CN218593516U

CN218593516U - Mould embedded nail mould

Info

Publication number: CN218593516U
Application number: CN202223060383.0U
Authority: CN
Inventors: 陈步林; 周辉虎; 朱树春; 谢应春; 李彪; 高裕文
Original assignee: LCFC Hefei Electronics Technology Co Ltd
Current assignee: LCFC Hefei Electronics Technology Co Ltd
Priority date: 2022-11-16
Filing date: 2022-11-16
Publication date: 2023-03-10
Anticipated expiration: 2032-11-16

Abstract

The utility model provides a bury nail mould in mould, include mould benevolence and prevent falling the nail subassembly, prevent falling the nail subassembly and include magnetism-insulating mold insert, magnetic part and department section of thick bamboo, seted up the through-hole on the magnetism-insulating mold insert, the through-hole includes first hole portion and is used for injecing the second hole portion that the position was buried underground to the magnetic conduction nail, and the magnetic part sets up in the first hole portion, department section of thick bamboo has first section, second section and head, and first section is inserted and is established in mould benevolence, and first hole portion is worn to locate by the second section, and the head stretches into to the second hole portion in, and the magnetic property of magnetic part can pass through the second section and transmit for the head, makes the magnetic conduction nail adsorb in order to fix a position in the second hole portion through the head. This openly has avoided falling the nail phenomenon, has reduced the production disability rate of moulding plastics, has improved the product yield.

Description

Mould embedded nail mould

Technical Field

The utility model relates to an injection mold technical field specifically, relates to bury nail mould in mould.

Background

The majority of housings of electronic products (such as notebook computers and tablet computers) are plastic parts, which are usually injection molded, and in order to facilitate subsequent assembly processes, after the housings of the electronic products are injection molded, iron nails or copper nails need to be embedded into the housings at corresponding positions. However, in the production process of the electronic product casing, a nail leakage phenomenon frequently occurs, so that a product is poor, in order to overcome the problem, a Charge Coupled Device (CCD) is used for photographing and comparing in the production process of the existing nail-embedded injection molding product, but the scheme can only carry out static comparison, and the vibration of a machine table in the mold opening and closing process can also cause the falling of iron nails or copper nails, so that the product is poor.

SUMMERY OF THE UTILITY MODEL

In view of the above, in order to at least partially solve the above problems, the present disclosure provides an in-mold nail embedding mold, which adopts the following technical solution.

The utility model provides an bury nail mould in mould, includes mould benevolence, still including preventing falling the nail subassembly, it includes to prevent falling the nail subassembly:

the magnetism insulation insert is provided with a through hole, and the through hole comprises a first hole part and a second hole part used for limiting the embedding position of the magnetic nail;

a magnetic member disposed in the first hole portion; and

a cartridge having a first section, a second section, and a head;

the magnetic part is provided with a first section and a second section, wherein the first section is inserted in the die core, the second section penetrates through the first hole part, the head part extends into the second hole part, and the magnetic property of the magnetic part is transferred to the head part through the second section, so that the magnetic nail can be adsorbed by the head part to be positioned in the second hole part.

In one embodiment, the magnetic member is an annular member having a bore with a first diameter and the second section has a second diameter, the second diameter being smaller than the first diameter.

In an embodiment, the through hole further comprises an intermediate hole portion located between the first hole portion and the second hole portion, the intermediate hole portion having a diameter smaller than a diameter of the first hole portion.

In an embodiment, the diameter of the second bore portion is smaller than the diameter of the first bore portion.

In an embodiment, the diameter of the intermediate hole portion is not greater than the diameter of the second hole portion.

In an embodiment, the diameter of the second hole portion is larger than the outer diameter of the magnetic nail.

In one embodiment, the magnetic member is a neodymium iron boron magnet.

In one embodiment, the magnetic insulating insert is made of beryllium copper.

In one embodiment, the first bore portion has a first locating surface and the second bore portion has a second locating surface, and the distance between the first locating surface and the second locating surface is no greater than 16 mm.

In an embodiment, a third positioning surface is formed at the junction of the second segment and the head, and the third positioning surface is flush with the second positioning surface.

