CN218630726U - Memory bank heat radiation structure - Google Patents

Abstract

The utility model relates to a DRAM technical field specifically is a DRAM heat radiation structure, which comprises a mainboard, the top of mainboard is provided with the installation piece, the right side of installation piece is provided with the installation storehouse, the inside in installation storehouse is provided with the DRAM, the left side in installation storehouse is provided with heat radiation structure, the top in installation storehouse is provided with the restriction groove, the top in restriction groove is provided with fixed storehouse, the inside in fixed storehouse is provided with the threaded rod, the below of threaded rod is provided with the fixed plate. The utility model discloses the DRAM pulls open the baffle through the pull rod when using, and the motor begins work, and the flabellum rotates and blows into the installation storehouse with outside air through first dust screen and second dust screen in, dispels the heat, and the inside air in installation storehouse is discharging through the breather plate, strengthens the radiating effect, removes baffle and dust storehouse through the pull rod when the DRAM is out of work and forms a seal structure, prevents that outside dust from entering into the internal damage DRAM of installation storehouse.

Description

A cooling structure for a memory stick

technical field

The utility model relates to the technical field of memory sticks, in particular to a heat dissipation structure of memory sticks.

Background technique

Memory stick generally refers to random access memory, random access memory, also called main memory, is an internal memory that directly exchanges data with the CPU.

For example, a memory bar with a high-efficiency heat dissipation structure whose publication number is CN213581986U discloses a memory bar with a high-efficiency heat dissipation structure, which includes a fan box and a heat dissipation plate. The fan box is installed on the upper outer wall of the heat dissipation plate. The heat dissipation plate is provided with a heat dissipation hole, and the sliding frame is pressed on the front and rear surfaces of the main body of the memory stick through the action of the spring, so that the heat dissipation plate is stuck on the main body of the memory stick to prevent the heat dissipation plate from falling off from the main body of the memory stick. Install the fan box on the heat sink, connect the wires to the external power supply, and drive the fan blades to rotate through the micro motor to blow the air on the main body of the memory stick. When the main body of the memory stick works for a long time, it will generate a relatively high temperature , affecting the operation of the main body of the memory stick, because the cold air blown from the fan box enters between the two cooling plates to dissipate heat from the main body of the memory stick, and after the heat is taken away, it will be dissipated from the cooling holes to the outside air. The cooling device can realize rapid multi-directional heat dissipation, prolong service life, high efficiency, and easy operation.

Based on the above, it can be seen that the following technical problems exist in the prior art: when the memory stick is not used for a long time, there is no structure to prevent dust from entering, which will cause the memory stick to be damaged due to the influence of dust, and there is no fixed memory stick when the host vibrates. The structure of the memory stick will cause the memory stick to fall off, so that the computer cannot be turned on. Therefore, we provide a heat dissipation structure for the memory stick.

Utility model content

The purpose of this utility model is to provide a memory stick heat dissipation structure to solve the problems raised in the above-mentioned background technology.

In order to solve the above-mentioned technical problems, the utility model adopts the following technical solutions:

A heat dissipation structure for a memory bar, comprising a main board, an installation block is arranged above the main board, an installation compartment is arranged on the right side of the installation block, a memory bar is arranged inside the installation compartment, and a memory bar is arranged on the left side of the installation compartment A heat dissipation structure is provided, a limiting groove is arranged above the installation chamber, a fixed chamber is arranged above the restricting groove, a threaded rod is arranged inside the fixed chamber, and a fixing plate is arranged below the threaded rod, so An installation groove is arranged inside the installation block, a ventilation plate is arranged on the left side of the threaded rod, and a heat conduction plate is arranged inside the fixing plate.

Preferably, the heat dissipation structure includes a first dust-proof net, a motor is arranged on the right side of the first dust-proof net, and a fan blade is arranged on the right side of the motor, and a second anti-dust net is arranged on the right side of the fan blade. Dust net, and the right side of the second dust-proof net is provided with a dust-proof bin, the interior of the dust-proof bin is provided with a chute, and a baffle is provided above the chute, and a spring is provided on the right side of the baffle , and the right side of the spring is provided with a limiting block, the inside of the baffle is provided with a pull rod, and the rear end of the pull rod is provided with a pull block, and the outer end of the dustproof bin is provided with a fixing groove.

Preferably, the baffle is slidably connected with the dustproof bin through a slide groove.

Preferably, the restriction block matches the size of the fixing slot.

Preferably, the mounting block is connected to the main board through screws.

Preferably, the fixed bin is slidably connected to the installation bin through a limiting groove.

Preferably, the threaded rod is threadedly connected with the fixed bin.

