CN218399450U - Orientation mould - Google Patents

Abstract

The application relates to a preparation process of a high-resilience oriented heat-conducting interface material, which comprises the steps of providing a mixed base material, pressing the mixed base material into an oriented die, stacking a heat-conducting glue layer by layer and cutting a heat-conducting blank. The orientation mould comprises a multistage shunt pipeline and an orientation row nozzle communicated with the shunt pipeline, a plurality of closely-arranged orientation grooves are arranged in the orientation row nozzle, mixed base materials flow along the multistage shunt pipeline and are extruded to arrange carbon fibers in an oriented mode, the mixed base materials flow into the orientation row nozzle from the shunt pipeline, and the mixed base materials are extruded from the orientation grooves to form a heat-conducting glue layer. Through adopting above-mentioned technical scheme, will mix the matrix and form holistic heat-conducting glue layer in orientation mould, remove orientation mould and make the heat-conducting glue layer along the direction of movement shaping of mould and pile up. Compare in piling up heat-conducting adhesive tape, directly pile up the heat-conducting adhesive layer and can control the gap width between the heat-conducting adhesive layer to fill more easily, directly pile up the heat-conducting adhesive layer simultaneously and also can improve and pile up efficiency.

Description

Orientation mould

Technical Field

The application relates to the technical field of heat-conducting interface materials, in particular to an orientation mold.

Background

With the development of semiconductor technology, along with the power enhancement of semiconductor chip devices, the requirement for the heat dissipation performance of the heat conductive material disposed on the semiconductor chip is also increasing, and the heat dissipation performance of the existing heat conductive material cannot meet the heat dissipation requirement of the chip.

The heat dissipation properties of the heat conductive material are mainly provided by the heat conductive fibers, which generally have good heat conductive properties only in a specific direction. Therefore, the heat dissipation performance of the heat conductive material can be further improved by improving the orientation of the heat conductive fibers in a specific direction.

Promote the orientation of heat conduction fibre among the prior art and mainly rely on the row mouth internal diameter with orientation mould to reduce, promote the centripetal effect of heat conduction material in the flow through reducing row mouth internal diameter, reach the effect that promotes the orientation of heat conduction fibre. However, reducing the inner diameter of the nozzle also results in a reduced flow of the heat conductive material for a single extrusion, and the orientation die needs to be moved repeatedly many times to extrude and stack the heat conductive material into a three-dimensional heat conductive blank, so that the method greatly reduces the production efficiency. Meanwhile, in the stacking process of the heat conduction materials extruded once, the interval distance generated between the heat conduction adhesive tapes extruded at each time has fluctuation errors, so that gaps are formed between the heat conduction adhesive tapes, finally, holes are generated in the heat conduction material products, and the heat conduction performance is seriously influenced.

Disclosure of Invention

Therefore, it is necessary to provide an orientation mold aiming at the problem that the existing preparation process of the heat-conducting interface material cannot simultaneously meet the requirements of high orientation of the heat-conducting fiber and high production efficiency of the heat-conducting product.

An orientation mould comprises a base and an orientation row nozzle, wherein a multi-stage flow distribution channel is arranged in the base; the orientation row nozzle is clamped on the base and communicated with the plurality of shunting channels, a plurality of closely arranged orientation grooves are arranged in the orientation row nozzle, the mixed base material flows into the orientation row nozzle along the multistage shunting channels, and the orientation grooves extrude the heat-conducting fibers in the mixed base material in a directional arrangement mode to continuously guide out the diaphragm-shaped heat-conducting adhesive layer.

By adopting the technical scheme, the mixed base material can be dispersed into the shunt pipes from one inlet, then the mixed base material forms an integral heat-conducting adhesive layer through the orientation discharge nozzle, and because the inner diameter of the orientation groove in the orientation discharge nozzle is obviously smaller than that of the inlet of the shunt pipe, the mixed base material extruded from the orientation groove is naturally thinner in the thickness direction. Meanwhile, the plurality of orientation grooves are closely arranged, and the mixed base materials are mutually bonded in the width direction, so that a heat-conducting adhesive layer with a longer width is formed. At the moment, the orientation mold is moved, and the heat-conducting adhesive layers are formed and stacked along the moving direction.

Compared with the traditional process in which the mixed base materials are directly extruded from the shunt pipeline to form the heat-conducting adhesive strips for stacking, the mixed base materials are bonded into the heat-conducting adhesive layers in advance and then stacked, the inconsistency of gaps generated between any two adjacent heat-conducting adhesive strips in the stacking process of the heat-conducting adhesive strips can be avoided, and all the gaps can not be filled when the heat-conducting adhesive strips are stacked in the later period, so that the holes generated due to air wrapping in the gaps are reduced, and the heat conductivity coefficient of the finally-formed heat-conducting product is improved. Meanwhile, compared with the traditional process that the extrusion die needs to be moved back and forth to fully spread the first layer and then the second layer is laid, the heat-conducting glue layer formed by the die can form one heat-conducting glue layer by moving the orientation die for one time, the second-time movement is carried out to form the second heat-conducting glue layer, the orientation die needs to be moved for several times to form the heat-conducting blank, and the production efficiency is far higher than that of the traditional process.