The present disclosure has the following beneficial effects: on one hand, the magnetism of the magnetic part is transmitted to the head of the ejector sleeve through the second section of the ejector sleeve, and the head of the ejector sleeve generates magnetic force to adsorb the magnetic conduction nail, so that the purpose of fixing the magnetic conduction nail is achieved, the nail falling phenomenon in the injection molding process is avoided, the rejection rate of injection molding production is reduced, and the product yield is improved; on the other hand, because of the setting of the magnetism-proof mold insert, the magnetic guiding-in mold core surface of the magnetic part is stopped, the mold core can be supported to complete injection molding, the magnetic force of the head of the ejector sleeve can be greatly improved, the magnetic attraction stability is improved, and the magnetic conduction nail can not fall off even if the machine table vibrates in the mold opening and closing process.

Advantages and features of the present disclosure are described in detail below with reference to the accompanying drawings.

Drawings

The following drawings of the present disclosure are included to provide an understanding of the disclosure. The drawings illustrate embodiments of the disclosure and their description, serve to explain the principles of the disclosure. In the drawings, there is shown in the drawings,

FIG. 1 is a block diagram of an in-mold nail-burying mold according to an exemplary embodiment of the present disclosure;

FIG. 2 is an exploded view of an in-mold nail-embedding mold according to an exemplary embodiment of the present disclosure;

FIG. 3 is a block diagram of the anti-drop nail assembly of FIG. 2;

FIG. 4 is an exploded view of the drop pin prevention assembly shown in FIG. 3;

FIG. 5 is a partial assembly view of the drop resistant nail assembly shown in FIG. 3;

fig. 6 is a partial cross-sectional view of the magnetic insulating insert of the drop resistant pin assembly of fig. 3.

The reference numbers in the figures illustrate:

10. a mold core; 101. mounting position; 20. a nail drop prevention assembly; 21. a magnetism-insulating insert; 211. a through hole; 2111. a first hole portion; 21111. a first positioning surface; 2112. a second hole portion; 21121. a second positioning surface; 2113. a middle hole portion; 22. a magnetic member; 221. perforating holes; 23. a ejector sleeve; 231. a first stage; 232. a second stage; 233. a head portion; 234. a third positioning surface; 24. magnetic conduction nail.

Detailed Description

In the following description, numerous details are provided to provide a thorough understanding of the present disclosure. One skilled in the art, however, will understand that the following description merely illustrates alternative embodiments of the disclosure and that the disclosure may be practiced without one or more of these details. In addition, some features that are well known in the art have not been described in detail to avoid obscuring the present disclosure.

As shown in fig. 1 and 2, the mold for embedding nails in a mold according to the present disclosure includes a mold core 10 and a nail dropping prevention assembly 20, wherein the mold core 10 is provided with a mounting position 101, and the nail dropping prevention assembly 20 is disposed on the mounting position 101 of the mold core 10, because the shape and structure of the mold core 10 can be adjusted according to the actual requirement of an injection molding product, further description thereof is omitted, and the nail dropping prevention assembly 20 is mainly described in detail below.

As shown in fig. 3 to 6, the nail drop prevention assembly 20 includes a magnetism-insulating insert 21, a magnetic member 22, and a cartridge 23.

The magnetism isolating insert 21 is made of magnetism isolating material, in an embodiment of the present disclosure, the magnetism isolating insert 21 is made of beryllium copper, and here, the material of the magnetism isolating insert 21 is not limited to beryllium copper. The magnetism isolating insert 21 is provided with a through hole 211, the through hole 211 comprises a first hole portion 2111 and a second hole portion 2112, and the first hole portion 2111 is used for arranging a magnetic part 22; the second hole portion 2112 is used for limiting the nail embedding position, in the embodiment of the disclosure, in order to achieve the purpose of preventing nail falling, the nail embedding adopts a magnetic conduction nail 24, and the magnetic conduction nail 24 is, for example, a steel nail, so as to have the characteristic of being magnetically attracted.

The magnetic member 22 is a magnet, and the magnetic member 22 is disposed in the first hole portion 2111.

The ejector sleeve 23 has a first section 231, a second section 232 and a head 233, the first section 231 is inserted into the mold core 10, the second section 232 is inserted into the first hole portion 2111, and the head 233 extends into the second hole portion 2112, so that the magnetic property of the magnetic member 22 is transmitted to the head 233 through the second section 232, and the magnetic nail 24 can be adsorbed by the head 233 to be positioned in the second hole portion 2112.

