CN218587538U - Heat radiation structure of automatically controlled box - Google Patents

Abstract

The utility model discloses a heat radiation structure of automatically controlled box, including fin, radiator fan and semiconductor refrigeration piece, the semiconductor refrigeration piece is located the fin with between the radiator fan, the fin comprises heat-conducting plate and a plurality of thin slice, and is a plurality of thin slice fixed mounting is in two of the top outer wall of heat-conducting plate is located the outside the equal fixed mounting in both ends of thin slice has the stopper, one side of stopper all is provided with sunken opening, four the stopper the opening all moves towards the centre of fin and the top of thin slice enclose into one with the installing zone of semiconductor refrigeration piece looks adaptation, the semiconductor refrigeration piece place in the installing zone. The utility model discloses a heat radiation structure of automatically controlled box has embedded the semiconductor refrigeration piece between radiator fan and fin, can effectively reduce the thickness of fin when not reducing the radiating effect, has the technological effect that reduces the thickness of automatically controlled box.

Description

Heat radiation structure of automatically controlled box

Technical Field

The utility model relates to an automatically controlled box technical field of air conditioner especially relates to a heat radiation structure of automatically controlled box.

Background

The electric control box is also called a controller, mainly comprises a shell and a circuit board and is used for controlling the operation of electric equipment. The chip on the circuit board in the electric control box can emit a large amount of heat during working, and a heat dissipation structure needs to be added to the electric control box in order to enable the CPU to work normally. Common heat radiation structure in the automatically controlled box is air-cooled, blow the hot-air in the automatically controlled box outside the automatically controlled box through the fan promptly, wherein, need use the fin in the air-cooled mode, hug closely on CPU through the fin, paste the fan on the fin again, dispel the heat with this, it needs the fin to have great thickness in order to guarantee that the fin has suitable heat conduction area, consequently, the fin can occupy great space, lead to the whole volume of automatically controlled box great, to this need a heat radiation structure that can reduce automatically controlled box volume.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a heat radiation structure of automatically controlled box aims at solving the heat radiation structure volume of current automatically controlled box big, leads to the bulky great technical problem of automatically controlled box body.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a heat radiation structure of automatically controlled box, includes fin, radiator fan and semiconductor refrigeration piece, the semiconductor refrigeration piece is located the fin with between the radiator fan, the fin comprises heat-conducting plate and a plurality of thin slice, and is a plurality of thin slice fixed mounting is in the top outer wall of heat-conducting plate is located two in the outside the equal fixed mounting in both ends of thin slice has the stopper, one side of stopper all is provided with sunken opening, four the stopper the opening all moves towards the centre of fin and the top of thin slice enclose into one with the installing zone of semiconductor refrigeration piece looks adaptation, the semiconductor refrigeration piece place in the installing zone, the heat-absorbing surface of semiconductor refrigeration piece with the thin slice contacts.

When the semiconductor refrigeration piece is used, the radiating fin and a part, needing radiating, in the electric control box are made of metal, and the radiating fin has better heat conductivity, so that heat exchange can be carried out through the radiating fin and the environment at the position of a chip in the electric control box, namely the heat absorption surface of the semiconductor refrigeration piece is contacted with the radiating fin, the chip of the electric control box is cooled through low temperature generated by the semiconductor refrigeration piece, the semiconductor refrigeration piece is convenient to quickly install by arranging limiting blocks around the top of the radiating fin, the semiconductor refrigeration piece is installed between a radiating fan and the radiating fin, heat generated by the heat release surface of the semiconductor refrigeration piece can be blown away by the fan, and meanwhile, a clamping installation position is provided for the semiconductor refrigeration piece, namely, the semiconductor refrigeration piece is fixedly placed, and the semiconductor refrigeration piece is prevented from shaking in use; the cooling fin provides a mounting position for the semiconductor refrigeration piece, and the semiconductor refrigeration piece is convenient to mount, and simultaneously is convenient for providing low-temperature air to the surroundings through gaps of the thin slices in the cooling fin.