It can be seen from the above description that the technical problem to be solved in the present application must be solved through the above technical solution of the present application.

At the same time, through the above technical solutions, the utility model at least has the following beneficial effects:

The utility model is equipped with a heat dissipation structure. When the memory stick is in use, the baffle plate is pulled apart by the pull rod, the motor starts to work, and the fan blades rotate to blow the external air into the installation warehouse through the first dust-proof net and the second dust-proof net. For heat dissipation, the air inside the installation compartment is discharged through the ventilation plate to enhance the heat dissipation effect. When the memory stick is not working, the baffle is moved by the pull rod to form a sealed structure with the dust-proof compartment to prevent external dust from entering the installation compartment and damaging the memory stick. .

Description of drawings

Fig. 1 is a schematic view of the front view of the utility model;

Fig. 2 is the schematic diagram of the front section structure of the utility model;

Fig. 3 is a schematic diagram of the heat dissipation structure of the utility model;

Fig. 4 is a schematic diagram of the heat dissipation side structure of the utility model.

In the figure: 1, main board; 2, installation block; 3, memory stick; 4, heat dissipation structure; 401, first dust-proof net; 402, motor; 403, fan blade; 404, second dust-proof net; 405, anti-dust net Dust bin; 406, baffle plate; 407, chute; 408, limit block; 409, spring; 410, pull block; 411, pull rod; 412, fixed groove; 5, limit groove; 6, fixed warehouse; 7, fixed plate ; 8, threaded rod; 9, installation groove; 10, ventilation plate; 11, heat conduction plate; 12, installation warehouse.

Detailed ways

In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

Implementation Case 1

As shown in Figure 1 and Figure 2, the utility model provides a technical solution: a memory stick heat dissipation structure, including a main board 1, an installation block 2 is arranged above the main board 1, and an installation compartment is arranged on the right side of the installation block 2 12. The interior of the installation compartment 12 is provided with a memory module 3, the left side of the installation compartment 12 is provided with a heat dissipation structure 4, the upper part of the installation compartment 12 is provided with a limiting groove 5, and the upper part of the limiting slot 5 is provided with a fixed compartment 6, and the fixed compartment 6 The interior of the threaded rod 8 is provided with a fixed plate 7, the interior of the mounting block 2 is provided with a mounting groove 9, the left side of the threaded rod 8 is provided with a ventilation plate 10, and the interior of the fixed plate 7 is provided with a heat conduction plate. The board 11, the mounting block 2 are connected with the main board 1 by screws, the fixed bin 6 is slidably connected with the installation bin 12 through the limiting groove 5, and the threaded rod 8 is threadedly connected with the fixed bin 6.

Embodiment two

The solution in Embodiment 1 will be further introduced in combination with specific working methods below, see the following description for details:

As shown in Figure 3 and Figure 4, as a preferred embodiment, on the basis of the above method, further, the heat dissipation structure 4 includes a first dust-proof net 401, and a motor 402 is arranged on the right side of the first dust-proof net 401, And the right side of the motor 402 is provided with a fan blade 403, the right side of the fan blade 403 is provided with a second dust-proof net 404, and the right side of the second dust-proof net 404 is provided with a dust-proof bin 405, and the inside of the dust-proof bin 405 A chute 407 is provided, and a baffle 406 is provided above the chute 407, a spring 409 is provided on the right side of the baffle 406, and a limiting block 408 is provided on the right side of the spring 409, and a pull rod 411 is provided inside the baffle 406 , and the rear end of the pull rod 411 is provided with a pull block 410, the outer end of the dustproof bin 405 is provided with a fixing groove 412, the baffle plate 406 is slidably connected with the dustproof bin 405 through the chute 407, and the size of the limiting block 408 is the same as that of the fixing groove 412 When the memory stick 3 is in use, the baffle plate 406 is pulled apart by the pull rod 411, the motor 402 starts to work, and the fan blade 403 rotates to blow the external air into the installation compartment 12 through the first dust-proof net 401 and the second dust-proof net 404 The air inside the installation compartment 12 is discharged through the ventilation panel 10 to enhance the heat dissipation effect. When the memory module 3 is not working, the baffle 406 and the dust-proof compartment 405 are moved by the pull rod 411 to form a sealed structure to prevent external dust Go into the installation compartment 12 and damage the memory stick 3 .