According to the in-mold nail embedding mold, on one hand, the magnetism of the magnetic part 22 is transmitted to the head 233 of the ejector sleeve 23 through the second section 232 of the ejector sleeve 23, and the head 233 of the ejector sleeve 23 generates magnetic force to adsorb the magnetic conduction nail 24, so that the purpose of fixing the magnetic conduction nail 24 is achieved, the nail falling phenomenon in the injection molding process is avoided, the nail leakage problem is solved, the rejection rate of injection molding production is reduced, and the product yield is improved; on the other hand, because of the setting of magnetism-insulating insert 21, the magnetism of magnetic part 22 is stopped to be led into mould core 10 surface, can not only support mould core 10 and accomplish and mould plastics, can promote the magnetic force of department's section of thick bamboo 23 head 233 moreover greatly, has improved magnetism and has inhaled stability, even open and shut mould process board vibrations magnetic conduction nail can not drop yet.

In order to achieve the purpose of transmitting magnetism well, in one embodiment of the present disclosure, the magnetic member 22 is a ring-shaped member having a through hole 221, the through hole 221 has a first diameter D1, the second section 232 of the driver cylinder 23 has a second diameter D2, and the second diameter D2 is smaller than the first diameter D1, so that the magnetic member 22 can be sleeved on the outer periphery of the second section 232.

Further, the through hole 211 further includes an intermediate hole portion 2113 located between the first hole portion 2111 and the second hole portion 2112, the intermediate hole portion 2113 serving to communicate the first hole portion 2111 with the second hole portion 2112, a diameter D3 of the intermediate hole portion 2113 being smaller than a diameter D4 of the first hole portion 2111, so that the through hole 211 forms a stepped hole for easy positioning.

Further, the diameter D5 of the second hole portion 2112 is smaller than the diameter D4 of the first hole portion 2111, and when the sleeve 23 is assembled to the magnetism isolating insert 21, the sleeve 23 can be inserted into the second hole portion 2112 along the first hole portion 2111, and the diameter D5 of the second hole portion 2112 is smaller than the diameter D4 of the first hole portion 2111, so that the sleeve 23 and the magnetism isolating insert 21 can be easily assembled.

Further, the diameter D3 of the intermediate hole portion 2113 is not greater than the diameter D5 of the second hole portion 2112, where the diameter D3 of the intermediate hole portion 2113 may be less than the diameter D5 of the second hole portion 2112, and may also be equal to the diameter D5 of the second hole portion 2112.

Here, the diameter D5 of the second hole portion 2112 is greater than the outer diameter of the magnetic conductive nail 24, so that a gap is formed between the magnetic conductive nail 24 and the hole wall of the second hole portion 2112, and the purpose of injection molding and nail burying is achieved.

To achieve the positioning, the first hole portion 2111 has a first positioning surface 21111, the second hole portion 2112 has a second positioning surface 21121, and a distance L between the first positioning surface 21111 and the second positioning surface 21121 is not greater than 16 mm, such as 12 mm, 13 mm, 14 mm, and the like, so as to ensure that the magnetic nail 24 is located in the effective magnetic force range of the magnetic member 22.

Here, a third positioning surface 234 is formed at the junction of the second segment 232 and the head 233, and the third positioning surface 234 is flush with the second positioning surface 21121.

In an embodiment of the present disclosure, the magnetic member 22 is a neodymium iron boron magnet, such as an N35EH magnet, the N35EH magnet can resist temperature of more than 200 degrees, the attraction force is weakened when the temperature is high, and the attraction force is restored when the temperature is low, which can well satisfy the requirements of low temperature and strong magnetism when the magnetic nail 24 is placed (i.e. when the mold is opened), and the magnetic force is easy to attract the magnetic nail 24; the temperature is high and the magnetism is weak when the injection molding is finished, the injection molding product is easy to take out, and the quality of the product cannot be influenced.

In the in-mold nail embedding mold disclosed by the invention, during manufacturing, the magnetic part 22 can be embedded into the first hole part 2111 of the through hole 211, and in the process of embedding the magnetic part 22, the magnetic part 22 is positioned through the first positioning surface 21111; then, the magnetic nail 24 is sleeved on the head 233 of the driver barrel 23, and the position of the magnetic nail 24 on the driver barrel 23 is positioned through the second positioning surface 21121; afterwards, wear to locate the department's section of thick bamboo 23 that is equipped with the magnetic conduction nail 24 in the through-hole 211 to assemble together with the magnetic insulation mold insert 21 and form and prevent falling the nail subassembly 20, wear to establish the department's section of thick bamboo 23 in-process, make third locating surface 234 and second locating surface 21121 parallel and level, so that the distance between the bottom of magnetic conduction nail 24 and the top of magnetic part 22 is roughly equal to the distance between first locating surface 21111 and the second locating surface 21121, thereby guarantee that the magnetic conduction nail 24 is located the magnetic force effective range of magnetic part 22.