In one embodiment, the multi-stage flow dividing channel comprises a first-stage flow dividing channel, a second-stage flow dividing channel and a third-stage flow dividing channel, wherein the cross-sectional area of the first-stage flow dividing channel, the cross-sectional area of the second-stage flow dividing channel and the cross-sectional area of the third-stage flow dividing channel are sequentially reduced, and the third-stage flow dividing channel is communicated with the orientation nozzle.

In one embodiment, a flow regulating element is arranged on the tertiary flow dividing channel and used for controlling the flow in the tertiary flow dividing channel.

In one embodiment, the sectional areas of the first-stage flow distribution channel, the second-stage flow distribution channel and the third-stage flow distribution channel are reduced step by step according to a proportion of 10% -30%, and the number of the first-stage flow distribution channel, the second-stage flow distribution channel and the third-stage flow distribution channel is increased step by step according to a proportion of 2-4.

Through adopting above-mentioned technical scheme, a plurality of orientation groove intercommunicate for mixed base stock can realize mutually bonding in the orientation groove, forms the heat-conducting glue film, just because closely arranged bonds each other after avoiding mixed base stock to extrude, thereby because the bonding time produces the fracture inadequately. Meanwhile, the mutually communicated orientation grooves mean that a communication part exists between the orientation grooves, and the communication part can reduce the height of a gap generated between adjacent orientation grooves, thereby reducing a void generated in a final product.

In one embodiment, the orientation groove is provided with a symmetrical arc structure, and the mixed base material is extruded by the inner wall of the arc structure in the orientation groove to form the heat-conducting adhesive layer with the symmetrical arc structure.

In one embodiment, the orientation grooves are communicated with each other, and the mixed base materials are adhered to each other in the orientation grooves to form the heat-conducting adhesive layer.

In one embodiment, the ratio of the maximum diameter of the arc-shaped structure in the orientation groove to the shortest width of the connection in the orientation groove ranges from 0 to 0.7.

In one embodiment, a guide inclined plane is arranged in the orientation groove, the guide inclined plane is matched with one embodiment, the orientation die further comprises a cover plate, the cover plate is mounted on the base, and the cover plate and the base surround to form a plurality of stages of flow dividing channels.

In one embodiment, the orientation row nozzle comprises a first orientation row nozzle and a second orientation row nozzle which are symmetrical, and the first orientation row nozzle and the second orientation row nozzle are buckled to form the orientation row nozzle.

In summary, the orientation mold of the present application has at least one of the following beneficial technical effects:

1. the mixed base material forms a whole heat-conducting adhesive layer to be stacked, and the production efficiency is improved.

2. The structure that adopts multistage reposition of redundant personnel pipeline cooperation orientation row mouth improves pipeline pressure in order to overcome extrusion resistance for can adopt the higher formula of carbon fiber ratio, improve product thermal conductivity.

3. The heat-conducting adhesive layer extruded from the closely-arranged orientation grooves can reduce and fix the gap distance on the surface of the heat-conducting adhesive layer, so that the gap size generated by the heat-conducting adhesive layers between different layers is reduced in the later stacking process, the gap size is also convenient to fill, and the phenomenon that the heat-conducting performance is reduced due to the fact that holes appear in a formed heat-conducting product is avoided.

Drawings

Fig. 1 is a flow chart of a process for preparing a high-resilience oriented thermal interface material according to an embodiment of the present disclosure;

fig. 2 is a schematic view of a scene of a process for preparing a high-resilience oriented thermal interface material according to an embodiment of the present application;

FIG. 3 is a schematic view of a first perspective view of an orientation tool in an embodiment of the present application;

FIG. 4 is an exploded view of a first perspective structure of an orientation tool in an embodiment of the present application;

FIG. 5 is a schematic cross-sectional view of an orientation tool from a second perspective in an embodiment of the present application;

FIG. 6 is an enlarged view of the structure at B in FIG. 4;

FIG. 7 is an enlarged view of the structure at A in FIG. 2;

FIG. 8 is an enlarged view of the structure at C in FIG. 3;

FIG. 9 is a schematic view of a first perspective of an orientation nozzle 10 according to an embodiment of the present application;

fig. 10 is a schematic view of a second perspective view of stacked thermal films according to an embodiment of the present application.

Description of reference numerals:

10. an orientation mold; 10A, a base; 10B, an orientation mold cover plate; 10C, limiting holes; 11. a diversion pipeline; 11A, a primary diversion pipeline; 11B, a secondary flow distribution pipeline; 11C, a third-stage shunt pipeline; 12. a flow regulating member; 13. orientation row nozzles; 13A, a first orientation row nozzle; 13B, second orientation row of nozzles; 13C, orientation connecting grooves; 13D, buckling; 13E, a card slot; 13F, a guide inclined plane; 14. an adapter; 15. a diversion dam; 20. stacking the molds; 21. a base; 22. a stack frame; 200. a glue barrel; 110. a heat conductive green body; 110. a heat-conducting adhesive layer; 111. a protrusion; 112. and (4) sinking.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Referring to fig. 1 and fig. 2, fig. 1 is a flowchart illustrating a process of a high-resilience oriented thermal interface material in an embodiment of the present application, and fig. 2 is a schematic view illustrating a scene in a process of preparing the high-resilience oriented thermal interface material in the embodiment of the present application.

