the first direction a, and comprehensively realize the flexible adjustment of the main substrate 40 . In addition, the support plane 25 cooperates with the locking curved surface 31 to lock the main substrate 40 along the first direction a. The locking curved surface 31 is in point contact with the main substrate 40, and there is no assembly stress on the main substrate 40 during locking, which improves the focus adjustment. The stability of leveling, while meeting the higher and higher adjustment accuracy requirements for focusing and leveling in the integrated circuit process, also improves the focus plane drift or repeated adjustments caused by assembly stress during the adjustment process, shortening the adjustment time. The detection time of focus leveling is shortened, the adjustment efficiency is improved, and the production rate of the product is improved.

Each embodiment in this specification is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same and similar parts of each embodiment can be referred to each other.

The above description is only a description of the preferred embodiments of the utility model, not any limitation to the scope of the utility model. Any changes and modifications made by those of ordinary skill in the field of utility model based on the above disclosure shall fall within the scope of protection of the claims.

Claims (10)

1. A focusing and leveling device, comprising: the device comprises a base, an adjusting assembly and a locking piece;

the adjusting assembly is movably arranged on the base along a first direction and comprises a supporting plane, the supporting plane is used for supporting on the main substrate, and the supporting plane can rotate to adjust the orientation to fit with the main substrate;

the retaining member is movably arranged on the base along a first direction and comprises a locking curved surface, and the locking curved surface is used for being in point contact with the main substrate and pressing the main substrate onto the supporting plane along the first direction.

2. The focusing and leveling device according to claim 1 wherein the locking member further comprises a locking shaft, an axis of the locking shaft extends in the first direction, and the locking curved surface is provided at one end of the locking shaft.

3. The focus and leveling apparatus of claim 2 wherein the locking shaft is threadably engaged with the base.

4. The focus and leveling apparatus of claim 1 wherein the adjustment assembly comprises an adjustment body and a support member movably disposed on the adjustment body in a first direction, the support member being disposed on the support member.

5. The focus and leveling device of claim 4 wherein the adjustment body is movably disposed on the base in a first direction.

6. The focusing and leveling device of claim 4 wherein the adjustment assembly further comprises a positioning member disposed on the adjustment body and/or the base for locking the position of the adjustment body relative to the base in the first direction.

7. The focus leveling apparatus of claim 4 wherein the adjustment body is a shaft-like structure, an axis of the adjustment body extending in a first direction, the adjustment body being in threaded engagement with the base.

8. The focus leveling apparatus of claim 7, wherein the adjustment assembly further comprises an adjustment member slidably mounted on the adjustment body in an axial direction of the adjustment body, the adjustment member being threadably engaged with the adjustment body for adjusting the position of the support member in the first direction.

9. The focusing and leveling device according to claim 7 or 8 wherein the support member comprises a first support member and a second support member, the first support member is movably disposed on the adjustment body along a first direction, the second support member is in universal rotation fit with the first support member, and the support plane is disposed on the second support member.

10. A lithographic apparatus, characterized in that it is equipped with a focusing and leveling device according to any one of claims 1-9.

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