Based on the above, we can see that:

The utility model aims at the technical problem: when the memory stick is not used for a long time, there is no structure to prevent dust from entering, which will cause the memory stick to be damaged by the influence of dust, and there is no structure to fix the memory stick when the host vibrates, which will make the memory stick The memory stick falls off, so that the computer cannot be turned on; the technical solutions of the above-mentioned embodiments are adopted. Simultaneously, the realization process of above-mentioned technical scheme is:

First, the memory stick 3 is first installed on the motherboard 1, the installation compartment 12 is fixedly connected to the installation block 2 through the installation groove 9, the installation block 2 is connected to the motherboard 1 through screws, and the fixed compartment 6 is slidingly connected to the installation compartment 12 through the limiting groove 5 , through the threaded connection between the threaded rod 8 and the fixed bin 6, turning the threaded rod 8 drives the fixed plate 7 to move downwards so that the heat conducting plate 11 contacts the memory stick 3 for fixing;

Then, when the memory stick 3 is in operation, the baffle plate 406 is pulled by the pull rod 411 and the pull block 410, and the baffle plate 406 moves in the dustproof bin 405 through the chute 407, and after moving to a specified position, the limiting block 408 is ejected by the spring 409 Pass through the fixed groove 412 to limit the movement of the baffle plate 406, the motor 402 starts to work, the fan blade 403 rotates and blows the external air into the installation chamber 12 through the first dust-proof net 401 and the second dust-proof net 404 to dissipate heat. Exhausting through the ventilation plate 10;

Finally, when the memory stick 3 is not used for a long time, the pull rod 411 drives the baffle plate 406 to move and form a sealed structure with the dustproof compartment 405 to prevent external dust from entering the installation compartment 12 .

Through the above settings, the present application must be able to solve the above technical problems, and at the same time, achieve the following technical effects:

The utility model is provided with a heat dissipation structure 4. When the memory stick 3 is in use, the baffle plate 406 is pulled apart by the pull rod 411, the motor 402 starts to work, and the fan blade 403 rotates to pass the external air through the first dust-proof net 401 and the second dust-proof net. The net 404 is blown into the installation chamber 12 to dissipate heat. The air inside the installation chamber 12 is discharged through the ventilation plate 10 to enhance the heat dissipation effect. When the memory module 3 is not working, the baffle 406 is moved by the pull rod 411 to form a dustproof chamber 405. The sealed structure prevents external dust from entering the installation compartment 12 and damaging the memory stick 3 .

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes and modifications can be made to these embodiments without departing from the principle and spirit of the present invention , replacements and modifications, the scope of the present utility model is defined by the appended claims and their equivalents.

Claims (7)

1. The utility model provides a DRAM heat radiation structure, a serial communication port, including mainboard (1), the top of mainboard (1) is provided with installation piece (2), the right side of installation piece (2) is provided with installation storehouse (12), the inside of installation storehouse (12) is provided with DRAM (3), the left side of installation storehouse (12) is provided with heat radiation structure (4), the top of installation storehouse (12) is provided with restriction groove (5), the top of restriction groove (5) is provided with fixed storehouse (6), the inside of fixed storehouse (6) is provided with threaded rod (8), the below of threaded rod (8) is provided with fixed plate (7), the inside of installation piece (2) is provided with mounting groove (9), the left side of threaded rod (8) is provided with breather plate (10), the inside of fixed plate (7) is provided with heat-conducting plate (11).

2. The heat dissipation structure of the memory bank as claimed in claim 1, wherein the heat dissipation structure (4) comprises a first dust screen (401), a motor (402) is arranged on the right side of the first dust screen (401), fan blades (403) are arranged on the right side of the motor (402), a second dust screen (404) is arranged on the right side of the fan blades (403), a dust-proof bin (405) is arranged on the right side of the second dust screen (404), a sliding groove (407) is arranged in the dust-proof bin (405), a baffle (406) is arranged above the sliding groove (407), a spring (409) is arranged on the right side of the baffle (406), a limiting block (408) is arranged on the right side of the spring (409), a pull rod (411) is arranged in the baffle (406), a pull block (410) is arranged at the rear end of the pull rod (411), and a fixing groove (412) is arranged at the outer end of the dust-proof bin (405).

3. The memory bank heat dissipation structure of claim 2, wherein the baffle (406) is slidably connected to the dust-proof bin (405) through a sliding slot (407).

4. The die pad heat dissipation structure of claim 2, wherein the limiting blocks (408) are matched with the fixing grooves (412).

5. The heat dissipation structure of claim 1, wherein the mounting block (2) is connected to the motherboard (1) by screws.

6. The memory bank heat dissipation structure of claim 1, wherein the fixing bin (6) is slidably connected with the mounting bin (12) through a limiting groove (5).

7. The memory bank heat dissipation structure of claim 1, wherein the threaded rod (8) is in threaded connection with the fixed bin (6).

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