The preparation process of the high-resilience oriented heat-conducting interface material provided by the embodiment of the application comprises the following steps: s1, providing a mixed base material; s2, pressing the mixed base material into the orientation mold 10 to form a heat-conducting adhesive layer 110; s3, stacking the heat-conducting glue layers 110 layer by layer to form a heat-conducting blank 100; and S4, cutting the heat-conducting blank 100 to form a heat-conducting product. Through the process method, the whole heat-conducting adhesive layer 110 can be directly formed in the orientation mold 10, and compared with the stacking of a plurality of independent heat-conducting adhesive strips, the heat-conducting adhesive layer 110 can reduce gaps generated among the heat-conducting adhesive strips in the stacking process, so that the holes existing in the molded heat-conducting product are reduced, and the heat conductivity coefficient of the heat-conducting product is improved.

The process parameters, formula proportions and related equipment are described in the following according to the flow steps in the production process.

S1, providing a mixed base material. Wherein, the mixed base material comprises carbon fiber, a plurality of fillers, adhesive and the like. Specifically, carbon fibers are the main heat conducting material in the formula, and due to the unique crystal structure of the carbon fibers, the crystals of the carbon fibers have excellent heat conducting performance in the axial direction. Further, by utilizing the heat-conducting property of the carbon fibers in the axial direction, all the carbon fibers are arranged in the same direction, and the final heat-conducting product can have excellent heat-conducting property in a specific direction.

The filling amount of the carbon fibers in the heat conduction product is increased to provide more heat conduction channels, and the heat conductivity coefficient of the final heat conduction product can also be improved. However, in the conventional process, the larger the proportion of the carbon fibers in the mixed base material, the drier and looser the mixed base material, and the greater the resistance to extrusion in the orientation die 10 to form the thermal conductive rubber strip. When the filling amount of the carbon fibers reaches a certain proportion, the orientation mold 10 cannot extrude the mixed base material to form the heat conducting adhesive tape, or the extruded heat conducting adhesive tape has an influence on the orientation of the carbon fiber arrangement due to an excessive external force, and the heat conductivity coefficient of the heat conducting product is reduced. Meanwhile, the mechanical properties of the finally molded heat-conducting product can also be reduced by directly filling too much carbon fibers in the mixed base material.

In the embodiment of the application, due to the adoption of a unique manufacturing process and a unique mold (Rong Houwen for detailed description), the formula of the mixed base material can be correspondingly adjusted, so that the problem of reduction of the thermal conductivity and the mechanical property of a product caused by excessive addition of carbon fibers in the formula of the traditional process is solved.

Specifically, in the embodiment of the present application, the formulation of the mixed base material includes carbon fiber, alumina, colloid, compound powder, vulcanizing agent, reaction inhibitor, curing catalyst, and powder filler.

Wherein, the carbon fiber is prepared with pitch base, and the length scope of carbon fiber is 110 to 250um, and the diameter length of carbon fiber is normal distribution, expects that the mean value is 5um. The alumina is spherical alumina prepared by a vapor phase method, has an average particle size of 10um, and is used for filling products and assisting in heat conduction. The compound powder is a metal powder material with different grain sizes, is used for further filling gaps between spherical alumina molecules and strip-shaped carbon fiber molecules, and mainly plays a role in filling products and assisting in heat conduction. The colloid is vinyl silicone rubber with different viscosities and is used for bonding materials such as carbon fiber, alumina, compound powder and the like to form fluid with certain viscosity. The rest of the vulcanizing agent, the reaction inhibitor, the curing catalyst and the powder filler are all common formulations in the field of heat conduction materials, and a person skilled in the art can select a specific product and model according to the common general knowledge in the field and the actual requirements.

Based on the above introduction of each component in the formulation of the high resilience oriented thermal interface material, the present application provides a plurality of examples with different component ratios, as specifically shown in table 1 below:

table 1: formulation Components of examples and comparative examples

The examples 1 to 4 are heat-conducting products prepared by the process of the example, and the comparative examples 1 to 3 are heat-conducting products prepared by the conventional process, and the heat-conducting performance test results and the mechanical performance test results are respectively shown in the following tables 2 and 3:

table 2: results of heat conductivity test of examples and comparative examples

Table 3: mechanical property test results of examples and comparative examples

As can be seen from Table 2, in the comparison between examples 1 to 4, the thermal conductivity increases with the increase of the specific gravity of the carbon fiber, and the thermal resistance decreases with the increase of the specific gravity of the carbon fiber, which proves that the filling amount of the carbon fiber is positively correlated with the thermal conductivity of the product within a certain range. As can be seen from Table 3, with the increasing specific gravity of the carbon fiber, the mechanical properties such as rebound resilience, elongation, hardness and density are reduced, and the general physical law is met.