In the description of the present disclosure, it is to be understood that the orientation or positional relationship indicated by the orientation terms is generally based on the orientation or positional relationship shown in the drawings, and is for convenience of description and simplicity of description only, and in the event that the description is not made to the contrary, these orientation terms are not intended to indicate and imply that the device or element so referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore should not be construed as limiting the scope of the disclosure; the terms "inner" and "outer" refer to the interior and exterior relative to the contours of the components themselves.

For ease of description, spatially relative terms such as "above … …", "above … …", "above … …", "above", and the like, may be used herein to describe the spatial relationship of one or more components or features to other components or features shown in the figures. It is understood that the spatially relative terms are intended to encompass not only the orientation of the component as depicted in the figures, but also different orientations in use or operation. For example, if an element in the drawings is turned over in its entirety, the articles "over" or "on" other elements or features will include the articles "under" or "beneath" the other elements or features. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". Further, these components or features may also be positioned at various other angles (e.g., rotated 90 degrees or other angles), all of which are intended to be encompassed herein.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, elements, components, and/or combinations thereof, unless the context clearly indicates otherwise.

It should be noted that the terms "first," "second," and the like in the description and claims of the present disclosure and in the above-described drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the disclosure described herein are capable of operation in other sequences than those illustrated or described herein.

The present disclosure has been illustrated by the above-described embodiments, but it should be understood that the above-described embodiments are for purposes of illustration and description only and are not intended to limit the present disclosure to the described embodiments. Furthermore, it will be understood by those skilled in the art that the present disclosure is not limited to the embodiments described above, and that many variations and modifications may be made in light of the teaching of the present disclosure, all of which fall within the scope of the claimed disclosure. The scope of the disclosure is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a bury nail mould in mould, includes mould benevolence (10), its characterized in that, still including preventing falling nail subassembly (20), prevent falling nail subassembly (20) and include:

the magnetic insulation insert (21) is provided with a through hole (211), and the through hole (211) comprises a first hole part (2111) and a second hole part (2112) used for limiting the embedding position of the magnetic nail (24);

a magnetic member (22), the magnetic member (22) being disposed in the first hole portion (2111); and

a cartridge (23), the cartridge (23) having a first section (231), a second section (232), and a head (233);

the first section (231) is inserted into the mold core (10), the second section (232) penetrates through the first hole portion (2111), the head portion (233) extends into the second hole portion (2112), and the magnetic performance of the magnetic part (22) is transmitted to the head portion (233) through the second section (232), so that the magnetic nail (24) can be adsorbed by the head portion (233) to be positioned in the second hole portion (2112).

2. The in-mold nail embedding mold according to claim 1, wherein the magnetic member (22) is an annular member having a through hole (221), the through hole (221) having a first diameter, and the second section (232) having a second diameter smaller than the first diameter.

3. The in-mold nailing mold according to claim 1, wherein the through-hole (211) further comprises an intermediate hole portion (2113) between the first hole portion (2111) and the second hole portion (2112), the intermediate hole portion (2113) having a diameter smaller than the diameter of the first hole portion (2111).

4. The in-mold nailing mold according to claim 3, wherein a diameter of the second bore section (2112) is smaller than a diameter of the first bore section (2111).

5. The in-mold nailing mold according to claim 4, wherein a diameter of the middle hole portion (2113) is not larger than a diameter of the second hole portion (2112).

6. The in-mold nailing mold according to claim 1, wherein the diameter of the second hole portion (2112) is larger than the outer diameter of the magnetic conductive nail (24).

7. The in-mold nail embedding mold according to claim 1, wherein the magnetic member (22) is a neodymium iron boron magnet.

8. The in-mold nail embedding mold according to claim 1, wherein the magnetism isolating insert (21) is made of beryllium copper.

9. The mold-in-mold nailing mold according to any of claims 1-8, wherein the first bore section (2111) has a first locating surface (21111), the second bore section (2112) has a second locating surface (21121), and the distance between the first locating surface (21111) and the second locating surface (21121) is not more than 16 mm.

10. The in-mold nailing mold according to claim 9, wherein a third positioning surface (234) is formed at a junction of the second section (232) and the head portion (233), the third positioning surface (234) being flush with the second positioning surface (21121).