In a preferred scheme, a first clamping groove is formed in the outer wall of the bottom of a bottom plate of the cooling fan, the first clamping groove is matched with the semiconductor refrigerating sheet, so that the semiconductor refrigerating sheet is pressed and clamped through a mounting area and the first clamping groove, and expansion grooves are formed in the inner walls of two sides of the first clamping groove.

The heat radiation fan rotates to suck air from the expansion slot to generate airflow to blow away hot air generated by the heat radiation part on the upper part of the semiconductor refrigeration sheet, and the length direction of the expansion slot is the same as that of the sheet of the heat radiation sheet, so that air can be sucked from two sides of the heat radiation sheet; if the length direction of the expansion groove is the same as the width direction of the thin sheet of the radiating fin, a large amount of low-temperature air can be taken away from the gap of the thin sheet, and the refrigerating effect is reduced.

In a preferred scheme, the top edge of the inner wall of the first clamping groove is provided with a slope.

The inclined plane forms a horn shape with a downward opening, so that the contact area between the top of the first clamping groove and the semiconductor refrigeration piece is reduced, and the heat dissipation effect of the heat dissipation fan on the semiconductor refrigeration piece is improved.

In a preferred scheme, the four corners of the heat conducting plate are provided with mounting feet, and mounting holes are formed in the outer wall of the top of each mounting foot and the four corners of the bottom plate.

The installation on the bottom plate with mounting hole on the installation foot is corresponding relation from top to bottom, uses the bolt from last to passing the mounting hole of bottom plate on passing the installation foot in proper order down, fixes on the circuit board at last to this realizes that heating panel and cooling fan only need four hole sites when fixed can, compares in the mounting hole position that fin and fan that looses adopted the difference on the circuit board, and this scheme can reduce the area that the mounting hole position occupy the circuit board, makes overall structure compacter.

By last, a heat radiation structure of automatically controlled box, including fin, radiator fan and semiconductor refrigeration piece, the semiconductor refrigeration piece is located the fin with between the radiator fan, the fin comprises heat-conducting plate and a plurality of thin slice, and is a plurality of thin slice fixed mounting is in two that are located the outside the top outer wall of heat-conducting plate the equal fixed mounting in both ends of thin slice has the stopper, one side of stopper all is provided with sunken opening, four the stopper the opening all moves towards the centre of fin and the top of thin slice enclose into one with the installing zone of semiconductor refrigeration piece looks adaptation, the semiconductor refrigeration piece place in the installing zone, the heat absorption surface of semiconductor refrigeration piece with the thin slice contacts. The utility model provides a pair of heat radiation structure of automatically controlled box has embedded the semiconductor refrigeration piece between radiator fan and fin, can effectively reduce the thickness of fin when not reducing the radiating effect, has the technological effect that reduces the thickness of automatically controlled box, need not trompil or glue on the semiconductor refrigeration piece, simple to operate.

The parts of the device not involved are the same as or can be implemented using prior art.

Drawings

Fig. 1 is a schematic structural view of a heat dissipation structure of an electric control box provided by the present invention.

Fig. 2 is the installation schematic diagram of the heat dissipation sheet and the semiconductor refrigeration sheet of the heat dissipation structure of the electric control box provided by the utility model.

Fig. 3 is a schematic view of a heat dissipation sheet structure of a heat dissipation structure of an electric control box.

Fig. 4 is another schematic view of the heat dissipation structure of the electrical control box according to the present invention.

Fig. 5 is a schematic view of a local structure of a heat dissipation fan of a heat dissipation structure of an electrical control box.

In the drawings: 1. a heat radiation fan; 2. a base plate; 3. a bolt; 4. a heat sink; 5. mounting a foot; 6. a first card slot; 7. expanding the grooves; 8. a bevel; 9. mounting holes; 10. a limiting block; 11. semiconductor refrigeration piece.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

The utility model discloses a heat radiation structure of automatically controlled box mainly is applied to the heat radiation structure volume of current automatically controlled box big, leads to the long-pending great scene of automatically controlled box body.