As can also be seen from table 2 and table 3 above, compared with comparative examples 1 to 3 obtained by the conventional preparation process, in the examples 1 to 3 obtained by the preparation process of the present application, under the same component ratio, the thermal conductivity such as thermal conductivity and thermal resistance of the examples obtained by the preparation process of the present application is better than that of the comparative examples obtained by the conventional process, and the mechanical properties such as instantaneous compressive stress, rebound resilience, elongation, and hardness of the examples are also better than that of the comparative examples obtained by the conventional process. Therefore, the preparation process disclosed by the embodiment of the application can effectively improve the heat-conducting property and the mechanical property of the heat-conducting product except for the influence of the formula.

It should be noted that, in the comparison between example 4 and comparative example 4, example 4 with the same formulation can be molded and obtain better thermal conductivity and corresponding mechanical properties, while comparative example 4 prepared by the conventional process cannot be molded due to too much carbon fiber filling. Therefore, the process adopted by the embodiment of the application can break through the upper limit of the filling rate of the carbon fiber in the traditional process, so that the prepared product achieves higher heat conductivity coefficient.

Further, in order to investigate the upper limit of the carbon fiber filling rate of the heat conductive product that can be achieved by the process adopted in the embodiment of the present application, a series of embodiments are further provided to prove, specifically, please refer to table 4 and table 5 below, where table 4 is used to show the formula components of the embodiments in which different carbon fiber filling rates are provided in the present application, and table 5 is used to show the test results of the embodiments in which different carbon fiber filling rates are provided in the present application.

Table 4: formulation components of different carbon fiber fill factor examples

Examples	Colloid	Carbon fiber	Alumina oxide	Compound powder	Vulcanizing agent	Inhibitors	Catalyst and process for preparing same	Filler
									Example 5	50	120	200	150	2	0.1	1.5	0.5
Example 6	50	140	200	150	2	0.1	1.5	0.5
									Example 7	50	150	200	150	2	0.1	1.5	0.5

Table 5: test results for different carbon fiber fill factor embodiments

As is clear from tables 4 and 5, when the mass fraction of the carbon fiber reached 120 in example 5 and example 6, the filling rate of the carbon fiber was further increased, and the thermal conductivity was slightly decreased, and the coefficients of the spring back rate, elongation, hardness, and the like were also decreased. By calculating the filling mass ratio of the carbon fibers in example 5 and example 6, it can be considered that the optimum thermal conductivity supported by the process has been achieved by the preparation process of the examples of the present application when the mass filling rate of the carbon fibers is between 23% and 26%.

Continuing to compare example 6 with example 7, when the mass fraction of the carbon fiber reaches 150, the mass filling rate of the carbon fiber is about 27%, and the mixed base material prepared by the formulation cannot be molded to obtain the standard-compliant thermally conductive green body 100, which proves that the mass filling rate of the carbon fiber supported by the preparation process of the embodiment of the present application cannot exceed 27% at most. Through comparison between comparative example 4 and example 7, the mass filling rate of the carbon fibers in comparative example 4 is 24%, so that the mass filling rate of the carbon fibers in the traditional process can be improved from 24% to 27% by adopting the preparation process of the embodiment.

It should be noted that the formula obtained in the examples of the present application is obtained based on the preparation process provided in the examples of the present application, and a heat conductive product having corresponding heat conductive performance and mechanical performance parameters in the examples of the present application cannot be obtained by adopting the formula without the preparation process described in the examples of the present application.

It should be noted that the comparative examples used in the present application were obtained by a conventional extruder-based manufacturing process, and other parameter conditions in the manufacturing process were the same as those used in the examples. The performance test results of the same heat-conducting product obtained in the examples and the comparative examples cannot be reproduced without the parameter conditions of the preparation process.

The description of step S2 is continued below.

Referring to fig. 3, fig. 3 is a schematic structural diagram of an orientation mold 10 according to an embodiment of the present application from a first viewing angle.

And S2, pressing the mixed base material into the orientation mold 10 to form the heat conducting adhesive layer 110. Specifically, the orientation mold 10 includes a multi-stage branch pipe 11 and an orientation discharge nozzle 13, and the orientation discharge nozzle 13 is communicated with the tail end of the branch pipe 11. The multi-stage shunt pipe 11 is used for extruding the mixed base materials to form a plurality of directionally arranged heat conducting adhesive tapes, and the directional row nozzles 13 are used for connecting the mixed base materials flowing out of the shunt pipe 11 to form an integral heat conducting adhesive layer 110.

Referring to fig. 4, fig. 4 is an exploded view of a first perspective view of an orientation mold according to an embodiment of the present application. In particular embodiments, the orientation die 10 includes an adapter 14, a base 10A, a multi-stage manifold 11, an orientation die cover plate 10B, and an orientation row nozzle 13. Multistage reposition of redundant personnel pipeline 11 sets up in base 10A, is provided with the splitter box (not marked in the figure) in the adapter 14, and the splitter box is used for communicating in the gluey bucket 300 on upper reaches with multistage reposition of redundant personnel pipeline 11 for in will mixing the base-material flow and transmitting to multistage reposition of redundant personnel pipeline 11. Orientation mould apron 10B detachably sets up on base 10A to surround airtight multistage reposition of redundant personnel pipeline 11, thereby can process base 10A and orientation mould apron 10B respectively, assembles again after the processing, reduces orientation mould 10's processing cost, also is convenient for carry out inside overhaul to base 10A in the later stage.

Referring to fig. 5, fig. 5 is a schematic cross-sectional structure view of an orientation mold according to an embodiment of the present application from a second viewing angle. Specifically, the section of the multi-stage flow dividing pipeline 11 is designed to be gradually reduced, and the reduction coefficient is preferably designed according to the sectional area of 10% -30% step by step. The stepwise decreasing of the distribution pipe 11 enables the stepwise increasing of the flow pressure and the stepwise increasing of the flow velocity when the mixed base material flows along the multistage distribution pipe 11, thereby forming a continuous orientation effect on the carbon fibers in the mixed base material. In this embodiment specifically, multistage reposition of redundant personnel pipeline 11 includes 2 one-level reposition of redundant personnel pipelines 11A, 4 second grade reposition of redundant personnel pipelines 11B and 8 tertiary reposition of redundant personnel pipelines 11C that the pipe diameter reduces in proper order, and one-level reposition of redundant personnel pipeline 11A, second grade reposition of redundant personnel pipeline 11B and tertiary reposition of redundant personnel pipeline 11C communicate end to end in proper order.

In other embodiments, the diversion conduit may be designed according to a symmetrical structure, an even symmetrical design, or an odd symmetrical design, which is not limited herein.

In this embodiment, a diversion dam 15 is disposed between adjacent three-stage diversion pipelines 11C, and the diversion dam 15 is used to separate and define the adjacent three-stage diversion pipelines 11C.

It will be appreciated that a flow dividing dam 15 is also provided between adjacent second stage flow dividing pipelines 11B, and adjacent first stage flow dividing pipelines 11A, and functions in the same manner as the flow dividing dam 15 provided between third stage flow dividing pipelines 11C.

After entering from one-level reposition of redundant personnel pipeline 11A, the reposition of redundant personnel gets into two less second grade reposition of redundant personnel pipelines 11B of pipe diameter relatively, passes second grade reposition of redundant personnel pipeline 11B and shunts again and gets into two less tertiary reposition of redundant personnel pipelines 11C of pipe diameter. Because the pipe diameter is continuously reduced, the mixed base material can continuously obtain forward power in the diversion pipeline 11 under the action of gravity so as to overcome the extrusion resistance of the inner wall of the pipeline to the mixed base material.

Meanwhile, as the mixed base material in the shunt pipeline 11 always flows along the length direction of the pipeline, and the pipe diameter is gradually reduced, the carbon fibers are gradually arranged along the flowing direction of the mixed base material in the posture with the minimum resistance under the characteristic of natural flowing of the fluid mixed base material, even if the length direction of the carbon fibers is arranged in parallel with the flowing direction, the carbon fibers in the mixed base material are directionally arranged, the orientation degree of the carbon fibers is improved, and the final heat-conducting product has excellent heat-conducting performance.

Referring to fig. 4 and 5, fig. 5 is a schematic cross-sectional structure diagram of an orientation mold 10 according to an embodiment of the present disclosure from a second perspective. In some embodiments, the branch pipes 11 are further provided with flow regulators 12 for regulating the flow in the different branch pipes 11. Specifically, in this embodiment, the flow rate adjusting member 12 is a screw disposed in the third-stage flow dividing pipe 11C, and the flow rate in the third-stage flow dividing pipe 11C is controlled by rotating the insertion depth of the screw in the third-stage flow dividing pipe 11C.

When the mixed base material passes through the branch pipes 11, the flow distribution of the mixed base material in each branch pipe 11 is not uniform due to too small flow, too large viscosity of the mixed base material or other mechanical reasons, and the flow rate finally flowing to each position of the orientation discharge nozzle 13 is also different. Wherein, the position with larger flow will tend to spread to the periphery, and the mixed base material at the peripheral position is extruded. The arrangement of the internal carbon fibers of the mixed base material extruded from one side is disturbed, which affects the orientation degree of the final heat-conducting product. Meanwhile, the thickness of the formed heat-conducting adhesive layer 110 is inconsistent due to uneven flow distribution, and the thickness unevenness of the heat-conducting adhesive layer 110 is further enlarged in the stacking process, so that a large number of holes exist in the finally formed heat-conducting product, and the product quality is influenced.

Referring to fig. 4, in the embodiment, the orientation mold 13 is formed by assembling a first orientation mold 13A and a second orientation mold 13B, the first orientation mold 13A and the second orientation mold 13B are mirror-symmetrical structures, and the same set of molds is used for machining and forming, so as to reduce the machining cost. Meanwhile, compared with an integral forming structure, the assembling and forming structure is lower in processing difficulty and higher in processing precision.

It should be noted that in other embodiments, the orientation mold 13 is integrally formed.