Refer to fig. 1, fig. 2 and fig. 3, a heat radiation structure of automatically controlled box, including fin 4, radiator fan 1 and semiconductor refrigeration piece 11, semiconductor refrigeration piece 11 is located between fin 4 and radiator fan 1, fin 4 comprises heat-conducting plate and a plurality of thin slice, a plurality of thin slice fixed mounting are at the top outer wall of heat-conducting plate, a plurality of thin slices are arranged in "one" word, the equal fixed mounting in both ends of two thin slices that are located the outside has stopper 10, one side of stopper 10 all is provided with the opening of sinking, the opening of four stopper 10 all encloses into a installing zone with semiconductor refrigeration piece 11 looks adaptation in the centre of fin 4 and in the top of thin slice, semiconductor refrigeration piece 11 is placed in the installing zone, semiconductor refrigeration piece 11's heat absorbing surface and thin slice upper surface contact.

When the cooling device is used, the cooling fin 4 and a part needing heat dissipation in the electric control box are made of metal, the cooling fin 4 made of metal has better heat conductivity, therefore, heat exchange can be carried out through the environment at the position of the cooling fin 4 and a chip in the electric control box, namely, a heat absorption surface of the semiconductor refrigeration piece 11 is contacted with the cooling fin 4, the chip of the electric control box is cooled through low temperature generated by the semiconductor refrigeration piece 11, the semiconductor refrigeration piece 11 is convenient to rapidly install by arranging the limiting blocks 10 around the top of the cooling fin 4, the semiconductor refrigeration piece 11 is installed between the cooling fan 1 and the cooling fin 4, heat generated by a heat release surface of the semiconductor refrigeration piece 11 is blown away by the fan, meanwhile, a clamped installation position is provided for the semiconductor refrigeration piece 11, namely, the semiconductor refrigeration piece 11 is fixedly placed, and the semiconductor refrigeration piece 11 is prevented from shaking in use; the cooling fin 4 provides a mounted position for the semiconductor refrigeration piece 11, and the semiconductor refrigeration piece 11 simple to operate is convenient for simultaneously provide low temperature air to around through the clearance of thin slice in the cooling fin 4, uses the semiconductor refrigeration piece 11 to provide low temperature after, and the heat radiating area of cooling fin 4 can suitably reduce, can be with the thickness that reduces cooling fin 4, and then realizes reducing the purpose of automatically controlled box thickness.

Referring to fig. 4 and 5, in a preferred embodiment, a first clamping groove 6 is formed in an outer wall of a bottom plate 2 of a cooling fan 1, the first clamping groove 6 is matched with a semiconductor chilling plate 11, so that the semiconductor chilling plate 11 is pressed and clamped through a mounting area and the first clamping groove 6, expansion grooves 7 are formed in inner walls of two sides of the first clamping groove 6, when the cooling fan 1 rotates, air can be sucked from the expansion grooves 7, air flow is generated, hot air generated in a heat release portion of the upper portion of the semiconductor chilling plate 11 is blown away, and the length direction of the expansion grooves 7 is the same as the length direction of sheets of the cooling fins 4, so that air can be sucked from two sides of the cooling fins 4; if the length direction of the expansion groove 7 is the same as the width direction of the thin sheet of the radiating fin 4, a large amount of low-temperature air can be taken away from the gap of the thin sheet, and the refrigerating effect is reduced.

Referring to fig. 4 and 5, in a preferred embodiment, an inclined surface 8 is disposed at an edge of a top portion of an inner wall of the first card slot 6, and the inclined surface 8 forms a horn shape with an opening facing downward, so that a contact area between the top portion of the first card slot 6 and the semiconductor chilling plate 11 is reduced, and a heat dissipation effect of the heat dissipation fan 1 on the semiconductor chilling plate 11 is improved.

The shape of the opening and the shape of the first clamping groove 6 are both matched with the semiconductor chilling plate 11, and the length of the semiconductor chilling plate 11 is smaller than that of the slice.