Referring to fig. 6 and 7 in combination, fig. 6 is an enlarged view of a portion B in fig. 4 for illustrating a structure of the alignment groove 13C, and fig. 7 is an enlarged view of a portion a in fig. 2 for illustrating a structure of the thermal conductive adhesive layer 110. A plurality of alignment grooves 13C are provided in the second alignment mold 13B, and the plurality of alignment grooves 13C are arranged closely in the width direction of the alignment mold 13B. Specifically, in this embodiment, the inner diameter of each alignment groove 13C is 0.9mm, so that the flow width of the carbon fibers of the mixed base material in the alignment groove 13C is smaller, only the carbon fibers with the same orientation and the same flow direction will not collide with the alignment groove 13C, and other orientations of the carbon fibers will continuously collide with the inner wall of the alignment groove 13C until the orientation of the carbon fibers is corrected to be the same as the flow direction, thereby improving the orientation of the carbon fibers and improving the heat conductivity of the product. Meanwhile, the heat-conducting adhesive layers 110 formed by extrusion from the orientation connecting grooves 13C with smaller inner diameters have smaller fluctuation in thickness, and gaps generated by the fluctuation and the unevenness of the surfaces of the heat-conducting adhesive layers 110 are smaller in the stacking process of different heat-conducting adhesive layers 110, so that the cavities in the heat-conducting products during later-stage molding can be reduced.

When the mixed base material flows into the orientation connecting groove 13C from the third-stage flow dividing pipeline 11C, the mixed base material is divided into 120 flow paths from 8 flow paths, so that the width of the mixed base material flowing out of each single flow path is reduced to improve the orientation of the carbon fiber arrangement, meanwhile, the total width of the extruded mixed base material is kept unchanged, a heat conducting glue layer is formed to lay and stack, and the stacking efficiency is improved. Thereby overcoming the technical contradiction that the smaller the pipe diameter of the extrusion mixed base material is, the higher the carbon fiber orientation degree is, but the lower the stacking efficiency is.

Further, the plurality of alignment grooves 13C communicate with each other, so that the mixed base materials in the alignment grooves 13C are adhered to each other to form the integral thermal adhesive layer 110. Therefore, the heat-conducting adhesive layers 110 can form a whole, and the phenomenon that the product quality is influenced due to the fact that the mixed base materials are broken among the heat-conducting adhesive layers 110 due to different flowing speeds in the different orientation connecting grooves 13C in the stacking process is avoided. Only after the heat-conducting adhesive layer 110 is formed integrally, can directly pile up whole layer by layer, thereby realize improving the stack efficiency high-quality, when heat-conducting adhesive layer 110 piles up whole layer by layer, compare in traditional handicraft with heat-conducting adhesive tape from the one end of base plate crowded to the other end, then with orientation mould turning direction back, a translation segment distance, until having paved one deck heat-conducting adhesive tape, this application directly piles up heat-conducting adhesive layer 110, the technology is simpler, heat-conducting adhesive layer undulates the interval each other and fixes, can not be because the different errors of distance of translation orientation mould, fill up the gap more easily.

It should be noted that the outlet of the orientation connecting groove 13C may be a flat rectangular outlet, which is changed according to the requirement of the extrusion orientation characteristic, or an outlet with an arc-shaped groove. Preferably, the mixed base material is extruded out in a cylindrical structure through an arc-shaped outlet, so that the centripetal effect of carbon fibers in the mixed base material is improved, and the orientation is improved.

Therefore, the orientation mold 10 is adopted to form the heat-conducting adhesive layer 110, the advantage of good orientation of the long and thin heat-conducting adhesive tape is realized, the defect of low production efficiency of the long and thin heat-conducting adhesive tape is overcome, and the problem of cavities in products caused by gaps generated in the stacking process of the heat-conducting adhesive tape can be solved.

Referring to fig. 8, fig. 8 is an enlarged schematic view of a structure at C in fig. 3, for showing structures of the buckle 13D and the card slot 13F. Base 10A and orientation mould apron 10B surround and form the mounting groove (not marked in the figure) that has concave-convex structure, and first orientation row mouth 13A and second orientation row mouth 13B then are provided with buckle 13D and draw-in groove 13F with concave-convex structure looks adaptation to make orientation row mouth 13 fixed card connect in the mounting groove, and make tertiary reposition of redundant personnel pipeline 11C in the orientation mould 10 and the orientation in the row mouth 13 of orientation link to each other groove 13C, in order to guarantee to mix the flow of matrix. In some embodiments, the mounting groove is further provided with a limiting hole 10C at the upper side thereof for limiting the movement of the orientation nozzle 13 in the mounting groove.

Referring to fig. 5 and 9, fig. 9 is a schematic structural diagram of a first viewing angle of the orientation nozzle 10 according to an embodiment of the present application. The bottom of orientation row mouth 13 is provided with orientation and links groove 13C, the orientation links the one end that groove 13C is close to tertiary reposition of redundant personnel pipeline 11C and is provided with the direction inclined plane 13F that has the inclination, all be provided with direction inclined plane 13F on first orientation row mouth 10A and the second orientation row mouth 10B, two direction inclined planes 13F surround and form the funnel structure, the one side of funnel structure broad and tertiary reposition of redundant personnel pipeline 11C's internal diameter looks adaptation communicates in tertiary reposition of redundant personnel pipeline 11C to accept the mixed base-material that flows in from tertiary reposition of redundant personnel pipeline 11C. The narrower side of the funnel structure is matched with the inner diameter of the orientation connecting groove 13C and communicated with the orientation connecting groove 13C so as to extrude the mixed base material into the orientation connecting groove 13C. The funnel structure formed by the inclined guide surfaces 13F can level the flow velocity difference of the mixed base material flowing from the tertiary flow distribution pipeline 11C in the funnel structure, so that the mixed base material can uniformly flow into each orientation connecting groove 13C.

The description of step S3 is continued below.

Please refer to fig. 2 again. And S3, stacking the heat-conducting glue layers 110 layer by layer to form a solidified heat-conducting blank 100. Specifically, a stack mold 20 is provided, and an inner cavity for stacking the thermal conductive adhesive layers 110 to form the thermal conductive blank 100 is disposed in the stack mold 20, and the inner cavity simultaneously limits the forming size and shape of the thermal conductive blank 100. The thermal conductive adhesive layers 110 are stacked from the base 21 of the stack mold 20 upward along the height direction to form the thermal conductive green body 100, and then reach the top cover (not shown) sealing the inner cavity. Finally, the stack mold 20 is heated to solidify the heat conductive blank 100 in the stack mold 20, and the molded heat conductive blank 100 is taken out.

Specifically in the present embodiment, the stack mold 20 includes a base 21, a top cover, and a plurality of stack frames 22, and the plurality of stack frames 22 are detachably connected in a height direction to form sidewalls of the stack mold 20. When the thermal conductive adhesive layers 110 are stacked, the number of the stacking frames 22 is adjusted to control the height of the formed inner cavity according to the specification and size of the finally formed thermal conductive product, so as to control the height of the thermal conductive blank 100. After the heat conductive adhesive layer 110 is stacked in the stack mold 20, the top cover is sealed to prevent the heat conductive blank 100 from being heated and cured subsequently, and the volume of the heat conductive blank 100 expands to deform the stack mold 20.

After the heat-conducting blank 100 is cured and molded, when the heat-conducting blank 100 is detached from the stack mold 20, the top cover is first removed, and then the stack frame 22 is removed layer by layer from the top layer to the bottom layer until the entire stack mold 20 is completely detached, and the cured heat-conducting blank 100 can naturally move to perform the next process. In the conventional process, the heat conductive blank 100 is detached from the stack mold 20 by cutting off the connection between the heat conductive blank 100 and the stack mold 20 with a tool, and taking out the heat conductive blank 100 from the stack mold 20. Compare in traditional handicraft, dismantle heat conduction idiosome 100 from stack mold 20 in, the thought that adopts is dismantled for the stack mold 20 of direct dismantlement outside in this application, can avoid the destruction of use instrument to heat conduction idiosome 100 to improve the quality of final fashioned heat conduction product.

In the embodiment, the stacking frame 22 is provided with a snap structure (not shown) for being buckled with each other. The thickness of the stack frames 22 of the bottom and top layers is equal to the thickness of the stack frame 22 located in the middle. Preferably, the thickness of the stack frames 22 of the bottom and top layers may be set to be 5 times that of the middle stack frame 22 to enhance the fixing effect and the wear-resistant effect.

In other embodiments, before the stacking of the heat conductive adhesive layer 110, a separation film is disposed on the bottom wall of the stack mold 20, and before the top cover is finally sealed, a similar separation film is disposed on the top cover of the stack mold 20, and the separation film is made of PET material, so as to prevent the heat conductive blank 100 from adhering to the stack mold 20, which may cause damage to the heat conductive blank 100 when the heat conductive blank 100 is finally detached from the stack mold 20.

In the step of stacking the thermal conductive adhesive layers 110 layer by layer, the orientation row nozzle 13 of the orientation mold 10 is disposed on the upper side of the stack mold 20, and the thermal conductive adhesive layer 110 formed in the orientation row nozzle 13 is extruded on the bottom wall of the stack mold 20 and simultaneously moves at a constant speed along a certain direction, so that the thermal conductive adhesive layer 110 gradually fills up the bottom wall of the stack mold 20 in the extrusion process.

When the bottom wall of the stack mold 20 is completely filled, the height of the orientation nozzle 13 is raised, and the raised height is the same as the thickness of the heat-conducting glue layer 110, so that the height of the orientation nozzle 13 is always the same as the height of the heat-conducting blank 100 which is formed by stacking, and therefore the phenomenon that the heat-conducting glue layer 110 laid on the second layer and the heat-conducting glue layer 110 laid on the first layer are extruded to deform to influence the orientation of carbon fibers in the heat-conducting glue layer 110 is avoided.