Referring to fig. 1, fig. 2 and fig. 3, in a preferred embodiment, the four corners of the heat conducting plate are provided with mounting feet 5, mounting holes 9 have been all opened in the top outer wall of mounting feet 5 and the four corners of bottom plate 2, the mounting on bottom plate 2 corresponds to mounting holes 9 on mounting feet 5 from top to bottom, use bolt 3 to pass mounting holes 9 on mounting feet 5 from top to bottom in proper order, fix on the circuit board at last, so that the heat dissipation plate and the cooling fan only need four hole sites when fixed, compare in the mounting hole positions that cooling fin 4 and fan that looses adopt different on the circuit board, this scheme can reduce the area that the mounting hole position occupies the circuit board, make overall structure more compact.

The working principle is as follows: during the use, the heat absorption face of semiconductor refrigeration piece 11 contacts with fin 4, the low temperature that produces through semiconductor refrigeration piece 11 is cooled down for the chip department of automatically controlled box, set up stopper 10 around the top of fin 4 and be convenient for install semiconductor refrigeration piece 11 fast, install semiconductor refrigeration piece 11 between radiator fan 1 and fin 4, can blow away the heat that semiconductor refrigeration piece 11 exothermic face produced with the fan, provide the mounted position of clamp connection for semiconductor refrigeration piece 11 simultaneously, realize placing semiconductor refrigeration piece 11 fixed promptly, avoid semiconductor refrigeration piece 11 to appear rocking when using, can provide low temperature for semiconductor refrigeration piece 11's below after using semiconductor refrigeration piece 11 circular telegram, the heat radiating area of fin 4 can suitably reduce, be convenient for low temperature quick conduction to the CPU department of circuit board, can be with the thickness that reduces fin 4, and then realize reducing the purpose of automatically controlled box thickness.

The above description is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto. The substitution may be of partial structures, devices, method steps, or may be a complete solution. According to the utility model discloses a technical scheme and utility model design and equal replacement or change all should be covered within the scope of protection of the utility model.

Claims (7)

1. The utility model provides a heat radiation structure of automatically controlled box, includes fin (4), radiator fan (1) and semiconductor refrigeration piece (11), its characterized in that, semiconductor refrigeration piece (11) are located fin (4) with between radiator fan (1), fin (4) comprise heat-conducting plate and a plurality of thin slice, and is a plurality of thin slice fixed mounting be in the top outer wall of heat-conducting plate is located two in the outside the equal fixed mounting in both ends of thin slice has stopper (10), one side of stopper (10) all is provided with sunken opening, four stopper (10) the opening all moves towards the centre of fin (4) and the top of thin slice enclose into one with the installing zone of semiconductor refrigeration piece (11) looks adaptation, semiconductor refrigeration piece (11) place in the installing zone, the heat absorption face of semiconductor refrigeration piece (11) with the thin slice contacts.

2. The heat dissipation structure of an electric control box according to claim 1, wherein a first clamping groove (6) is formed in the outer wall of the bottom plate (2) of the heat dissipation fan (1), the first clamping groove (6) is matched with the semiconductor refrigeration sheet (11), and expansion grooves (7) are formed in the inner walls of two sides of the first clamping groove (6).

3. A heat dissipating structure of an electrical control box according to claim 2, wherein the length of the expanding slot (7) is smaller than the length of the thin sheet.

4. The heat dissipation structure of an electric control box according to claim 2, wherein the top edge of the inner wall of the first slot (6) is provided with an inclined surface (8).

5. A heat dissipation structure of an electric control box according to claim 4, wherein the shape of the opening and the shape of the first clamping groove (6) are both adapted to the semiconductor chilling plate (11).

6. The heat dissipation structure of an electronic control box according to claim 5, wherein mounting feet (5) are arranged at four corners of the heat conduction plate, and mounting holes (9) are arranged at the outer wall of the top of each mounting foot (5) and the four corners of the bottom plate (2).

7. A heat dissipation structure of an electric control box according to claim 1, characterized in that the length of the semiconductor chilling plate (11) is smaller than the length of the thin sheet.

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