Referring to fig. 10, fig. 10 is a view illustrating a second view angle of stacked thermal films according to an embodiment of the present disclosure. After the orientation row nozzles 13 are raised, it is also necessary to horizontally move the orientation mold 10 by a certain distance so that a misalignment is formed between the adjacent thermally conductive adhesive layers 110 in the height direction. The offset width distance is preferably one-half of the thermal conductive adhesive protrusion width, and as the thermal conductive adhesive layer 110 is formed by extruding a mixed base material in a plurality of cylindrical orientation connecting grooves 13C, continuous and alternate arc-shaped recesses 412 and protrusions 411 are formed on the surface of the thermal conductive adhesive layer 110, and the adjacent thermal conductive adhesive layers 110 are arranged in an offset manner, so that the recesses 412 on the first thermal conductive adhesive layer 110 can be correspondingly adhered to the protrusions 411 on the second thermal conductive adhesive layer 110. Meanwhile, as the structures of the heat conductive adhesive layers 110 are the same, all the recesses 412 on the heat conductive adhesive layers 110 can be filled by the protrusions 411 on the adjacent heat conductive adhesive layers 110, so that the problem of gaps of the heat conductive blank 100 caused by the recesses 412 and the protrusions 411 generated by the heat conductive adhesive tapes in the stacking process of the heat conductive adhesive layers 110 is greatly reduced.

It is understood that the subsequent orientation mold 10 moves and extrudes the thermal conductive adhesive layers 110 in forward and reverse directions alternately with each other, so that the extruded thermal conductive adhesive layers 110 are sequentially stacked on the thermal conductive adhesive layers 110 laid one above another, and finally the thermal conductive blank 100 is formed.

The description of step S4 is continued below.

And S4, cutting the heat-conducting blank 100 to form a heat-conducting product. After the cured heat conducting blank 100 is disassembled, the heat conducting blank 100 is cut into the heat conducting blank 100 meeting the design requirements of the product by means of ultrasonic cutting and the like so as to form the high-resilience oriented heat conducting interface material.

The application adopts the preparation process of the high-resilience oriented heat-conducting interface material, and the implementation principle is as follows: replace traditional extruder through orientation mould 10 for mix the matrix and can extrude and form thinner heat conduction adhesive tape in order to improve the carbon fiber orientation and reduce the product cavity, make many heat conduction adhesive tapes bonding form heat conduction adhesive layer 110 again simultaneously, in order to overcome production efficiency problem. And through the process, because the multistage shunt pipeline 11 of the orientation mould 10 has a smaller pipeline sectional area and is assisted with flow regulation, larger resistance can be overcome in the process of extruding the mixed base material to form the heat-conducting rubber strip, so that the technical problem of the upper limit of the carbon fiber filling rate in the traditional process is broken through, and the finally formed heat-conducting product has higher heat conductivity coefficient. In the stacking process, the efficiency of detaching the heat conducting blank 100 is improved by the stack mold 20 composed of the detachable stack frame 22, and meanwhile, the damage to the heat conducting blank 100 in the detaching process is reduced, and the quality of the finally formed heat conducting product can also be improved.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. An orientation die, comprising:

the base is internally provided with a multi-stage flow distribution channel;

the orientation row nozzle is clamped on the base and communicated with the plurality of the shunting channels, a plurality of closely arranged orientation grooves are arranged in the orientation row nozzle, the mixed base material flows into the orientation row nozzle along the multistage shunting channels, and the orientation grooves extrude the heat-conducting fibers in the mixed base material in a directional arrangement mode so as to continuously guide out the diaphragm-shaped heat-conducting adhesive layer.

2. The orientation tool of claim 1 wherein the plurality of stages of flow splitting channels comprise a first stage flow splitting channel, a second stage flow splitting channel, and a third stage flow splitting channel of successively decreasing cross-sectional area, the third stage flow splitting channel communicating with the orientation row nozzle.

3. The orientation die of claim 2, wherein the tertiary flow dividing channel is provided with a flow regulating member for controlling the flow rate in the tertiary flow dividing channel.

4. The orientation die according to claim 2, wherein the sectional areas of the primary flow distribution channel, the secondary flow distribution channel and the tertiary flow distribution channel are reduced in steps by a ratio of 10% to 30%, and the numbers of the primary flow distribution channel, the secondary flow distribution channel and the tertiary flow distribution channel are increased in steps by a ratio of 2 to 4.

5. The orientation die of claim 1, wherein the orientation groove is provided with a symmetrical arc structure, and the mixed base material is extruded by the inner wall of the arc structure in the orientation groove to form a heat-conducting adhesive layer with the symmetrical arc structure.

6. The orientation mold according to claim 5, wherein a plurality of the orientation grooves are communicated with each other, and the mixed base materials are adhered to each other in the orientation grooves to form the thermal conductive adhesive layer.

7. The orientation tool of claim 6 wherein the ratio of the maximum diameter of the arcuate structure in the orientation groove to the shortest width of the connection in the orientation groove is in the range of 0-0.7.

8. The orientation mold according to claim 5, wherein a guide slope is disposed in the orientation groove, the guide slope is configured to form a funnel structure, and two ends of the funnel structure are respectively communicated with the diversion channel and the orientation groove.

9. The orientation die of claim 1, further comprising a cover plate mounted to the base, the cover plate and the base enclosing a plurality of stages of the flow dividing channels.

10. The orientation die of claim 1 wherein the orientation row nozzles comprise symmetrical first and second orientation row nozzles that snap fit to form the orientation row nozzle.

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